NextFlex: Roadmap a for Flexible Hybrid Electronics ... Benjamin...America’s Flexible Hybrid Electronics Manufacturing Institute NextFlex: Roadmap a for Flexible Hybrid Electronics

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America’s Flexible Hybrid Electronics Manufacturing Institute

NextFlex: Roadmap a for Flexible Hybrid Electronics Manufacturing Ecosystem

FLEX 2017

June 19-22

Benjamin Leever

Government CTO, AFRL/RX



What Does “Flexible Hybrid” Mean?

6/9/2017 2

Thin Si CMOS

Power

Low-temperature

Manufacturing Processes

High-speed Automation

Printed Components

Integrated Array Antenna Systems

Asset Monitoring Systems

Human Monitoring Systems

Soft Robotics

Manufacturing Convergence

for Application Spaces

Electronics

Manufacturing Services


Manufacturing USA Network

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Other Institutes in Planning:

Flexible Hybrid Elec.San Jose, CA

Additive Mfg.Youngstown, OH

Power ElectronicsRaleigh, NC

Light/Modern MetalsDetroit, MI

Adv. CompositesKnoxville, TN

Integrated PhotonicsAlbany, NY

Digital Mfg. & DesignChicago, IL

Revolutionary Fibers & Textiles

Boston, MA

Recycling, Reuse, & Remanuf.

Rochester NY

Advanced Tissue Biofabrication

Manchester, NH

BiopharmaceuticalsNewark, DE

Process IntensificationNew York, NY

Los Angeles, CA

Reducing Embodied Energy and Decreasing Emissions Industry-proposed topic

“Across the Manufacturing USA institutes, the Federal government has committed over $850 million, which has been matched by more than $1.8 billion in non-Federal investment.”- White House Fact Sheet, December 21, 2016

Manufacturing RoboticsPittsburgh, PA

Addressing the critical TRL/MRL 4-7 gap between proof of concept and product


Established 28 August 2015

Lead FlexTech Alliance

Hub Location San Jose, California

Members 72 in 26 states

Federal Funding $75 million over 5 years

Committed Matching $96 million

Government Agencies Engaged 17 DOD & OGAs

NextFlex Establishment

10


NextFlex Programmatic Thrusts

Roadmap-Driven, Industry-Led Projects: Develop FHE manufacturing ecosystem through manufacturing-focused projects.

Pilot-Scale Manufacturing Facility in San Jose, CA for FHE integration

Creating a Trained Workforce from K-12 outreach through workforce development and re-training

Enabling Collaborative Discussions between industry, government, and academics to focus the FHE ecosystem

Rapid Acquisition Vehicle for agency FHE fundingLeverage NextFlex Project Call process –ecosystem access, review expertise, cost-share

Agencies control their own funding - final funding authority & management

Rapid project award on obligations/expenditures control

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Members

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Distribution A. Cleared for Public Release. Distribution is unlimited.7

Building a Nationwide Network

Distribution A. Cleared for Public Release. Distribution is unlimited.6/9/2017

8

Government Partners


Flexible silicon, substrates, inks, conductors, insulators for additive

manufacturingHMS:

Wellness, occupational & medical

AMS: Agricultural, industrial & structural

Modeling & Design

Materials & processes

Equipment & tools

Supply chain

Standards, Test & Reliability

Workforce development

Pick & place, printing, device packaging/ assembly, automation, testing, yield &

capacity requirements

Application-specific requirement, protocol and methodology

Academic outreach and technical training thru industry/academic/local

government partnerships

System design & integration; component/material/process integration & improvement

The FHE Ecosystem

13


TPD1 Human Monitoring

TPD2 Asset Monitoring

TPD3 Integrated Array Antennas

TPD4 Soft Robotics

Demos 1

Key Features

1.

2.

Demos 1

Key Features

1.

2.

“What” we do• Led by Tech council

• Strong end-user participation

• Demos describe “What” the institute

is doing in manufacturing

• Revised annually

MTA1. Device Integration and Packaging

MTA2. Materials

MTA3. Printed Flexible Components& Microfluidics

MTA4. Modeling & Design

MTA5. Standards, Test & Reliability

“How” we do it• Industry Led at WG level

• Clear boundaries, detailed

roadmaps and deliverables feeding

into TPDs

• Develop “How” – gap analysis

• Drive Project Calls

• Revised semi-annually

TIME

• Approximately 150 SMEs across industry, government, and academia contribute to roadmap process.

