PROCEEDINGS

OF THE TECHNICAL

PROGRAM

Conference: February 27 - March 4,1994 • Exposition: March 1-3, 1994

Anaheim Convention Center • Anaheim, California

TECHNICAL SESSION 12

DOE (Design of Experiments) and QFD (Concurrent Engineering)as Necessary Tools to Support and Enhance SPC

Chairman: Ronald Anjard

"An Overview and Inter-Relationships of QFD, SPS, DOE" 801

Ronald Anjard

"QFD - What It All Means and Where It's Headed" 805

Rick Norman, Leemak

"Optimizing Quality Function Deployment (QFD) - The Process" 814

Pam Dunham, QFD Systems Manager, NCR

"Application Advances in QFD" 821

William Riordan, Howard Johnson and Donald Murphy, GDE Systems, Inc.

"Taguchi Methods in the Semiconductor World: Concepts and Applications" 827

Marilyn Hwan, LSI Logic Corporation

"Why Experimental Designs Fail" 834

Tom Barker, Rochester Institute of Technology

"Process Integration of 200K Silicon Process with ThermocompressionTab Bonding Using Robust Design Methodology" 849

Brian Lynch, LSI Logic Corporation

"The Quality as a Management Strategic Tool"

Shin Ta Liu, Lynx System

TECHNICAL SESSION 13

The Environmental Challenge for PCB Assembly Processes

Chairman: Malcolm Warwick, Technical Director, Multicore Solders Ltd.

"Solder Safety and Disposal Management" 867

Peter Biocca, Technical Manager, Multicore Solders, Inc.

"Screening Studies on Lead-Free Solder Alloys" 874

M.E. Warwick and H.AH. Steen, Multicore Solders Ltd.; J.H. Vincent and

B.P. Richards, GEC-Marconi Ltd.; P.G. Harris and M.A. Whitmore,International Tin Research Institute; S.R. Billington and AC. Harman,

BNR Europe Ltd.

"Alternative Solders for Electronic Assemblies" 884

C.G. Tanner, B.M. Wright, S.R. Billington, AC. Harman, E. Knight,BNR Europe Ltd.; J.H. Vincent, B.P. Richards, D.R. Wallis, I.A. Gunter,GEC-Marconi Ltd.; M.E. Warwick, H.AH. Steen, Multicore Solders Ltd.;P.G. Harris, M.A Whitmore, International Tin Research Institute

"Cleaning Without CFC's: The Flux/Solvent Puzzle" 893

Dean Johnson, Western Regional Sales Manager, Accel Corp.

"Material Choices for No-Clean Process" 902

Kevin Posivy, IBM Canada Ltd.

"Design Considerations of No-Clean Fluxes Used to Eliminate VOC Emissions" 908

Bob Gilbert, Technical Manager, Multicore Solders, Inc.

"Precision Application of No-Clean Flux with Ink Jet Techniques" N/A

Brad Stoops, President, Precision Dispensing Equipment Inc.

TECHNICAL SESSION 14

Polymer Composite Use in High-Density Electronic PackagingChairman: Joe Fulton, Member of the Technical Staff, AT & T

"Nitto Denko Application Specific Material (ASMAT) Micro-Connector" 915Ronald Blankenhorn, Nikko Denko America, Inc.

"Repair Problems and Possible Solutions for Isotropic Conductive

Adhesive Interconnect" N/AY. Zaks and H.D. Rubin, AT&T Bell Laboratories

"Are Polymer 'Solders' Real? Metallurgical vs. Adhesive Joining" 922Ken Gilleo and Norbert Socolowski, Alpha Metals

"Unique Applications for New Low-Resistance Elastomeric Connectors" 931Nicholas Creighton and Hitoshi Ando, Shin-Etsu Polymer

TECHNICAL SESSION 15

High-Speed Circuitry Issues in Design, Assembly and Test

Chairman: W. Kinzy Jones, President, ISHM

"Issues in Designing High Speed ICs, PCB & MCMs" 947

Ravender Goyal, Mentor Graphics

"Facts on High Speed PCB Design" 955

James Blankenhorn, President, SMT Plus, Inc.

