Low-Voltage Power Factor Correction Development …ww1.microchip.com/downloads/en/DeviceDoc/Low-Voltage...2018 Microchip Technology Inc. DS50002832A-page 5 LOW-VOLTAGE POWER FACTOR

2018 Microchip Technology Inc. DS50002832A

Low-VoltagePower Factor Correction

Development KitUser’s Guide

DS50002832A-page 2 2018 Microchip Technology Inc.

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© 2019, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-4435-0

LOW-VOLTAGEPOWER FACTOR CORRECTION

DEVELOPMENT KIT USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 5

Chapter 1. Overview....................................................................................................... 91.1 Introduction ..................................................................................................... 91.2 Low-Voltage Power Factor Correction Development Kit .............................. 10

1.2.1 LVPFC Development Board ...................................................................... 101.2.2 Digital Power Plug-In Module (DP PIM) Board .......................................... 12

1.3 System Setup ............................................................................................... 131.4 Test Points ................................................................................................... 141.5 Electrical Characteristics .............................................................................. 151.6 Mating Socket Pinout ................................................................................... 151.7 Measurement Results .................................................................................. 16

Appendix A. Board Layout and Schematics.............................................................. 23A.1 LVPFC Development Board Schematics ..................................................... 24A.2 LVPFC Development Board PCB Layout .................................................... 26A.3 Auxiliary Power Supply Module Schematics ................................................ 28A.4 Auxiliary Power Supply Module PCB Layout ............................................... 29

Appendix B. Bill of Materials (BOM)........................................................................... 31B.1 Bill of Materials – LVPFC Development Board ............................................ 31B.2 Bill of Materials – Auxiliary Power Supply Module ....................................... 34

Appendix C. Example Algorithm ................................................................................ 37C.1 Interleaved PFC Boost Converter in Transition Mode ................................. 37C.2 Interleaved PFC Boost Converter in Continuous

Conduction Mode ................................................................................... 39

Appendix D. Optional Supporting Equipment........................................................... 41D.1 Introduction .................................................................................................. 41D.2 Isolation Transformer ................................................................................... 41D.3 Active Load 50W .......................................................................................... 42

Worldwide Sales and Service .................................................................................... 44

2018 Microchip Technology Inc. DS50002832A-page 3

Low-Voltage Power Factor Correction Development Kit User’s Guide

NOTES:




Preface

INTRODUCTION

This chapter contains general information that will be useful to know before using the Low-Voltage Power Factor Correction (LVPFC) Development Kit. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Website

• Product Change Notification Service

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the LVPFC Development Kit to ensure safe voltage levels at moderate power. The document is organized as follows:

• Chapter 1. “Overview” — This chapter introduces the LVPFC Development Kit and provides a brief overview of its various features.

• Appendix A. “Board Layout and Schematics” — This appendix presents the schematics and board layouts for the LVPFC Development Kit and the Auxiliary Power Supply module.

• Appendix B. “Bill of Materials (BOM)” — This appendix presents the Bill of Materials for the LVPFC Development Kit and the Auxiliary Power Supply module.

• Appendix C. “Example Algorithm” — This appendix provides algorithm examples for the LVPFC Development Board.

• Appendix D. “Optional Supporting Equipment” — This appendix presents the recommended supporting equipment to be used with the LVPFC Development Board.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.


http://www.microchip.com


CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or dialog

“Save project before build”

Underlined, italic text with right angle bracket

A menu path File>Save

Bold characters A dialog button Click OK

A tab Click the Power tab

N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.

4‘b0010, 2‘hF1

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be any valid filename

Square brackets [ ] Optional arguments mcc18 [options] file [options]

Curly brackets and pipe character: { | }

Choice of mutually exclusive arguments; an OR selection

errorlevel {0|1}

Ellipses... Replaces repeated text var_name [, var_name...]

Represents code supplied by user

void main (void){ ...}


Preface

RECOMMENDED READING

This user’s guide describes how to use LVPFC Development Kit. Other useful document(s) are listed below. The following Microchip document(s) are recommended as supplemental reference resources.

• “Digital Power Development Board User’s Guide” (www.microchip.com/DS50002814); available for download from the Microchip website.

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events; and listings of Microchip sales offices, distributors and factory representatives

PRODUCT CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Corporate Application Engineer (CAE)

• Embedded Solutions Engineer (ESE)

Customers should contact their distributor, representative or Embedded Solutions Engineer (ESE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the website at:

http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (April 2019)

This is the initial version of this document.




http://www.microchip.com/support


NOTES:




Chapter 1. Overview

1.1 INTRODUCTION

When developing high-voltage applications, especially offline Power Factor Correction (PFC) applications, engineers face safety concerns with high-voltage and high-energy electronic devices. The purpose of the Low-Voltage Power Factor Correction (LVPFC) Development Kit is to offer safe voltage levels at moderate power, while designing algorithms for a boost Power Factor Correction topology. These algorithms can be applied on real systems under development with minimal effort. The LVPFC Development Kit utilizes Microchip’s latest Digital Power Plug-In Module (DP PIM) with the dsPIC33EP128GS806 device, supporting fully digital and advanced power control algorithm schemes. However, the pinout is standardized and the kit supports all currently available DP PIMs, thus allowing users to evaluate different devices under the same conditions. For more information on the available DP PIMs, visit: https://www.microchip.com.

Figure 1-1 shows the high-level block diagram.

FIGURE 1-1: HIGH-LEVEL BLOCK DIAGRAM

The topics covered in this chapter include:

• Low-Voltage Power Factor Correction Development Kit

• System Setup

• Test Points

• Electrical Characteristics

• Mating Socket Pinout

• Measurement Results

LVPFC Development

Board

V C/ V C

V C/ V C

VDC

Note: Please note that the Isolation Transformer has 10:1 turns ratio. Therefore, every voltage at the primary side will be scaled down by a factor of 10.For documentation simplicity, further on we will talk about 24 VAC input voltage.


https://www.microchip.com/


1.2 LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT KIT

The LVPFC Development Kit consists of:

1. LVPFC Development Board.

2. Digital Power Plug-In Module (DP PIM) Board.

Optional supporting equipment:

3. Isolation Transformer.

4. Active Load 50W.

1.2.1 LVPFC Development Board

The LVPFC Development Board is based on conventional Interleaved Boost Power Factor Correction (PFC) topology. The converter supports a 24 VAC input, but the PCB is designed following high-voltage design rules. With some modifications, the board can support a universal offline voltage range of 80 VAC to 260 VAC, and up to 200W output power at 400 VDC output voltage. Figure 1-2 shows the high-level overview.

