Ion beam etch anddeposition systems

The Business of Science®

Ion beam systems

Oxford Instruments offers a single tool, allowing the flexibility to perform etch and/or deposition and maximising system utilisation.

System specifications can be closely tuned toapplications, enabling faster and repeatable process results. The Oxford Instruments Ion Beamrange offers functionality in multiple modes:

n Ion Beam Etching (IBE)

n Reactive Ion Beam Etching (RIBE)

n Chemical Assisted Ion Beam Etching (CAIBE)

n Ion Beam Sputter Deposition (IBSD)

n Ion Assisted Sputter Deposition (IASD)

Oxford Instruments’ systems are scalable from R&D to batch production in one tool.

Ion beam technology offers unique abilities in etch and deposition

Typical applications andmaterialsn IR detectors

n CdHgTe (CMT) etch

n VOx deposition and etch

n Metal contact and track etch

n Cu, Ni, Al…

n Noble metals: Au, Pt, Pd…

n Diffraction gratings

n SiO2 ‘blazed’ etch

n Spintronics and MRAM

n AR and HR coatings for laser bars

n Telecom filters

n III-V photonics etching

n Thin film magnetic hard disk heads (TFMH)

n Ring laser gyroscope mirrors

The Ion Beam Range

Ionfab300PlusEtch and deposition processes in one tool

Optofab3000Purpose made system for optical coatings

Ionfab500PlusSpecialist high precision ion beamdeposition system

Night vision andsecurity equipment

Thin filmmagnetic heads

Ionfab®300Plus

Flexibility in a single tooln Handles from small pieces, through 100 mm

(4 inch), up to 200 mm (8 inch) wafers

n Ability to clamp any shape, and design uniquecarrier plates

n Wafer handling options

• Manual loading for one-off trials

• Load-lock for faster trials

• Cassette-to-cassette loading/unloading for batch production

• Clusterable with other process tools including Oxford Instruments’ Plasmalab® plasma etch, deposition and sputtering tools, and FlexAL®

atomic layer deposition (ALD) tools

• Simple upgrade options to add etch and deposition sources

Leading ion source and grid settechnologyn Grids are designed to suit specific applications:

high uniformity, high rate, & low energy

n Specific deposition grid sets to suit multipletargets, offer superior utilisation of target material

Ionfab300Plus is a modular System designed for ion beam etchingand deposition. It is used in a wide variety of processes,particularly in the Semiconductor and Optical Coating Industries

Ionfab300Plus tool images produced with the cooperation of the Optoelectronics Research Centre, University of Southampton, UK

Easy to site, use and maintainn Through-wall interface options allow the system

to be sited in “grey area”

n Ease of access to process chamber with two doors

n Ease of maintenance with door-mounted ion sources

n Compact footprint reduces cleanroom space required

Plasma Etch & Deposition Atomic Layer Deposition Molecular Beam Epitaxy Ion Beam Etch & Deposition Nanoscale Growth Systems

Optofab3000

Optofab3000 is based on the proven architecture ofthe Ionfab300Plus – offering the same features andbenefits of the Ionfab300Plus with added capabilities.

n The high speed 8” specimen holder fitted to thesystem, delivers uniformity of < +/- 1%, and verygood layer to layer repeatability. The option touse uniformity shields is available with this system,offering further improvements in layer uniformity.

n A high deposition rate is achievable through theuse of the 15cm ion source, with a tailor madedished molybdenum 3 grid design. In additionexcellent refractive index results may be achievedwith the use of an assist source.

n The option to use a white light optical monitor isavailable with the Optofab3000 patented specimenholder. This is essential in ensuring that each layer isapplied at the correct thickness, thereby achievingthe specified optical characteristics.

Specifically developed for highquality optical applications,including High Reflective andAnti Reflective Coatings

Simulation of a high performance opticalfilter by an integrated software package

In-situ monitoring of optical coating depositionby an integrated software package

Multi-layer optical coating design by anintegrated software package

High speed specimen holder with uniformity shield

Process and materials capability

Ionfab300Plus and Optofab3000

Etch and deposition in one tool via single or dual-beamtechnologyn A full range of etch source options up to 35cm

n Dual beam configurations (etch plus depositionsource) offer the possibility to add capping layerimmediately after etch, without exposing theprocess chamber or wafer to atmosphere

n Increased deposition rates by using etch source asa plasma radical source (IASD)