"Assembly Constraints in High-Speed Packaging Applications" 960

Dr. Harris Charles, Supervisor, Engg. Fabrication, John Hopkins University

"Testing High Speed Circuits" 972

Dr. David Keezer, Associate Professor, EE, University of So. Florida,

College of Engineering

"Characterization of High-Speed Interconnects" 986

Scott Diamond and Stan Kaveckis, Tetronix

TECHNICAL SESSION 16

Design for TestabilityChairman: Tim Aspell, Manager, Innovative Technologies

Co-Chairman: Charles Masi, Technical Journalist, C. G. Masi Associates

"Emerging Technologies Support the Elimination of Product Testing" 995

Tim Lantz, Test Development Manager, Litton Industries

"Design for Test - Profit or Loss?" 1001

Jon Turino, President, Logical Solutions Technologies

"Automated DOT Analysis for Bare and Loaded Board Testing" 1010

Jack Luna, President, CADtest Inc.

"Design for Inspectability" 1018

Harold Wasserman, Director of Engineering, Control Automation, Inc.

"Analog Built-in Self-Test" 1036

Lahouari Sebaa, Mohammad S. Nejad, Andrew Ladick, and Henry Kuo,

Western Digital Corporation

TECHNICAL SESSION 17

Using Vision for Manufacturing Discrete Electronics

Chairman: Gary Wagner, Vice President, Automatix

"100% Inspection of Package Leads: Why it Pays to Demand it" 1047

Bill Schmidt, Product Marketing Manager, RVSI

'Vision-Guided Assembly" 2420

Philip Lamoreaux and Gary Wagner, Automatix, Inc.

"Detecting and Classifying Defects on the Surfaces of IC Packages" 1057

Dr. Larry Schmitt, Vice President of Marketing, AppliedIntelligent Systems, Inc.

"Application of Machine Vision in the Assembly of Discrete Electronics" 1067

Dan Krage, OEM Motion Accounts Manager, Adept Technology, Inc.

"Uses of Vision in SMT Process Control" • • •1080

Stephen Kress, Product Marketing Specialist, Cognex Corporation

This session is sponsored by the Automated Imaging Association (AIA).

TECHNICAL SESSION 18

New Developments in Solders and Solder Interconnections

Chairman: Dr. Jennie Hwang, President & CEO, IEM-Fusion, Inc.

"Ceramic Solder Grid Array Interconnections Reliability Over a

Wide Temperature Range" 1087

David Gerke, Motorola

"Reflow Cooling Rate vs. Solder Joint Integrity Part I" 1095

Dr. Jennie Hwang and Dr. Zhenfeng Guo, IEM-Fusion, Inc.

"Evaluating the Method of Measuring the Tackiness and Wettness of

Solder Paste" 1121

Tom Fujikawa, Malcom Instruments Corp.

"Fine Pitch Soldering Pad and Stencil Design" 1130

Richard Latta and Jess Asia, Micron CMS, Inc.

"Surface Mount Assembly Yield Improvement and PCB

Solderability Testing" 2399Bob Willis, Electronic Presentation Services; John Porter,Multicore Solders; Phil Hunter, Shipley UK Limited

TECHNICAL SESSION 19

VXIBus

Chairman: Ron Wolfe, VXI Product Manager, National Instruments

"VXI-Based System for Testing Satellite Sub-Assemblies:

The Next Generation" N/A

John Markowski, Honeywell, Satellite Systems Operation

"Circuit Card Test-System Modernization Using VXIbus and Lab Windows" 1145

Bo Halamandaris and Harry Kane, Litton Industries

"Test Executive Techniques for VXI-Based Systems-The Applicability of

Graphical Programming to Automated Test" 1153

Jack Barber and Michael Santori, National Instruments

"Hot Insertion/Removal of VXI Modules with a Powered VXI Mainframe" 1148

Robert Mahoney, Test Engineer, Hewlett-Packard Company

"A VXI Instrument for Primary Rate Telecommunications Test" 1165

Matthew Fichtenbaum and Robert M. Manlick, GenRad, Inc.

"Panasonic Repair Automation Tool Strategy--A User's Guide on

VXI Bus Implementation" 1176

Robert Jakaitis, Technical Liason, Panasonic

"The Evolution of VXI-Based Automatic Test Equipment (ATE)" 2413

Mike Zayac and Sean L. Kent, Westinghouse Electric Corp.

