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1
LTC1666/LTC1667/LTC1668
APPLICATIO SU
FEATURES DESCRIPTIO
U
TYPICAL APPLICATION
U
12-Bit, 14-Bit, 16-Bit,50Msps DACs
50Msps Update Rate Pin Compatible 12-Bit, 14-Bit and 16-Bit Devices High Spectral Purity: 87dB SFDR at 1MHz fOUT 5pV-s Glitch Impulse Differential Current Outputs 20ns Settling Time Low Power: 180mW from ±5V Supplies TTL/CMOS (3.3V or 5V) Inputs Small Package: 28-Pin SSOP
The LTC®1666/LTC1667/LTC1668 are 12-/14-/16-bit,50Msps differential current output DACs implemented ona high performance BiCMOS process with laser trimmed,thin-film resistors. The combination of a novel current-steering architecture and a high performance processproduces DACs with exceptional AC and DC performance.The LTC1668 is the first 16-bit DAC in the marketplace toexhibit an SFDR (spurious free dynamic range) of 87dBfor an output signal frequency of 1MHz.
Operating from ±5V supplies, the LTC1666/LTC1667/LTC1668 can be configured to provide full-scale outputcurrents up to 10mA. The differential current outputs ofthe DACs allow single-ended or true differential operation.The –1V to 1V output compliance of the LTC1666/LTC1667/LTC1668 allows the outputs to be connecteddirectly to external resistors to produce a differential out-put voltage without degrading the converter’s linearity. Al-ternatively, the outputs can be connected to the summingjunction of a high speed operational amplifier, or to atransformer.
The LTC1666/LTC1667/LTC1668 are pin compatible andare available in a 28-pin SSOP and are fully specified overthe industrial temperature range.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Cellular Base Stations Multicarrier Base Stations Wireless Communication Direct Digital Synthesis (DDS) xDSL Modems Arbitrary Waveform Generation Automated Test Equipment Instrumentation
LTC1668, 16-Bit, 50Msps DAC
–
+
VSS
VDD
–5V
CLOCKINPUT
16-BIT DATAINPUT
LADCOM
AGND DGND CLK DB15 DB0
1666/7/8 TA01
IOUT A
0.1µF
LTC1668
5V
52.3Ω
IREFIN
REFOUT
COMP1
COMP2
C20.1µF
0.1µF
C10.1µF
RSET2k
IOUT B52.3Ω VOUT
1VP-PDIFFERENTIAL
+
–
0.1µF
16-BITHIGH SPEED
DAC
2.5VREFERENCE
LTC1668 SFDR vs fOUT and fCLOCK
fOUT (MHz)0.1
SFDR
(dB)
100
90
80
70
60
501.0 10 100
1666/7/8 G05
5MSPS
25MSPS
50MSPS
DIGITAL AMPLITUDE = 0dBFS
2
LTC1666/LTC1667/LTC1668
LTC1666CGLTC1666IG
TJMAX = 110°C, θJA = 100°C/W
ORDER PARTNUMBER
Consult LTC Marketing for parts specified with wider operating temperature ranges.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
G PACKAGE28-LEAD PLASTIC SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DB13
DB12
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0 (LSB)
DB14
DB15 (MSB)
CLK
VDD
DGND
VSS
COMP2
COMP1
IOUT A
IOUT B
LADCOM
AGND
IREFIN
REFOUT
Supply Voltage (VDD) ................................................ 6VNegative Supply Voltage (VSS) ............................... –6VTotal Supply Voltage (VDD to VSS) .......................... 12VDigital Input Voltage .................... –0.3V to (VDD + 0.3V)Analog Output Voltage
(IOUT A and IOUT B) ........ (VSS – 0.3V) to (VDD + 0.3V)
PACKAGE/ORDER I FOR ATIOU UW
ABSOLUTE AXI U RATI GS
W WW U
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
G PACKAGE28-LEAD PLASTIC SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0 (LSB)
NC
NC
NC
NC
DB10
DB11 (MSB)
CLK
VDD
DGND
VSS
COMP2
COMP1
IOUT A
IOUT B
LADCOM
AGND
IREFIN
REFOUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
G PACKAGE28-LEAD PLASTIC SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0 (LSB)
NC
NC
DB12
DB13 (MSB)
CLK
VDD
DGND
VSS
COMP2
COMP1
IOUT A
IOUT B
LADCOM
AGND
IREFIN
REFOUT
Power Dissipation ............................................. 500mWOperating Temperature Range
LTC1666C/LTC1667C/LTC1668C ........... 0°C to 70°CLTC1666I/LTC1667I/LTC1668I .......... –40°C to 85°C
Storage Temperature Range ................ – 65°C to 150°CLead Temperature (Soldering, 10 sec).................. 300°C
(Note 1)
TJMAX = 110°C, θJA = 100°C/W TJMAX = 110°C, θJA = 100°C/W
LTC1668CGLTC1668IG
ORDER PARTNUMBER
LTC1667CGLTC1667IG
ORDER PARTNUMBER
3
LTC1666/LTC1667/LTC1668
