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StrongIRFET™ IRL7472L1TRPbF
Application Brushed Motor drive applications BLDC Motor drive applications Battery powered circuits Half-bridge and full-bridge topologies Synchronous rectifier applications Resonant mode power supplies OR-ing and redundant power switches DC/DC and AC/DC converters DC/AC Inverters
Fig 1. Typical On-Resistance vs. Gate Voltage
DirectFET™ N-Channel Power MOSFET
VDSS 40V
RDS(on) typ. 0.34m max @ VGS = 10V 0.45m
RDS(on) typ. 0.52m max
@ VGS = 4.5V 0.70m
ID (Package Limited) 375A
DirectFET™ ISOMETRIC
L8
Benefits Optimized for Logic Level Drive Improved Gate, Avalanche and Dynamic dv/dt Ruggedness Fully Characterized Capacitance and Avalanche SOA Enhanced body diode dv/dt and di/dt Capability Lead-Free, RoHS Compliant
Base part number Package Type Standard Pack
Form Quantity
IRL7472L1PbF Direct FET Large Can (L8) Tape and Reel 4000 IRL7472L1TRPbF
Orderable Part Number
D D
G
S
S
SS
S
S
S
S
Fig 2. Maximum Drain Current vs. Case Temperature
2 4 6 8 10 12 14 16 18 20
VGS, Gate -to -Source Voltage (V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
RD
S(o
n),
Dra
in-t
o -
Sou
rce
On
Res
ista
nce
(m
)
ID = 195A
TJ = 25°C
TJ = 125°C
1 2016-10-14
25 50 75 100 125 150 175
TC , Case Temperature (°C)
0
100
200
300
400
500
600
700
I D,
Dra
in C
urre
nt (
A)
Limited by package
IRL7472L1TRPbF
2 2016-10-14
Notes: Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Used double sided cooling , mounting pad with large heatsink.
Absolute Maximum Ratings
Symbol Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 645
A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 456
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 68
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) 375
IDM Pulsed Drain Current 1500 A PD @TC = 25°C Maximum Power Dissipation 341 PD @TA = 25°C Maximum Power Dissipation 3.8
Linear Derating Factor 0.025 W/°C VGS Gate-to-Source Voltage ± 20 V
TJ Operating Junction and -55 to + 175 °C
TSTG Storage Temperature Range
Avalanche Characteristics EAS (Thermally limited) Single Pulse Avalanche Energy 308
mJ EAS (Thermally limited) Single Pulse Avalanche Energy 765
IAR Avalanche Current See Fig.15,16, 23a, 23b
A EAR Repetitive Avalanche Energy mJ
Thermal Resistance
Symbol Parameter Typ. Max. Units RJA Junction-to-Ambient ––– 40
°C/W RJA Junction-to-Ambient 12.5 –––
RJA Junction-to-Ambient 20 –––
RJC Junction-to-Case ––– 0.44 RJA-PCB Junction-to-PCB Mounted 1.0 –––
W
Static @ TJ = 25°C (unless otherwise specified)
Symbol Parameter Min. Typ. Max. Units Conditions V(BR)DSS Drain-to-Source Breakdown Voltage 40 ––– ––– V VGS = 0V, ID = 250µA
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 30 ––– mV/°C Reference to 25°C, ID = 5.0mA RDS(on) Static Drain-to-Source On-Resistance ––– 0.34 0.45
m VGS = 10V, ID = 195A
––– 0.52 0.70 VGS = 4.5V, ID = 98A VGS(th) Gate Threshold Voltage 1.0 1.7 2.5 V VDS = VGS, ID = 250µA
IDSS Drain-to-Source Leakage Current ––– ––– 1.0
µA VDS = 40V, VGS = 0V
––– ––– 150 VDS = 40V, VGS = 0V, TJ = 125°C IGSS Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20V
Gate-to-Source Reverse Leakage ––– ––– -100 VGS = -20V RG Internal Gate Resistance ––– 1.0 –––
nA
TC measured with thermocouple mounted to top (Drain) of part.
