8
Semiconductor Components Industries, LLC, 2000 March, 2000 – Rev. 3 1 Publication Order Number: MC14093B/D The MC14093B Schmitt trigger is constructed with MOS P–channel and N–channel enhancement mode devices in a single monolithic structure. These devices find primary use where low power dissipation and/or high noise immunity is desired. The MC14093B may be used in place of the MC14011B quad 2–input NAND gate for enhanced noise immunity or to “square up” slowly changing waveforms. Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving Two Low–Power TTL Loads or One Low–Power Schottky TTL Load Over the Rated Temperature Range Triple Diode Protection on All Inputs Pin–for–Pin Compatible with CD4093 Can be Used to Replace MC14011B Independent Schmitt–Trigger at each Input MAXIMUM RATINGS (Voltages Referenced to V SS ) (Note 2.) Symbol Parameter Value Unit V DD DC Supply Voltage Range – 0.5 to +18.0 V V in , V out Input or Output Voltage Range (DC or Transient) – 0.5 to V DD + 0.5 V I in , I out Input or Output Current (DC or Transient) per Pin ± 10 mA P D Power Dissipation, per Package (Note 3.) 500 mW T A Ambient Temperature Range – 55 to +125 °C T stg Storage Temperature Range – 65 to +150 °C T L Lead Temperature (8–Second Soldering) 260 °C 2. Maximum Ratings are those values beyond which damage to the device may occur. 3. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, V in and V out should be constrained to the range V SS (V in or V out ) V DD . Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V SS or V DD ). Unused outputs must be left open. http://onsemi.com A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week Device Package Shipping ORDERING INFORMATION MC14093BCP PDIP–14 2000/Box MC14093BD SOIC–14 2750/Box MC14093BDR2 SOIC–14 2500/Tape & Reel MC14093BDT TSSOP–14 MC14093BF SOEIAJ–14 96/Rail See Note 1. MARKING DIAGRAMS 1 14 PDIP–14 P SUFFIX CASE 646 MC14093BCP AWLYYWW SOIC–14 D SUFFIX CASE 751A TSSOP–14 DT SUFFIX CASE 948G 1 14 14093B AWLYWW 14 093B ALYW 1 14 SOEIAJ–14 F SUFFIX CASE 965 1 14 MC14093B AWLYWW MC14093BFEL SOEIAJ–14 See Note 1. 1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative. MC14093BDTR2 TSSOP–14 2500/Tape & Reel MC14093BDTEL TSSOP–14 2000/Tape & Reel

Mc 14093

Embed Size (px)

Citation preview

Page 1: Mc 14093

Semiconductor Components Industries, LLC, 2000

March, 2000 – Rev. 31 Publication Order Number:

MC14093B/D

�������

� �� ����� � !�� �������� �������

The MC14093B Schmitt trigger is constructed with MOSP–channel and N–channel enhancement mode devices in a singlemonolithic structure. These devices find primary use where low powerdissipation and/or high noise immunity is desired. The MC14093Bmay be used in place of the MC14011B quad 2–input NAND gate forenhanced noise immunity or to “square up” slowly changingwaveforms.

• Supply Voltage Range = 3.0 Vdc to 18 Vdc

• Capable of Driving Two Low–Power TTL Loads or One Low–PowerSchottky TTL Load Over the Rated Temperature Range

• Triple Diode Protection on All Inputs

• Pin–for–Pin Compatible with CD4093

• Can be Used to Replace MC14011B

• Independent Schmitt–Trigger at each Input

MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)

Symbol Parameter Value Unit

VDD DC Supply Voltage Range –0.5 to +18.0 V

Vin, Vout Input or Output Voltage Range(DC or Transient)

–0.5 to VDD + 0.5 V

Iin, Iout Input or Output Current(DC or Transient) per Pin

±10 mA

PD Power Dissipation,per Package (Note 3.)

500 mW

TA Ambient Temperature Range –55 to +125 °C

Tstg Storage Temperature Range –65 to +150 °C

TL Lead Temperature(8–Second Soldering)

260 °C

2. Maximum Ratings are those values beyond which damage to the devicemay occur.

3. Temperature Derating:Plastic “P and D/DW” Packages: – 7.0 mW/�C From 65�C To 125�C

This device contains protection circuitry to guard against damage due to highstatic voltages or electric fields. However, precautions must be taken to avoidapplications of any voltage higher than maximum rated voltages to thishigh–impedance circuit. For proper operation, Vin and Vout should be constrainedto the range VSS � (Vin or Vout) � VDD.