The denotes specifications which apply over the full operatingtemperature range, otherwise specifications are at TA = 25°C. VDD = 5V, VSS = –5V, LADCOM = AGND = DGND = 0V, IOUTFS = 10mA.ELECTRICAL CHARACTERISTICS
LTC1666 LTC1667 LTC1668SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS
DC Accuracy (Measured at IOUT A, Driving a Virtual Ground)
Resolution 12 14 16 Bits
Monotonicity 12 14 14 Bits
INL Integral Nonlinearity (Note 2) ±1 ±2 ±8 LSB
DNL Differential Nonlinearity (Note 2) ±1 ±1 ±1 ±4 LSB
Offset Error 0.1 ±0.2 0.1 ±0.2 0.1 ±0.2 % FSR
Offset Error Drift 5 5 5 ppm/°C
GE Gain Error Internal Reference, RIREFIN = 2k 2 2 2 % FSRExternal Reference, 1 1 1 % FSRVREF = 2.5V, RIREFIN = 2k
Gain Error Drift Internal Reference 50 50 50 ppm/°CExternal Reference 30 30 30 ppm/°C
PSRR Power Supply VDD = 5V ±5% ±0.1 ±0.1 ±0.1 % FSR/VRejection Ratio VSS = –5V ±5% ±0.2 ±0.2 ±0.2 % FSR/V
AC Linearity
SFDR Spurious Free Dynamic fCLK = 25Msps, fOUT = 1MHzRange to Nyquist 0dB FS Output 76 78 78 87 dB
–6dB FS Output 87 dB –12dB FS Output 83 dB
fCLK = 50Msps, fOUT = 1MHz 85 dB
fCLK = 50Msps, fOUT = 2.5MHz 81 dB
fCLK = 50Msps, fOUT = 5MHz 79 dB
fCLK = 50Msps, fOUT = 20MHz 70 dB
Spurious Free Dynamic fCLK = 25Msps, 85 86 86 96 dBRange Within a Window fOUT = 1MHz, 2MHz Span
fCLK = 50Msps, 88 dBfOUT = 5MHz, 4MHz Span
THD Total Harmonic Distortion fCLK = 25Msps, fOUT = 1MHz –75 –77 – 84 – 77 dBfCLK = 50Msps, fOUT = 5MHz – 78 dB
4
LTC1666/LTC1667/LTC1668
The denotes specifications which apply over the full operatingtemperature range, otherwise specifications are at TA = 25°C. VDD = 5V, VSS = –5V, LADCOM = AGND = DGND = 0V, IOUTFS = 10mA.ELECTRICAL CHARACTERISTICS
LTC1666/LTC1667/LTC1668SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Analog Output
IOUTFS Full-Scale Output Current 1 10 mA
Output Compliance Range IFS = 10mA –1 1 V
Output Resistance; RIOUT A, RIOUT B IOUT A, B to LADCOM 0.7 1.1 1.5 kΩOutput Capacitance 5 pF
Reference Output
Reference Voltage REFOUT Tied to IREFIN Through 2kΩ 2.475 2.5 2.525 V
Reference Output Drift 25 ppm/°C
Reference Output Load Regulation ILOAD = 0mA to 5mA 6 mV/mA
Reference Input
Reference Small-Signal Bandwidth IFS = 10mA, CCOMP1 = 0.1µF 20 kHz
Power Supply
VDD Positive Supply Voltage 4.75 5 5.25 V
VSS Negative Supply Voltage –4.75 –5 –5.25 V
IDD Positive Supply Current IFS = 10mA, fCLK = 25Msps, fOUT = 1MHz 3 5 mA
ISS Negative Supply Current IFS = 10mA, fCLK = 25Msps, fOUT = 1MHz 33 40 mA
PDIS Power Dissipation IFS = 10mA, fCLK = 25Msps, fOUT = 1MHz 180 mWIFS = 1mA, fCLK = 25Msps, fOUT = 1MHz 85 mW
Dynamic Performance (Differential Transformer Coupled Output, 50Ω Double Terminated, Unless Otherwise Noted)
fCLOCK Maximum Update Rate 50 75 Msps
tS Output Settling Time To 0.1% FSR 20 ns
tPD Output Propagation Delay 8 ns
Glitch Impulse Single Ended 15 pV-sDifferential 5 pV-s
tr Output Rise Time 4 ns
tf Output Fall Time 4 ns
iNO Output Noise 50 pA/√Hz
Digital Inputs
VIH Digital High Input Voltage 2.4 V
VIL Digital Low Input Voltage 0.8 V
IIN Digital Input Current ±10 µA
CIN Digital Input Capacitance 5 pF
tDS Input Setup Time 8 ns
tDH Input Hold Time 4 ns
tCLKH Clock High Time 5 ns
tCLKL Clock Low Time 8 ns
Note 1: Absolute Maximum Ratings are those values beyond which the lifeof the device may be impaired.
Note 2: For the LTC1666, ±1LSB = ±0.024% of full scale;for the LTC1667, ±1LSB = ±0.006% of full scale = ±61ppm of full scale;for the LTC1668, ±1LSB = ±0.0015% of full scale = ±15.3ppm of full scale.
5
LTC1666/LTC1667/LTC1668
FREQUENCY (MHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
SIGN
AL A
MPL
ITUD
E (d
BFS)
1666/7/8 G01
0 5 10 15 20 25
SFDR = 87dBfCLOCK = 50MSPSfOUT = 1.002MHzAMPL = 0dBFS
= –8.25dBm
TYPICAL PERFOR A CE CHARACTERISTICS
UW
Single Tone SFDR at 50MSPS 2-Tone SFDR
FREQUENCY (MHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
SIGN
AL A
MPL
ITUD
E (d
BFS)
1666/7/8 G02
4.5 5.0 5.5
SFDR > 86dBfCLOCK = 50MSPSfOUT1 = 4.9MHzfOUT2 = 5.09MHzAMPL = 0dBFS
4-Tone SFDR, fCLOCK = 50MSPS
4-Tone SFDR, fCLOCK = 5MSPSSFDR vs fOUT and Digital Amplitude(dBFS) at fCLOCK = 5MSPSSFDR vs fOUT and fCLOCK
FREQUENCY (MHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
SIGN
AL A
MPL
ITUD
E (d
BFS)
1666/7/8 G03
1 4.6 8.2 11.8 15.4 19
SFDR > 74dBfCLOCK = 50MSPSfOUT1 = 5.02MHzfOUT2 = 6.51MHzfOUT3 = 11.02MHzfOUT4 = 12.51MHzAMPL = 0dBFS
