Upload
rrebollar
View
11
Download
1
Embed Size (px)
Citation preview
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 31 Publication Order Number:
MC14093B/D
�������
� �� ����� � !�� �������� �������
The MC14093B Schmitt trigger is constructed with MOSP–channel and N–channel enhancement mode devices in a singlemonolithic structure. These devices find primary use where low powerdissipation and/or high noise immunity is desired. The MC14093Bmay be used in place of the MC14011B quad 2–input NAND gate forenhanced noise immunity or to “square up” slowly changingwaveforms.
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–Power TTL Loads or One Low–PowerSchottky TTL Load Over the Rated Temperature Range
• Triple Diode Protection on All Inputs
• Pin–for–Pin Compatible with CD4093
• Can be Used to Replace MC14011B
• Independent Schmitt–Trigger at each Input
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol Parameter Value Unit
VDD DC Supply Voltage Range –0.5 to +18.0 V
Vin, Vout Input or Output Voltage Range(DC or Transient)
–0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current(DC or Transient) per Pin
±10 mA
PD Power Dissipation,per Package (Note 3.)
500 mW
TA Ambient Temperature Range –55 to +125 °C
Tstg Storage Temperature Range –65 to +150 °C
TL Lead Temperature(8–Second Soldering)
260 °C
2. Maximum Ratings are those values beyond which damage to the devicemay occur.
3. Temperature Derating:Plastic “P and D/DW” Packages: – 7.0 mW/�C From 65�C To 125�C
This device contains protection circuitry to guard against damage due to highstatic voltages or electric fields. However, precautions must be taken to avoidapplications of any voltage higher than maximum rated voltages to thishigh–impedance circuit. For proper operation, Vin and Vout should be constrainedto the range VSS � (Vin or Vout) � VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,either VSS or VDD). Unused outputs must be left open.
http://onsemi.com
A = Assembly LocationWL or L = Wafer LotYY or Y = YearWW or W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14093BCP PDIP–14 2000/Box
MC14093BD SOIC–14 2750/Box
MC14093BDR2 SOIC–14 2500/Tape & Reel
MC14093BDT TSSOP–14
MC14093BF SOEIAJ–14
96/Rail
See Note 1.
MARKINGDIAGRAMS
1
14PDIP–14P SUFFIXCASE 646
MC14093BCPAWLYYWW
SOIC–14D SUFFIX
CASE 751A
TSSOP–14DT SUFFIXCASE 948G
1
14
14093BAWLYWW
14093BALYW
1
14
SOEIAJ–14F SUFFIXCASE 965
1
14
MC14093BAWLYWW
MC14093BFEL SOEIAJ–14 See Note 1.
1. For ordering information on the EIAJ version ofthe SOIC packages, please contact your localON Semiconductor representative.
MC14093BDTR2 TSSOP–14 2500/Tape & Reel
MC14093BDTEL TSSOP–14 2000/Tape & Reel
MC14093B
http://onsemi.com2
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
OUTC
OUTD
IN 1D
IN 2D
VDD
IN 1C
IN 2C
OUTB
OUTA
IN 2A
IN 1A
VSS
IN 2B
IN 1B
LOGIC DIAGRAM
1311
VDD = PIN 14VSS = PIN 7
10
4
3
12
98
65
21
EQUIVALENT CIRCUIT SCHEMATIC(1/4 OF CIRCUIT SHOWN)
MC14093B
http://onsemi.com3
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
VDDÎÎÎÎÎÎÎÎÎÎ
– 55�C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
25�C ÎÎÎÎÎÎÎÎÎÎ
125�C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎCharacteristic ÎÎÎÎ
ÎÎÎÎSymbolÎÎÎ
ÎÎÎ
VDDVdc ÎÎÎÎÎÎ
MinÎÎÎÎÎÎ
MaxÎÎÎÎÎÎÎÎ
Min ÎÎÎÎÎÎ
Typ (4.)ÎÎÎÎÎÎÎÎ
Max ÎÎÎÎÎÎ
MinÎÎÎÎÎÎ
MaxÎÎÎÎÎÎ
Unit
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Output Voltage “0” LevelVin = VDD or 0
ÎÎÎÎÎÎÎÎÎÎÎÎ
VOL ÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
0.050.050.05
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
000
ÎÎÎÎÎÎÎÎÎÎÎÎ
0.050.050.05
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
0.050.050.05
ÎÎÎÎÎÎÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
“1” LevelVin = 0 or VDD
ÎÎÎÎÎÎÎÎÎÎÎÎ
VOHÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎ
4.959.9514.95
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎÎÎÎ
4.959.9514.95
ÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
4.959.9514.95
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Output Drive Current(VOH = 2.5 Vdc) Source(VOH = 4.6 Vdc)(VOH = 9.5 Vdc)(VOH = 13.5 Vdc)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
IOH
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
5.05.01015
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
– 3.0– 0.64– 1.6– 4.2
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
————
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
– 2.4– 0.51– 1.3– 3.4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
– 4.2– 0.88– 2.25– 8.8
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
————
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
– 1.7– 0.36– 0.9– 2.4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
————
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
mAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
(VOL = 0.4 Vdc) Sink(VOL = 0.5 Vdc)(VOL = 1.5 Vdc)
ÎÎÎÎÎÎÎÎÎÎÎÎ
IOLÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎ
0.641.64.2
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎÎÎÎ
0.511.33.4
ÎÎÎÎÎÎÎÎÎ
0.882.258.8
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
0.360.92.4
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
mAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎInput Current
ÎÎÎÎÎÎÎÎIin
ÎÎÎÎÎÎ15ÎÎÎÎÎΗÎÎÎÎÎα 0.1ÎÎÎÎÎÎÎΗ
ÎÎÎÎÎα0.00001ÎÎÎÎÎÎÎα 0.1
ÎÎÎÎÎΗÎÎÎÎÎα 1.0ÎÎÎÎÎεAdcÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Input Capacitance(Vin = 0)
ÎÎÎÎÎÎÎÎÎÎÎÎ
Cin
ÎÎÎÎÎÎÎÎÎ
—ÎÎÎÎÎÎÎÎÎ
—ÎÎÎÎÎÎÎÎÎ
—ÎÎÎÎÎÎÎÎÎÎÎÎ
—ÎÎÎÎÎÎÎÎÎ
5.0ÎÎÎÎÎÎÎÎÎÎÎÎ
7.5ÎÎÎÎÎÎÎÎÎ
—ÎÎÎÎÎÎÎÎÎ
—ÎÎÎÎÎÎÎÎÎ
pF
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Quiescent Current(Per Package)
ÎÎÎÎÎÎÎÎÎÎÎÎ
IDDÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
0.250.51.0
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
0.00050.00100.0015
ÎÎÎÎÎÎÎÎÎÎÎÎ
0.250.51.0
ÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎ
7.51530
ÎÎÎÎÎÎÎÎÎ
µAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,Per Package)(CL = 50 pF on all outputs, allbuffers switching)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ITÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
IT = (1.2 µA/kHz) f + IDDIT = (2.4 µA/kHz) f + IDDIT = (3.6 µA/kHz) f + IDD
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
µAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Hysteresis Voltage ÎÎÎÎÎÎÎÎÎÎÎÎ
VH† ÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎ
0.31.21.6
ÎÎÎÎÎÎÎÎÎ
2.03.45.0
ÎÎÎÎÎÎÎÎÎÎÎÎ
0.31.21.6
ÎÎÎÎÎÎÎÎÎ
1.11.72.1
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.03.45.0
ÎÎÎÎÎÎÎÎÎ
0.31.21.6
ÎÎÎÎÎÎÎÎÎ
2.03.45.0
ÎÎÎÎÎÎÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Threshold VoltagePositive–Going
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
VT+
ÎÎÎÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.24.66.8
ÎÎÎÎÎÎÎÎÎÎÎÎ
3.67.110.8
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
2.24.66.8
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.95.98.8
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
3.67.110.8
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.24.66.8
ÎÎÎÎÎÎÎÎÎÎÎÎ
3.67.110.8
ÎÎÎÎÎÎÎÎÎÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Negative–GoingÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
VT–ÎÎÎÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎ
0.92.54.0
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.85.27.4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
0.92.54.0
ÎÎÎÎÎÎÎÎÎÎÎÎ
1.93.95.8
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
2.85.27.4
ÎÎÎÎÎÎÎÎÎÎÎÎ
0.92.54.0
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.85.27.4
ÎÎÎÎÎÎÎÎÎÎÎÎ
Vdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.5. The formulas given are for the typical characteristics only at 25�C.6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.