Surface mounted on 1 in. square Cu board (still air).
Mounted to a PCB with small clip heatsink (still air)
Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air)
IRL7472L1TRPbF
3 2016-10-14
D
S
G
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol Parameter Min. Typ. Max. Units Conditions gfs Forward Transconductance 232 ––– ––– S VDS = 10V, ID = 195A Qg Total Gate Charge ––– 220 330
nC
ID = 195A Qgs Gate-to-Source Charge ––– 95 ––– VDS = 20V Qgd Gate-to-Drain ("Miller") Charge ––– 87 ––– VGS = 4.5V Qsync Total Gate Charge Sync. (Qg - Qgd) ––– 133 ––– ID = 195A, VDS =0V, VGS = 4.5V td(on) Turn-On Delay Time ––– 68 –––
ns
VDD = 20V tr Rise Time ––– 176 ––– ID = 30A td(off) Turn-Off Delay Time ––– 174 ––– RG = 2.7 tf Fall Time ––– 137 ––– VGS = 4.5V Ciss Input Capacitance ––– 20082 –––
pF
VGS = 0V Coss Output Capacitance ––– 2436 ––– VDS = 25V Crss Reverse Transfer Capacitance ––– 1594 ––– ƒ = 10kHz Coss eff. (ER) Effective Output Capacitance (Energy Related) ––– 2855 ––– VGS = 0V, VDS = 0V to 32V Coss eff. (TR) Effective Output Capacitance (Time Related) ––– 3544 ––– VGS = 0V, VDS = 0V to 32V
Notes: Package limit current based on source connection technology Repetitive rating; pulse width limited by max. junction temperature.
Limited by TJmax, starting TJ = 25°C, L = 0.016mH, RG = 50, IAS = 195A, VGS =10V. ISD ≤ 195A, di/dt ≤ 984A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. Pulse width ≤ 400µs; duty cycle ≤ 2%. Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS.
R is measured at TJ approximately 90°C.
Limited by TJmax, starting TJ = 25°C, L = 1.0mH, RG = 50, IAS = 39A, VGS =10V. Silicon limit current based on maximum allowable junction temperature TJmax.
Diode Characteristics
Symbol Parameter Min. Typ. Max. Units Conditions IS Continuous Source Current
––– ––– 341 A
MOSFET symbol (Body Diode) showing the ISM Pulsed Source Current
––– ––– 1500 integral reverse
(Body Diode) p-n junction diode. VSD Diode Forward Voltage ––– ––– 1.2 V TJ= 25°C, IS =195A, VGS = 0V
dv/dt Peak Diode Recovery ––– 1.3 ––– V/ns
TJ =175°C, IS =195A, VDS = 40V
trr Reverse Recovery Time ––– 57 ––– ns
TJ = 25° C VR = 34V, ––– 58 ––– TJ = 125°C IF = 195A Qrr Reverse Recovery Charge ––– 103 –––
nC TJ = 25°C di/dt = 100A/µs
––– 114 ––– TJ = 125°C IRRM Reverse Recovery Current ––– 3.1 ––– A TJ = 25°C
IRL7472L1TRPbF
4 2016-10-14
Fig 6. Normalized On-Resistance vs. Temperature Fig 5. Typical Transfer Characteristics
Fig 4. Typical Output Characteristics Fig 3. Typical Output Characteristics
Fig 7. Typical Capacitance vs. Drain-to-Source Voltage
0.01 0.1 1 10 100
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
10000
I D,
Dra
in-t
o-S
ourc
e C
urre
nt (
A)
VGSTOP 15V
10V6.0V5.0V4.5V4.0V3.5V
BOTTOM 3.0V
60µs PULSE WIDTHTj = 175°C
3.0V
0.01 0.1 1 10 100
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
10000I D
, Dra
in-t
o-S
ourc
e C
urre
nt (
A)
VGSTOP 15V
10V6.0V5.0V4.5V4.0V3.5V
BOTTOM 3.0V
60µs PULSE WIDTHTj = 25°C
3.0V
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VGS, Gate-to-Source Voltage (V)