FIGURE 1-2: LVPFC DEVELOPMENT BOARD

The main blocks of the LVPFC Development Board are:

• EMI/EMC Filter at the Input (capable of high voltage)

• Bridge Rectifier (3 AMAX, capable of high voltage)

• Phase 1 (MOSFET, Current Transformer, diode rectifier)

• Phase 2 (MOSFET, Current Transformer, diode rectifier)

• Ultra-Wide Voltage Range (UWVR) 5W Flyback (capable of low and high voltage); provides a 12V primary, non-galvanic isolated and 12V secondary, 4 kV galvanic isolated voltage

• Switch Mode Step-Down Regulator, 5V/400 mA, Pin-to-Pin Compatible with theLAN780X Family of Linear Regulators

EMI Filter Phase 1

Phase 2

Current Sense (CS) Gate Drive

and ZCD

Input Voltage 12 VAC to 24 VAC

3 ARMS_MAX

Output Voltage 36 V to 42 V

50 W

DP PIM Board dsPIC33EPXX

UWVR 5W Flyback

12V Primary

Bridge Rec er

Bulk Capacitors

UART (I2C)

GPIOProgramming

PWM1 and 2 CS1 and 2 ZCD1 and 2

V V

DC-DC 5V Regulator

Current Sense Gate Drive

and ZCD

Legend:

PFC Development Board

5W Flyback Board

DC-DC Regulator

Digital Power PIM Board

12V Secondary4 kV Isolated


Overview

The LVPFC Development Board supports:

• Single-Phase or Dual Phase Operation Mode

• Discontinuous, Transition, Continuous Current Mode of Operation

• Input AC Voltage, Output DC Voltage: Resistive Voltage Divider Sense

• Current Sense in Each Power Switch Leg: Current Transformers

• Zero-Cross Detection (ZCD): Auxiliary Winding Placed at Storage Chokes

• Inrush Current Limiter: Negative Temperature Coefficient (NTC) Resistor and Relay

• Output Overvoltage Protection (OVP): Analog Comparator with Hysteresis and Disabling Gate Drivers; power Reset (unplug the power) is needed to reset the comparator

• Mating Socket for DP PIM Board

The LVPFC Development Board has the following features, as shown in Figure 1-3:

FIGURE 1-3: LVPFC DEVELOPMENT BOARD

1. Socket for Digital Power Plug-In Module (DP PIM) boards. Socket type is Samtec, Inc. (Part #: MECF-30-01-L-DV-WT).

2. Auxiliary Power Supply module.

3. Input power connector.

4. Output power connector.

5. Input EMI filter.

6. PFC storage chokes.

7. Current Transformers.

8. Output bulk capacitors.

9. Input rectifier, power MOSFETs with their heat sink.

10. Inrush current limiter (NTC resistor and relay).

11. DC-DC 5V regulator.

Board dimensions are: 160 mm (length) x 100 mm (height).



1.2.2 Digital Power Plug-In Module (DP PIM) Board

The dsPIC33EP128GS806 Digital Power Plug-In Module (DP PIM) is a demonstration board that showcases the Microchip dsPIC33EP128GS806 16-Bit Digital Signal Controller (DSC) features. The DP PIM provides access to the dsPIC33EP128GS806 analog inputs, the Digital-to-Analog Converter (DAC) outputs, the Pulse-Width Modulation (PWM) outputs and the General Purpose Input and Output (GPIO) ports. The Microchip series of DP PIMs for digital power share the same pinout at the mating socket. However, these DP PIMs show slightly different performing characteristics.

Figure 1-4 shows the features of the dsPIC33EP128GS806 DP PIM Board.

FIGURE 1-4: dsPIC33EP128GS806 DP PIM BOARD

1. Microchip dsPIC33EP128GS806 16-bit Digital Signal Controller (64-pin TQFP package).

2. ICSP™ programming header (6-pin, 2.54 mm header).

3. On-board LDO (3.6 VDC to 6.3 VDC) with Power Good (PG) function.

4. Solder pad for ground connection.

5. Micro-USB connector. (Please note that there is no galvanic isolation provided at this point.)

6. MCP2221A USB to UART/I2C serial converter.

7. Power indicator LED (green).

8. User LED (red).

9. Board edge connection interface for analog inputs/outputs, PWM outputs and GPIO ports.

10. Analog input with op amp buffer via test point loop connector; can be used for Bode plot measurements.

11. Test point loops for DAC outputs.

Board dimensions are: 51 mm (length) x 38.5 mm (width).

For more information on the DP PIM Board, refer to the “dsPIC33EP128GS806 Digital Power Plug-In Module (PIM) User’s Guide” (www.microchip.com/DS50002761).

1.2.2.1 SOCKET FOR DP PIM BOARDS

Insert the DP PIM Board under test into the socket located at the end of the board. This socket has a slot that defines the DP PIM Board direction. Be careful not to break the slot when inserting the DP PIM Board into the socket.

The DP PIM Board has a micro-USB connector that can be used for communication with the dsPIC® device. The UART protocol and Graphical User Interface (GUI) are used to establish communication. For more information, please visit: www.microchip.com.

1

2

3

4

5 6

7

8

9

10

11

10

A D D A

4

9

PCB Top View PCB Bottom View


www.microchip.com

Overview

1.3 SYSTEM SETUP

Figure 1-5 shows the standard test setup. For more information on the isolation transformer and the active load, refer to Appendix D. “Optional Supporting Equipment”.

FIGURE 1-5: STANDARD SYSTEM SETUP

Isolation Transformer: Be careful to position the input voltage selector into the proper place (120V or 230V) before plugging into mains. The Protective Earthing (PE) connection between the transformer and the LVPFC Development Board is not mandatory. Use the switch at the front panel to provide or cut off the power to the LVPFC Development Board.

The isolation transformer can be coupled with an adjustable AC source to support a wider AC input voltage range. Output impedance of the transformer should be very close to the Line Insertion Stabilization Network (LISN), which is used for EMI measurements. It allows a certain grade of impedance matching and interference to bring the LVPFC Development Board closer to real-world applications. If using a different type of transformer, please take care that the leakage inductance is in the range of 50 µH (±20%). Also, if using an active AC source only, the usage of differential voltage probes is mandatory.

Active Load: Please read the user manual of the device before operating. Incorrect setup can damage the LVPFC Development Board. The purpose of the PFC stage is to source loads, such as a DC/DC downstream converter, which is acting as a constant power system. Therefore, all measurements must be done under this condition. The active load, prepared for this development kit, can act as a downstream converter with the following features: constant power, constant current, Undervoltage Lockout (UVLO), load step of 100 Hz and 50% duty cycle (pulse). If different equipment is used, please note that some functions on the supplementary equipment may not be available and special care must be taken during start-up, light or no load conditions.

DP PIM Board USB Connection: Use the micro-USB cable to connect the DP PIM Board with the host PC and run the dSMPS GUI to communicate with the dsPIC device; it is allowed only if the board is galvanically isolated (isolation transformer is used). For more information, refer to the user’s guide of the specific DP PIM Board that is used.

Isola onTransformer 10:1 50W A ve Load

Constant PowerConstant Current

120 V /230 V

24 VUVLO = 36V

Po = 45W

0 V

ACPower Meter

I V

+

12 V WallAdapter

120 V ...230 V

DPPI

MBo

ard

L N GND

LVPFC Development

Board

GUI

!

!

V = 12VI = 200 mA

+

GND +V

12V AuxiliaryPower Supply

Firmware DebuggingPurpose Only

J1 J2

J9

J3



12V Auxiliary Power Supply: Connecting this voltage source to the board provides a permanent 12V. It is useful for debugging purposes, where powering a main power train is not needed.