Unused inputs must always be tied to an appropriate logic voltage level (e.g.,either VSS or VDD). Unused outputs must be left open.

http://onsemi.com

A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week

Device Package Shipping

ORDERING INFORMATION

MC14093BCP PDIP–14 2000/Box

MC14093BD SOIC–14 2750/Box

MC14093BDR2 SOIC–14 2500/Tape & Reel

MC14093BDT TSSOP–14

MC14093BF SOEIAJ–14

96/Rail

See Note 1.

MARKINGDIAGRAMS

1

14PDIP–14P SUFFIXCASE 646

MC14093BCPAWLYYWW

SOIC–14D SUFFIX

CASE 751A

TSSOP–14DT SUFFIXCASE 948G

1

14

14093BAWLYWW

14093BALYW

1

14

SOEIAJ–14F SUFFIXCASE 965

1

14

MC14093BAWLYWW

MC14093BFEL SOEIAJ–14 See Note 1.

1. For ordering information on the EIAJ version ofthe SOIC packages, please contact your localON Semiconductor representative.

MC14093BDTR2 TSSOP–14 2500/Tape & Reel

MC14093BDTEL TSSOP–14 2000/Tape & Reel

Page 2: Mc 14093

MC14093B

http://onsemi.com2

PIN ASSIGNMENT

11

12

13

14

8

9

105

4

3

2

1

7

6

OUTC

OUTD

IN 1D

IN 2D

VDD

IN 1C

IN 2C

OUTB

OUTA

IN 2A

IN 1A

VSS

IN 2B

IN 1B

LOGIC DIAGRAM

1311

VDD = PIN 14VSS = PIN 7

10

4

3

12

98

65

21

EQUIVALENT CIRCUIT SCHEMATIC(1/4 OF CIRCUIT SHOWN)

Page 3: Mc 14093

MC14093B

http://onsemi.com3

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎ

VDDÎÎÎÎÎÎÎÎÎÎ

– 55�C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

25�C ÎÎÎÎÎÎÎÎÎÎ

125�C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎCharacteristic ÎÎÎÎ

ÎÎÎÎSymbolÎÎÎ

ÎÎÎ

VDDVdc ÎÎÎÎÎÎ

MinÎÎÎÎÎÎ

MaxÎÎÎÎÎÎÎÎ

Min ÎÎÎÎÎÎ

Typ (4.)ÎÎÎÎÎÎÎÎ

Max ÎÎÎÎÎÎ

MinÎÎÎÎÎÎ

MaxÎÎÎÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Voltage “0” LevelVin = VDD or 0

ÎÎÎÎÎÎÎÎÎÎÎÎ

VOL ÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

0.050.050.05

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

000

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.050.050.05

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

0.050.050.05

ÎÎÎÎÎÎÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

“1” LevelVin = 0 or VDD

ÎÎÎÎÎÎÎÎÎÎÎÎ

VOHÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎ

4.959.9514.95

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎÎÎÎ

4.959.9514.95

ÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

4.959.9514.95

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Drive Current(VOH = 2.5 Vdc) Source(VOH = 4.6 Vdc)(VOH = 9.5 Vdc)(VOH = 13.5 Vdc)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

IOH

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

5.05.01015

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

– 3.0– 0.64– 1.6– 4.2

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

————

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

– 2.4– 0.51– 1.3– 3.4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

– 4.2– 0.88– 2.25– 8.8

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

————

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

– 1.7– 0.36– 0.9– 2.4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

————

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

(VOL = 0.4 Vdc) Sink(VOL = 0.5 Vdc)(VOL = 1.5 Vdc)

