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IEEE MDTS’2022 Submission Key Dates: Manuscript submission: 2/28/2022 Tutorial, Panel, Special Session: 3/30/2022 Notification of acceptance: 4/19/2022 Camera ready paper: 5/10/2022 Submission of presentations: 5/14/2022 Organizing Committee General Chair Kelly Ockunzzi - Marvell Vice General Chair Andy Laidler – ON Semiconductor Program Chair Danella Zhao - Old Dominion Univ. Vice Program Chair Uma Srinivasan - IBM Past General Chair Eugene Atwood – IBM Tutorial Chair Carl Wisnesky – Cadence Krishna Chakravadhanula – Cadence Special Session Chair TBD Panel Chair Malinky Ghosh – IBM Finance & Registration Charles Thangaraj - Univ. of St. Thomas Ryan Patterson – CACI Xinghao Chen – IEEE Ted Cooley - Cooley & Company Publication Chair Themistoklis Haniotakis – S. Illinois U. Web Master & Publicity Yu Zhang – Aptiv Steering Committee Vishwani Agrawal – Auburn Univ. Xinghao Chen – IEEE Ted Cooley – Cooley & Company Jennifer Dworak – SMU Brion Keller – Lockheed Martin Karen Panetta – Tufts University Paul Reuter – Siemens EDA Peilin Song – IBM Research Tian Xia – Univ. of Vermont Krishnat Patil –IEEE Schenectady Charles Rubenstein - Pratt Institute IEEE MICROELECTRONICS DESIGN & TEST SYMPOSIUM May 23 - 25, 2022 | http://mdts.ieee.org Theme - Innovation in Microelectronics for AI, Security, and New Advances in Computing The 31st IEEE Microelectronics Design & Test Symposium (MDTS, formerly known as NATW) provides an annual world forum for academy and industry researchers and engineers to discuss latest advances in microelectronics, share their visions in modern microelectronic technologies and foster academy-industry collaboration. The three day symposium will begin after lunch on Monday with a session tutorial, followed by a welcome reception dinner and evening panel. The symposium is planning to spend Tuesday using a lecture auditorium on the SUNY POLYTECHNIC Nanotech campus for the day's technical program. Tuesday evening a group dinner and social event are being planned. On Wednesday the remaining technical program is planned for the morning. Please see the website for the agenda as it is assembled. Topics of Interest include but are not limited to: Micro Devices, Circuits and Microsystems: Analog/mixed-signal/RF circuits; Low-power low- voltage design; Sensors and sensing systems; Smart system design for automotive, automation and robotics; Circuits and systems for approximate and evolvable computing; Memristor based devices; Lab-on-Chip, wearable and implantable devices; Heterogeneous integration and multi-scale chiplet-based packaging architecture Biomedical, Photonics, and Quantum Electronics: Biomedical and bio-inspired circuits and systems; MEMS sensors and bioelectronics; Nanobiophotonics for optical imaging, sensing and diagnostics; Terahertz photonics for communications; Photodetectors, sensors and imaging; Photonics for energy and green photonics Electronic Design & Test Methodologies and EDA: Electronic design tools, processes and methodologies; EDA for 3D integrations and advanced packaging; EDA for bio-inspired and neuromorphic systems; EDA tools, methodologies and applications for Photonics devices, circuit and system design; SoC/IP testing strategies; Hardware/software co-verification; DFT & BIST for digital designs, analog/mixed-signal IC's, SoC's, and memories; Design verification/validation; Machine learning for testing Hardware Security: Microarchitectural attacks; Side channel attacks and mitigation; (Anti-)Reverse engineering and physical attacks; Hardware obfuscation; Computer-aided design for security; System-on-chip security, FPGA and reconfigurable fabric security; Internet-of-Things and cyber physical system security Emerging Technologies and Applications: Computing-in-memory architectures; Neural networks, machine and deep learning; Application of cognitive, neuromorphic and quantum computing; Next-generation design-technology co-optimization; Advanced interconnect; 3D manufacturing. Special Session: To be Announced Jake Karrfalt Best Student Paper Award To encourage student participation in the microelectronics research community, MDTS will recognize the top student first-author paper and presentation. 2021 Corporate Supporters

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Page 1: IEEE MICROELECTRONICS DESIGN & TEST SYMPOSIUM