Test Points: Use an oscilloscope to access the test points at the edge of the board. For reference potential, use GND_P or GND_A; this is allowed only if the board is galvanically isolated (isolation transformer is used).

AC Power Meter: Use the AC power meter for algorithm optimizations at the AC line (power factor, THD, efficiency, etc.); it is not mandatory for basic algorithm development.

1.4 TEST POINTS

Test loop points are placed mostly on the LVPFC Development Board. They can be used to access analog and PWM signals coming from or to the DP PIM Board. Table 1-1 lists the test points on the LVPFC Development Board.

TABLE 1-1: TEST POINTS

Test Point Name Function/Description

TP1, TP2 GND_P (power reference GND)

TP3 Switching Node, Phase 1

TP4 Power GND Reference Potential

AGND Analog GND Reference Potential

TP6 Switching Node, Phase 2

CH2 Output PFC Voltage, Spectrum Analyzer Injection Point

CH1 Spectrum Analyzer Injection Point

VAC Rectified Input AC Voltage

ZCD1 Zero-Cross Detection, Phase 1

ZCD2 Zero-Cross Detection, Phase 2

PFC-PWM1 dsPIC® DSC PWM Output, Phase 1

PFC-PWM2 dsPIC DSC PWM Output, Phase 2

CS1 Current Transformer – Current Sense, Phase 1

CS1 Current Transformer – Current Sense, Phase 2

Relay dsPIC DSC Output Control – Relay On/Off

VAC_SENSE Input AC Voltage Sense Line

VPFC_SENSE PFC Voltage Sense Line

5V System VDD Rail


Overview

1.5 ELECTRICAL CHARACTERISTICS

Table 1-2 shows the electrical characteristics of the LVPFC Development Board.

1.6 MATING SOCKET PINOUT

The pinout is shown in Table 1-3.

TABLE 1-2: ELECTRICAL CHARACTERISTICS

Parameter Low-Voltage Solution High-Voltage Solution

Input Voltage Range (VAC) 8 to 26 80 to 260

Output Power (WMAX) 50 200

Output Load Current (AMAX) 1.28 0.51

Input Current (AMAX) 3

Efficiency (%) ~90 ~96

Operating Temperature Range 0°C to +40°C

TABLE 1-3: MATING SOCKET PINOUT

Name Mating Socket Pin Function/Description

GND_A 1, 2 Analog Ground

CS2 6 Current Sense, Phase 2

ZCD2 8 Zero-Cross Detection, Phase 2

Temp 9 Temperature Sense

VPFC_SENSE 10 Output PFC Voltage Sense

CS1 12 Current Sense, Phase 1

VAC_SENSE 14 Input AC Voltage Sense

ZCD1 18 Zero-Cross Detection, Phase 1

PFC-PWM2 42 PWM Output, Phase 2

PFC-PWM1 45 PWM Output, Phase 1

Relay 46 Inrush Control – Relay On/Off

+5V 57, 59 VDD Rail

GND_D 58, 60 Digital Ground



1.7 MEASUREMENT RESULTS

If not otherwise stated, all measurements were done at 24 VAC input voltage and 50W output load, using the setup shown in Figure 1-5. The algorithm used was supporting the interleaved Transition Mode (TM) regulation technique. The regulated output voltage was 40 VDC. Distortion in the input AC signal is coming from the mains voltage. The input current distortion close to zero cross is due to the fact that the voltage below 1.2V cannot cross the bridge rectifier at the input. This 1.2V is approximately 4% of the input voltage. In case of full voltage scale at the mains, this error would be one decade below, that is, 0.4%.

Figure 1-6 through Figure 1-12 show the oscilloscope measurements.

FIGURE 1-6: SWITCHING NODES

Legend:

C1 (yellow): Gate Voltage

C2 (red): Drain Voltage

C4 (green): Input Current

Time Base: 10 µs/div


Overview

FIGURE 1-7: 100 Hz OUTPUT RIPPLE VOLTAGE

Legend:

C1 (yellow): VOUT (AC coupled)


Time Base: 5 ms/div



FIGURE 1-8: VPFC_SENSE, VAC_IN TEST POINTS

Legend:

C1 (yellow): VPFC_SENSE

C2 (red): VAC_IN


Time Base: 5 ms/div


Overview

FIGURE 1-9: ZERO-CROSS DETECTION (ZCD), PWM TEST POINTS

Legend:

C1 (yellow): ZCD Test Point

C2 (red): PWM Test Point



Condition: Input current close to minimum.



FIGURE 1-10: ZERO-CROSS DETECTION (ZCD), PWM TEST POINTS

Legend:

C1 (yellow): ZCD Test Point




Condition: Input current at the peak.


Overview

FIGURE 1-11: CURRENT TRANSFORMER (CT), PWM TEST POINTS

Legend:

C1 (yellow): CT Test Point




Condition: Input current close/around zero cross.



FIGURE 1-12: CURRENT TRANSFORMER (CT), PWM TEST POINTS

Legend:

C1 (yellow): CT Test Point




Condition: Input current at the peak.




Appendix A. Board Layout and Schematics

This appendix contains the schematics and board layouts for the LVPFC Development Board. The topics covered in this appendix include:

• LVPFC Development Board Schematics

• LVPFC Development Board PCB Layout

• Auxiliary Power Supply Module Schematics

• Auxiliary Power Supply Module PCB Layout


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Designed with

Altium.com

ND_P

1N4148D11

GND_AGND_A

CS2

VPFC

Ptot = 1W

UPFC = 36V ...42 VMAXIOUT_MAX = 1.3APMAX = 50W

10k12061%

R16

10k12061%

R15

10k12061%

R14Vpfc_sense

GND_P

2

3 4

1

CS4100V-01L

T2

ES3B

D3

50V1500 μFC4

50V1500 μFC5

GND_P GND_P

GND_P

VPFC

10k12061%

R21

TP2

GND_P

51R06031%

R8CH2

CH1

120R06031%

R22120R06031%

R23

GND_A

3V @ 5A peak current

IRMS_MAX = 2AIPEAK_MAX = 5APD_MAX = 300 mW

2.20k06031%

R4

GND_A

VSENSE = 0,06832 x VPFCVSENSE = 2,12V @ 31VVSENSE = 2.73V @ 40V

TP1

GND_P

47 μF63V

C19

GND_PGND

VPFC

0.1 μF500V1210

C20

GND_P

15R12061%

R9

GND_P

4.7 μH

L4

330 μF450VP10D35H35

DNPC1

CAP1931

33 μF450VP5D12.5H27

DNPC18

2

3 IPP126N10N3GQ4

12

TERMINAL 1x2

J2

12

TERMINAL 1x2

J3

6800 pF50V0603

C23

GND_A

680 pF100V0805

C22

CH2 and CH1 for BODEvoltage loop measurment only

A.1 LVPFC DEVELOPMENT BOARD SCHEMATICS

Figure A-1 and Figure A-2 show the board schematics.