• Roadmaps drive both NextFlex and industrial investments in an FHE ecyostem.

Road-Mapping Process

19



Asset Monitoring Systems

Integrated Array Antennas

Soft Robotics

Wearable, unobtrusive, and non-invasive devices for sensing and

reporting physiological state of warfighters, athletes, geriatric

populations, and medical patients in varied environments.

Conformal or integrated devices for sensing and reporting the

state of infrastructure, vehicles, logistics, or the environment.

Networks of sensors or devices for Internet of Things concepts.

Soft, compressible sensors and devices for robotic functionality,

enabling active clothing, wearable robots or robotic tools, and

advanced prosthetics. Improved robot-human interactions for

surgery, manufacturing, and consumer electronics.

Patterning of efficient printed wideband array elements on

flexible or conformal surfaces and integration of thinned

electronics with printed wideband array elements.

Technology Platform Demonstrators


Manufacturing Thrust AreasDevice Integration & Packaging

Printed Flexible Components & Microfluidics

Materials

Development of new tools for testing, slicing, and thinning of silicon wafers

as well as for electronic device and sensor integration on flexible,

stretchable, and/or foldable substrates. Leveraging advanced precision

printing and high-speed automated pick & place for integration of device

components, interconnects, and data lines.

Developing and maturing contact and non-contact printing processes that

support hybrid device concepts, including sensors and discrete device

components. Printing & integration of microfluidic channels and fluidic

control elements.

Manufacturing scale-up of conductive and dielectric inks and pastes,

adhesives, encapsulant materials, and flexible substrates.

Modeling & Design

Standards, Testing, and Reliability

Leveraging existing software & hardware design capabilities, simulation

techniques, and manufacturing process control tools while also integrating

novel manufacturing design rules for FHE.

Developing tools and test protocols to evaluate device-level and system-level

FHE performance as well as reliability in both commercial and military

environments. Partnering with standards organizations and professional

societies to develop specifications & standards.


Technical Working Groups

6/9/2017 13

• Device Integration and Packaging– Bruce Hughes (AMRDEC), Val Marinov (Uniqarta),

Steve Gonya (Lockheed Martin), Mark Poliks(Binghamton University)

• Materials– Giuseppe Di Benedetto (ARDEC), Jim Lamb (Brewer

Science), John Williams (Boeing), Joey Mead (UMass Lowell)

• Printed Flexible Components & Microfluidics– Jeremy Ward (AFRL), Chris Stoessel (Eastman

Chemical), Masood Atashbar (Western Michigan Univ.)

• Modeling & Design– Phil Buskohl (AFRL), Jim Huang (Hewlett Packard

Enterprise), Suresh Sitaraman (Georgia Tech)

• Standards, Test & Reliability– Emily Heckman (AFRL), Chris Jorgensen (IPC), Mark

Poliks (Binghamton)

• Human Monitoring Systems― Christian Whitchurch (DTRA), Azar Alizadeh (GE GRC),

Jeff Morse (UMass Amherst)

• Asset Monitoring Systems― Ken Blecker (ARDEC), Robert Smith (Boeing) Pradeep

Lall (Auburn University)

• Integrated Array Antenna Systems― Steven Weiss (ARL), Joe Kunze (Si2 Technologies),

Alkim Akyurtlu (UMass Lowell)

• Soft Robotics― Geoff Slipher (ARL), Romano Patrick (GE GRC), Chuck

Zhang (Georgia Tech)

Manufacturing Thrust Areas Technology Platform Demonstrators


Soft & Wearable Robotics

Robot – A system that can:• Sense – Measure or detect some aspect of its environment• Decide – Make decisions based on that sensed information• Act – Physically modify environment based on decisions…and do so autonomously or semi-autonomously

Soft robot applications:• Soft manipulators – Decrease control complexity by passively conforming

around objects while providing task specific interaction forces• Soft exoskeleton suits – Actively protect or augment human performance• Prosthetics – Augment degraded human performance• Mobile manipulation – Deform to allow passage through constrained

environments while still providing task-specific reach and interaction forces• Safer robotic team mates – reduce risk of injury in close proximity to humans

