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University of Southern California USC REVIEW OF THIS MATERIAL DOES NOT IMPLY DEPARTMENT OF DEFENSE INDORSEMENT OF FACTUAL ACCURACY OR OPINION APPROVED FOR PUBLIC RELEASE, DISTRIBUTION UNLIMITED Nanophotonics and Nanophotonics and Microcavities Microcavities for for Dense WDM Systems Dense WDM Systems Dan Dapkus and John O’Brien The Photonics Center @ USC

Nanophotonics and Microcavities for Dense WDM Systems fileDan Dapkus and John O’Brien The Photonics Center @ USC. Report Documentation Page Form Approved OMB No. 0704-0188 Public

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University of Southern California

USC

REVIEW OF THIS MATERIAL DOES NOT IMPLY DEPARTMENT OF DEFENSE INDORSEMENT OF FACTUAL ACCURACY OR OPINION

APPROVED FOR PUBLIC RELEASE, DISTRIBUTION UNLIMITED

Nanophotonics and Nanophotonics and Microcavities Microcavities forforDense WDM SystemsDense WDM Systems

Dan Dapkus and John O’BrienThe Photonics Center @ USC

Report Documentation Page Form ApprovedOMB No. 0704-0188

Public reporting burden for the collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering andmaintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, ArlingtonVA 22202-4302. Respondents should be aware that notwithstanding any other provision of law, no person shall be subject to a penalty for failing to comply with a collection of information if itdoes not display a currently valid OMB control number.

1. REPORT DATE 18 APR 2000

2. REPORT TYPE N/A

3. DATES COVERED -

4. TITLE AND SUBTITLE Nanophotonics and Microcavities for Dense WDM Systems

5a. CONTRACT NUMBER

5b. GRANT NUMBER

5c. PROGRAM ELEMENT NUMBER

6. AUTHOR(S) 5d. PROJECT NUMBER

5e. TASK NUMBER

5f. WORK UNIT NUMBER

7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) University of Southern California

8. PERFORMING ORGANIZATIONREPORT NUMBER

9. SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSOR/MONITOR’S ACRONYM(S)

11. SPONSOR/MONITOR’S REPORT NUMBER(S)

12. DISTRIBUTION/AVAILABILITY STATEMENT Approved for public release, distribution unlimited

13. SUPPLEMENTARY NOTES DARPA/MTO, WDM for Military Platforms Workshop held in McLean, VA on April 18-19, 2000, Theoriginal document contains color images.

14. ABSTRACT

15. SUBJECT TERMS

16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF ABSTRACT

UU

18. NUMBEROF PAGES

14

19a. NAME OFRESPONSIBLE PERSON

a. REPORT unclassified

b. ABSTRACT unclassified

c. THIS PAGE unclassified

Standard Form 298 (Rev. 8-98) Prescribed by ANSI Std Z39-18

University of Southern California

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REVIEW OF THIS MATERIAL DOES NOT IMPLY DEPARTMENT OF DEFENSE INDORSEMENT OF FACTUAL ACCURACY OR OPINION

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Integrated NanophotonicIntegrated NanophotonicTechnologyTechnology

Photonic Crystal Defect Photonic Crystal Defect NanolasersNanolasers Photonic Crystal Photonic Crystal Waveguide Waveguide ComponentsComponents

Active and PassiveActive and Passiveµµµµµµµµ resonator resonatorComponentsComponents

QW and QD Active RegionsQW and QD Active Regions

University of Southern California

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REVIEW OF THIS MATERIAL DOES NOT IMPLY DEPARTMENT OF DEFENSE INDORSEMENT OF FACTUAL ACCURACY OR OPINION

APPROVED FOR PUBLIC RELEASE, DISTRIBUTION UNLIMITED

µµµµµµµµ Disk and Photonic Crystal Devices Disk and Photonic Crystal Devicesfor DWDM Systemsfor DWDM Systems

• High Density Integrated SystemsVLSI Photonic Integrated Circuits

• Compact, Low Power ComponentsMillimeters Microns

• Single or Multi-wavelength ResonantComponents

• New Functionality in Active Components

University of Southern California

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REVIEW OF THIS MATERIAL DOES NOT IMPLY DEPARTMENT OF DEFENSE INDORSEMENT OF FACTUAL ACCURACY OR OPINION