MC14093B
http://onsemi.com4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25�C)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
CharacteristicÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SymbolÎÎÎÎÎÎÎÎÎÎÎÎ
VDDVdcÎÎÎÎÎÎÎÎÎÎÎÎ
MinÎÎÎÎÎÎÎÎÎÎÎÎ
Typ (7.)ÎÎÎÎÎÎÎÎÎÎÎÎ
MaxÎÎÎÎÎÎÎÎÎ
Unit
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Output Rise Time ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
tTLH ÎÎÎÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎÎÎÎ
1005040
ÎÎÎÎÎÎÎÎÎÎÎÎ
20010080
ÎÎÎÎÎÎÎÎÎ
ns
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Output Fall Time ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
tTHL ÎÎÎÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎÎÎÎ
1005040
ÎÎÎÎÎÎÎÎÎÎÎÎ
20010080
ÎÎÎÎÎÎÎÎÎ
ns
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Propagation Delay Time ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
tPLH, tPHLÎÎÎÎÎÎÎÎÎÎÎÎ
5.01015
ÎÎÎÎÎÎÎÎÎÎÎÎ
———
ÎÎÎÎÎÎÎÎÎÎÎÎ
1255040
ÎÎÎÎÎÎÎÎÎÎÎÎ
25010080
ÎÎÎÎÎÎÎÎÎ
ns
7. Data labeled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Switching Time Test Circuit and Waveforms
PULSEGENERATOR
VDD
OUTPUT
CLVSS7
14
INPUT
20 ns 20 ns
VDD
VSS
VOH
VOL
tPLHtPHL
OUTPUT
INPUT
tTHL tTLH
90%50%
10%
90%50%
10%
Vout
Vin
VH VDD
VSS
VDD
VSS
(a) Schmitt Triggers will square up(a) inputs with slow rise and fall times.
(b) A Schmitt trigger offers maximum(b) noise immunity in gate applications.
VH
Vout
Vin
VDD
VSS
VDD
VSS
Figure 2. Typical Schmitt Trigger Applications
MC14093B
http://onsemi.com5
Figure 3. Typical Output SourceCharacteristics Test Circuit
VDS, DRAIN VOLTAGE (Vdc)
– 10 – 8.0 – 6.0 – 4.0 – 2.0 0
0
– 2.0
– 4.0
– 6.0
– 8.0
– 10
I OH,
DR
AIN
CU
RR
ENT
(mAd
c)
Figure 4. Typical Output SinkCharacteristics Test Circuit
VDS, DRAIN VOLTAGE (Vdc)
0 2.0 4.0 6.0 8.0 10
10
8.0
6.0
4.0
2.0
0
I OL,
DR
AIN
CU
RR
ENT
(mAd
c)
14
7
VGS
Vout
IOH
All unused inputsconnected to ground.
All unused inputsconnected to ground.
14
7
Vout
IOLVGS
V out
, OU
TPU
T VO
LTAG
E (V
dc)
VDD
00 VDDVT– VT+
VH
Vin, INPUT VOLTAGE (Vdc)
Figure 5. Typical Transfer Characteristics
VGS = – 5.0 Vdc
c
b
a
c
b c b
a a
– 15 Vdc– 10 Vdc
a TA = – 55°Cb TA = + 25°Cb TA = + 125°C
a b c
a
b
c
ab
c5.0 Vdc
a TA = – 55°Cb TA = + 25°Cc TA = + 125°C
15 Vdc
VGS = 10 Vdc
MC14093B
http://onsemi.com6
PACKAGE DIMENSIONS
P SUFFIXPLASTIC DIP PACKAGE
CASE 646–06ISSUE M
1 7
14 8
B
A DIM MIN MAX MIN MAXMILLIMETERSINCHES
A 0.715 0.770 18.16 18.80B 0.240 0.260 6.10 6.60C 0.145 0.185 3.69 4.69D 0.015 0.021 0.38 0.53F 0.040 0.070 1.02 1.78G 0.100 BSC 2.54 BSCH 0.052 0.095 1.32 2.41J 0.008 0.015 0.20 0.38K 0.115 0.135 2.92 3.43LM ––– 10 ––– 10 N 0.015 0.039 0.38 1.01
� �
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.5. ROUNDED CORNERS OPTIONAL.