1.0
10
100
1000
10000
I D, D
rain
-to-
Sou
rce
Cur
rent
(A)
TJ = 25°CTJ = 175°C
VDS = 10V
60µs PULSE WIDTH
-60 -40 -20 0 20 40 60 80 100120140160180
TJ , Junction Temperature (°C)
0.5
0.8
1.1
1.4
1.7
2.0
0.5
0.8
1.1
1.4
1.7
2.0
RD
S(o
n) ,
Dra
in-t
o-S
ourc
e O
n R
esis
tanc
e
(
Nor
mal
ized
)
ID = 195A
VGS = 10V
1 10 100
VDS, Drain-to-Source Voltage (V)
1000
10000
100000
C, C
apac
itanc
e (p
F)
VGS = 0V, f = 10 KHZCiss = Cgs + Cgd, Cds SHORTED
Crss = Cgd Coss = Cds + Cgd
Coss
Crss
Ciss
0 60 120 180 240 300 360 420 480 540 600
QG, Total Gate Charge (nC)
0
2
4
6
8
10
12
14
VG
S, G
ate-
to-S
ourc
e V
olta
ge (
V)
VDS= 32V
VDS= 20V
ID= 195A
Fig 8. Typical Gate Charge vs. Gate-to-Source Voltage
IRL7472L1TRPbF
5 2016-10-14
Fig 10. Maximum Safe Operating Area
Fig 11. Drain-to-Source Breakdown Voltage
Fig 9. Typical Source-Drain Diode Forward Voltage
Fig 12. Typical Coss Stored Energy
Fig 13. Typical On-Resistance vs. Drain Current
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
VSD, Source-to-Drain Voltage (V)
1.0
10
100
1000
10000I S
D, R
ever
se D
rain
Cur
rent
(A
)
TJ = 25°CTJ = 175°C
VGS = 0V
-60 -20 20 60 100 140 180
TJ , Temperature ( °C )
41
42
43
44
45
46
47
48
49
50
V(B
R)D
SS
, D
rain
-to-
Sou
rce
Bre
akdo
wn
Vol
tage
(V
)
Id = 5.0mA
-5 0 5 10 15 20 25 30 35 40
VDS, Drain-to-Source Voltage (V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Ene
rgy
(µJ)
0 20 40 60 80 100 120 140 160 180 200
ID, Drain Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
RD
S(o
n),
Dra
in-t
o -S
ourc
e O
n R
esis
tanc
e (m
)
Vgs = 3.5VVgs = 4.0VVgs = 4.5VVgs = 5.5VVgs = 6.0VVgs = 8.0VVgs = 10V
0.1 1 10
VDS, Drain-to-Source Voltage (V)
0.1
1
10
100
1000
I D,
Dra
in-t
o-S
ourc
e C
urre
nt (
A)
Tc = 25°CTj = 175°CSingle Pulse
10msec
1msec
OPERATION IN THIS AREA LIMITED BY RDS(on)
100µsec
DC
Limited by Package
IRL7472L1TRPbF
6 2016-10-14
Fig 14. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 16. Maximum Avalanche Energy vs. Temperature
Fig 15. Avalanche Current vs. Pulse Width
Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 ) 1.Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 23a, 23b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. T = Allowable rise in junction temperature, not to exceed Tjmax
(assumed as 25°C in Figure 14, 15). tav = Average time in avalanche. D = Duty cycle in avalanche = tav ·f ZthJC(D, tav) = Transient thermal resistance, see Figures 13) PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC Iav = 2T/ [1.3·BV·Zth] EAS (AR) = PD (ave)·tav
1E-006 1E-005 0.0001 0.001 0.01 0.1
t1 , Rectangular Pulse Duration (sec)
0.0001
0.001
0.01
0.1
1
The
rmal
Res
pons
e (
Z th
JC )
°C
/W0.20
0.10
D = 0.50
0.020.01
0.05
SINGLE PULSE( THERMAL RESPONSE )
Notes:1. Duty Factor D = t1/t22. Peak Tj = P dm x Zthjc + Tc
1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01
tav (sec)
1
10
100
1000
Ava
lanc
he C
urre
nt (
A)
Allowed avalanche Current vs avalanche pulsewidth, tav, assuming j = 25°C and Tstart = 125°C.
