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May 2017 DocID15487 Rev 9 1/17
SD4933
HF/VHF/UHF RF power N-channel MOSFET
Datasheet - production data
Figure 1. Pin connection
Features• Improved ruggedness V(BR)DSS > 200 V
• Excellent thermal stability
• 20:1 all phases load mismatch capability
• POUT = 300 W min. with 24 dB gain @ 30 MHz
• In compliance with the 2002/95/EEC European directive
DescriptionThe SD4933 is an N-channel MOS field-effect RF power transistor. It is intended for use in 50 V ISM applications up to 100 MHz.
1
3
4
2
1. Drain
2. Source
3. Gate
4. Source
5. Source
5
M177Epoxy sealed
Table 1. Device summary
Order code Marking Base qty. Package Packaging
SD4933 SD4933(1) 25 pcs M177 Plastic tray
1. For more details please refer to Chapter 9: Marking, packing and shipping specifications.
www.st.com
Contents SD4933
2/17 DocID15487 Rev 9
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Typical performance (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 Test circuit (30 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 VGS/GFS sorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 15
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DocID15487 Rev 9 3/17
SD4933 Electrical data
17
1 Electrical data
1.1 Maximum ratings(TCASE = 25 °C)
1.2 Thermal data
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
V(BR)DSS Drain source voltage 200 V
VDGR Drain-gate voltage (RGS = 1 MΩ) 200 V
VGS Gate-source voltage ±20 V
ID Drain current 40 A
PDISS Power dissipation 648 W
EASAvalanche energySingle pulse (ID = 56 A - 800 µH coil)
1200 mJ
TJ Max. operating junction temperature 200 °C
TSTG Storage temperature -65 to +150 °C
Table 3. Thermal data
Symbol Parameter Value Unit
RthJC Junction - case thermal resistance 0.27 °C/W
Electrical characteristics SD4933
4/17 DocID15487 Rev 9
2 Electrical characteristics
TCASE = +25 oC
2.1 Static
2.2 Dynamic
Table 4. Static
Symbol Test conditions Min Typ Max Unit
V(BR)DSS VGS = 0 V IDS = 100 mA 200 240 V
IDSS VGS = 0 V VDS = 100 V 2 mA
IGSS VGS = 20 V VDS = 0 V 500 nA
VGS(Q) VDS = 10 V ID = 250 mA 2.5 3.75 V
VDS(ON) VGS = 10 V ID = 20 A 3.5 4.0 V
GFS VDS = 10 V ID = 5 A 8 14 S
CISS VGS = 0 V VDS = 50 V f = 1 MHz 1000 pF
COSS VGS = 0 V VDS = 50 V f = 1 MHz 400 pF
CRSS VGS = 0 V VDS = 50 V f = 1 MHz 16 pF
Table 5. Dynamic
Symbol Test conditions Min Typ Max Unit
POUT VDD = 50 V IDQ = 250 mA f = 30 MHz 300 - W
GPS VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz 20 24 - dB
hD VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHz 50 58 - %
Load mismatch
VDD = 50 V IDQ = 250 mA POUT = 300 W f = 30 MHzAll phase angles
10:1 20:1 - VSWR
DocID15487 Rev 9 5/17
SD4933 Impedance data
17
3 Impedance data
Figure 2. Impedance data
Table 6. Impedance values
Zin Zdl
1.6 - j 5.0 3.3 + j 1.0
Typical performance SD4933
6/17 DocID15487 Rev 9
4 Typical performance
Figure 3. Capacitance vs. drain voltage Figure 4. Drain current vs. drain-source voltage
Figure 5. Drain current vs. drain-source voltage at different temperatures
0
200
400
600
800
1000
1200
1400
0 10 20 30 40 50
Cap
acita
nce
(pF)
Drain-source voltage (V)
Cgs Cgd Cds