Deposit different material layerswithout breaking vacuum

Vacuum options to suit processn Turbo-pump fitted as standard

n Cryo-pump option for moisture-sensitive applications

n Additional water vapour cryo trap optionInterior of the Ionfab300Plus

Target Size Target Quantity

x 2 x 4

4" 3 3

6" 3 3

8" 3 3

LiNbO3 etch RIBE of GaAs and AlGaAs. Courtesy of Chalmers University, Sweden

CdHgTe (CMT) etch for infrareddetector applications

‘Blazed’ quartz etch for diffraction grating

Plasma Etch & Deposition Atomic Layer Deposition Molecular Beam Epitaxy Ion Beam Etch & Deposition Nanoscale Growth Systems

Process control

Ionfab300Plus and Optofab3000

Flexibility in a single tooln Tiltable substrate holder can be angled from

-90° up to +75° (depending upon configuration)

- Enables ‘blazed’ gratings

- Allows sidewalls to be cleaned off or etched

n Angle control of substrate relative to depositiontarget ensures excellent deposition uniformity

Platen rotation speedn Variable platen rotation speed enables

deposition rate to be controlled specifically for the application

n Standard and high speed platen options

Substrate coolingn Prevents degradation of substrate and devices

structures/other materials already in place

n Option for wafer backside cooling with He (turbo-pump) or Ar (cryo-pump)

Process monitoringn Etch endpoint monitoring by SIMS for

multi-material applications

n Deposition process monitoring

- Crystal monitor (single or dual head)

- White Light Optical Monitor (WLOM)

n Chamber gas identification, partial pressurecontrol and leak checking via RGA

Process tool softwareThe intuitive, user-friendly PC3000TM graphical interface and control software for the Ionfab300Plus offers:

n Fast user learning

n Full process recipe editing

n Real-time visibility of process data including SIMS endpointing

n Automatic process and system data logging during runs

n Multi-level password-controlled user access for safe and secure operation

Screen shot of system includingcassette loading & robotic handling

The process page provides complete controland visibility of the process being run

The PC3000 graphical interfaceshowing chamber and load lock status

Specialist high-precision ionbeam deposition system

Transmission spectrum of a mirrordesigned for 633 nm at 45°, deposited in the Ionfab500Plus, showing:

• Mirror loss < 40 ppm• Uniformity < ±0.0005• Surface Roughness < 0.11 nm

Excellent refractive index (RI) control and uniformity provides high wafer yield

Low loss mirrors produced by Ion Beam sputterdeposition are incorporated in this inertia sensorassembly which incorporates three ring lasergyroscopes. Image courtesy of Marconi Electric Systems

The Ionfab500Plus has been developed for the requirementsof customers demanding high throughput. This is deliveredby the use of the 4 x 10” planetary substrates and the abilityto use 14” targets.

Another key benefit to customers requiring high throughputis the use of up to 3 targets, meaning that different materiallayers may be deposited without breaking vacuum.

Ionfab500PlusDesigned for ultra high quality optical thin films

Plasma Etch & Deposition Atomic Layer Deposition Molecular Beam Epitaxy Ion Beam Etch & Deposition Nanoscale Growth Systems

The Ionfab500Plus was first supplied in 1983 and was the world’s first commercial ion beam sputter depositionsystem for ring laser gyroscope manufacture. In recent years customers have demonstrated mirrors exhibiting < 20ppm on a commercially available system using the Ionfab500Plus.

Oxford Instruments, at Yatton, UK, operates Quality Management Systems approved to the requirements of BS EN ISO 9001. This publication is the copyrightof Oxford Instruments Plasma Technology Limited and provides outline information only which (unless agreed by the company in writing) may not be used,applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned.Oxford Instruments’ policy is one of continued improvement. The company reserves the right to alter, without notice, the specification, design or conditions ofsupply of any product or service. Oxford Instruments acknowledges all trade marks and registrations.

© Oxford Instruments Plasma Technology Ltd, 2008. All rights reserved.

n Plasma Etch & Deposition

n Atomic Layer Deposition

n Molecular Beam Epitaxy

n Ion Beam Etch & Deposition

n Nanoscale Growth System

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Ionfab, Optofab, Plasmalab, FlexAL are registered trademarks of Oxford Instruments Plasma Technology Ltd.Ref: OIPT/IonBeam/2008/01

Oxford Instruments is committed to supporting our customers’ success.We recognise that this requires world class products complemented byworld class support. Our global service force is backed by regionaloffices, offering rapid support wherever you are in the world.

Worldwide Service and Support

We can provide:

n Tailored service agreements to meet your needs n Comprehensive range of structured training courses n Immediate access to genuine spare parts and accessories n System upgrades and refurbishments

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