Allowed avalanche Current vs avalanche pulsewidth, tav, assuming Tj = 125°C and Tstart =25°C (Single Pulse)
25 50 75 100 125 150 175
Starting TJ , Junction Temperature (°C)
0
50
100
150
200
250
300
350
EA
R ,
Ava
lanc
he E
nerg
y (m
J)
TOP Single Pulse BOTTOM 1.0% Duty CycleID = 195A
IRL7472L1TRPbF
7 2016-10-14
Fig 18. Typical Recovery Current vs. dif/dt
Fig 21. Typical Stored Charge vs. dif/dt
-60 -40 -20 0 20 40 60 80 100120140160180
TJ , Temperature ( °C )
0.0
0.5
1.0
1.5
2.0
2.5V
GS
(th)
, G
ate
thre
shol
d V
olta
ge (
V)
ID = 250µA
ID = 1.0mA
ID = 1.0A
100 200 300 400 500 600
diF /dt (A/µs)
2
4
6
8
10
12
14
16
18
20
I RR
M (
A)
IF = 117A
VR = 34V
TJ = 25°C
TJ = 125°C
100 200 300 400 500 600
diF /dt (A/µs)
2
4
6
8
10
12
14
16
18
20
I RR
M (
A)
IF = 195A
VR = 34V
TJ = 25°C
TJ = 125°C
Fig 17. Threshold Voltage vs. Temperature
100 200 300 400 500 600
diF /dt (A/µs)
100
200
300
400
500
600
700
800
900
1000
QR
R (
nC)
IF = 117A
VR = 34V
TJ = 25°C
TJ = 125°C
Fig 20. Typical Stored Charge vs. dif/dt
100 200 300 400 500 600
diF /dt (A/µs)
100
200
300
400
500
600
700
800
900
1000
QR
R (
nC)
IF = 195A
VR = 34V
TJ = 25°C
TJ = 125°C
Fig 19. Typical Recovery Current vs. dif/dt
IRL7472L1TRPbF
8 2016-10-14
Fig 22. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
Fig 23a. Unclamped Inductive Test Circuit
RG
IAS
0.01tp
D.U.T
LVDS
+- VDD
DRIVER
A
15V
20V
Fig 25a. Gate Charge Test Circuit
tp
V(BR)DSS
IAS
Fig 23b. Unclamped Inductive Waveforms
Fig 24a. Switching Time Test Circuit Fig 24b. Switching Time Waveforms
Vds
Vgs
Id
Vgs(th)
Qgs1 Qgs2 Qgd Qgodr
Fig 25b. Gate Charge Waveform
VDD
IRL7472L1TRPbF
9 2016-10-14
Note: For the most current drawing please refer to website at http://www.irf.com/package/
G = GATED = DRAINS = SOURCE
G
DS
D
D D
D
D
S
S
S S
S
S
S
DirectFET™ Board Footprint, L8 Outline (Large Size Can, 8-Source Pads) Please see DirectFET™ application note AN-1035 for all details regarding the assembly of DirectFET™. This includes all recommendations for stencil and substrate designs.