AM09243V1
0
5
10
15
20
25
30
35
0 2 4 6 8
Ids
(A
)
Vds (V)10
AM09244V1
0
5
10
15
20
25
30
35
40
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Ids
(A)
Vgs (V)
25°C 80°C -20°C
AM09245V1
DocID15487 Rev 9 7/17
SD4933 Typical performance
17
Figure 6. Transient thermal impedance
0.00
0.05
0.10
0.15
0.20
0.25
0.30
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Ther
mal
Impe
danc
e -
ZTH
J-C
(°C
/ W
)
Rectangular power pulse Width (s)
single pulse10%
20%
30%
40%
50%
60%
Single -repetitive pulse
AM09280V2
Typical performance SD4933
8/17 DocID15487 Rev 9
Figure 7. Transient thermal impedance model
DocID15487 Rev 9 9/17
SD4933 Typical performance (30 MHz)
17
5 Typical performance (30 MHz)
Figure 8. Gain and efficiency vs. output
power_Vdd = 50 V, Idq = 250 mA, freq = 30 MHzFigure 9. Output power vs. input power
Figure 10. Output power vs. supply voltage Figure 11. Output power vs. gate voltage
10
20
30
40
50
60
70
80
14
16
18
20
22
24
26
28
0 50 100 150 200 250 300 350 400 450
Effic
ienc
y (%
)
Pow
er g
ain
(dB
)
Output Power (W)
Pgain Efficiency
AM09248V2
050
100150200250300350400450
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5Po
ut (W
)Pin (W)
50 V 40 V
AM09246V1
100
150
200
250
300
350
400
25 30 35 40 45 50
Pout
(W)
Vdd (V)
Pin = 2.8W Pin = 1.4W
AM09247V1
0
100
200
300
400
500
-3 -2 -1 0 1 2 3 4
Pout
(W)
Vgs (V)
Pin = 2.8W
AM09248V1
Typical performance (30 MHz) SD4933
10/17 DocID15487 Rev 9
5.1 Test circuit (30 MHz)
Figure 12. 30 MHz test circuit schematic
Table 7. Transmission line dimensions
Dim. Inch mm
A 0.532 13.51
B 0.250 6.35
C 0.181 4.59
D 0.383 9.37
E 0.351 8.91
F 0.633 16.08
G 0.477 12.12
H 0.438 11.12
J 0.200 5.08
K 0.164 4.16
L 0.174 4.42
M 0.817 20.75
N 0.350 8.89
P 0.779 19.79
R 0.639 16.23
DocID15487 Rev 9 11/17
SD4933 Typical performance (30 MHz)
17
S 0.165 4.19
T 1.017 25.84
U 0.375 9.52
V 0.456 11.58
W 0.325 8.24
X 0.650 16.50
Table 8. 30 MHz test circuit component list
Component Description
C1,C9 0.01 μF / 500 V surface mount ceramic chip capacitor
C2, C3 750 pF ATC 700B surface mount ceramic chip capacitor
C4 300 pF ATC 700B surface mount ceramic chip capacitor
C5,C10,C11,C14,C16 10000 pF ATC 200B surface mount ceramic chip capacitor
C6 510 pF ATC 700B surface mount ceramic chip capacitor
C7 300 pF ATC 700B surface mount ceramic chip capacitor
C8 175-680 pF type 46 standard trimmer capacitor
C12 47 μF / 63 V aluminum electrolytic radial lead capacitor
C13 1200 pF ATC 700B surface mount ceramic chip capacitor
C15 100 μF / 63 V aluminum electrolytic radial lead capacitor
R1,R3 1 kΩ, 1 W surface-mount chip resistor
R2 560 Ω 2 W wire-wound axis lead resistor
T1 HF 2-30 MHz surface mount 9:1 transformer
T2RG - 142B/U 50 coaxial cable OD = 0.165[4.18] L 15”[381.00] covered with 15” [381.00] tinned copper tubular brand 13/65” [5.1] width
L1 1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire
L2 1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire
RFC1,RFC2 3 turns 14 AWG wire through ferrite toroid
FB1 Surface mount EMI shield bead
FB2 Toroid
PCB ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU both sides