FIGURE A-1: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD SCHEMA

PFC-PWM2

GND_P

G

1N4148D8 CS1

GND_A GND_A10R1206

R17

10R1206

R24

VAC

Ptot = 1W

3V @ 5A peak currentGND_P

275V

Disc 10 mm

MOV1

IRMS_MAX = 2AIPEAK_MAX = 5APD_MAX = 300 mW

IRMS_MAX = 1.3AIPEAK_MAX = 5AIAV = 0.63APD_MAX = 450 mW

10k12061%

R5

10k12061%

R6

10k12061%

R7Vac_sense

US1JD6

US1JD7

2

3 4

1

CS4100V-01L

T1

2 mH

2 3

41 1

2

L2ES3B

D2

PFC-PWM1

31

22N7002-7-FQ3

10k06031%

R20

Relay

1N4148D10

PFC Power Stage12V<Uinac<26V30V<UPFC<42V0W<POUT<50WEta>90%Ploss<6W

3 1276

12

50 μHL1

PE

VIN =12 VAC...26 VAC3 AMAX

PEPE

0.33 μFAC 275V

C3

10k12061%

R11

1 μF16V

C12

1 μF16V

C13

Vac

10R1206

R18

10R1206

R25

3.3k06031%

R19

3.3k06031%

R26

120R06031%

R12120R06031%

R13

GND_A

GND_A

GND_A

1k06031%

R10

1k06031%

R1

ZCD2

ZCD1

GND_A

GND_A

0.47 μF310V

C80.47 μF310V

C9

1N4148D1

1N4148D9

+5V

+12V_P

TP3

TP6

GND_P GND_P

2.20k06031%

R30

GND_A

GND_P

VDD1

IN2

EN3

GND 4

GND 5

OUT 6OUT 7

VDD8

MCP14A0452

U1

10R

R31

GND_P

GND_P

VDD1

IN2

EN3

GND 4

GND 5

OUT 6OUT 7

VDD8

MCP14A0452

U2

GND_P

10R

R32+12V_P

GND_P

GND_P

Drive_Enable


100R06031%

R39

15R12061%

R2

GND_P

F2395-NDFuse has to be added

5A 250 VAC

F2

-t10R

TH1

3 1276 2

50 μHL3

P1 P2

P3 P4

123

TERMINAL 1x3J1

Fuse Holder 5x20 mm

F1

0.68 μF310VRadial

C7

4700 pF300VP7.5D8H11

C104700 pF300VP7.5D8H11

C11

RS3J

D12

1

2

3

4

G6C-1114P-US-DC5

RL1

2

13 IPP126N10N3G

Q2

1

6800pF50V0603

C24

GND_A

3.3VD16

GND_A

3.3VD14

GND_A

1N4148D15

1N4148D13

3 1

42

~

~

+

-600V/3AKBP306GTB

D5

680 pF100V0805

C21

1

Bo

ard

La

yo

ut a

nd

Sc

he

ma

tics

2

01

8 M

icroch

ip T

ech

no

log

y Inc.

DS

50

00

28

32

A-p

ag

e 2

5

FIG S (PAGE 2 OF 2)

Designed with

Altium.com

Temp100R06031%

R27

1 μF16V

C6

GND_P

PFC-PWM1

Temp

ZCD1

PFC-PWM2

PFC-PWM1

CS2

VPFC_SENSE

ZCD2

CS1

VAC_IN

ZCD2

ZCD1

PFC-PWM2

PFC-PWM1

CS1

CS2

Vpfc_sense

Vac_sense

135791113151719

23252729313335373941434547495153555759

GE 60P FemaleCF-30-01-L-DV-WT

UT2

+5V

URE A-2: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD SCHEMATIC

10R

R33

GND_P GND_P

1 μF16V

C16

+5V

Temp = 10 mV/°CUTEMP = 500 mV + Temp * 10 mV/°C

VPFC

GND_P

External Supply10V..12V-500 mA

For development purpose only

35V47 μFC25

CS1

TP4

PFC-PWM2

CS2

Vac_sense

Vpfc_sense

ZCD1

ZCD2

Relay

GND_A

GND_P

+12V_P +12V_S

GND

4 kV Isolation Barrier

AGND

GND_P

2468

101214161820

24262830323436384042444648505254565860

EDME

J4

GND3

VDD1

VO

MCP9700

U3

12

TERMINAL 1x2

J8+12V_S

35V47 μFC15

IN+3

IN-4

OUT 1V-

2

V+

5+

T

MIC6270U4

GND_P

+5V+12V_P

10R0603

R28

1 μF16V0603

C2

+5V

10k06031%

R35

7.5k06031%

R36

10k06031%

R37

+5V

Vpfc_sense10k06031%

R38

100 pF50V0603

C17

Drive_Enable

6.2k06031%

R34

3.73Vhysteresis = 2V


3.75V @ 55 VPFC

GND_P

Overvoltage ProtectionVENABLE = 24VVDISABLE = 55VThe comparator will disable gate driversas soon as the PFC Voltage hits 55V

GND_P

GND_P

GND_P

Drive Enable

5V

GND_P

GND2

VIN1 VOUT

3MCHP-10751 7805 Replacement

MOD11

1

22

33

44

55

66

HV9123

Isol

atio

n B

arrie

r 4kV

InOut Out

MCHP-10749 UWVR_5W_FlybackMOD2

0R1206

R29

GND_AGND_P

GND_A

GND_P

+12V_P

+VGnd STPS1150A

D4

GND_P

12

TERMINAL 1x2

J9


A.2 LVPFC DEVELOPMENT BOARD PCB LAYOUT

The LVPFC Development Board is a two-layer FR4, 1.55 mm, Plated-Through-Hole (PTH) PCB construction with a copper thickness of 70 µm. Figure A-3 and Figure A-4 show the top and bottom assembly of the LVPFC Development Board.

FIGURE A-3: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD TOP ASSEMBLY

3 3

1

2

6

4

1

6

4

2

1

1

1

5

1 1

2 2

10 10

1

2

1

1

1

2

1

2

1

2

1

4

1

2

2

1

4 3

13

1

2

1

7

9

11

4

3

3

14

1

2

2

1

13

4

3

2

1

7

9

11

1

14

2

1

2

43

2

2 1

2

2

1

21

6

1

1

0

2 2

1

2

8

12

5 8

12

2 1

1 2

1

1

1

1 3

2

3

4

1

3

22

1

1

2

3

1

1

1

0

1

1

1

1

1

0

5

2

1

2

1 211

1

2

3

1

0

1

1

2

4

10

14

16

20

26

30

32

36

42

46

48

52

58

3

9

13

15

19

25

29

31

35

41

45

47

51

57

2

6

8

12

18

24

28

34

38

40

44

50

54

56

60

1

5

7

11

17

23

27

33

37

39

43

49

53

55

59

1

1

1

1


Board Layout and Schematics

FIGURE A-4: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD BOTTOM ASSEMBLY

33

1

2

6

4

1

6

4

2

1

1

1

5

11

22

1010

1

2

1

1

1

2

2

1

1

2

1

4

1

2

2

1

3 4

13

1

2

1

7

9

11

4

3

3

14

1

2

1

2

13

4

3

2

1

7

9

11

1

14

2

1

2

34

2

2

1 2

1

2

12

6

1

1

0

22

1

2

8

12

58

12

21

2 1

1

1

1

3 1

2

3

1

4

3

22

1

1

2

3

1

1

0

1

1

1

1

1

1

0

5

2

1

2

1112

2

1

3

0

1

1

1

2

1

1

3

2

2

2

1

2

1

2

1

2

2

1

1

1

2

1

1

1

11

32

1

1

2

1

1

2

11

2

1

3

2

1

7

2

6

3

21

1

8

1

6

3

5

4

1

2

2

2

1

2

1

2

22

2

1

2

2

2

2

2

2

21

1

1

1

2

2 2

12

2

2

2

2

2

2

3

12

2

1 2

2

2

1

2

21

1

2

1

2

2

1

1 1

85

14

1

1

7

2

2

1

1

2

1

2

1

12

12

1

2

2

12

1

45

2

1

21

1

12

12

1

1

1

2 1

1

12

1 2

1 3

12

2

1

1

2

2


Lo

w-V

oltag

e Po

wer F

actor C

orrectio

n D

evelop

men

t Kit U

ser’s Gu

ide

DS

50

00

28

32

A-p

ag

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8

20

18

Micro

chip

Te

chn

olo

gy In

c.

e 1-3).