FREQUENCY (MHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
SIGN
AL A
MPL
ITUD
E (d
BFS)
1666/7/8 G04
0.1 0.46 0.82 1.18 1.54 1.9
SFDR > 82dBfCLOCK = 5MSPSfOUT1 = 0.5MHzfOUT2 = 0.65MHzfOUT3 = 1.10MHzfOUT4 = 1.25MHzAMPL = 0dBFS
fOUT (MHz)0.1
SFDR
(dB)
100
90
80
70
60
501.0 10 100
1666/7/8 G05
5MSPS
25MSPS
50MSPS
DIGITAL AMPLITUDE = 0dBFS
fOUT (MHz)
100
95
90
85
80
75
70
65
60
55
50
SFDR
(dB)
1666/7/8 G06
0 0.4 0.8 1.2 1.6 2.0
–12dBFS
–6dBFS
0dBFS
(LTC1668)
fOUT (MHz)0
SFDR
(dB)
4 8 10
95
90
85
80
75
70
65
60
55
50
1666/7/8 G07
2 6
–12dBFS
–6dBFS
0dBFS
fOUT (MHz)0
SFDR
(dB)
10 20
90
85
80
75
70
65
60
55
50
1666/7/8 G08
5 15
–12dBFS –6dBFS
0dBFS
fOUT (MHz)0
SFDR
(dB)
10
95
90
85
80
75
70
65
60
55
50
1666/7/8 G09
2.5 5 7.5
DIGITAL AMPLITUDE = 0dBFS
IOUTFS = 2.5mA
IOUTFS = 5mA
IOUTFS = 10mA
SFDR vs fOUT and Digital Amplitude(dBFS) at fCLOCK = 25MSPS
SFDR vs fOUT and Digital Amplitude(dBFS) at fCLOCK = 50MSPS
SFDR vs fOUT and IOUTFS atfCLOCK = 25MSPS
6
LTC1666/LTC1667/LTC1668
Integral Nonlinearity
DIGITAL INPUT CODE
–5
INTE
GRAL
NON
LINE
ARIT
Y (L
SB)
–4
–2
–1
0
5
2
16384 32768
1666/7/8 G18
–3
3
4
1
49152 65535
TYPICAL PERFOR A CE CHARACTERISTICS
UW
SFDR vs Digital Amplitude (dBFS)and fCLOCK at fOUT = fCLOCK/11
Single-Ended OutputsFull-Scale Transition
Differential OutputFull-Scale Transition
Single-Ended OutputFull-Scale Transition
Differential OutputFull-Scale Transition
Differential MidscaleGlitch Impulse
Single-Ended MidscaleGlitch Impulse
DIGITAL AMPLITUDE (dBFS)
100
95
90
85
80
75
70
65
60
55
50
SFDR
(dB)
1666/7/8 G10
–20 –15 –10 –5 0
455kHz AT 5MSPS
4.55MHz AT 50MSPS
2.277MHz AT 25MSPS
DIGITAL AMPLITUDE (dBFS)
100
95
90
85
80
75
70
65
60
55
50
SFDR
(dB)
1666/7/8 G11
–20 –15 –10 –5 0
1MHz AT 5MSPS
10MHz AT 50MSPS
5MHz AT 25MSPS
100mV/DIV
CLK IN5V/DIV
1666/7/8 G12
5ns/DIV
V(IOUTB)
V(IOUTA)
FFFF0000
CLOCK INPUT
SFDR vs Digital Amplitude (dBFS)and fCLOCK at fOUT = fCLOCK/5
100mV/DIV
CLK IN5V/DIV
1666/7/8 G13
5ns/DIV
V(IOUTA) – V(IOUTB)
FFFF0000 100mV/DIV
CLK IN5V/DIV
1666/7/8 G14
5ns/DIV
V(IOUTA)
V(IOUTB)
FFFF 0000
CLOCK INPUT
100mV/DIV
CLK IN5V/DIV
1666/7/8 G15
5ns/DIV
V(IOUTA) – V(IOUTB)
FFFF 0000
1mV/DIV
CLK IN5V/DIV
1666/7/8 G16
5ns/DIV
V(IOUTA), V(IOUTB)
7FFF 8000
1mV/DIV
CLK IN5V/DIV
1666/7/8 G17
5ns/DIV
V(IOUTA) – V(IOUTB)
7FFF 8000
(LTC1668)
7
LTC1666/LTC1667/LTC1668
TYPICAL PERFOR A CE CHARACTERISTICS
UW
Differential Nonlinearity
DIGITAL INPUT CODE0
DIFF
EREN
TIAL
NON
LINE
ARIT
Y (L
SB)
0
1.0
65535
1666/7/8 G19
–1.0
–2.016384 32768 49152
2.0
–0.5
0.5
–1.5
1.5
(LTC1668)
UUU
PI FU CTIO SLTC1666
REFOUT (Pin 15): Internal Reference Voltage Output.Nominal value is 2.5V. Requires a 0.1µF bypass capacitorto AGND.
IREFIN (Pin 16): Reference Input Current. Nominal value is1.25mA for IFS = 10mA. IFS = IREFIN • 8.
AGND (Pin 17): Analog Ground.
LADCOM (Pin 18): Attenuator Ladder Common. Normallytied to GND.
IOUT B (Pin 19): Complementary DAC Output Current. Full-scale output current occurs when all data bits are 0s.
IOUT A (Pin 20): DAC Output Current. Full-scale outputcurrent occurs when all data bits are 1s.
COMP1 (Pin 21): Current Source Control Amplifier Com-pensation. Bypass to VSS with 0.1µF.
COMP2 (Pin 22): Internal Bypass Point. Bypass to VSSwith 0.1µF.
VSS (Pin 23): Negative Supply Voltage. Nominal value is–5V.
DGND (Pin 24): Digital Ground.
VDD (Pin 25): Positive Supply Voltage. Nominal value is 5V.
CLK (Pin 26): Clock Input. Data is latched and the outputis updated on positive edge of clock.
DB11 to DB0 (Pins 27, 28, 1 to 10 ): Digital Input Data Bits.
8
LTC1666/LTC1667/LTC1668
LTC1667
REFOUT (Pin 15): Internal Reference Voltage Output.Nominal value is 2.5V. Requires a 0.1µF bypass capacitorto AGND.
IREFIN (Pin 16): Reference Input Current. Nominal value is1.25mA for IFS = 10mA. IFS = IREFIN • 8.
AGND (Pin 17): Analog Ground.
LADCOM (Pin 18): Attenuator Ladder Common. Normallytied to GND.
IOUT B (Pin 19): Complementary DAC Output Current. Full-scale output current occurs when all data bits are 0s.
IOUT A (Pin 20): DAC Output Current. Full-scale outputcurrent occurs when all data bits are 1s.
COMP1 (Pin 21): Current Source Control Amplifier Com-pensation. Bypass to VSS with 0.1µF.