TECHNICAL SESSION 20

Design for the Environment (DFE): Product Take-back,

De-Manufacturing and Waste Minimization

Chairman: William Hoffman, III, Project Mgr., CMRC, Motorola, Inc.

"Design for the Environment-Getting Started" 1187

David Ufford, System Producibility Manager, Texas Instruments

"Profiting from Pollution Prevention through Design for the

Environment (DFM)" 1197

Edward Surette, Corp. Environmental Engr. Mgr., M/A-Com, Inc.

"Network and Data Support for DFE" N/A

Robert Ferrone, Corp. Env. Health and Safety, DigitalEquipment Corporation

"Refining and Smelting of Precious Metals from Printed Circuit

Boards: Part I" 1205

Ron Rosenson, Don Walsh and Peter Dietl, Behr Precious Metals

"Refining and Smelting of Precious Metals from Printed Circuit Boards:

Part H Environmental" 1209

Don Walsh, Executive Vice President, Behr Precious Metals

"Refining and Smelting of Precious Metals from Printed Circuit

Boards: Part III Electronic Component Retrieval from Unusable

Circuit Board Assemblies" 1212

Peter Dietl, President, Bruin Electronics

TECHNICAL SESSION 21

Successful Post-CFC Soldering and Cleaning Conversions

Chairman: William Kenyon, Du Pont Electronics

"Concurrent Implementation of Four Soldering/Cleaning Technologies for

Military Hardware Assembly" N/ACarole Ellenberger, and Joe R. Felty, Texas Instruments

"Evaluation of Water-Soluble Fluxes and Non-CFC Cleaning Alternatives

in a Cycling Humidity Environment" N/A

James Maguire, Boeing Electronics

"New Developments in Simplified, Low Cost, Semi-Aqueous Emulsion

Cleaning Technology" 1217

Rex Breunsbach, Pres. & Chief Tech. Officer, Electronic Controls Design, Inc.

"Novel Waste-Treatment Technology Applicable to Aqueous-Based Effluent

Streams from Alternative Cleaning Processes to Facilitate Compliancewith Environmental Regulations-Case Histories" 1226

Jeff Spira, President, Unit Design

"Maximizing Standard to Ultra-Fine Pitch Soldering Yields While

Minimizing Total Manufacturing Costs Through Solid-Solder-Deposit

(SSD) Technology" 1236

U. Biegcl, Peter Biegel GmbH

TECHNICAL SESSION 22

Ball Grid Array (BGA) Technology

Chairman: John Lau, Senior Engineer, Hewlett-Packard

"Development of the Slightly Larger Than IC Carrier (SLICC)" 1249

Kingshuk Banerji, Motorola, Inc.

"BGA Package Design Considerations for Solder Joint Reliability" N/A

Randy Johnson and Mike Petrucci, COMPAQ Computer Corp.

"Using Cross-Section X-Ray Techniques for Testing Ball-Grid-Array

Connections and Improving Process Quality" 1257

John Adams, Chief Scientist, Four Pi Systems

"Thermal Modeling of a Multichip BGA Package"1266

David Walshak, Jr. and Hassan Hashemi, MCC

"MCM-L Built on Ball Grid Array Formats"1277

Phil Rogren, Hestia Technologies, Inc.

TECHNICAL SESSION 23

Modern Memory Subsystems: A New Opportunity to Profit

Chairman: Cecil Ho, President, C.S.T., Inc.

"Market Trend - Memory Module and Memory Sub-Systems" N/A

Ron Seide, Director of Marketing, Kingston Technology

"Controlled Impedance Design in Memory Sub-Systems" 1285

Gary Smith, President, Momory X, Inc.

"Manufacturing Technique For Producing Memory Sub-Systems" N/A

Paul Emrick, Electro Surface Technologies

"High Volume Testing For Memory Sub-Systems" 1292

Cecil Ho, President, C.S.T., Inc.

"PCMCIA Memory Card Design & Applications" 1299

Nelson Chan, Director of Marketing, Sundisk

TECHNICAL SESSION 24

Chairman: Martin Jawitz, California Circuits Association

The chairman and speakers elected not to speak 1303

TECHNICAL SESSION 25

Conformal CoatingChairman: Dennis Derfiny, Engr. Manager-Advanced Engrg., Motorola, Inc.

