ILC Electronics Manufacturing Opportunities ILC Industrial Forum at Fermilab September 21-22, 2005 Ray Larsen for SLAC ILC Electronics Group

ILC Electronics ManufacturingOpportunities

ILC Industrial Forum at FermilabSeptember 21-22, 2005

Ray Larsen for SLAC ILC Electronics Group

September 21-22, 2005 ILC Electronics Industrial Opps R.S. Larsen 2

Outline I. Power Electronics

Modulators Power Supplies

II. Controls & Networks III. Instrumentation


Subsystem Relative Costs

0

5

10

15

20

25

30

35

% TPC

CF Struct RF SysEng InstTest MagnetVac Cntrl Cryo Ops Instr


2-Tunnel Model w/~Penetrations

Dual Serial

Gigabit Trays

Dual DC

Power Buses

Instrumentation Electronics

Alcove

Power Electronics

Alcove

Cooling

AC Power Buses & Pnls

Beamline Devices Control/

Data In/Out

Module ServiceSystem

ModulatorsPower

Supplies

Radiation Protection

~6in. Penetration

Module Tray


I. Power Electronics Modulators

Est. Production Cost 4% TPC Est. Range $100-200M

Power Supplies Est. Production Cost ~4% TPC


Modulators: TESLA and Marx


Design Comparison 600 Units total Assume Dual Tunnels, short HV cables to klystron TESLA – Current Baseline design

PFN, IGBT redundant switch at 1/10 HV, bouncer flattener, step-up Xfmr to 120KV, 140A

MARX – R&D Design Potential 40-50% cost reduction, 10X lower switch

current, losses. Plug-in module design to backplane, IGBT switch arrays

each board, vernier board flattener, redundant switches, modules, diagnostic controllers, robotic module swap


Manufacturing Comparison TESLA:

Traditional capacitor banks in cabinets, point-to-point interconnects, separate charging source at 10KV DC, separate dual discharge switch, separate oil-filled transformer.

Entire unit can be contracted to assembler Could subcontract switches, transformer, HV

cable assemblies, controls subassemblies Modulators and Xfmrs separately factory tested.


Manufacturing Comparison 2 MARX

Transformer-less oil-free design Each unit has 16 plug-in circuit board modules Total boards = 9600 for 600 units 60% Parts cost in IGBT switch sub-modules Total sub-modules =10 per module, 96,000 for 600 units Capacitors mount on each module Operates in sealed box with air-water heat exchanger Contract for fully assembled factory tested units Subcontract all subassemblies to standard PC board

manufacturers.


Installation Comparison TESLA

Install tested units in large cabinets, move units into tunnel position depending on how large can handle. May have to separate racks.

Install transformer, HV connections separately Repair in situ or remove failed Xfmr

MARX Install box 2x2x1.5m, populated with modules optional. Option: Populate, service with robotic module remove

and replace system. Can work 24/7 from maintenance depots along machine.


Power Supplies High Availability 1/n Modular Designs where

failure will interrupt machine Apply as needed to:

KW to 100KW single load or string supplies Multi-channel Corrector supplies Cryogenic magnet supplies


HA PS Concept – Quads, LGPS5 Parallel 1.25 KW Modules

Backplane

DC Out

AC In/ Out

Serial I/O (5x2)

EmbeddedPSDC’s

n/N parallel modules for DC magnet supply (1/5 shown)

Overall load current feedback

Dual Diagnostics Controller Mezzanine Card each module


HA PS Module - Correctors, Cryo Motherboard Dual Serial

Control IO Independent

Carriers Hot Swappable

Optional: Redundant n/N w/ Switchover

Dual Bulk 48V DC In

DCOut


ManufacturingInjection, Damping Ring and Beam Delivery all

warm supplies, LGPS & Modular Main Linac quads, correctors cryogenic low

voltage, high current, low power supplies Total units estimates

LGPS 1/n redundant supplies:1500? Modular n-channel supplies: 3000? Cryogenic modular supplies: 3000


II. Controls & Networks Review of existing SLAC Linear Collider &

PEP Control System Redundant DEC (HP) Alpha mainframes with 4

tandem processors each Remote Multibus SBC IOCs throughout systems IOCs fan out over multiple serial links to

CAMAC simple communications controllers SLCnet, PEPnet, Pnet custom protocols Special fast timing net locked to Linac, PEP RF


