N- And P-Channel Enhancement Mode MOSFET MTC3588BDFA6 N-CH … · 2019. 3. 14. · CYStech Electronics Corp. Spec. No. : C102DFA6 Issued Date : 2015.12.03 Revised Date : 2018.05.03

CYStech Electronics Corp. Spec. No. : C102DFA6 Issued Date : 2015.12.03 Revised Date : 2018.05.03 Page No. : 1/13

MTC3588BDFA6 CYStek Product Specification

N- And P-Channel Enhancement Mode MOSFET

MTC3588BDFA6

Description The MTC3588BDFA6 consists of a N-channel and a P-channel enhancement-mode MOSFET in a single DFN2*2-6L package, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DFN2*2-6L package is universally preferred for all commercial-industrial surface mount applications.

Features • Simple drive requirement • Fast switching speed • Pb-free lead plating and halogen-free package • Low gate charge • Low on-resistance

Equivalent Circuit Outline

Ordering Information

Device Package Shipping

MTC3588BDFA6-0-T1-G DFN2×2-6L (Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel

MTC3588BDFA6

DFN2×2-6L

G：Gate S：Source D：Drain

N-CH P-CH BVDSS 14V -14V ID 6A(VGS=4.5V) -4A(VGS=-4.5 V)

16.6mΩ(VGS=4.5V) 43mΩ(VGS=-4.5V) 23.7mΩ(VGS=2.5V) 63.6mΩ(VGS=-2.5V) 38.5mΩ(VGS=1.8V) 86.5mΩ(VGS=-1.8V) RDSON(TYP.)

66.3mΩ(VGS=1.5V) 153.3mΩ(VGS=-1.5V)

Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel

Product rank, zero for no rank products Product name



Absolute Maximum Ratings (Ta=25°C) Limits Parameter Symbol N-channel P-channel Unit

Drain-Source Breakdown Voltage BVDSS 14 -14 Gate-Source Voltage VGS ±8 ±8

V

Continuous Drain Current @TA=25 °C (Note 1) 6.0 -4.0 Continuous Drain Current @TA=70 °C (Note 1)

ID 4.8 -3.2

Pulsed Drain Current (Note 2) IDM 30 -20 A

PD 1.38 W Total Power Dissipation (Note 1) Linear Derating Factor 0.01 W / °C Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C

Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec 2.Pulse width limited by maximum junction temperature

Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max RθJC 80 Thermal Resistance, Junction-to-ambient, max RθJA 90 (Note ) °C/W

Note :.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec; 195°C/W when mounted on minimum copper pad

N-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions

Static BVDSS 14 - - V VGS=0V, ID=250μA

∆BVDSS/∆Tj - 8 - mV/°C Reference to 25°C, ID=1mA VGS(th) 0.5 0.7 1.2 V VDS=VGS, ID=250μA IGSS - - ±100 nA VGS=±8V, VDS=0V

- - 1 VDS=12V, VGS=0V IDSS - - 10 μA VDS=10V, VGS=0V, Tj=70°C - 16.6 26 VGS=4.5V, ID=5A - 23.7 33 VGS=2.5V, ID=4.6A - 38.5 74 VGS=1.8V, ID=4.1A

*RDS(ON)

- 66.3 114

mΩ

VGS=1.5V, ID=2A *GFS - 5.6 - S VDS=5V, ID=3A

Dynamic Ciss - 407 - Coss - 115 - Crss - 100 -

pF VDS=10V, VGS=0V, f=1MHz

*td(ON) - 5 - *tr - 18.8 -

*td(OFF) - 49.6 - *tf - 30.8 -

ns VDS=10V, ID=1A, VGS=5V, RG=3.3Ω



*Qg - 6.5 - *Qgs - 0.7 - *Qgd - 2.3 -

nC VDS=10V, ID=3A, VGS=4.5V

Rg - 1 - Ω f=1MHz Source-Drain Diode

*VSD - 0.87 1.2 V VGS=0V, IS=5.2A *trr - 12 - ns *Qrr - 2.3 - nC IF=3A, VGS=0V, dIF/dt=100A/μs

*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

P-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified)

Symbol Min. Typ. Max. Unit Test Conditions Static

BVDSS -14 - - V VGS=0V, ID=-250μA ∆BVDSS/∆Tj - -5 - mV/°C Reference to 25°C, ID=-250μA