ÎÎÎÎÎÎÎÎÎÎÎÎ

IOLÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎ

0.641.64.2

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.511.33.4

ÎÎÎÎÎÎÎÎÎ

0.882.258.8

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

0.360.92.4

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎInput Current

ÎÎÎÎÎÎÎÎIin

ÎÎÎÎÎÎ15ÎÎÎÎÎΗÎÎÎÎÎα 0.1ÎÎÎÎÎÎÎΗ

ÎÎÎÎÎα0.00001ÎÎÎÎÎÎÎα 0.1

ÎÎÎÎÎΗÎÎÎÎÎα 1.0ÎÎÎÎÎεAdcÎÎÎÎÎÎÎÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Capacitance(Vin = 0)

ÎÎÎÎÎÎÎÎÎÎÎÎ

Cin

ÎÎÎÎÎÎÎÎÎ

—ÎÎÎÎÎÎÎÎÎ

—ÎÎÎÎÎÎÎÎÎ

—ÎÎÎÎÎÎÎÎÎÎÎÎ

—ÎÎÎÎÎÎÎÎÎ

5.0ÎÎÎÎÎÎÎÎÎÎÎÎ

7.5ÎÎÎÎÎÎÎÎÎ

—ÎÎÎÎÎÎÎÎÎ

—ÎÎÎÎÎÎÎÎÎ

pF

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Quiescent Current(Per Package)

ÎÎÎÎÎÎÎÎÎÎÎÎ

IDDÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

0.250.51.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

0.00050.00100.0015

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.250.51.0

ÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎ

7.51530

ÎÎÎÎÎÎÎÎÎ

µAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Total Supply Current (5.) (6.)

(Dynamic plus Quiescent,Per Package)(CL = 50 pF on all outputs, allbuffers switching)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ITÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

IT = (1.2 µA/kHz) f + IDDIT = (2.4 µA/kHz) f + IDDIT = (3.6 µA/kHz) f + IDD

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

µAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Hysteresis Voltage ÎÎÎÎÎÎÎÎÎÎÎÎ

VH† ÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎ

0.31.21.6

ÎÎÎÎÎÎÎÎÎ

2.03.45.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.31.21.6

ÎÎÎÎÎÎÎÎÎ

1.11.72.1

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.03.45.0

ÎÎÎÎÎÎÎÎÎ

0.31.21.6

ÎÎÎÎÎÎÎÎÎ

2.03.45.0

ÎÎÎÎÎÎÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Threshold VoltagePositive–Going

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VT+

ÎÎÎÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.24.66.8

ÎÎÎÎÎÎÎÎÎÎÎÎ

3.67.110.8

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

2.24.66.8

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.95.98.8

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

3.67.110.8

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.24.66.8

ÎÎÎÎÎÎÎÎÎÎÎÎ

3.67.110.8

ÎÎÎÎÎÎÎÎÎÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Negative–GoingÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

VT–ÎÎÎÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.92.54.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.85.27.4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

0.92.54.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

1.93.95.8

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

2.85.27.4

ÎÎÎÎÎÎÎÎÎÎÎÎ

0.92.54.0

ÎÎÎÎÎÎÎÎÎÎÎÎ

2.85.27.4

ÎÎÎÎÎÎÎÎÎÎÎÎ

Vdc

4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.5. The formulas given are for the typical characteristics only at 25�C.6. To calculate total supply current at loads other than 50 pF:

IT(CL) = IT(50 pF) + (CL – 50) Vfk

where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.

Page 4: Mc 14093

MC14093B

http://onsemi.com4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25�C)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

CharacteristicÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SymbolÎÎÎÎÎÎÎÎÎÎÎÎ

VDDVdcÎÎÎÎÎÎÎÎÎÎÎÎ

MinÎÎÎÎÎÎÎÎÎÎÎÎ

Typ (7.)ÎÎÎÎÎÎÎÎÎÎÎÎ

MaxÎÎÎÎÎÎÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Rise Time ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

tTLH ÎÎÎÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎÎÎÎ

1005040

ÎÎÎÎÎÎÎÎÎÎÎÎ

20010080

ÎÎÎÎÎÎÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Fall Time ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

tTHL ÎÎÎÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎÎÎÎ

1005040

ÎÎÎÎÎÎÎÎÎÎÎÎ

20010080

ÎÎÎÎÎÎÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Propagation Delay Time ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