IRL7472L1TRPbF
10 2016-10-14
DirectFET™ Outline Dimension, L8 Outline (Large Size Can, 8-Source Pads) Please see DirectFET™ application note AN-1035 for all details regarding the assembly of DirectFET™. This includes all recommendations for stencil and substrate designs.
DirectFET™ Part Marking
PART NUMBER
LOGO
BATCH NUMBER
DATE CODELine above the last character ofthe date code indicates "Lead-Free"
GATE MARKING
+
Note: For the most current drawing please refer to website at http://www.irf.com/package/
CODE
A
B
C
D
E
F
G
H
J
K
L
M
R
P
0.017
0.029
0.003
0.007
0.057
0.104
0.236
0.048
0.026
0.024
MAX
0.360
0.280
0.38
0.68
0.02
0.09
1.35
2.55
5.90
1.18
0.55
0.58
MIN
9.05
6.85
0.42
0.74
0.08
0.17
1.45
2.65
6.00
1.22
0.65
0.62
MAX
9.15
7.10
0.015
0.027
0.003
0.001
0.100
0.053
0.232
0.046
0.023
0.022
MIN
0.270
0.356
METRIC IMPERIALDIMENSIONS
0.98 1.02
0.73 0.77
0.0400.039
0.0300.029
L1 0.2155.35 5.45 0.211
IRL7472L1TRPbF
11 2016-10-14
Note: For the most current drawing please refer to website at http://www.irf.com/package/
Qualification Information
Qualification Level Industrial *
(per JEDEC JESD47F† guidelines)
Moisture Sensitivity Level DirectFET (Large -Can) MSL1
(per JEDEC J-STD-020D†)
RoHS Compliant Yes
† Applicable version of JEDEC standard at the time of product release. * Industrial qualification standards except autoclave test conditions.
DirectFET™ Tape & Reel Dimension (Showing component orientation).
LOADED TAPE FEED DIRECTION
NOTE: CONTROLLINGDIMENSIONS IN MM CODE
A
B
C
D
E
F
G
H
IMPERIAL
MIN
4.69
0.154
0.623
0.291
0.283
0.390
0.059
0.059
MAX
12.10
4.10
16.30
7.60
7.40
10.10
N.C
1.60
MIN
11.90
3.90
15.90
7.40
7.20
9.90
1.50
1.50
METRIC
DIMENSIONS
MAX
0.476
0.161
0.642
0.299
0.291
0.398
N.C
0.063
+
REEL DIMENSIONS
NOTE: Controlling dimensions in mmStd reel quantity is 4000 parts. Order as IRF7472L1TRPBF).
MAX
N.C
N.C
0.520
N.C
3.940
0.880
0.720
0.760
IMPERIAL
MIN
330.00
20.20
12.80
1.50
99.00
N.C
16.40
15.90
STANDARD OPTION (QTY 4000)
CODE
A
B
C
D
E
F
G
H
MAX
N.C
N.C
13.20
N.C
100.00
22.40
18.40
19.40
MIN
12.992
0.795
0.504
0.059
3.900
N.C
0.650
0.630
METRIC
IRL7472L1TRPbF
12 2016-10-14
Trademarks of Infineon Technologies AG µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™ Trademarks updated November 2015 Other Trademarks All referenced product or service names and trademarks are the property of their respective owners.
Edition 2016-04-19 Published by Infineon Technologies AG 81726 Munich, Germany © 2016 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: [email protected]
Document reference ifx1
IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council.
WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
Revision History
Date Comments
08/09/2016
Changed datasheet with Infineon logo - all pages. Changed max Rdson @ 10V/4.5V from “0.59m /0.97m" to “0.45m" / 0.7m" - on pages 1 & 2. Changed ID @ TC 25C/100C from “564A/399A” to “645A/456A” - on pages 1 & 2. Changed ID @ TA 25C from “59A” to “68A” - on pages 1 & 2. Changed Fig.2 -on page 2.
10/14/2016 Corrected Outline Dimension, L8 Outline on page 10.