COMP2 (Pin 22): Internal Bypass Point. Bypass to VSSwith 0.1µF.
VSS (Pin 23): Negative Supply Voltage. Nominal value is–5V.
DGND (Pin 24): Digital Ground.
VDD (Pin 25): Positive Supply Voltage. Nominal value is 5V.
CLK (Pin 26): Clock Input. Data is latched and the outputis updated on positive edge of clock.
DB13 to DB0 (Pins 27, 28, 1 to 12 ): Digital Input Data Bits.
LTC1668
REFOUT (Pin 15): Internal Reference Voltage Output.Nominal value is 2.5V. Requires a 0.1µF bypass capacitorto AGND.
IREFIN (Pin 16): Reference Input Current. Nominal value is1.25mA for IFS = 10mA. IFS = IREFIN • 8.
AGND (Pin 17): Analog Ground.
LADCOM (Pin 18): Attenuator Ladder Common. Normallytied to GND.
IOUT B (Pin 19): Complementary DAC Output Current. Full-scale output current occurs when all data bits are 0s.
IOUT A (Pin 20): DAC Output Current. Full-scale outputcurrent occurs when all data bits are 1s.
COMP1 (Pin 21): Current Source Control Amplifier Com-pensation. Bypass to VSS with 0.1µF.
COMP2 (Pin 22): Internal Bypass Point. Bypass to VSSwith 0.1µF.
VSS (Pin 23): Negative Supply Voltage. Nominal value is–5V.
DGND (Pin 24): Digital Ground.
VDD (Pin 25): Positive Supply Voltage. Nominal value is 5V.
CLK (Pin 26): Clock Input. Data is latched and the outputis updated on positive edge of clock.
DB15 to DB0 (Pins 27, 28, 1 to 14 ): Digital Input Data Bits.
UUU
PI FU CTIO S
9
LTC1666/LTC1667/LTC1668
BLOCK DIAGRA
W
–
+
IFS/8IREFIN
IINT
RSET2k
0.1µF
0.1µF
0.1µF–5V
0.1µF
REFOUT
VDD
VREF 15
16
COMP121
COMP2
VSS
22
23
2.5VREFERENCE
ATTENUATORLADDER
LSB SWITCHES
INPUT LATCHES
CLOCKINPUT 12-BIT
DATA INPUT
SEGMENTED SWITCHESFOR DB15–DB12
CURRENT SOURCE ARRAY
AGND
17
DGND
24
CLK DB0DB11 • • •
• • •
• • • • • •
26 27 10 1666 BD
18LADCOM
20IOUT A
19IOUT B
52.3Ω 52.3ΩVOUT1VP-PDIFFERENTIAL
+
–
0.1µF
25
5V
–
+
IFS/8IREFIN
IINT
RSET2k
0.1µF
0.1µF
0.1µF–5V
0.1µF
REFOUTVREF 15
16
COMP121
COMP2
VSS
22
23
2.5VREFERENCE
ATTENUATORLADDER
LSB SWITCHES
INPUT LATCHES
CLOCKINPUT 14-BIT
DATA INPUT
SEGMENTED SWITCHESFOR DB15–DB12
CURRENT SOURCE ARRAY
AGND
17
DGND
24
CLK DB0DB13 • • •
• • •
• • • • • •
26 27 12 1667 BD
18LADCOM
20IOUT A
19IOUT B
52.3Ω 52.3ΩVOUT1VP-PDIFFERENTIAL
+
–
0.1µF
25
5V
VDD
LTC1666
LTC1667
10
LTC1666/LTC1667/LTC1668
BLOCK DIAGRA
W
TI I G DIAGRAUW W
1666/7/8 TD
tDS tDH
CLK
N – 1
N – 1 N
N N + 1DATAINPUT
IOUT A/IOUT B
tCLKL tCLKH
tPD
0.1%
tST
–
+
IFS/8IREFIN
IINT
RSET2k
0.1µF
0.1µF
0.1µF–5V
0.1µF
REFOUTVREF 15
16
COMP121
COMP2
VSS
22
23
2.5VREFERENCE
ATTENUATORLADDER
LSB SWITCHES
INPUT LATCHES
CLOCKINPUT 16-BIT
DATA INPUT
SEGMENTED SWITCHESFOR DB15–DB12
CURRENT SOURCE ARRAY
AGND
17
DGND
24
CLK DB0DB15 • • •
• • •
• • • • • •
26 27 14 1668 BD
18LADCOM
20IOUT A
19IOUT B
52.3Ω 52.3ΩVOUT1VP-PDIFFERENTIAL
+
–
0.1µF
25
5V
VDD
LTC1668
11
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Theory of Operation
The LTC1666/LTC1667/LTC1668 are high speed currentsteering 12-/14-/16-bit DACs made on an advancedBiCMOS process. Precision thin film resistors and wellmatched bipolar transistors result in excellent DC linearityand stability. A low glitch current switching design givesexcellent AC performance at sample rates up to 50Msps.The devices are complete with a 2.5V internal bandgapreference and edge triggered latches, and set a newstandard for DAC applications requiring very high dy-namic range at output frequencies up to several mega-hertz.
Referring to the Block Diagrams, the DACs contain anarray of current sources that are steered to IOUTA or IOUTBwith NMOS differential current switches. The four mostsignificant bits are made up of 15 current segments ofequal weight. The remaining lower bits are binary weighted,using a combination of current scaling and a differentialresistive attenuator ladder. All bits and segments areprecisely matched, both in current weight for DC linearity,and in switch timing for low glitch impulse and lowspurious tone AC performance.
Setting the Full-Scale Current, IOUTFS
The full-scale DAC output current, IOUTFS, is nominally10mA, and can be adjusted down to 1mA. Placing aresistor, RSET, between the REFOUT pin, and the IREFIN pinsets IOUTFS as follows.
The internal reference control loop amplifier maintains avirtual ground at IREFIN by servoing the internal currentsource, IINT, to sink the exact current flowing into IREFIN.IINT is a scaled replica of the DAC current sources andIOUTFS = 8 • (IINT), therefore:
IOUTFS = 8 • (IREFIN) = 8 • (VREF/RSET) (1)
For example, if RSET = 2k and is tied to VREF = REFOUT =2.5V, IREFIN = 2.5/2k = 1.25mA and IOUTFS = 8 • (1.25mA)= 10mA.