Technology enablers for soft-robotics:• Materials – Advanced materials for soft robotic structures, sensing and other

supportive functions• Sensing – Passively conforming sensors of pressure, motion, shape, texture,

temperature• Actuation – Actuators that can passively conform in multiple dimensions

while actively regulating forces in one or more dimensions• Human Interface – Interaction leveraging soft sensing and actuation• Power – Power storage or transmission in soft packages• Communications – Coordinate sensed information and actuator commands

with a decision making component (human or computer)• Manufacturing – Advanced manufacturing techniques such as 3D printing

and printed electronics for fabricating and integrating soft robotic structures and electronics

SOCAT prosthesis system with soft self sensing and control capabilities (Credit: C. Zhang/Georgia Tech)

Soft robotic sleeve: circumferential actuators on a porcine heart (Credit: E.T. Roche/Harvard)

Multi-gait soft robot crawling under an obstacle (Credit: R. Shepherd/Cornell)


Soft & Wearable Robotics

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Demonstration/validation of sensing capability in an integrated FHE demonstrator at a soft interface (e.g. human body or upholstery) (1Q FY18 – 4Q FY20)Adaptive Wearable or

Structural Articles with Soft Robotic Response [TPD]

Integration and demonstration of soft actuation (response) with prior sensing input at a soft interface (1QFY20 – 4QFY22)

Qualification of existing stretchable conductive (ionic or electronic) material processing into manufacturing development pipeline (2017 –2020)

Key Enablers

Development and validation of design rules for high strain gradient regions at the flexible/hard interface (2018 – 2021)

Development and qualification of a cost-effective manufacturing process for soft

flexible actuators using printing method, Materials research improvement for lower

power / higher output force, Characterize mechano-electrical response, quasi-isostatic,

dynamic and cyclic (3Q FY17- 4Q FY20) Soft Robotics

Actuator Manufacturing [MTA]

Development and qualification of hybrid (soft/hard)

manufacturing, device integration, and test/evaluation

processes, improve robustness (1QFY20 – 4QFY22)

Scale up soft actuator and hybrid control

electronics production (starting 1Q FY21)

Implement electronic controls and feedback sensors (3Q FY17 – 4Q FY18)

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Soft & Wearable Robotics (Near-Mid-Far Impacts)Human

Performance Augmentation

Training Aids

Medical

Robotic Mobility & Manipulation

Other

2017

2019

2018

2021

2020

2023

2022

2025

2024

● Integrated automatic wearable tourniquet

● Biocompatiple implantablesfor corrective interventions (e.g. digestive tract obstruction or heart cuff)

● Engineered Soft Muscles for Soft Robotic Systems (e.g. for assistive nursing)

● Adaptive Passive/Active Soft Grippers for Robots(e.g. for geometric complexity or fragility)

● Surgeon assistive conformal clothing for improved dexterity/stability

● Electromechanical Soft Logic for Integrated Computation, Memory, and Actuation in Single Material (e.g. for Robotic Reflexes, or Robotic Autonomic Nervous System)

● Soft Deformable Reactive Beam forming arrays for Synthetic Aperture Radar Front Ends

● Stability/BalanceAssistive Conformal Clothing

● Dynamic MotionAssistive Conformal Clothing

● Strength & Endurance Assistive Conformal Clothing

● Energy Minimization Wearables for Performance Athlete Training (e.g. gait optimization)

● Haptic Feedback Wearables for Kinematic Motion Training (e.g. golf swing)

● Corrective Wearables to reduce repetitive motion related injury

● Adaptive Soft Energy Harvesters (e.g. mechanical to electrical conversion of human motion)

● Dynamic Mechanical/Structural Impedance Modulation for Kinematic Energy Storage and Transfer Optimization

All Require Sense-and-Respond Feedback Loop Paradigm

● Life like feel Soft Active Prosthetics

● Adaptive Frequency Energy Transfer and Power Conditioning (e.g. stretchable/tunable inductor)


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Human Health & Performance Monitoring

• Clinical (patient monitoring, decision making , disease diagnosis & therapy)

• Occupational (monitoring & alerting of workers in factory & field environments including harsh conditions)

• Extreme performance (monitoring & alerting of elite personnel in mentally & physically demanding settings, e.g. during extreme exertion and combat)

• Wellness/fitness (monitoring of all people for everyday life enhancement, well-being, disease prevention)

Perf

orm

ance

& r

egu

lati

on

de

man

ds

Taxonomy Ecosystem

• Physiological biomarkers• Motion, strain • Fluid bio-markers• Environment parameters • Wound and drug

managements (more relevant to clinical)

• Multi-sensing capabilities


Human Health & Performance Monitoring

6/9/2017

Development of soft patches to monitor micro stress, strains

and fatigue of nerves, muscles, tendons, & vascular system

Motion, strain, and pressure monitors

Maturity M

Development of embedded low cost,

robust insole based sensors:

stress/pressure weight (load ) , gait.