VGS(th) -0.4 - -1.0 V VDS=VGS, ID=-250μA IGSS - - ±100 nA VGS=±8V, VDS=0V

- - -1 VDS=-12V, VGS=0V IDSS - - -10 μA VDS=-10V, VGS=0V, Tj=70°C - 43 56 VGS=-4.5V, ID=-3.6A - 63.6 79 VGS=-2.5V, ID=-3.2A - 86.5 168 VGS=-1.8V, ID=-1A

*RDS(ON)

- 153.3 276

mΩ

VGS=-1.5V, ID=-1A *GFS - 5.6 - S VDS=-5V, ID=-2A

Dynamic Ciss - 561 - Coss - 153 - Crss - 142 -

pF VDS=-10V, VGS=0V, f=1MHz

*td(ON) - 5 - *tr - 18.8 -

*td(OFF) - 49.6 - *tf - 30.8 -

ns VDS=-10V, ID=-1A, VGS=-5V, RG=3.3Ω

*Qg - 8 - *Qgs - 1 - *Qgd - 2.8 -

nC VDS=-10V, ID=-2A, VGS=-4.5V

Rg - 9.3 - Ω f=1MHz Source-Drain Diode

*VSD - -0.9 -1.2 V VGS=0V, IS=-3.4A *trr - 27 - ns *Qrr - 7 - nC IF=-2A, VGS=0V, dIF/dt=100A/μs

*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%



N-channel Typical Characteristics

Typical Output Characteristics

0

5

10

15

20

25

30

0 1 2 3 4 5VDS, Drain-Source Voltage(V)

I D, D

rain

Cur

rent

(A)

VGS=1.5V

VGS=2V

5V, 4V, 3.5V, 3V

VGS=2.5V

Brekdown Voltage vs Ambient Temperature

0.4

0.6

0.8

1

1.2

1.4

-75 -50 -25 0 25 50 75 100 125 150 175

Tj, Junction Temperature(°C)

BV

DS

S, N

orm

aliz

ed D

rain

-Sou

rce

Bre

akdo

wn

Vol

tage

ID=250μA, VGS=0V

Static Drain-Source On-State resistance vs Drain Current

10

100

1000

0.01 0.1 1 10 100ID, Drain Current(A)

RD

S(o

n), S

tati

c D

rain

-Sou

rce

On-

Sta

teR

esis

tanc

e(m

Ω)

VGS=1.8VVGS=1.5V

VGS=4.5V

VGS=2.5V

Reverse Drain Current vs Source-Drain Voltage

0.2

0.4

0.6

0.8

1

1.2

0 1 2 3 4 5 6 7 8 9 10

IDR, Reverse Drain Current(A)

VS

D, S

ourc

e-D

rain

Vol

tage

(V)

Tj=25°C

Tj=150°C

VGS=0V

Static Drain-Source On-State Resistance vs Gate-Source

Voltage

0

20

40

60

80

100

120

140

160

180

200

0 1 2 3 4 5VGS, Gate-Source Voltage(V)

RD

S(o

n), S

tati

c D

rain

-Sou

rce

On-

Sta

te R

esis

tanc

e(m

Ω)

ID=5A

Drain-Source On-State Resistance vs Junction Tempearture

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

-75 -50 -25 0 25 50 75 100 125 150 175


RD

S(o

n), N

orm

aliz

ed S

tati

c D

rain

-S

ourc

e O

n-S

tate

Res

ista

nce

VGS=4.5V, ID=5A

RDS(ON)@Tj=25°C :16.6mΩ



N-channel Typical Characteristics(Cont.)

Capacitance vs Drain-to-Source Voltage

10

100

1000

0 1 2 3 4 5 6 7 8 9 10VDS, Drain-Source Voltage(V)

Cap

acit

ance

---(

pF)

Coss

Ciss

Crss

Threshold Voltage vs Junction Tempearture

0.4

0.6

0.8

1

1.2

1.4

1.6

-75 -50 -25 0 25 50 75 100 125 150 175


VG

S(t

h), N

orm

aliz

edT

hres

hold

Vol

tage

ID=250μA

ID=1mA

Single Pulse Power Rating, Junction to Ambient

0

10

20

30

40

50

0.001 0.01 0.1 1 10 100

Pulse Width(s)

Pow

er (

W)