tPLH, tPHLÎÎÎÎÎÎÎÎÎÎÎÎ

5.01015

ÎÎÎÎÎÎÎÎÎÎÎÎ

———

ÎÎÎÎÎÎÎÎÎÎÎÎ

1255040

ÎÎÎÎÎÎÎÎÎÎÎÎ

25010080

ÎÎÎÎÎÎÎÎÎ

ns

7. Data labeled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

Figure 1. Switching Time Test Circuit and Waveforms

PULSEGENERATOR

VDD

OUTPUT

CLVSS7

14

INPUT

20 ns 20 ns

VDD

VSS

VOH

VOL

tPLHtPHL

OUTPUT

INPUT

tTHL tTLH

90%50%

10%

90%50%

10%

Vout

Vin

VH VDD

VSS

VDD

VSS

(a) Schmitt Triggers will square up(a) inputs with slow rise and fall times.

(b) A Schmitt trigger offers maximum(b) noise immunity in gate applications.

VH

Vout

Vin

VDD

VSS

VDD

VSS

Figure 2. Typical Schmitt Trigger Applications

Page 5: Mc 14093

MC14093B

http://onsemi.com5

Figure 3. Typical Output SourceCharacteristics Test Circuit

VDS, DRAIN VOLTAGE (Vdc)

– 10 – 8.0 – 6.0 – 4.0 – 2.0 0

0

– 2.0

– 4.0

– 6.0

– 8.0

– 10

I OH,

DR

AIN

CU

RR

ENT

(mAd

c)

Figure 4. Typical Output SinkCharacteristics Test Circuit

VDS, DRAIN VOLTAGE (Vdc)

0 2.0 4.0 6.0 8.0 10

10

8.0

6.0

4.0

2.0

0

I OL,

DR

AIN

CU

RR

ENT

(mAd

c)

14

7

VGS

Vout

IOH

All unused inputsconnected to ground.

All unused inputsconnected to ground.

14

7

Vout

IOLVGS

V out

, OU

TPU

T VO

LTAG

E (V

dc)

VDD

00 VDDVT– VT+

VH

Vin, INPUT VOLTAGE (Vdc)

Figure 5. Typical Transfer Characteristics

VGS = – 5.0 Vdc

c

b

a

c

b c b

a a

– 15 Vdc– 10 Vdc

a TA = – 55°Cb TA = + 25°Cb TA = + 125°C

a b c

a

b

c

ab

c5.0 Vdc

a TA = – 55°Cb TA = + 25°Cc TA = + 125°C

15 Vdc

VGS = 10 Vdc

Page 6: Mc 14093

MC14093B

http://onsemi.com6

PACKAGE DIMENSIONS

P SUFFIXPLASTIC DIP PACKAGE

CASE 646–06ISSUE M

1 7

14 8

B

A DIM MIN MAX MIN MAXMILLIMETERSINCHES

A 0.715 0.770 18.16 18.80B 0.240 0.260 6.10 6.60C 0.145 0.185 3.69 4.69D 0.015 0.021 0.38 0.53F 0.040 0.070 1.02 1.78G 0.100 BSC 2.54 BSCH 0.052 0.095 1.32 2.41J 0.008 0.015 0.20 0.38K 0.115 0.135 2.92 3.43LM ––– 10 ––– 10 N 0.015 0.039 0.38 1.01

� �

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.5. ROUNDED CORNERS OPTIONAL.

F

H G DK

C

SEATINGPLANE

N

–T–

14 PL

M0.13 (0.005)

L

MJ

0.290 0.310 7.37 7.87

D SUFFIXPLASTIC SOIC PACKAGE

CASE 751A–03ISSUE F

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.

–A–

–B–

G

P 7 PL

14 8

71M0.25 (0.010) B M

SBM0.25 (0.010) A ST

–T–

FR X 45

SEATINGPLANE

D 14 PL K

C

JM

�DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 8.55 8.75 0.337 0.344B 3.80 4.00 0.150 0.157C 1.35 1.75 0.054 0.068D 0.35 0.49 0.014 0.019F 0.40 1.25 0.016 0.049G 1.27 BSC 0.050 BSCJ 0.19 0.25 0.008 0.009K 0.10 0.25 0.004 0.009M 0 7 0 7 P 5.80 6.20 0.228 0.244R 0.25 0.50 0.010 0.019