APPROVED FOR PUBLIC RELEASE, DISTRIBUTION UNLIMITED

Integrable Integrable NanophotonicNanophotonicComponentsComponents

!! DWDM DWDM µµµµµµµµ-Disk and -Disk and Nanolasers Nanolasers and Arraysand Arrays!! Tunable LasersTunable Lasers!! DispersiveDispersive, , SuperprismSuperprism Propagation Propagation!! Low Voltage, High Bit Rate ModulatorsLow Voltage, High Bit Rate Modulators!! Wavelength Selective SwitchesWavelength Selective Switches!! Narrow Band Tunable Filters and DetectorsNarrow Band Tunable Filters and Detectors!! Wavelength Selective Couplers and SplittersWavelength Selective Couplers and Splitters!! Chemical and Biological Sensor ElementsChemical and Biological Sensor Elements!! Waveguide to Fiber CouplersWaveguide to Fiber Couplers

University of Southern California

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APPROVED FOR PUBLIC RELEASE, DISTRIBUTION UNLIMITED

Nanophotonic Technologies

•• High Q ResonatorsHigh Q Resonators""Heterogeneous IntegrationHeterogeneous Integration""Electron Beam LithographyElectron Beam Lithography""Highly Asymmetric Dry EtchingHighly Asymmetric Dry Etching""Selective Area EpitaxySelective Area Epitaxy""QW and QD Active RegionsQW and QD Active Regions

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Selectively Grown Active RegionsSelectively Grown Active Regions

0 10 20 30 40 501.54

1.56

1.58

1.60

1.62

1.64

1.66

1.68

Lasi

ng W

avel

engt

h [ µ µµµ

m]

SAG stripe width [µµµµm], W

- 1000 µµµµm - 800 µµµµm - 750 µµµµm - 500 µµµµm - 400 µµµµm

I2,λλλλ2

I1,λλλλ1

Si3N4

W W

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After Lithography After RIE Etch

r = 135 nma = 400 nm

Resonant Cavity Structures

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Top Views of GaAs PBGs after ECR etch

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Magnitude of the Electric Field in the Defect Cavity

top view

cross section

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One-Dimensional Lattices

"!v g = ∇ "!

k ω(k)

sample after lithography dispersion surface

Superprism effect can be used for routing or multiplexing/demultiplexing

University of Southern California

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Magnitude of the Electric Field in the Defect Cavity

top

bottom

top

bottom

symmetric cladding asymmetric cladding

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µ Resonator Structuresµ Resonator Structures

λλλλres2

λλλλres .

λλλλ1111,λ,λ,λ,λ2222, ...,, ...,, ...,, ...,λλλλres,................λλλλΝΝΝΝ

λλλλ1111,λ,λ,λ,λ2222, ....., ....., ....., .....λλλλΝΝΝΝ

λλλλ1111,λ,λ,λ,λ2222, ...,, ...,, ...,, ...,λλλλres,................λλλλΝΝΝΝ

λλλλres

λλλλ1111,λ,λ,λ,λ2222, ....., ....., ....., .....λλλλΝΝΝΝ

λλλλres1, λλλλres2

λλλλres1

Resonant Filter / Switch Resonant Y or Splitter

Resonant T or Splitter

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Vertical Coupler Fabricated byVertical Coupler Fabricated byHeterogeneous IntegrationHeterogeneous Integration

λλλλi

λλλλ1...λλλλN

λλλλ1.λλλλi-1..λλλλN

Laterally Coupled Disk • Air Couping • Sub Micron Control

��������������������������������������������

��������������������������������������������

������������������������������

������������������������������

OLD NEW

Vertically Coupled Disk • Epi Layer Coupling • Control Coupling by Epilayer Thickness

Transfer Substrate

Resonant Disk

Waveguides

• Add-Drop Filters• Resonant Detectors• Integrated Lasers• Resonant Modulators

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µµµµµµµµ Disk Resonant Components Disk Resonant Components

1560155015401530

Wavelength, nm

2

6

20

60

Sign

al In

tens

ity (a

rb u

nits

)

R = 20 µm

Passive Passive µµµµµµµµ disk coupler disk coupler

Active Active µµµµµµµµ disk disk tunable filter / switchtunable filter / switch

Tran

smitt

ed P

ower

6 8

0.1

2

4

6 8

1No bias

Biased to transparency

Wavelength (nm)1530 1540 1550 1560 1570