IEEE MDTS’2022

Submission Key Dates:

Manuscript submission: 2/28/2022 Tutorial, Panel, Special Session: 3/30/2022 Notification of acceptance: 4/19/2022 Camera ready paper: 5/10/2022 Submission of presentations: 5/14/2022

Organizing Committee

General Chair Kelly Ockunzzi - Marvell Vice General Chair Andy Laidler – ON Semiconductor Program Chair Danella Zhao - Old Dominion Univ. Vice Program Chair Uma Srinivasan - IBM Past General ChairEugene Atwood – IBM

Tutorial Chair Carl Wisnesky – Cadence Krishna Chakravadhanula – Cadence

Special Session Chair TBD Panel Chair Malinky Ghosh – IBM Finance & Registration Charles Thangaraj - Univ. of St. Thomas Ryan Patterson – CACIXinghao Chen – IEEETed Cooley - Cooley & Company

Publication Chair Themistoklis Haniotakis – S. Illinois U. Web Master & Publicity Yu Zhang – Aptiv

Steering Committee

Vishwani Agrawal – Auburn Univ. Xinghao Chen – IEEE Ted Cooley – Cooley & Company Jennifer Dworak – SMU Brion Keller – Lockheed Martin Karen Panetta – Tufts University Paul Reuter – Siemens EDAPeilin Song – IBM Research Tian Xia – Univ. of Vermont Krishnat Patil –IEEE Schenectady Charles Rubenstein - Pratt Institute

IEEE MICROELECTRONICS DESIGN & TEST SYMPOSIUM

May 23 - 25, 2022 | http://mdts.ieee.org

Theme - Innovation in Microelectronics for AI, Security, and New Advances in Computing The 31st IEEE Microelectronics Design & Test Symposium (MDTS, formerly known as NATW) provides an annual world forum for academy and industry researchers and engineers to discuss latest advances in microelectronics, share their visions in modern microelectronic technologies and foster academy-industry collaboration. The three day symposium will begin after lunch on Monday with a session tutorial, followed by a welcome reception dinner and evening panel. The symposium is planning to spend Tuesday using a lecture auditorium on the SUNY POLYTECHNIC Nanotech campus for the day's technical program. Tuesday evening a group dinner and social event are being planned. On Wednesday the remaining technical program is planned for the morning. Please see the website for the agenda as it is assembled.

Topics of Interest include but are not limited to:Micro Devices, Circuits and Microsystems: Analog/mixed-signal/RF circuits; Low-power low-voltage design; Sensors and sensing systems; Smart system design for automotive, automation and robotics; Circuits and systems for approximate and evolvable computing; Memristor based devices; Lab-on-Chip, wearable and implantable devices; Heterogeneous integration and multi-scale chiplet-based packaging architecture

Biomedical, Photonics, and Quantum Electronics: Biomedical and bio-inspired circuits and systems; MEMS sensors and bioelectronics; Nanobiophotonics for optical imaging, sensing and diagnostics; Terahertz photonics for communications; Photodetectors, sensors and imaging; Photonics for energy and green photonicsElectronic Design & Test Methodologies and EDA: Electronic design tools, processes and methodologies; EDA for 3D integrations and advanced packaging; EDA for bio-inspired and neuromorphic systems; EDA tools, methodologies and applications for Photonics devices, circuit and system design; SoC/IP testing strategies; Hardware/software co-verification; DFT & BIST for digital designs, analog/mixed-signal IC's, SoC's, and memories; Design verification/validation; Machine learning for testingHardware Security: Microarchitectural attacks; Side channel attacks and mitigation; (Anti-)Reverse engineering and physical attacks; Hardware obfuscation; Computer-aided design for security; System-on-chip security, FPGA and reconfigurable fabric security; Internet-of-Things and cyber physical system securityEmerging Technologies and Applications: Computing-in-memory architectures; Neural networks, machine and deep learning; Application of cognitive, neuromorphic and quantum computing; Next-generation design-technology co-optimization; Advanced interconnect; 3D manufacturing.

Special Session: To be Announced

Jake Karrfalt Best Student Paper Award To encourage student participation in the microelectronics research community,

MDTS will recognize the top student first-author paper and presentation.

2021 Corporate Supporters