� � � �

Page 7: Mc 14093

MC14093B

http://onsemi.com7

PACKAGE DIMENSIONS

DT SUFFIXPLASTIC TSSOP PACKAGE

CASE 948G–01ISSUE O

DIM MIN MAX MIN MAXINCHESMILLIMETERS

A 4.90 5.10 0.193 0.200B 4.30 4.50 0.169 0.177C ––– 1.20 ––– 0.047D 0.05 0.15 0.002 0.006F 0.50 0.75 0.020 0.030G 0.65 BSC 0.026 BSCH 0.50 0.60 0.020 0.024J 0.09 0.20 0.004 0.008J1 0.09 0.16 0.004 0.006K 0.19 0.30 0.007 0.012K1 0.19 0.25 0.007 0.010L 6.40 BSC 0.252 BSCM 0 8 0 8

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS. MOLDFLASH OR GATE BURRS SHALL NOT EXCEED0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDEINTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALL NOTEXCEED0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTAL INEXCESS OF THE K DIMENSION AT MAXIMUMMATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

7. DIMENSION A AND B ARE TO BEDETERMINED AT DATUM PLANE –W–.

� � � �

SU0.15 (0.006) T

2X L/2

SUM0.10 (0.004) V ST

L–U–

SEATINGPLANE

0.10 (0.004)–T–

ÇÇÇÇÇÇSECTION N–N

DETAIL E

J J1

K

K1

ÉÉÉÉ

DETAIL E

F

M

–W–

0.25 (0.010)814

71

PIN 1IDENT.

HG

A

D

C

B

SU0.15 (0.006) T

–V–

14X REFK

N

N

Page 8: Mc 14093

MC14093B

http://onsemi.com8

PACKAGE DIMENSIONS

F SUFFIXPLASTIC EIAJ SOIC PACKAGE

CASE 965–01ISSUE O

HE

A1

DIM MIN MAX MIN MAXINCHES

––– 2.05 ––– 0.081

MILLIMETERS

0.05 0.20 0.002 0.0080.35 0.50 0.014 0.0200.18 0.27 0.007 0.0119.90 10.50 0.390 0.4135.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC7.40 8.20 0.291 0.3230.50 0.85 0.020 0.0331.10 1.50 0.043 0.0590

0.70 0.90 0.028 0.035––– 1.42 ––– 0.056

A1

HE

Q1

LE� 10

� 0 � 10 �

LE

Q1

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND AREMEASURED AT THE PARTING LINE. MOLD FLASHOR PROTRUSIONS SHALL NOT EXCEED 0.15(0.006) PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE LEAD WIDTHDIMENSION AT MAXIMUM MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWERRADIUS OR THE FOOT. MINIMUM SPACEBETWEEN PROTRUSIONS AND ADJACENT LEADTO BE 0.46 ( 0.018).

0.13 (0.005) M 0.10 (0.004)

DZ

E

1

14 8

7

e A

b

VIEW P

c

L

DETAIL P

M

A

bcDEe

0.50

M

Z

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changeswithout further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particularpurpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must bevalidated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury ordeath may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and holdSCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonableattorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claimalleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATIONCENTRAL/SOUTH AMERICA:Spanish Phone : 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)

Email : ONlit–[email protected]

ASIA/PACIFIC : LDC for ON Semiconductor – Asia SupportPhone : 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)

Toll Free from Hong Kong & Singapore:001–800–4422–3781

Email : ONlit–[email protected]

JAPAN : ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549Phone : 81–3–5740–2745Email : [email protected]

ON Semiconductor Website : http://onsemi.com

For additional information, please contact your localSales Representative.

MC14093B/D

NORTH AMERICA Literature Fulfillment :Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone : 303–675–2175 or 800–344–3860 Toll Free USA/CanadaFax: 303–675–2176 or 800–344–3867 Toll Free USA/CanadaEmail : [email protected] Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada

N. American Technical Support : 800–282–9855 Toll Free USA/Canada

EUROPE: LDC for ON Semiconductor – European SupportGerman Phone : (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)

Email : ONlit–[email protected] Phone : (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)

Email : ONlit–[email protected] Phone : (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)

Email : [email protected]

EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781*Available from Germany, France, Italy, England, Ireland