Existing SLC Layout, Networks

MAIN CONTROL CENTER

SLCnet + Pnet + Timing

PEPnet + Pnet + Ethernet + Timing

SLC/SLD

PEP/ BABAR

3 Km Linac Damping Rings

Injector


SLC-PEP Controls Architecture

DEC Alphas

Switch

Ethernet

IOC MBCD

CAMAC Serial

CAMAC Crates

PEPnet Pnet

Timing Net

SLCnet Pnet

Timing Net

MAIN CONTROL

PEP/ BABAR SLC/

SLD


SLC-PEP Summary

SLC Item Function Number Model Location RedundancyControlsExisting Hdwe Architecture

Central Computers Main Control Center 2X4 Proc. DEC Alpha Mainframe MCC 1 of 2Multibus IOCs Remote Nodes 75 Intel SBCs Sectors, Ring IRs NoneMBCDs Serial drivers to CAMAC SCC's 75 Custom SLAC design ~Every 4th Camac Crate NoneCAMAC SCCs Serial crate controllers 300+ Custom SLAC design Every Linac sector, rings NoneNetworksSLCnet Linac to SLD controls Custom SLAC design Linac, Arcs, SLD NonePEPnet PEP ring controls Custom SLAC design PEP rings NoneEthernet PEP new Pentium IOCs Commercial product PEP rings NonePnet Pattern Broadcast Config Custom SLAC design All priority timed areas NoneFast Timing Net RF locked fiducials, PDUs Custom SLAC design RF Master Osc at head end None

SLC Coax cables to PDUs all areas

Software Notes

HP VMS 1Vxworks 2Commun Firmware 3Commun Firmware 3

Notes1 2 computers 4 proc each, 1 is development system and backup, manual failover2 Approx. One per 4 CAMAC crates3 No processor


SLC-PEP Upgrade Plan

DEC Alphas Or SBC Cluster

Switch Matrix

FECC

Ethernet

CAMAC Crates

Ethernet Timing Net

MAIN CONTROL

PEP/ BABAR

SLC/ SLD

IOC Cluster

Ethernet SCCs

Ethernet Timing Net


SLC-PEP Upgrade Summary

SLC Proposed Upgrade Hdwe Architecture

Central Computers System Main Control >3 Commercial cluster Main Control Center ~1/3IOCs Remote Node Control ~50 Commercial SBCs (tbd) Main Control Center 1/nFECC CAMAC Cntrlr Replace MBCDs ~50 SLAC custom desing Remote Nodes 1/nCAMAC SCCs Communication cntrlrs (new) 2-400 Commercial unit Remote Front Ends noneNetworksEthernet Dual Star Replace SLC, PEPnet Commercial Main to all nodes DualPnet Upgrade Repalce w/ Ethernet Commercial All priority timed areas DualFast Timing Net RF locked fiducials, PDUs Custom SLAC design RF Master Osc at head end Dual

Fibers to PDUs all areas

SLC Item Function Number Model Location Redundancy

RTEMS?RTEMSVxWorks or RTEMSCommun. Firmware

Software Notes


ILC Proposed Architecture

Node N

Detector

Linac

Damping Ring

Injector

Instrument Modules

Linac Sector

Dual Star Network

Dual Star Network

Main Control Cluster

Ethernet (Pnet Imbedded) Timing Net


ILC Proposed SummaryItem Function Number Model Location Redundancy Software Notes

ILCProposed Hdwe Architecture

ATCA Central Cluster System Main Control 2-400 Commercial SBCs (tbd) Main Control Center 1/n Crate LevelATCA Cluster Cntrlrs Data IO from Remote Nodes ~600 Commercial Switches (tbd) Main Control Center Dual Star BackboneATCA NodeCntrlrs Data IO from Front End Brds ~600 Commercial Switches (tbd) Remote Nodes Dual Star BackboneATCA AMC cards Intelligent Front End Modules ~25000 Custom Design, Comml Mfgr All areas along machines Dual Star, 1/n redund.NetworksEthernet All IO, timing to 10 nsec ~5000 Commercial TxRx, switches All carrier modules in crates Dual Star Gb FiberPnet Pattern Broadcast Config ~5000 Commercial Ethernet All priority timed areas Dual Star Gb FiberFast Timing Net RF locked fiducials, chip PDUs ~2500 Custom design RF dual master phase locked Dual Star RF Fiber

to satellite, dual fibers to FEMs

TBD 4,5Linux OS? 5Linux OS? 5Linux OS? 6

Priority Mode on Std. Enet7

4 Auto failover at crate level5 Autofailover ATCA Backbone6 Auto failover modules in critical applications7 Temp compensated fibers, phase locked to RF dual master clocks; auto-failover