Fluid levels and fluid bio-marker

monitors

Maturity L-M

FHE hybrid integration & embedded

electronics for body fluid contact: E.g.

lactate sensing from saliva

Integration of fluidics & sensing systems for non-invasive

monitoring of proteins / small molecules: Hydration- sweat rate,

Infectious & chronic diseases

18

Development of low cost PPE (glove) with integrated

environmental physical hazard (electrical, high

temperature, moving objects) sensing

Smart environment PPE wearables

Maturity M

Development of low cost PPE with integrated

environmental chemical & biological hazard

sensing (sampling and sensitivity)

Development of clinical grade low cost

sensors: Integration of high performance

ICs on low cost printed substrates

Physiological (ECG, EEG, SpO2, BP, RR,

temperature) monitors

Maturity M-HDevelopment of novel low profile sensors: Small foot print non-invasive facial sensors such

as CO2-based RR sensor (novel powering and energy harvesting schemes)

Development of low cost disposable sensors :Address environmental

requirements for disposal of large volumes of electronics

Integration with wearable

textiles: Assembly of Flexible ICs

and sensors on textiles

Integrated multi-sensor simple

systems in wearable formats

Integration and fusion of multiple high performing ICs on user friendly format wearables (wear

and forget) including large stretchable substrate appliques: (address user mobility and motion

artifacts adhesives, disposability (single use) and at least 3 days of operation)

Smart bandages

Maturity L-M

Integration and printing of electronics on

low cost substrates and paper fluidics:

wound dressing, bedsore monitoring



6/9/2017 Page 19

Electro-Physiological

MotionStrain, Posture

Fluid-biomarkers

Smart bandages

Other

2017

2019

2018

2021

2020

2023

2022

2025

2024

● Clinical grade wearables (ECG, Temp, Resp., BP, O2) ● Environment aware PPE

(electrical, temperature, collision, hazards)

● Wearables for continuous & non-invasive electrolyte sensing

● Standalone sensors for wellness and “limited” performance monitoring applications (HR, O2, motion, skin temp,…)

● Wearable medical imaging devices

● Wearables for non-invasive metabolite (lactate, glucose) sensing

● Smart low cost optical, auditory and haptic prosthetics for medical

● Wearable accessories for augmented reality

●Wearables for rehab (physical therapy) assistance

●Low cost, low profile sensors (such as facial sensors for CO2-based RR or clothing/shoe embedded sensors)

● Low cost wearables for real time musculoskeletal injury, nerve fatigue prediction algorithms based on work-load

● Wearable sensors for non-invasive drug metabolites sensing and optimum drug delivery

● Wearables for non-invasive innate biomarker sensing (from stress, cancer to infectious diseases,…)

●Low profile pseudo skin sensors integrated w/ prosthetics

● low cost, low profile wearable sensors and exoskeletons for bone and muscle degeneration

Worker safety and productivity

● Disposable clinical grade wearables

●Low cost multi-sensor systems w/ energy harvesting and integration with AI

● Wearable sensors for non-invasive wound monitoring and healing

● Wearables for extreme environment sensing and feedback (toxic gases, confined spaces, dehydration, etc.)

● Low cost wearables for worker’s mental fatigue and stress prediction and prevention


Device Integration, Packaging and Assembly

6/9/2017 20

Thinned die and compliant attach methods.Stretchable and conformable substrates. Flexible low dielectric / low loss RF materials.