The reference control loop requires a capacitor on theCOMP1 pin for compensation. For optimal AC perfor-mance, CCOMP1 should be connected to VSS and be placedvery close to the package (less than 0.1").
For fixed reference voltage applications, CCOMP1 shouldbe 0.1µF or more. The reference control loop small-signalbandwidth is approximately 1/(2π) • CCOMP1 • 80 or 20kHzfor CCOMP1 = 0.1µF.
Reference Operation
The onboard 2.5V bandgap voltage reference drives theREFOUT pin. It is trimmed and specified to drive a 2kresistor tied from REFOUT to IREFIN, corresponding to a1.25mA load (IOUTFS = 10mA). REFOUT has nominaloutput impedance of 6Ω, or 0.24% per mA, so it must bebuffered to drive any additional external load. A 0.1µFcapacitor is required on the REFOUT pin for compensa-tion. Note that this capacitor is required for stability, evenif the internal reference is not being used.
External Reference Operation
Figure 1, shows how to use an external reference to controlthe LTC1666/LTC1667/LTC1668 full-scale current.
Figure 1. Using the LTC1666/LTC1667/LTC1668with an External Reference
REFOUT
+
–
IREFIN
2.5VREFERENCE
RSET
0.1µF5V
1666/7/8 F02
EXTERNALREFERENCE
LTC1666/LTC1667/LTC1668
12
LTC1666/LTC1667/LTC1668
Adjusting the Full-Scale Output
In Figure 2, a serial interfaced DAC is used to set IOUTFS.The LTC1661 is a dual 10-bit VOUT DAC with a bufferedvoltage output that swings from 0V to VREF.
DAC Transfer Function
The LTC1666/LTC1667/LTC1668 use straight binary digitalcoding. The complementary current outputs, IOUT A and IOUTB, sink current from 0 to IOUTFS. For IOUTFS = 10mA (nomi-nal), IOUT A swings from 0mA when all bits are low (e.g.,Code = 0) to 10mA when all bits are high (e.g., Code = 65535for LTC1668) (decimal representation). IOUT B is comple-mentary to IOUT A. IOUT A and IOUT B are given by the followingformulas:
LTC1666:
IOUT A = IOUTFS • (DAC Code/4096) (2)
IOUT B = IOUTFS • (4095 – DAC Code)/4096 (3)
LTC1667:
IOUT A = IOUTFS • (DAC Code/16384) (4)
IOUT B = IOUTFS • (16383 – DAC Code)/16384 (5)
LTC1668:
IOUT A = IOUTFS • (DAC Code/65536) (6)
IOUT B = IOUTFS • (65535 – DAC Code)/65536 (7)
In typical applications, the LTC1666/LTC1667/LTC1668differential output currents either drive a resistive loaddirectly or drive an equivalent resistive load through atransformer, or as the feedback resistor of an I-to-Vconverter. The voltage outputs generated by the IOUT A andIOUT B output currents are then:
Figure 2. Adjusting the Full-Scale Current ofthe LTC1666/LTC1667/LTC1668 with a DAC
APPLICATIO S I FOR ATIO
WU UU
VOUT A = IOUT A • RLOAD (8)
VOUT B = IOUT B • RLOAD (9)
The differential voltage is:
VDIFF = VOUT A – VOUT B (10) = (IOUT A – IOUT B) • (RLOAD)
Substituting the values found earlier for IOUT A, IOUT B andIOUTFS (LTC1668):
VDIFF = 2 • DAC Code – 65535)/65536 • 8 •(RLOAD/RSET) • (VREF) (11)
From these equations some of the advantages of differen-tial mode operation can be seen. First, any common modenoise or error on IOUT A and IOUT B is cancelled. Second, thesignal power is twice as large as in the single-ended case.Third, any errors and noise that multiply times IOUT A andIOUT B, such as reference or IOUTFS noise, cancel nearmidscale, where AC signal waveforms tend to spend themost time. Fourth, this transfer function is bipolar; e.g. theoutput swings positive and negative around a zero outputat mid-scale input, which is more convenient for ACapplications.
Note that the term (RLOAD/RSET) appears in both thedifferential and single-ended transfer functions. This meansthat the Gain Error of the DAC depends on the ratio ofRLOAD to RSET, and the Gain Error tempco is affected by thetemperature tracking of RLOAD with RSET. Note also thatthe absolute tempco of RLOAD is very critical for DCnonlinearity. As the DAC output changes from 0mA to10mA the RLOAD resistor will heat up slightly, and even avery low tempco can produce enough INL bowing to besignificant at the 16-bit level. This effect disappears withmedium to high frequency AC signals due to the slowthermal time constant of the load resistor.
Analog Outputs
The LTC1666/LTC1667/LTC1668 have two complemen-tary current outputs, IOUT A and IOUT B (see DAC TransferFunction). The output impedance of IOUT A and IOUT B(RIOUT A and RIOUT B) is typically 1.1kΩ to LADCOM. (SeeFigure 3.)
+
–
IREFIN
2.5VREFERENCE
RSET1.9k
REF0.1µF
1/2 LTC1661
5V
1666/7/8 F03
LTC1666/LTC1667/LTC1668
13
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
LADCOM
The LADCOM pin is the common connection for theinternal DAC attenuator ladder. It usually is tied to analogground, but more generally it should connect to the samepotential as the load resistors on IOUT A and IOUT B. TheLADCOM pin carries a constant current to VSS of approxi-mately 0.32 • (IOUTFS), plus any current that flows fromIOUT A and IOUT B through the RIOUT A and RIOUT B resistors.
Output Compliance
The specified output compliance voltage range is ±1V. TheDC linearity specifications, INL and DNL, are trimmed andguaranteed on IOUT A into the virtual ground of anI-to-V converter, but are typically very good over the fulloutput compliance range. Above 1V the output current willstart to increase as the DAC current steering switchimpedance decreases, degrading both DC and AC linear-ity. Below –1V, the DAC switches will start to approach thetransition from saturation to linear region. This will de-grade AC performance first, due to nonlinear capacitanceand increased glitch impulse. AC distortion performanceis optimal at amplitudes less than ±0.5VP-P on IOUT A andIOUT B due to nonlinear capacitance and other large-signaleffects. At first glance, it may seem counter-intuitive todecrease the signal amplitude when trying to optimizeSFDR. However, the error sources that affect AC perfor-mance generally behave as additive currents, so decreas-ing the load impedance to reduce signal voltage amplitudewill reduce most spurious signals by the same amount.