"Barrier Coatings for MCM Devices" 1307

Michael Lucey, President, Micro-Lite Technology

"Conformal Coating Over Soldermask, No-Clean Soldering and Alternative

Cleaning Technologies" 1312

Barry Ritchie, Senior Eng. Specialist, Loctite Corporation

"Quality Techniques for Optimizing Parylene Conformal Coating" 1332

Roger Olson, Dir. of New Business and Tech., Specialty Coating Systems Inc.

"Environmentally Compliant Application of Conformal Coatings" 1338

Hendrik Bok and Lamar Young, Specialty Coating Systems Inc.

"Excimer Laser Ablation of Flexible Dielectric Coatings" N/A

Christopher Schreiber, Adv. Tech. IR & D Staff, Hughes Interconnect Systems

TECHNICAL SESSION 26

Users Compliance with Environmental Regulations for Wastewater and HazardousSolid Waste from Cleaning Processes 1345

Chairman: John Russo, President, Separation Technologies, Inc.

"Lead Removal from a New Aqueous Cleaning Agent Before Discharge" 1346David Benton, Hughes Corporation

"Turnkey Installation of a Two-Stage Wastewater Treatment System used

on Saponifiers Cleaning PWA Operations" 1349

Steve Gaxiola and Felix Chou, Allied Signal Aerospace

"Membrane Closed-Loop Recycling of a Wastewater ContainingHydrocarbon Ester Solvent" 1351

John Tevels, Harris Corp.

"Closed-Loop Water Recycling of Wastewater from a

Relay-Cleaning Process" 2435

William Riser, Jr., United Technologies

"Compliance and Waste Minimization Makes 'Cents'" 1353

Marvin Sachse and Donna T. Chen, City of Los Angeles Public Works

TECHNICAL SESSION 27

Device and Board-level Inspection Issues and TechniquesChairman: John Flaherty, Technical Editor, Test and Measurement World

"Application of Reverse-Geometry X-Ray Technology to PCB Inspection" 1371

Tom Albert, Marketing Director, Digiray Corporation

"Using Cross-Sectional X-Ray Techniques for Testing Ball-Grid-ArrayConnections and Improving Process Quality" 1373

John Adams, Chief Scientist, Four Pi Systems

"Assessing and Solving Lifted Leads Under CoplanarityConsiderations in SMT" 1382

Yuan Guo and Peter C. Randklev, EMD Associates, Inc.

"Ultraboard: A Case Study Surrounding the Development of an Automated

C-Mode Scanning Acoustic Microscope (C-SAM) for Detecting Surface

Mounted Component Flaws" 1392

Donald Commare and Ray E. Thomas, Sonoscan, Inc.

"The Emerging Role of 3-D Measurement Technology on Ultra-Fine

Pitch Assembly" N/A

Earl Rideout, Vice President/General Manager, RVSI

"Infrared Inspection Technique for PCBs and Devices"

Jerry Schiagheck, Cincinnati Electronics

N/A

TECHNICAL SESSION 28

Electrostatic Discharge (ESD) Control in the 90's

Chairman: Steve Koehn, Advanced Engr., 3M

"US & Global ESD Standards" 1403

Ed Weggeland, Vice President, Richmond Technologies, Inc.

"The 4 Basic Rules for an Effective ESD Program" 1407

David Swenson, Int'l Technical Service Mgr., 3 M Corporation

"Packaging Fundamentals for ESD Sensitive Products" 1417

Ronald Gibson, Staff Engineer, IBM Canada, Ltd.

"Device Testing for ESD Standards" 1428

Les Avery, Senior Member-Technical Staff, David Sarnoff Research Ctr.

"Hands-on ESD Testing Laboratory Demonstration" 2419

Steve Koehn, Advanced Engr., 3M

This session is sponsored by the EOS/ESD Association.

TECHNICAL SESSION 29

Wave-Soldering with VOC-Free No-Clean Fluxes

Chairman: Alvin Schneider, Dir. Chemical Research & Dev., Alpha Metals, Inc.

"The Development of VOC-Free No-Clean Fluxes" 1444

Alvin Schneider, Dir. Chemical Research & Dev., Alpha Metals, Inc.