Notes


FEATURES

◊ Dual Star 1/NRedundant Backplanes

◊ Redundant Fabric Switches

◊ Dual Star/ Loop/ Mesh Serial Links

◊ Dual Star Serial Links To/From

Level 2Sector Nodes

Dual Star to/From Sector Nodes

Dual FabricSwitches

ApplicationsModules

Dual Star/Loop/Mesh

Central Controls Cluster


Linac Sector Nodes

Sector N+1

Sector N

Sector N+2


Manufacturing Controls Est. = 4% of TPC. Propose all controls to be designed to HA platform. ATCA under study as candidate de facto standard. Modules, hardware, base software -- commercial

contracts from standard suppliers. Custom design necessary for some data switching, fast

timing modules; commercial manufacture. Total modules est. ~4,000 (not incl. instrumentation) Ethernet & Timing fiber plants substantial cost item. HA software major engineering effort, cost


III. Instrumentation Front End Instrument Modules Est. at 2.5% of TPC. Standard Packaging system required.

Use ATCA HA packaging, concepts Some custom design necessary Assume 2-tunnel model for packaging R&D on Robotic Service System Assume 2-Tunnel Model Consider 1-Tunnel issues as backup (Cost vs.

Availability)


ILC Linac Instrumentation (~40m)

Cryomodule 1 Cryomodule 2 Cryomodule 3

Cavities 1-12

Cavity Tuner Motor (2)

Coupler (3) Tuner Motor (1 per) Window Arc Detect (2 per) Vacuum Pump (1per)

Piezo Tuner (2)

HOM BPM Ports (2)

RF Power Pickup (1)

Coupler Pfwd Prev

Cryo Resistive Sensors (12) (4/Cryomodule)

K

LLRF Vector Sum

Cryo Vacuum Pumps (6) 2/Cryomodule

SC Quad (1) SC Corrector (2) Cavity BPM (1)

~1m

ATCA StandardModule


Sector Node Instrument Modules

ATCA Style Carrier Modules, Hot SwappableATM Mezzanine Modules, Hot SwappableStand-Alone or Shelf ClusterDual Redundant Serial I/O, PowerRobotic Replaceable


Manufacturing All instrument packaging to be as far as possible in

standard HA modules and hot-swappable sub-modules.

Estimate ~ 1 ATCA carrier card w/ sub-modules per meter of machine, ~25,000 total carriers, 100,000 mezzanine modules.

Standard hardware and PC board techniques. Custom designs for high performance, reliability,

minimum cost.


Addenda: Single Tunnel Cost Study In 2001-2 post-Lehman Review studied placing

instruments inside beam tunnel in concrete holes (TEEs) for radiation protection to reduce overall costs. Study known as CD0.4.

Seemed feasible but for availability would need remote robotics servicing.

Applied to BPMs, LLRF, vacuum pumps-gauges-valves, magnet movers, temperature, MPS-BCS-PPS...

Note: Study was not for HA redundant design, did not estimate civil or robotics costs.


Lehman ($253M) vs. CD 0.4 ($118M)

Potential Cost Reduction: $135M (53%)

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50

60

70

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LLRf BPMs Movers Vacuum Racks TEEs

Lehman CD 0.4


Comment on Robotics Servicing Study of robotic service system conducted by J. Cornuelle in

collaboration with Stanford ME department graduate engineering students. Simple manipulations of removing, replacing modules in tunnel. Cost payback appears viable; major positive impact on availability

(avoid machine shutdown to replace modules). Viability in dual tunnel also significant in providing 24/7 operation to

minimize size, cost of crews.

All ILC electronics systems planned to be modular, robotically serviceable, some hot-swappable.

Significant manufacturer system opportunity.

Documents

ILC Electronics Manufacturing Opportunities ILC Industrial Forum at Fermilab September 21-22, 2005 Ray Larsen for SLAC ILC Electronics Group