Figure 4. AC Characterization Setup (LTC1668)
–
+ 16-BITHIGH SPEED
DAC
HP1663EALOGIC ANALYZER WITHPATTERN GENERATOR
VSS
VDD
–5V
LADCOM
AGND DGND CLK DB15 DB0
16
DIGITALDATA
CLKIN
1666/7/8 F05
IOUT A
0.1µF
LTC1668
5V
IREFIN
REFOUT
COMP1
COMP2
C20.1µF
0.1µF
OUT 1 OUT 2
C10.1µF
RSET2k
IOUT B
HP8110A DUALPULSE GENERATOR
LOW JITTERCLOCK SOURCE
CLKIN
50Ω
0.1µF
50Ω
TO HP3589ASPECTRUMANALYZER50Ω INPUT
110Ω
MINI-CIRCUITST1–1T
2.5VREFERENCE
Figure 3. Equivalent Analog Output Circuit
20
19
23
18RIOUT B
1.1k
5pF 5pF
–5V1666/7/8 F04
RIOUT A1.1k
LADCOM
IOUT A
IOUT B
VSS
52.3Ω
52.3Ω
LTC1666/LTC1667/LTC1668
14
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Operating with Reduced Output Currents
The LTC1666/LTC1667/LTC1668 are specified to operatewith full-scale output current, IOUTFS, from the nominal10mA down to 1mA. This can be useful to reduce powerdissipation or to adjust full-scale value. However, the DCand AC accuracy is specified only at IOUTFS = 10mA, andDC and AC accuracy will fall off significantly at lower IOUTFSvalues. At IOUTFS = 1mA, the LTC1668 INL and DNLtypically degrade to the 14-bit to 13-bit level, compared to16-bit to 15-bit typical accuracy at 10mA IOUTFS. Increas-ing IOUTFS from 1mA, the accuracy improves rapidly,roughly in proportion to 1/IOUTFS. Note that the AC perfor-mance (SFDR) is affected much more by reduced IOUTFSthan it is by reduced digital amplitude (see Typical Perfor-mance Characteristics). Therefore it is usually better tomake large gain adjustments digitally, keeping IOUTFSequal to 10mA.
Output Configurations
Based on the specific application requirements, theLTC1666/LTC1667/LTC1668 allow a choice of the best ofseveral output configurations. Voltage outputs can begenerated by external load resistors, transformer couplingor with an op amp I-to-V converter. Single-ended DACoutput configurations use only one of the outputs, prefer-ably IOUT A, to produce a single-ended voltage output.Differential mode configurations use the difference be-tween IOUT A and IOUT B to generate an output voltage,VDIFF, as shown in equation 11. Differential mode givesmuch better accuracy in most AC applications. Becausethe DAC chip is the point of interface between the digitalinput signals and the analog output, some small amountof noise coupling to IOUT A and IOUT B is unavoidable. Mostof that digital noise is common mode and is canceled bythe differential mode circuit. Other significant digital noisecomponents can be modeled as VREF or IOUTFS noise. Insingle-ended mode, IOUTFS noise is gone at zero scale andis fully present at full scale. In differential mode, IOUTFSnoise is cancelled at midscale input, corresponding to zeroanalog output. Many AC signals, including broadband andmultitone communications signals with high peak to aver-age ratios, stay mostly near midscale.
Differential Transformer-Coupled Outputs
Differential transformer-coupled output configurationsusually give the best AC performance. An example isshown in Figure 5. The advantages of transformer cou-pling include excellent rejection of common mode distor-tion and noise over a broad frequency range and conve-nient differential-to-single-ended conversion with isola-tion or level shifting. Also, as much as twice the power canbe delivered to the load, and impedance matching can beaccomplished by selecting the appropriate transformerturns ratio. The center tap on the primary side of thetransformer is tied to ground to provide the DC currentpath for IOUT A and IOUT B. For low distortion, the DCaverage of the IOUT A and IOUT B currents must be exactlyequal to avoid biasing the core. This is especially impor-tant for compact RF transformers with small cores. Thecircuit in Figure 5 uses a Mini-Circuits T1-1T RF trans-former with a 1:1 turns ratio. The load resistance onIOUT A and IOUT B is equivalent to a single differentialresistor of 50Ω, and the 1:1 turns ratio means the outputimpedance from the transformer is 50Ω. Note that theload resistors are optional, and they dissipate half of theoutput power. However, in lab environments or whendriving long transmission lines it is very desirable to havea 50Ω output impedance. This could also be done with a50Ω resistor at the transformer secondary, but puttingthe load resistors on IOUT A and IOUT B is preferred sinceit reduces the current through the transformer. At signalfrequencies lower than about 1MHz, the transformer coresize required to maintain low distortion gets larger, and atsome lower frequencies this becomes impractical.
Figure 5. Differential Transformer-Coupled Outputs
IOUT B
IOUT A
50Ω
50Ω
110Ω
MINI-CIRCUITST1-1T
RLOAD
1666/7/8 F06
LTC1666/LTC1667/LTC1668
15
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Resistor Loaded Outputs
A differential resistor loaded output configuration is shownin Figure 6. It is simple and economical, but it can driveonly differential loads with impedance levels and ampli-tudes appropriate for the DAC outputs.
The recommended single-ended resistor loaded configu-ration is essentially the same circuit as the differentialresistor loaded, case—simply use the IOUT A output,referred to ground. Rather than tying the unused IOUT Boutput to ground, it is preferred to load it with the equiva-lent RLOAD of IOUT A. Then IOUT B will still swing with awaveform complementary to IOUT A.
helps reduce distortion by limiting the high frequencysignal amplitude at the op amp inputs. The circuit swings±1V around ground.