Table 7. Transmission line dimensions (continued)
Dim. Inch mm
Circuit layout SD4933
12/17 DocID15487 Rev 9
6 Circuit layout
Figure 13. Test fixture component layout
Figure 14. Test circuit photomasters
SD 4933
44
DocID15487 Rev 9 13/17
SD4933 VGS/GFS sorts
17
7 VGS/GFS sorts
Table 9. VGS/GFS sorts
Marking VGS(min) VGS(max) GFS(min) GFS(max)
E4 2.50 2.75 8 9
E5 2.50 2.75 9 10
E6 2.50 2.75 10 11
E7 2.50 2.75 11 12
E8 2.50 2.75 12 13
E9 2.50 2.75 13 14
F4 2.75 3.00 8 9
F5 2.75 3.00 9 10
F6 2.75 3.00 10 11
F7 2.75 3.00 11 12
F8 2.75 3.00 12 13
F9 2.75 3.00 13 14
G4 3.00 3.25 8 9
G5 3.00 3.25 9 10
G6 3.00 3.25 10 11
G7 3.00 3.25 11 12
G8 3.00 3.25 12 13
G9 3.00 3.25 13 14
H4 3.25 3.50 8 9
H5 3.25 3.50 9 10
H6 3.25 3.50 10 11
H7 3.25 3.50 11 12
H8 3.25 3.50 12 13
H9 3.25 3.50 13 14
I4 3.50 3.75 8 9
I5 3.50 3.75 9 10
I6 3.50 3.75 10 11
I7 3.50 3.75 11 12
I8 3.50 3.75 12 13
I9 3.50 3.75 13 14
Package mechanical data SD4933
14/17 DocID15487 Rev 9
8 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
Figure 15. Package dimensions
Table 10. M177 (.550 DIA 4/L N/HERM W/FLG) mechanical data
Dim.mm. Inch
Min Typ Max Min Typ Max
A 5.72 5.97 0.225 0.235
B 6.73 6.96 0.265 0.275
C 21.84 22.10 0.860 0.870
D 28.70 28.96 1.130 1.140
E 13.84 14.10 0.545 0.555
F 0.08 0.18 0.003 0.007
G 2.49 2.74 0.098 0.108
H 3.81 4.32 0.150 0.170
I 7.11 0.280
J 27.43 28.45 1.080 1.120
K 15.88 16.13 0.625 0.635
GAPMSMD00039
Controlling dimension: Inches
DocID15487 Rev 9 15/17
SD4933 Marking, packing and shipping specifications
17
9 Marking, packing and shipping specifications
Figure 16. Marking layout
Table 11. Packing and shipping specifications
Order code PackagingPcs per
trayDry pack humidity
VGS and GFS
codeLot code
SD4933 Plastic tray 25 < 10% Not mixed Not mixed
Table 12. Marking specifications
Symbol Description
X VGS and GFS sort
CZ Assembly plant
xxx Last 3 digits of diffusion lot
VY Diffusion plant
MAR Country of origin
CZ Test and finishing plant
y Assembly year
yy Assembly week
SD4933
Revision history SD4933
16/17 DocID15487 Rev 9
10 Revision history
Table 13. Document revision history
Date Revision Changes
11-Mar-2009 1 Initial release
24-Feb-2010 2 Updated Table 9: VGS/GFS sorts on page 13.
29-Sep-2010 3 Document status promoted from preliminary to datasheet.
06-Apr-2011 4Inserted Section 3: Impedance data, Section 4: Typical performance, Section 6: Circuit layout and Section 9: Marking, packing and shipping specifications.
24-May-2011 5Inserted Figure 6: Transient thermal impedance, Figure 7: Transient thermal impedance model and Section 9: Marking, packing and shipping specifications.
11-Aug-2011 6– EAS parameter inserted in Table 2: Absolute maximum ratings on
page 3.
– Minor text changes.
10-Jun-2013 7– Corrected error in VGS(Q) symbol and test conditions in Table 4:
Static.– Minor text edits.
01-Jul-2013 8– Modified the VGS(Q) and GFS values in Table 4: Static.– Reduced the number of entries in Table 9: VGS/GFS sorts to
include only the relevant selection codes.
09-May-2017 9 – Modified the GFS values in Table 4: Static.
DocID15487 Rev 9 17/17
SD4933
17
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