Enablers

Flexible substrates using stretchable circuitry, RF materials and clothing textiles Circuitization

Flex circuit transition to multi-layer with internal pwr/gnd planes, via interconnections and embedded features

Die low I/O (<100) and pitch (>200 µm) for µc, mem, wifi using compliant chip attach methods

Dev of printed conductors, transmission lines, dielectrics, pwr/gnd, vias, R/C/L, 3D features and sensors

Encapsulation

Mostly single-die, S2S/batch

Flexible/ Conformable

multi-mode & higher I/O count

Sustainability / Recyclability;Demanding/Harsh Environments

High-volume / low-cost R2R

Flexible interposers for fine-pitch, <50 μm thick dies

Non-Printed Components

Interconnection methods for reliable assembly of <50 μm thick dies

Stress- and defect-free thinning & dicing of <50μm wafers

FHE interposers for <10μm thick dies; stretchable interposers; interposers with embedded components

Thinning & dicing of <10μm wafer, incl. non-contact methods

Assembly of <10μm thick dies; FHE integration of power source and passive components

Embedded and integrated passive components for FHE integration

Thin die flip-chip bonding

PnP methods for assembly of <50 μm thick dies without interposer

Device Assembly

Methods for assembly of <10 μm thick dies with and without interposer; non-contact methods for die assembly

Methods for embedding passive and active components in HD flex circuit boards

S2S to R2R migration for FHE device assembly

Assembly of FHE interposers with fine-pitch, <50 μm thick dies

Clothing textile substrates for wearable app.Printed features for RF and hi-speed functions.Flexible interposers for fine-pitch die attach.

Embedded components and integrated passives.Encapsulation for harsh environment reliability.S2S migration to R2R for FHE device assembly.


Project Call 1.0

6/9/2017 21

First Project Call released 67 days after award (November 2015)

3 Broad topics outlined in Institute proposalManufacturing for Human Monitoring Systems

Manufacturing for Asset Monitoring Systems

Medical Devices for Wearable/Medical Human Monitoring Systems

Enthusiastic Response70 Pre-proposals

Broad geographic diversity

21 Industrial leads

70 Industrial partners

18 Full proposals received

8 Projects Awarded


Project Call 2.0

6/9/2017 22

Project Call 2.0 Released May 2016

9 Topics driven by roadmap processUltra-Thin Die Assembly for FHE Systems

Multi-Process Integration Tool with Real Time Metrology

Printing on Complex Surfaces

FHE Process Design Kit

Mechanical Test Methods

Flex-Hybrid Array Antenna

Asset Monitoring for Time Critical Inventory

AFRL: Failure Modes in Wearable Performance Monitors

Stand-Alone Work Force Development

PC 2.0 Response

Received 59 pre-proposals

Requested 32 full proposals

Awarded 17 projects

$45M in total projects in PC 1.0 and 2.0

$18M federal funding and 60% cost-share


PC 1.0: Assembling Ultra-Thin ICs on Textiles

Develop & qualify assembly process for integrating flexible ICs and sensor onto textiles

Evaluate failure due to mechanical bending, temperature, moisture (humidity & washing); evaluate manufacturing metrics (e.g., throughput, yield)

Develop & demonstrate process at Jabil. Cal Poly leads development with engineering assistance from NovaCentrix. Add Chart on Project Call Process

6/9/2017 23


PC 1.0: Process Development for FHE Medical Devices

6/9/2017 24


PC1.0: Flexible Smart Wound Dressing

6/9/2017 25

Delivery Oxygen Antibiotics Growth factor Electomechanical stimulation

Sensing Chemical (oxygen, pH, biomarkers) Physical (moisture, temperature,

strain, blood flow)


Die Integration

and Assembly

Area( c l ass 10 ,000 C l ean R oom )

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Seminar, Training and

Workforce Development

Materials

Wearables

Lab

Product

Display

Design

Lab

Materials

Registry

Library

Cubicles

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Break Room

Lunch

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Processing Area(c lass 10,000 Clean Room)

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NextFlex Hub Facility

31


Next Steps for the FHE Roadmap & Ecosystem

Project Call 3.0 – Released on 31 May and targeting multiple technology platform demonstrators and manufacturing projects related to device integration & printing

FHE Process Design Kit – currently underway by HPE-led team

FHE materials & process database – foundational capability for efficient device design

NextFlex Pilot Line – new FHE manufacturing tools and standard EMS tools co-located to enable prototyping & low-volume manufacturing

Accelerated commercialization of FHE technology leveraging NextFlex or independent investments

6/9/2017 27


America’s Flexible Hybrid Electronics Manufacturing

Institute

Thank You!


Documents

NextFlex: Roadmap a for Flexible Hybrid Electronics ... Benjamin...America’s Flexible Hybrid Electronics Manufacturing Institute NextFlex: Roadmap a for Flexible Hybrid Electronics