"Wave-Soldering Machine Issues For The No-Clean Process" 1452

William Down, Technical Director, Electrovert USA Corporation

"Wave-Soldering Performance and Optimization of VOC-Free No-Clean Flux" 1456

Eric Fremd, Solectron and John Ivankovits and Christine Dong,Air Products and Chemicals

"Implementing VOC-Free Low Solids Flux Into Manufacturing" 1481

Mark Walker and Vince Thompson, Mitel Corporation

"Use of VOC-Free No-Clean Fluxes in Manufacturing: The Next

Environmental Success Story" , N/A

Cheryl Tulkoff, Senior Associate Eng., IBM

TECHNICAL SESSION 30

Direct Chip Attach on Low-Cost Substrates

Chairman: John Lau, Senior Engineer, Hewlett-Packard

"Robust Encapsulation for Chip-On-Board Applications" 1493

Larry White and Darbha Suryanarayana, IBM

"New General Encapsulants for Chips on Low-Cost First-Level Substrates" 1503

Art Burkhart, Chris Naito and Bradley Goodrich, Dexter Electronics Materials

"Techniques for Optimizing DCA Encapsulation Process" 1512

Robert Pennisi, Bobby Dean Landreth, and Dale Robinson, Motorola, Inc.

"Organic Carrier Requirements for Flip-Chip Assemblies" 1519

Julian Partridge and Puligandla Viswanadham, IBM PC Company

"Development of Large High I/O Flip-Chip Technology" 1527

Tom Chung, David Carey and Bob Gardner, MCC

"Flip Chip on Flexible Substrates" N/ABarbar Gibson, Cherry Semiconductors

"Competing Technologies for SMT: Direct-Chip-Attach Using Flip Chip,

Wirebond, or TAB" 1537

Don Franck and Michael Testani, DOVatron International

TECHNICAL SESSION 31

Thermal Management in Electronics

Chairman: Richard Nelson, MCC Corp.

"Thermal Management of C4 Surface-Mount-Array Interconnect

Technologies: A One-Dimensional Model" 1553

Gary Kromann, Motorola

"Adhesives for Thermal Enhancement of Surface-Mount Plastic

Electronic Packages"1560

Michael Gaynes, H. Shaukatullah, IBM Corporation

"Thermal Management of High-Power Multi-Chip Modules for Next

Generation Workstations" 1^70

Thomas Dolbear, Jon Zimmerman and Richard Nelson, MCC

"Combining System-, PCB- and MCM-level Thermal Analysis: At Last, a

Look at the Whole Picture"15S0

Dan Wolff, Mentor Graphics Corp.

TECHNICAL SESSION 32

Fine- and Ultra-Fine-Pitch TechnologyChairmen: Phil Zarrow and Debra Kopp, Integrated Technology Group

"Improved Productivity through Fine-Pitch Dispensing" 1589

Patricia Waitkus and Kevin Gaugler, ESP Solder Plus

"Comparative Analysis of Stencil Technologies for Fine-Pitch and

Ultra-Fine-Pitch Printing" N/A

Richard Clouthier, AMTX-Advanced Micro Tech.

"Alternative Solder Paste Application for Ultra Fine Pitch" 1596

Donald Burr and Mike Buscman, Unisys Corporation

"Fine Pitch Rework and Repair-Process Modeling" 1601

Joe Mearig, Electronic Manufacturing Productivity Facility

TECHNICAL SESSION 33

Advances in UV Processes for Electronics

Chairman: John Beasley, California Sales Manager, EFOS Inc.

"Technology of UV-Cured, Coating, Decorating and Bonding in Electronic

Manufacturing"Richard Stowe, Mgr, of Product Development, Fusion Systems, Inc.

"New Developments in ODC-Free UV Curing, Coatings and Adhesives"..

Dr. Steve Cantor and Farre Huang, Dymax Corporation

"Process Control and Measurement: Key Factors Insuring the Success of

UV-Curing Adhesives, Sealants and Encapsulants" 1635

Christy Marinelli and Gregory Marinelli, Loctite Corporation

"UV-Curable Barrier Coatings for MCM's" , . , .1648

Michael Lucey, President, Micro-Lite Technology

"Automation In UV Process for Electronics: How to Design for Them" 1655

Robert Alvarez, President, Base Technology and Pierre Metivier, ASI

"Ultra-Violet Spot Curing: An In-Line and Off-Line Spot-Cure Approach" 1661

John Beasley, California Sales Manager, EFOS Inc.

1611

1620