Designed with

Altium.com

12V_S

VOUT = 11V...13V, 250 mA max

TP3

X = 0.8A = 400 mAX = 2.5A

ND

GND

GND

GND

1 μF16V

C916V100 μF

C7

GND

12V_IN

5.6k06031%

R4

TP11

ND

16V220 μF

C6

1 μH

L2

RED0805

LD1

REDRAD_1.8 mm

LD2

12

HDR-2.54 Male 1x2

J2

Loop ements only

A.3 AUXILIARY POWER SUPPLY MODULE SCHEMATICS

Figure A-5 shows the Auxiliary Power Supply module schematics (refer to Figur

FIGURE A-5: AUXILIARY POWER SUPPLY MODULE SCHEMATIC

PGND PGND

VINTP1

IRMS_MAX = 300 mAIPEAK_MAX = 380 mAPDCOND_MAX = 100 mW

D1:IRMS_MAIAV_MAXIPEAK_MA

PGND

GND G

GND

Isolation Barrier 4 kV

US1KD4

PGND

47 pF200V0805

C1

470R0805

R2

PGND

PGND

10kR23

BAT54HT1GD5

10R12061%

R5

FOD817A3SD

23

14

U3

VIN_MIN = 25VVIN_MAX = 450V

100 μHRadial

L1

1.5 μF450VP7.5L17.5W9.3H17.5

C2

16V100 μF

C12

8.66k06031%

R25

15k06031%

R29 TP13

TP6

TP10

TP8

G

TP2

PGND

100 pF50V0603

C23

12V_S

150R06031%

R9

4

1

5

8

2

3

*

*

*

063092-bTR1

VIN

1k06031%

R16PGND

220k0603

1%

R71 μF16V

C13

PGND

20k06031%

R18

VDD

4.3k06031%

R27

0.1 μF16V

C21

FMMT2222AQ2

MMBT2907AQ4

VDD

100R

R8

TP7

BAT54HT1GD10

18k06031%

R15

4.7 μF25V0805

C8

PGND

TP4

6.2k06031%

R13

PGND

VIN

1

SEN

SE4

OUTPUT 5

Vss

6V

DD

7

OSC

OU

T8

OSC

IN9

DIS

CH

RG

10

VR

EF11

SHD

WN

12

RES

ET13

COMP14

FB15

BIA

S16

HV9123U1

PGND

0.022 μF50V0603

C28

2200 pF300VY2

C10

562k06031%

R12

FSW = 130 kHzDCMAX = 85%PWMIN = 100 ns

22R1206

R1

MM3Z12VST1GD9

0R0603

R24

GND

10R06031%

R26

1000 pF50V0603

C22

12V_P

PGND

12V_P

TP9

TP14

GND

12V_P

TP12

10R06031%

R32

VDD

4.3k06031%

R33

Isolation Barrier 4 kV

VOUT = 12V @ 3 WMAX

DFLS1150-7

D1

DFLS1150-7

D2

100RR6

Us = 1V @ 400 mA

UREF = 4V

PGND

1000 pF250V0805

C41000 pF250V0805

C5

1000 pF50V0603

C17

27kP15L11.5D4.55%

R3

3.3R12061%

R193.3R12061%

R20

3.3 μF450VP3.5D8H13

C3

2

13

IPA60R950C6XKSA1Q3

12

HDR-2.54 Male 1x2J3

12

HDR-2.54 Male 1x2J4

VDD = 8V...11V

FSW 135 kHz

R26 formeasurpurpose

R32 for Loop measurementspurpose only

Board Layout and Schematics

A.4 AUXILIARY POWER SUPPLY MODULE PCB LAYOUT

The Auxiliary Power Supply module is a two-layer FR4, 1.55 mm, Plated-Through-Hole PCB construction. Figure A-6 and Figure A-7 show the top and bottom assembly of the Auxiliary Power Supply module.

FIGURE A-6: AUXILIARY POWER SUPPLY MODULE TOP ASSEMBLY

1

1

1

1

1

2

1

5

2

1

21

2

1

2

2

2

1

1

2

2 1

1

3

2

1

1

2

4

3

1

1

1

8

1

2

1

1

1

1

1

1

1

1

2

2



FIGURE A-7: AUXILIARY POWER SUPPLY MODULE BOTTOM ASSEMBLY

1

1

1

1

1

2

1

5

2

1

2 1

2

1

2

2

2

1

1

2

21

1

3

2

1

1

2

4

3

1

1

1

8

1

2

1

1

1

1

1

1

1

1

2

2

1

1

1

2

2

2

1

2

2

2

2

2

3

2

1

1

2

1

2

1

2

1

1

2

2

12

2

1

2

1

1

2

1

1

3

1

1

2

2

2

1

2

10

11

13

15

16

1

2

1

1

1

1

2

11

1

2

2

2

11

1

1

9

2

14

12

2

1

1

2

2

2

22

1

12

1 2

1 2

12

12 1

2 1

1

1

2

2

7

6

4

1 1

4

8

2

5

2

2

1

3




Appendix B. Bill of Materials (BOM)

This appendix contains the Bill of Materials (BOMs) for the LVPFC Development Board and for the Auxiliary Power Supply module.

• Bill of Materials – LVPFC Development Board

• Bill of Materials – Auxiliary Power Supply Module

B.1 BILL OF MATERIALS – LVPFC DEVELOPMENT BOARD

Table B-1 shows the Bill of Materials for the LVPFC Development Board.