TJ(MAX)=150°C

TA=25°C

RθJA=90°C/W

Gate Charge Characteristics

0

2

4

6

8

10

0 2 4 6 8 10 12 14

Qg, Total Gate Charge(nC)

VG

S, G

ate-

Sou

rce

Vol

tage

(V)

ID=3A

VDS=10V

Maximum Safe Operating Area

0.01

0.1

1

10

100

0.01 0.1 1 10 100

VDS, Drain-Source Voltage(V)

I D, D

rain

Cur

rent

(A)

DC

10ms

100ms

1ms

100μs

TA=25°C, Tj=150°C,

VGS=4.5V, RθJA=90°C/W

Single Pulse

RDS(ON)Limited

Maximum Drain Current vs JunctionTemperature

0

1

2

3

4

5

6

25 50 75 100 125 150 175Tj, Junction Temperature(°C)

I D, M

axim

um D

rain

Cur

rent

(A)

TA=25°C, VGS=4.5V, RθJA=90°C/W



N-channel Typical Characteristics(Cont.)

Typical Transfer Characteristics

0

5

10

15

20

25

30

0 1 2 3 4 5VGS, Gate-Source Voltage(V)

I D, D

rain

Cur

rent

(A)

VDS=5V

Forward Transfer Admittance vs Drain Current

0.01

0.1

1

10

0.001 0.01 0.1 1 10

ID, Drain Current(A)

GF

S, F

orw

ard

Tra

nsfe

r A

dmit

tanc

e(S

)

VDS=5V

Pulsed

Ta=25°C

Transient Thermal Response Curves

0.001

0.01

0.1

1

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02

t1, Square Wave Pulse Duration(s)

r(t),

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Single Pulse

0.01

0.02

0.05

0.1

0.2

D=0.5

1.RθJA(t)=r(t)*RθJA2.Duty Factor, D=t1/t2

3.TJM-TA=PDM*RθJA(t)

4.RθJA=90°C/W



P-channel Typical Characteristics

Typical Output Characteristics

0

4

8

12

16

20

0 1 2 3 4 5-VDS, Drain-Source Voltage(V)

-ID, D

rain

Cur

rent

(A

)

-VGS=2.5V

-VGS=2V

-VGS=3V

5V, 4V

-VGS=1.5V

Brekdown Voltage vs Ambient Temperature

0.4

0.6

0.8

1

1.2

1.4

1.6

-75 -50 -25 0 25 50 75 100 125 150 175


-BV

DS

S, N

orm

aliz

ed D

rain

-Sou

rce

Bre

akdo

wn

Vol

tage

ID=-250μA, VGS=0V

Static Drain-Source On-State resistance vs Drain Current

10

100

1000

0.01 0.1 1 10-ID, Drain Current(A)

RD

S(o

n), S

tati

c D

rain

-Sou

rce

On-

Sta

teR

esis

tanc

e(m

Ω)

VGS=-1.8VVGS=-1.5V

VGS=-2.5V VGS=-4.5V

Reverse Drain Current vs Source-Drain Voltage

0.2

0.4

0.6

0.8

1

1.2

0 2 4 6 8 10

-IDR, Reverse Drain Current (A)

-VS

D, S

ourc

e-D

rain

Vol

tage

(V) Tj=25°C

Tj=150°C

VGS=0V

Static Drain-Source On-State Resistance vs Gate-Source

Voltage

0

50

100

150

200

250

300

0 1 2 3 4 5-VGS, Gate-Source Voltage(V)

RD

S(O

N),

Sta

tic

Dra

in-S

ourc

e O

n-S

tate

Res

ista

nce(

mΩ

)

ID=-3.6A

Drain-Source On-State Resistance vs Junction Tempearture

0.4

0.6

0.8

1

1.2

1.4

1.6

-75 -50 -25 0 25 50 75 100 125 150 175


RD

S(O

N),

Nor

mal

ized

Sta

tic

Dra

in-

Sou

rce

On-

Sta

te R

esis

tanc

e VGS=-4.5V, ID=-3.6A

RDS(ON)@Tj=25°C : 43mΩ



P-channel Typical Characteristics(Cont.) Capacitance vs Drain-to-Source Voltage

100

1000

0 2 4 6 8 10-VDS, Drain-Source Voltage(V)

Cap

acit

ance

---(

pF)