Figure 8 shows a simplified circuit for a single-endedoutput using I-to-V converter to produce a unipolarbuffered voltage output. This configuration typically hasthe best DC linearity performance, but its AC distortion athigher frequencies is limited by U1’s slewing capabilities.
Digital Interface
The LTC1666/LTC1667/LTC1668 have parallel inputs thatare latched on the rising edge of the clock input. Theyaccept CMOS levels from either 5V or 3.3V logic and canaccept clock rates of up to 50MHz.
Referring to the Timing Diagram and Block Diagram, thedata inputs go to master-slave latches that update on therising edge of the clock. The input logic thresholds, VIH =2.4V min, VIL = 0.8V max, work with 3.3V or 5V CMOSlevels over temperature. The guaranteed setup time, tDS,is 8ns minimum and the hold time, tDH, is 4ns minimum.The minimum clock high and low times are guaranteed at6ns and 8ns, respectively. These specifications allow theLTC1666/LTC1667/LTC1668 to be clocked at up to 50Mspsminimum.
For best AC performance, the data and clock waveformsneed to be clean and free of undershoot and overshoot.Clock and data interconnect lines should be twisted pair,coax or microstrip, and proper line termination is impor-tant. If the digital input signals to the DAC are consideredas analog AC voltage signals, they are rich in spectralcomponents over a broad frequency range, usually in-
Op Amp I to V Converter Outputs
Adding an op amp differential to single-ended convertercircuit to the differential resistor loaded output gives thecircuit of Figure 7.
This circuit complements the capabilities of the trans-former-coupled application at lower frequencies, sinceavailable op amps can deliver good AC distortion perfor-mance at signal frequencies of a few MHz down to DC. Theoptional capacitor adds a single real pole of filtering, and
Figure 6. Differential Resistor-Loaded Output
IOUT B
IOUT A
52.3Ω52.3Ω
1666/7/8 F07
LTC1666/LTC1667/LTC1668
Figure 8. Single-Ended Op Amp I to V Converter
200Ω
1666/7/8 F09
IOUT A
IOUT B
LADCOM
RFB200Ω
VOUT0V TO 2V
IOUTFS10mA
COUT
–
+U1
LT®1812LTC1666/LTC1667/LTC1668
IOUT B
IOUT A
52.3Ω 500Ω52.3Ω
1666/7/8 F08
–
+
200Ω
500Ω
200Ω
60pF LT1809±1V
10dBm
VOUT
LTC1666/LTC1667/LTC1668
Figure 7. Differential to Single-Ended Op Amp I-V Converter
16
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
cluding the output signal band of interest. Therefore, anydirect coupling of the digital signals to the analog outputwill produce spurious tones that vary with the exact digitalinput pattern.
Clock jitter should be minimized to avoid degrading thenoise floor of the device in AC applications, especiallywhere high output frequencies are being generated. Anynoise coupling from the digital inputs to the clock input willcause phase modulation of the clock signal and the DACwaveform, and can produce spurious tones. It is normallybest to place the digital data transitions near the fallingclock edge, well away from the active rising clock edge.Because the clock signal contains spectral componentsonly at the sampling frequency and its multiples, it isusually not a source of in band spurious tones. Overall, itis better to treat the clock as you would an analog signaland route it separately from the digital data input signals.The clock trace should be routed either over the analogground plane or over its own section of the ground plane.The clock line needs to have accurately controlled imped-ance and should be well terminated near the LTC1666/LTC1667/LTC1668.
Printed Circuit Board Layout Considerations—Grounding, Bypassing and Output Signal Routing
The close proximity of high frequency digital data lines andhigh dynamic range, wide-band analog signals makesclean printed circuit board design and layout an absolute
necessity. Figures 11 to 15 are the printed circuit boardlayers for an AC evaluation circuit for the LTC1668. Groundplanes should be split between digital and analog sectionsas shown. All bypass capacitors should have minimumtrace length and be ceramic 0.1µF or larger with low ESR.
Bypass capacitors are required on VSS, VDD and REFOUT,and all connected to the AGND plane. The COMP2 pin tiesto a node in the output current switching circuitry, and itrequires a 0.1µF bypass capacitor. It should be bypassedto VSS along with COMP1. The AGND and DGND pinsshould both tie directly to the AGND plane, and the tie pointbetween the AGND and DGND planes should nominally benear the DGND pin. LADCOM should either be tied directlyto the AGND plane or be bypassed to AGND. The IOUT A andIOUT B traces should be close together, short, and wellmatched for good AC CMRR. The transformer outputground should be capable of optionally being isolated orbeing tied to the AGND plane, depending on which givesbetter performance in the system.
Suggested Evaluation Circuit
Figure 10 is the schematic and Figures 11 to 15 are thecircuit board layouts for a suggested evaluation circuit,DC245A. The circuit can be programmed with componentselection and jumpers for a variety of differentially coupledtransformer output and differential and single-ended re-sistor loaded output configurations.
REFOUT LADCOMIOUT A
VOUT
IOUT BIREFIN CLK
LTC1668U2
Q-CHANNEL
REFOUT LADCOMIOUT A
IOUT BIREFIN CLK
LTC1668U1
I-CHANNEL
52.3Ω
52.3Ω52.3Ω
52.3Ω
LOW-PASSFILTER
LOW-PASSFILTER
CLOCKINPUT
REF
1/2 LTC1661U3
SERIALINPUT
2k
2.1k
21k
0.1µF
0.1µF
90° ∑
LOCALOSCILLATOR
QAMOUTPUT
QUADRATUREMODULATOR
±5%RELATIVE GAIN
ADJUSTMENT RANGE
1666/7/8 F10
Figure 9. QAM Modulation Using LTC1668 withDigitally Controlled I vs Q Channel Gain Adjustment
17
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Figu
re 1
0. S
ugge
sted
Eva
luat
ion
Circ
uit
J4 V OUT
J5 I OUT
B
J6 EXTC
LK
JP9
12
3
1516
R3 1.91
k0.
1%R2 200Ω
JP1
C17
0.1µ
FLT
C166
8
20 19 21 22 2318
C7 0.1µ
F
5V–5
V
TP5
TEST
POIN
T W
HT
C3 0.1µ
FC1
80.