TABLE B-1: BILL OF MATERIALS (BOM) – LVPFC DEVELOPMENT BOARD

Qty Designator Description ManufacturerManufacturer Part

Number

4 AGND, TP1, TP2, TP4 Connector Test Point, Loop, Black, Through-Hole (TH)

Keystone Electronics Corp. 5011

5 C2, C6, C12, C13, C16 Capacitor, Ceramic, 0.1 µF, 16V, 10%, X7R, SMD, 0603

Taiyo Yuden Co., Ltd. EMK107B7105KA-T

1 C3 Capacitor, Film, 0.33 µF, 10%, 275 VAC, Radial

Wurth Elecktronic 890324025034CS

2 C4, C5 Capacitor, 1500 µF, 20%, 50V Wurth Elecktronic 860010680026

1 C7 Capacitor, Film, 0.68 µF, 10%, 310 VAC, Radial

Wurth Elecktronic 890334025045

2 C8, C9 Capacitor, Film, 0.47 µF, 10%, 310 VAC, Radial

Wurth Elecktronic 890334024005CS

2 C10, C11 Capacitor, Ceramic, 4700 pF, 300V, 20%, Radial, P7.5D8H11

Murata Electronics® DE2E3KY472MN3AU02F

1 C14 Capacitor, Ceramic, 0.022 µF, 500V, 10%, X7R, SMD, 1206

Johanson Dielectrics 501R18W223KV4E

2 C15, C25 Capacitor, Aluminum, 47 µF, 35V, 20%, Radial, P2D5H12.5


1 C17 Capacitor, Ceramic, 100 pF, 50V, 10%, X7R, SMD, 0603

Vishay Intertechnology, Inc. VJ0603Y101KXACW1BC

1 C19 Capacitor, Aluminum, 47 µF, 20%, 63V, Through-Hole



KEMET C1210C104KCRACTU

2 C21, C22 Capacitor, Ceramic, 680 pF, 100V, X7R, 0805

Yageo Corporation CC0805KRX7R0BB681

2 C23, C24 Capacitor, Ceramic, 6800 pF, 50V, 10%, X7R, SMD, 0603

KEMET C0603C682K5RACTU

3 CH1, CH2, VAC Connector Test Point, Loop, Red, TH




8 CS1, CS2, PFC-PWM1, PFC-PWM2, Vac_in, Vpfc_sense, ZCD1, ZCD2

Misc., Test Point PC Mini,0.040", D, Yellow


7 D1, D8, D9, D10, D11, D13, D15

Diode, Rectifier, 1N4148, 1.25V, 150 mA, 100V, SOD-123

Micro Commercial Components

1N4148W-TP

2 D2, D3 Diode, Rectifier, ES3B, 900 mV, 3A, 100V, DO-214AB_SMC

Vishay Intertechnology, Inc. ES3B-E3/57T

1 D4 Diode, Schottky, STPS1150A, 790 mV, 1A, 150V, DO-214AC_SMA

STMicroelectronics STPS1150A

1 D5 Diode, Rectifier Bridge, 600V, 3A, TH, SIP-4

SMC Diode Solutions Co. LTD

KBP306GTB

2 D6, D7 Diode, Rectifier, US1J 1.7V, 1A, 600V, DO-214AC_SMA

Micro Commercial Components

US1J-TP

1 D12 Diode, Rectifier, RS3J, 1.3V, 3A, 600V, DO-214AB_SMC

Vishay Intertechnology, Inc. RS3J-E3/57T

2 D14, D16 Diode, Zener, BZX84-C3V3, 3.3V, 250 mW, SOT-23-3

NXP Semiconductors BZX84-C3V3,215

2 F1 Fuse Holder, 5 mm, TH Littelfuse® 01110501Z

1 F2 Fuse, Glass, 5A, 250 VAC, 5x20 mm

Littelfuse 0217005.HXP

1 J1 Connector, Terminal, 5 mm, 1x3, Female, 12-28AWG, 16A, TH, R/A

On-Shore Technology, Inc. OSTVI030152

2 J2, J3 Connector, Terminal, 5.08 mm, 1x2 Female, 12-28AWG, 16A, TH, R/A

On-Shore Technology, Inc. OSTVI022152

1 J4 Connector, Edge, MECF, 1.27 mm, 60P, Female, SMD, Vertical

Samtec, Inc. MECF-30-01-L-DV-WT

2 J8, J9 Connector, Terminal, 2.54 mm, 1x2, Female, 20-30AWG, 6A, TH, R/A

PHOENIX CONTACT 1725656

2 L1, L3 Inductor, Customized Part, 11.5A, T/H, PFC


1 L2 Common-mode Choke, 2 mH, 10A, 2 LN, TH


1 L4 Inductor, Fixed, 4.7 µH, 6.5A, 12.5 mOhm, TH


1 MOV1 Varistor, MO, 420V, 45J, Disc, 10 mm

TDK Corporation S10K420

2 Q2, Q4 N-FET, IPP126N10N3G, 100V, 58A, 0.0123R, 94W, TO-220-3

Infineon Technologies AG IPP126N10N3GXKSA1

1 Q3 N-FET, 2N7002-7-F, 60V, 170 mA, 370 mW, SOT-23-3

Diodes Incorporated® 2N7002-7-F

2 R1, R10 Resistor, TKF, 1k, 1%, 1/10W, SMD, 0603

Panasonic® - ECG ERJ-3EKF1001V

TABLE B-1: BILL OF MATERIALS (BOM) – LVPFC DEVELOPMENT BOARD (CONTINUED)


Number


Bill of Materials (BOM)

2 R2, R9 Resistor, TKF, 15R, 1%, 1/4W, SMD, 1206

Panasonic® - ECG ERJ-8ENF15R0V

2 R4, R30 Resistor, TF, 2.20k, 1%, 1/8W, SMD, 0603

Vishay Intertechnology, Inc. MCT06030C2201FP500

8 R5, R6, R7, R11, R14, R15, R16, R21

Resistor, TKF, 10k, 1%, 1/4W, SMD, 1206

Vishay Intertechnology, Inc. CRCW120610K0FKEA

1 R8 Resistor, TKF, 51R, 1%, 1/10W, SMD, 0603

Yageo Corporation RC0603FR-0751RL

4 R12, R13, R22, R23 Resistor, TKF, 120R, 1%, 1/10W, SMD, 0603

Stackpole Electronics, Inc. RMCF0603FT120R


Panasonic - ECG ERJ-8ENF10R0V

2 R19, R26 Resistor, TKF, 3.3k, 1%, 1/10W, SMD, 0603

Panasonic - ECG ERJ-3EKF3301V

4 R20, R35, R37, R38 Resistor, TKF, 10k, 1%, 1/10W, SMD, 0603





Stackpole Electronics, Inc. RMCF0603FT10R0

1 R29 Resistor, TKF, 0R, SMD, 1206 Panasonic - ECG ERJ-8GEY0R00V

1 R34 Resistor, TKF, 6.2k, 1%, 1/10W, SMD, 0603




1 RL1 Relay Power, SPST-NO, 5V, 10A, 250 VAC, TH

Omron Electronics LLC – EMC Division

G6C-1114P-US-DC5

2 SCR1, SCR2 Machine Screw Pan, Phillips, M3

B&F™ Fasteners Supply MPMS 003 0008 PH

2 T1, T2 Transformer, Current, 1:100, 1 MHz, 24A, TH

Coilcraft CS4100V-01L

1 TH1 Resistor, Thermistor, NTC, 10R, 3A, Radial

TDK Corporation B57235S100M54

2 WASHER1, WASHER2 Washer Flat, M3, Nylon Essentra Components MFW030A

1 MOD1 Microchip Module, MCHP-10751 7805, Replacement

Microchip Technology Inc. 04-10751

1 MOD2 Microchip Module, MCHP-10749, UWVR, 5W, Flyback

Microchip Technology Inc. 04-10749

2 U1, U2 Microchip Analog FET Driver, MCP14A0452-E/SN, SOIC-8

Microchip Technology Inc. MCP14A0452-E/SN

1 U3 Microchip Analog Temperature Sensor, -40C to +150°C, MCP9700T-E/TT, SOT-23-3

Microchip Technology Inc. MCP9700T-E/TT

1 U4 IC Comparator, Precision, 2-36V, SOT23-5

Microchip Technology Inc. MIC6270YM5-TR

TABLE B-1: BILL OF MATERIALS (BOM) – LVPFC DEVELOPMENT BOARD (CONTINUED)


Number



B.2 BILL OF MATERIALS – AUXILIARY POWER SUPPLY MODULE

Table B-2 shows the Bill of Materials for the Auxiliary Power Supply module.