F
H G DK
C
SEATINGPLANE
N
–T–
14 PL
M0.13 (0.005)
L
MJ
0.290 0.310 7.37 7.87
D SUFFIXPLASTIC SOIC PACKAGE
CASE 751A–03ISSUE F
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P 7 PL
14 8
71M0.25 (0.010) B M
SBM0.25 (0.010) A ST
–T–
FR X 45
SEATINGPLANE
D 14 PL K
C
JM
�DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344B 3.80 4.00 0.150 0.157C 1.35 1.75 0.054 0.068D 0.35 0.49 0.014 0.019F 0.40 1.25 0.016 0.049G 1.27 BSC 0.050 BSCJ 0.19 0.25 0.008 0.009K 0.10 0.25 0.004 0.009M 0 7 0 7 P 5.80 6.20 0.228 0.244R 0.25 0.50 0.010 0.019
� � � �
MC14093B
http://onsemi.com7
PACKAGE DIMENSIONS
DT SUFFIXPLASTIC TSSOP PACKAGE
CASE 948G–01ISSUE O
DIM MIN MAX MIN MAXINCHESMILLIMETERS
A 4.90 5.10 0.193 0.200B 4.30 4.50 0.169 0.177C ––– 1.20 ––– 0.047D 0.05 0.15 0.002 0.006F 0.50 0.75 0.020 0.030G 0.65 BSC 0.026 BSCH 0.50 0.60 0.020 0.024J 0.09 0.20 0.004 0.008J1 0.09 0.16 0.004 0.006K 0.19 0.30 0.007 0.012K1 0.19 0.25 0.007 0.010L 6.40 BSC 0.252 BSCM 0 8 0 8
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLDFLASH OR GATE BURRS SHALL NOT EXCEED0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDEINTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALL NOTEXCEED0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTAL INEXCESS OF THE K DIMENSION AT MAXIMUMMATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.
7. DIMENSION A AND B ARE TO BEDETERMINED AT DATUM PLANE –W–.
� � � �
SU0.15 (0.006) T
2X L/2
SUM0.10 (0.004) V ST
L–U–
SEATINGPLANE
0.10 (0.004)–T–
ÇÇÇÇÇÇSECTION N–N
DETAIL E
J J1
K
K1
ÉÉÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)814
71
PIN 1IDENT.
HG
A
D
C
B
SU0.15 (0.006) T
–V–
14X REFK
N
N
MC14093B
http://onsemi.com8
PACKAGE DIMENSIONS
F SUFFIXPLASTIC EIAJ SOIC PACKAGE
CASE 965–01ISSUE O
HE
A1
DIM MIN MAX MIN MAXINCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.0080.35 0.50 0.014 0.0200.18 0.27 0.007 0.0119.90 10.50 0.390 0.4135.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC7.40 8.20 0.291 0.3230.50 0.85 0.020 0.0331.10 1.50 0.043 0.0590
0.70 0.90 0.028 0.035––– 1.42 ––– 0.056
A1
HE
Q1
LE� 10
� 0 � 10 �
LE
Q1
�
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND AREMEASURED AT THE PARTING LINE. MOLD FLASHOR PROTRUSIONS SHALL NOT EXCEED 0.15(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE LEAD WIDTHDIMENSION AT MAXIMUM MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWERRADIUS OR THE FOOT. MINIMUM SPACEBETWEEN PROTRUSIONS AND ADJACENT LEADTO BE 0.46 ( 0.018).
0.13 (0.005) M 0.10 (0.004)
DZ
E
1
14 8
7
e A
b
VIEW P
c
L
DETAIL P
M
A
bcDEe
0.50
M
Z
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changeswithout further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particularpurpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must bevalidated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury ordeath may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and holdSCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonableattorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claimalleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATIONCENTRAL/SOUTH AMERICA:Spanish Phone : 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email : ONlit–[email protected]
ASIA/PACIFIC : LDC for ON Semiconductor – Asia SupportPhone : 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong & Singapore:001–800–4422–3781
Email : ONlit–[email protected]
JAPAN : ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549Phone : 81–3–5740–2745Email : [email protected]
ON Semiconductor Website : http://onsemi.com
For additional information, please contact your localSales Representative.
MC14093B/D
NORTH AMERICA Literature Fulfillment :Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone : 303–675–2175 or 800–344–3860 Toll Free USA/CanadaFax: 303–675–2176 or 800–344–3867 Toll Free USA/CanadaEmail : [email protected] Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada
N. American Technical Support : 800–282–9855 Toll Free USA/Canada
EUROPE: LDC for ON Semiconductor – European SupportGerman Phone : (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)
Email : ONlit–[email protected] Phone : (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)
Email : ONlit–[email protected] Phone : (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)
Email : [email protected]
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781*Available from Germany, France, Italy, England, Ireland