1µF
25 17 24
C10
0.1µ
FC1
10.
1µF
R9 50Ω
0.1%
R12
49.9
Ω 1%
JP6
R10
50Ω
0.1%
C12
22pF
C12
22pF
C90.
1µF
C8 0.1µ
F
C8 0.1µ
F
JP5
TP3
TEST
POIN
T W
HT
JP7
JP3
R5R6
R7 110Ω
JP4
JP2
5V
REFO
UTRE
FIN
27 28 1 2 3 4 5 6 7 8 9 10 11 12 13 14 26
DB15
(MSB
)DB
14
DB13
DB12
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
(LSB
)
CLK
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
I OUT
A
I OUT
B
COM
P1
COM
P2 V SS
LADC
OM V DD
AGND
DGND
R4
J2 I OUT
A
C4R8
3 2 1
4T1 MIN
I- CI
RCUI
TST1
–1T6
C5
JP8
TP4
TEST
POIN
TW
HT
2 4 6
1 3 5
RN5
+5VD
22Ω
+5VD
J7 J10
TP6
TEST
POIN
T RE
D4
2
5V
6
LT14
60DC
S8-2
.5
AMP
1021
59-9
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
RN6
22Ω
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
TP2
TEST
POIN
T W
HT2.
5VRE
F
TP10
TEST
POIN
T BL
KTP
1
V IN
V OUT
GND
C20.
1µF
C1 0.1µ
F
J1EX
TREF
R1 10Ω
+C1
90.
1µF
C14
10µF
25V
–5V
AGND
DGND
J9
TP8
TEST
POIN
T RE
D
GROU
ND P
LANE
TIE
POIN
T
+
C20
0.1µ
F
C16
10µF
25V
1666
/7/8
F11
C22
0.1µ
F
+5VA
J8 J11
TP7
TEST
POIN
T RE
D
TP9
TEST
POIN
T BL
K
+C2
30.
1µF
C15
10µF
25V
C21
0.1µ
F
OPTI
ONAL
SIP
PULL
-UP/
PULL
-DOW
NRE
SIST
ORS
(NOT
IN
STAL
LED)
OPTI
ONAL
SIP
PULL
-UP/
PULL
-DOW
NRE
SIST
ORS
(NOT
IN
STAL
LED)
+5VD
R16
0ΩR15
0ΩR14
0ΩR13
0Ω
18
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Figure 11. Suggested Evaluation Circuit Board—Silkscreen
19
LTC1666/LTC1667/LTC1668
Figure 12. Suggested Evaluation Circuit Board—Component Side
APPLICATIO S I FOR ATIO
WU UU
20
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Figure 13. Suggested Evaluation Circuit Board—GND Plane
21
LTC1666/LTC1667/LTC1668
APPLICATIO S I FOR ATIO
WU UU
Figure 14. Suggested Evaluation Circuit Board—Power Plane
22
LTC1666/LTC1667/LTC1668
Figure 15. Suggested Evaluation Circuit Board—Solder Side
APPLICATIO S I FOR ATIO
WU UU
23
LTC1666/LTC1667/LTC1668
U
PACKAGE DESCRIPTIO
G28 SSOP 0501
.13 – .22(.005 – .009)
0° – 8°
.55 – .95(.022 – .037)
5.20 – 5.38**(.205 – .212)
7.65 – 7.90(.301 – .311)
1 2 3 4 5 6 7 8 9 10 11 12 1413
10.07 – 10.33*(.397 – .407)
2526 22 21 20 19 18 17 16 1523242728
1.73 – 1.99(.068 – .078)
.05 – .21(.002 – .008)
.65(.0256)
BSC.25 – .38
(.010 – .015)
MILLIMETERS(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED .152mm (.006") PER SIDEDIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
G Package28-Lead Plastic SSOP (5.3mm)(Reference LTC DWG # 05-08-1640)
24
LTC1666/LTC1667/LTC1668
LINEAR TECHNOLOGY CORPORATION 2000
166678f LT/TP 0701 2K • PRINTED IN USALinear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 FAX: (408) 434-0507 www.linear.com
RELATED PARTS
TYPICAL APPLICATIO
U
Figure 16. Arbitrary Waveform Generator Has ±10V Output Swing, 50Msps DAC Update Rate
REFOUT LADCOM
IOUT A
IOUT B
IREFIN LTC1668
52.3Ω 52.3Ω
RSET2k –
+
VSS AGND DGND CLK DB15-DB0
COMP1COMP2
0.1µF
0.1µF
0.1µF
–5V
5V
CLOCKINPUT
18-BITDATAINPUT
VDD
100pF LT1227
1k
VOUT±10V
1666/7/8 F17
1k
PART NUMBER DESCRIPTION COMMENTS
ADCs
LTC1406 8-Bit, 20Msps ADC Undersampling Capability Up to 70MHz Input
LTC1411 14-Bit, 2.5Msps ADC
LTC1420 12-Bit, 10Msps ADC 72dB SINAD at 5MHz fINLTC1604/LTC1608 16-Bit, 333ksps/500ksps ADCs 16-Bit, No Missing Codes, 90dB SINAD, –100dB THD
DACs
LTC1591/LTC1597 Parallel 14/16-Bit Current Output DACs On-Chip 4-Quadrant Resistors
LTC1595/LTC1596 Serial 16-Bit Current Output DACs Low Glitch, ±1LSB Maximum INL, DNL
LTC1650 Serial 16-Bit Voltage Output DAC Low Power, Deglitched, 4-Quadrant Multiplying VOUT DAC,±4.5V Output Swing, 4µs Settling Time
LTC1655(L) Single 16-Bit VOUT DAC with Serial Interface in SO-8 5V (3V) Single Supply, Rail-to-Rail Output Swing
LTC1657(L) 16-Bit Parallel Voltage Output DAC 5V (3V) Low Power, 16-Bit Monotonic Over Temp., Multiplying Capability
AMPLIFIERs
LT1809/LT1810 Single/Dual 180MHz, 350V/µs Op Amp Rail-to-Rail Input and Output, Low Distortion
LT1812/LT1813 Single/Dual 100MHz, 750V/µs Op Amp 3.6mA Supply Current, 8nV/√Hz Input Noise Voltage