TABLE B-2: BILL OF MATERIALS (BOM) – AUXILIARY POWER SUPPLY MODULE


Number

1 C1 Capacitor, Ceramic, 47 pF, 200V, 5%, C0G, NP0, SMD, 0805

KEMET C0805C470J2GACTU

1 C2 Capacitor, Film 1.5 µF, 450V, 5%, RAD, P7.5L17.5W9.3H17.5

Panasonic® - ECG ECW-FD2W155JB

1 C3 Capacitor, Aluminum, 3.3 µF, 450V, 20%, RAD_P3.5D8H13

Rubycon Corporation 450PK3R3MEFC8X11.5

2 C4, C5 Capacitor, Ceramic, 1000 pF, 250V, 10%, X7R, SMD, 0805

Murata Electronics® GRM21AR72E102KW01D

1 C6 Capacitor, Aluminum, 220 µF, 16V, 20%, 0.015R, RAD_P3.5D8H8


2 C7, C12 Capacitor, 100 µF, 20%, 16V Wurth Elecktronic 860010372006


TDK Corporation C2012X5R1E475M125AB

2 C9, C13 Capacitor, Ceramic, 1 µF, 16V, 10%, X7R, SMD, 0603

Taiyo Yuden Co., Ltd. EMK107B7105KA-T

1 C10 Capacitor, Ceramic, 2200 pF, 300V, 20%, RAD_P7.5D8H11

Murata Electronics DE2E3KY222MN3AU02F

2 C17, C22 Capacitor, Ceramic, 1000 pF, 50V, 5%, C0G, SMD, 0603

AVX Corporation 06035A102JAT2A


AVX Corporation 0603YC104KAT2A

1 C23 Capacitor, Ceramic, 100 pF, 50V, 5%, NP0, SMD, 0603

Cal-Chip Electronics Inc. GMC10CG101J50NTLF


AVX Corporation 06035C223JAT2A

2 D1, D2 1.0A High-Voltage Schottky Barrier Rectifier

Diodes Incorporated® DFLS1150

1 D4 Diode, Rectifier, US1K, 1.7V, 1A, 800V, DO-214AC_SMA

Diodes Incorporated US1K-13

2 D5, D10 Diode, Schottky, BAT54HT1G, 30V, 200 mA, 40V, SOD-323

ON Semiconductor® BAT54HT1G

1 D9 Diode, Zener, 12V, 200 mW, SOD-323

ON Semiconductor MM3Z12VST1G

3 J2, J3, J4 Connector Header, 2.54 Male, 1x2, Gold, 6.75 mm, TH, R/A

Molex® 0901210762

1 L1 Inductor, Fixed, 100 µH, 900 mA, 190 mOhm


1 L2 Inductor, Fixed, 1 µH, 2.7A, 47 mOhm, SMD


1 LD1 Diode, LED, Red, 2V, 20 mA, 104 mcd, Diffuse, SMD, 0805

OSRAM Opto Semiconductors GmbH.

LS R976-NR-1

1 LD2 Diode, LED, Red, 1.85V, 30 mA, 200 mcd, Diffuse, RAD, 1.8 mm

Kingbright Electronic Co., Ltd.

WP4060SRD

1 Q2 Transistor, BJT, NPN, FMMT2222A, 40V, 600 mA, 330 mW, SOT-23-3

Diodes Incorporated MMBT2222A-7-F


Bill of Materials (BOM)

1 Q3 Transistor, FET N-CH, IPA60R950C6XKSA1, 600V, 4.4A, 0.95R, 26W, TO-220-3

Infineon Technologies AG IPA60R950C6XKSA1

1 Q4 Transistor, BJT, PNP, MMBT2907A, 60V, 800 mA, 350 mW, SOT-23-3

ON Semiconductor® MMBT2907A

1 R1 Resistor, 22R, 1/4W, 1%, 1206, SMD Panasonic® - ECG ERJ-8ENF22R0V


Panasonic - ECG ERJ-6ENF4700V

1 R3 Resistor, MO, 27k, 5%, 1W, AX, P15L11.5D4.5

Yageo Corporation RSF100JB-73-27K


Yageo Corporation RC0603FR-075K6L


Panasonic - ECG ERJ-8ENF10R0V



1 R7 Resistor, TKF, 220k, 1%, 1/10W, SMD, 0603



Stackpole Electronics, Inc. RMCF0603FT150R


Stackpole Electronics, Inc. RMCF0603FT562K









2 R19, R20 Resistor, TKF, 3.3R, 1%, 1/2W, SMD, 1206

Susumu Co., LTD. RL1632R-3R30-F



1 R24 Resistor, TKF, 0R, 1/10W, SMD, 0603

Panasonic - ECG ERJ-3GSY0R00V


Yageo Corporation RC0603FR-078K66L


Panasonic - ECG ERJ-3EKF10R0V

2 R27, R33 Resistor, TKF, 4.3k, 1%, 1/10W, SMD, 0603




1 TR1 Transformer, SMPS, Flyback 6:1:1, 20V-375V, 5.5W, TH

Kaschke Components GmbH

063092-a

1 U3 Optoisolator, FOD817A3SD, SMD-4 ON Semiconductor FOD817A3SD

1 U1 Microchip Analog, PWM Controller, 3 MHz, HV9123NG-G, SOIC-16

Microchip Technology Inc. HV9123NG-G

TABLE B-2: BILL OF MATERIALS (BOM) – AUXILIARY POWER SUPPLY MODULE (CONTINUED)


Number



NOTES:




Appendix C. Example Algorithm

This appendix provides algorithm examples for the LVPFC Development Board.

Examples presented are:

• Interleaved PFC Boost Converter in Transition Mode

• Interleaved PFC Boost Converter in Continuous Conduction Mode

C.1 INTERLEAVED PFC BOOST CONVERTER IN TRANSITION MODE

Figure C-1 shows a standard representation of a high-level block diagram of the implementation of an algorithm example of the interleaved PFC boost converter control system working in Transition mode. The exact implementation is subject to change with alternative control schemes and algorithms, and will be documented in subsequent code examples.

Black building blocks represents hardware blocks, while blue building blocks represent software blocks.