Coss

Ciss

Crss

Threshold Voltage vs Junction Tempearture

0.4

0.6

0.8

1

1.2

1.4

-75 -50 -25 0 25 50 75 100 125 150 175


-VG

S(t

h),N

orm

aliz

ed T

hres

hold

Vol

tage

ID=-250μA

ID=-1mA

Single Pulse Power Rating, Junction to Ambient

0

10

20

30

40

50

0.001 0.01 0.1 1 10 100Pulse Width(s)

Pow

er (

W)

TJ(MAX)=150°C

TA=25°C

RθJA=90°C/W

Gate Charge Characteristics

0

2

4

6

8

10

0 2 4 6 8 10 12 14 16

Qg, Total Gate Charge(nC)

-VG

S, G

ate-

Sou

rce

Vol

tage

(V)

VDS=-10V

ID=-2A

Maximum Safe Operating Area

0.01

0.1

1

10

100

0.01 0.1 1 10 100-VDS, Drain-Source Voltage(V)

-ID, D

rain

Cur

rent

(A

)

DC

10ms

100ms

1ms

100μsRDS(ON)Limited

TA=25°C, Tj=150°C,

VGS=-4.5V, RθJA=90°C/W

Single Pulse

Maximum Drain Current vs JunctionTemperature

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

25 50 75 100 125 150 175Tj, Junction Temperature(°C)

-ID, M

axim

um D

rain

Cur

rent

(A)

TA=25°C, VGS=-4.5V, RθJA=90°C/W



P-channel Typical Characteristics(Cont.) Typical Transfer Characteristics

0

4

8

12

16

20

0 1 2 3 4 5-VGS, Gate-Source Voltage(V)

-ID, D

rain

Cur

rent

(A)

VDS=-5V

Forward Transfer Admittance vs Drain Current

0.01

0.1

1

10

0.001 0.01 0.1 1 10

-ID, Drain Current(A)

GF

S, F

orw

ard

Tra

nsfe

r A

dmit

tanc

e-(S

)

VDS=-5V

Pulsed

Ta=25°C

Transient Thermal Response Curves

0.001

0.01

0.1

1

0.0001 0.001 0.01 0.1 1 10 100 1000

t1, Square Wave Pulse Duration(s)

r(t),

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e

Single Pulse

0.01

0.02

0.05

0.1

0.2

D=0.5

1.RθJA(t)=r(t)*RθJA2.Duty Factor, D=t1/t2

3.TJM-TA=PDM*RθJA(t)

4.RθJA=90°C/W

Recommended Soldering Footprint



Reel Dimension



Carrier Tape Dimension



Recommended wave soldering condition Product Peak Temperature Soldering Time

Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow

Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate

(Tsmax to Tp) 3°C/second max. 3°C/second max.

Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max)

100°C 150°C

60-120 seconds

150°C 200°C

60-180 seconds Time maintained above:

−Temperature (TL) − Time (tL)

183°C

60-150 seconds

217°C

60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C

Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds

Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max.

Note : All temperatures refer to topside of the package, measured on the package body surface.



DFN2×2-6L Dimension

Millimeters Inches Millimeters Inches DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A 0.700 0.800 0.028 0.031 E1 0.520 0.720 0.020 0.028

A1 0.000 0.050 0.000 0.002 k 0.200 - 0.008 - A3 0.203 REF 0.008 REF b 0.250 0.350 0.010 0.014 D 1.900 2.100 0.075 0.083 e 0.650 TYP 0.026 TYP E 1.900 2.100 0.075 0.083 L 0.200 0.300 0.008 0.012

D1 0.900 1.100 0.035 0.043 Notes : 1.Controlling dimension : millimeters.

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material : • Lead :Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:

6-Lead DFN2×2-6L Plastic Surface Mounted Package

CYStek Package Code: DFA6

Style: Pin 1. Source1 (S1) Pin 2. Gate 1 (G1) Pin 3. Drain2 (D2) Pin 4. Source2 (S2) Pin 5. Gate2 (G2) Pin 6. Drain1 (D1)

Device Name

Date Code

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Documents

N- And P-Channel Enhancement Mode MOSFET MTC3588BDFA6 N-CH … · 2019. 3. 14. · CYStech Electronics Corp. Spec. No. : C102DFA6 Issued Date : 2015.12.03 Revised Date : 2018.05.03