Software blocks have the following functions:

• INT1:

- Calculates VIN average and VOUT average every half of AC cycle (for instance, 10 ms for 50 Hz, 8.33 ms for 60 Hz)

- Voltage compensator on VOUT average

• ADCAN0 Interrupt:

- Verifies VIN zero crossing

- Accumulates VIN and VOUT

- Stores current in IPH1

• IC1 Interrupt:

- Measures PWM1 period of time

- Calculates delay at which to trigger the PWM2 TON pulse and to set OC1

• OC1:

- Programmed to generate the trigger for the PWM2 TON pulse


- Stores current in IPH2

- Filters temperature

Note: In order to maintain interleaved operation, the Slave phase must have the same switching frequency as the Master phase.



FIGURE C-1: INTERLEAVED PFC BOOST CONVERTER IN TRANSITION MODE

Legend: ADC: Analog-to-Digital ConverterCMP: ComparatorIC: Input Capture to measure the PWM period of frequencyPWM: Pulse-Width ModulatorZCD: Zero-Cross Detection

INT1

REF FB

ADCBUF3

ADCBUF1

ADCBUF0ADCAN0 Interrupt

PWM GENERATOR_1

IC1 Interrupt

OC1

ADCAN2 Interrupt

PWM TON

When VIN Zero Crossing, it Generates INT1 Interrupt

PWM1RA4_PWM1H Power Stage

Phase I

CMP1A

RA0_CMP1ACS1

DAC(3V)

CMP3A

ZCD1DAC

(0.3V)

ADC CORE_3AN3-RB0

BoostVOUTADC_TRIG Every

Other Cycle

IC1BUF

ADCBUF2

ADCBUF11

ADC CORE_1

ADC CORE_0

IC1

VAC_SENSE

AN1-RA1

CS1

CMP2A

Power StagePhase II

PWM2 RB13_PWM2H

ADC CORE_2

PWM GENERATOR_2

DAC(3V)

ADC SharedCore

CS2

Temperature AN11

Timer1 Interrupt Every 10 msec

Faultcheck()Faulthandler()

Scheduler Called Every 1 msec (Timer2)UART_RXUART_TXP Protocol 0001UART_TX Protocol 0000Converter State_Machine

CMP3_out

OC1_out – FLT1Current Reset

ADC_TRIG

CMP3_out

RA0_CMP1A

CMP1_outCurrent Limitfor Overcurrent

ProtectionCMP3_outUsed to Trigger Next

PWM1 Cycle

Current Limit forOvercurrent Protection

VOUT


Example Algorithm

C.2 INTERLEAVED PFC BOOST CONVERTER IN CONTINUOUS CONDUCTION MODE

Figure C-2 shows a standard representation of a high-level block diagram of the implementation of an algorithm example of the interleaved PFC boost converter control system working in Continuous Conduction mode. The exact implementation is subject to change with alternative control schemes and algorithms, and will be documented in subsequent code examples.

Black building blocks represent hardware blocks, while blue building blocks represent software blocks.

Software blocks have the following functions:


- Calculates the current reference:

c2P2Z_compensator_out_V * ADCBUF1/VINAVG2

- Samples IPH1 and executes PH1 current loop

- Accumulates VIN and VOUT

- Verifies zero crossing on VIN

- Triggers INT1 if zero crossing is ‘True’


- Samples IPH2 and executes PH2 current controller

• INT1: Interrupts every 10 msec (VIN zero crossing)

- Calculates VIN average and squares it (VINAVG2)

- Calculates VOUT average

- Runs voltage compensator on VOUT average that calculates the DC current reference for the current loops

Note: ADCBUF1 is proportional to the rectified input AC voltage. VINAVG2 is proportional to the square of the rectified average value of the input VAC voltage. The “c2P2Z_compensator_out” is the output of the voltage loop.



FIGURE C-2: INTERLEAVED PFC BOOST CONVERTER IN CONTINUOUS CONDUCTION MODE

CMP1A

CMP2A

Boost VOUT

VAC_SENSE

PWMGENERATOR_1

PWM I/OControl

DACMAX_CURRENT

PowerStage

Phase I

VOUT

CS1

ADC CORE_0

ADC CORE_3

ADC CORE_1

Duty Cycle

ADCAN0 Interrupt

PWMGENERATOR_2

Duty Cycle

PWM2 I/OControl

Current Limit for Overcurrent Protection

DACMAX_CURRENT

RA2_CMP2A

ADC CORE_2ADCBUF2

ADC Core 2 Triggered byPWM2 at TON/2

ADCAN2 Interrupt

INT1

RA0_CMP1A

Current Limit for Overcurrent Protection

RA4_PWM1H

AN3-RB0

AN3-RB0

AN1-RA1

ADCBUF0

ADCBUF3

ADCBUF1

Triggered by PWM1 at TON/2

ADC Cores 0, 1 and 3 Triggered byPWM1 at TON/2

RB13_PWM2H PowerStage

Phase II

CS2

c2P2Z_compensator_out_V

Scheduler Called Every 1 msec (Timer2)UART_RXUART_TX Protocol 0001UART_TX Protocol 0000Converter State_Machine

Timer1 Interrupt Every 10 msec

Faultcheck()Faulthandler()

Legend: ADC: Analog-to-Digital ConverterDAC: Digital-to-Analog ConverterCMP: ComparatorIC: Input Capture to measure the PWM period of frequencyPWM: Pulse-Width Modulator




Appendix D. Optional Supporting Equipment

D.1 INTRODUCTION

This appendix provides information on the following equipment, which is recommended for use to improve the functionality of the LVPFC Development Kit:

• Isolation Transformer• Active Load 50W

D.2 ISOLATION TRANSFORMER

The Isolation Transformer 10:1 has the following features, as shown in Figure D-1 and Figure D-2.

FIGURE D-1: ISOLATION TRANSFORMER – FRONT PANEL

1. Illuminated mains power switch.2. Four 4 mm banana plugs (0 VAC, 12 VAC, 24 Vac, PE connections).

FIGURE D-2: ISOLATION TRANSFORMER – BACK PANEL

1. Slide switch for input voltage selection (120 VAC/230 VAC).2. Fuse socket.3. IEC plug for mains connection.

1 2

1 2 3

Note: The product number is ASC-70 and the manufacturer is ASCALAB d.o.o. (www.ascalab.com).


www.ascalab.com


D.3 ACTIVE LOAD 50W

The Active Load has the following features, as shown in Figure D-3.

FIGURE D-3: ACTIVE LOAD 50W(1,2)

10

4

1

3 2

7 6 5

9 8

1

2

Front Back

Front Side Back Side

1. Display2. On/Off Push Button3. Pulse Push Button4. Preset Push Button5. I/P Push Button6. Coarse Potentiometer7. Fine Potentiometer8. UVLO Potentiometer9. Pulse Potentiometer10. Preset LED (green)

Pulse LED (yellow)On/Off LED (red)

1. 4 mm Banana Plugs(red for positive and blue for return line)

2. Plug for External 12 VDC Supply

Note 1: The ASC-50W device’s standard delivery includes an external AC/DC wall plug adapter. All various AC input plugs are included. Manufacturer: XP Power.Type: VER12US120-JA.

2: The product number is ASC-50W and the manufacturer is ASCALAB d.o.o. (www.ascalab.com).


www.ascalab.com

Optional Supporting Equipment

NOTES:



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