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Granted in the Metal Finishing Field Compiled by Anselm Kuhn; E-mail, [email protected] METAL FINISHING PATENTS PUBLISHED IN DECEMBER 2003 AQUEOUS SURFACE CONDITIONER AND SURFACE CONDITIONING METHOD FOR PHOSPHATING TREATMENT EP 1368508 (Henkel KGGAA) Moriya, Y.; Suda, A.; et al. An aqueous surface conditioner for use in a phos- phating treatment is provided which contains crys- tals having an average diameter of 5pm or less in an amount of at least 0.1 g/L. The crystals are selected to have a two-dimensional epitaxy that matches within 3 % of misfit with the crystal lattice of one phosphate coating selected from among (1) hopeite /Zn3(PO4)24H20) and/or phosphophyllite (Zn2Fe(P4)24H20), (2) scholzite (CaZn2(PO4)22H2 O) and (3) hureaulite (Mn5(PO4)2[PO3(OH]24H20). BATH FOR THE ELECTHODEPOSlTION OF GOLD AND GOLD ALLOYS, AND THE USE THEREOF EP 1366219 (Wieland Dental & Technik GmbH) Ruebel, S.; Stuemke, M.; et al. HEAT-INSULATING LAYER MADE OF COMPLEX PEROVSKITE WO 03106372 Schwartz-Lueckge, S.; Vassen, R.; et al. ELECTROLYTIC ETCHING OF METAL LAYERS WO 03106090 (Faraday Technology Inc.) Taylor, E.J.; Dyar, H. METHOD FOR PRODUCING FINE METAL POWDER WO 03106083 (Sumitomo Electric Industries) Tani, Y.; Inazawa, S.; et al. Method for producing a fine metal powder, which comprises subjecting a solution containing a tetravalent titanium ion and having a pH of 7 or less to a cathode electrolysis treatment to reduce a part of the tetravalent titanium ion to a trivalent ion, so preparing an aqueous reducing agent solution con- raining both trivalent & tetravalent titanium ions. Adding a water-soluble compound of the metal ele- ment to the resulting mixture, followed by mixing, to reduce an ion of the metal and precipitate the metal by the reducing action originating from the oxida- tion of the trivalent titanium ion to the tetravalent titanium ion. The method can be used for producing a high purity fine metal powder which is finer than a conventional fine metal powder, has a narrow par- ticle diameter distribution and is free of an impuri- ty, at a lower cost on a large scale with safety. METALLIZED PARTS MADE FROM PLASTIC MATERIAL WO 03105548 (Framatome Connectors Int.) Fares-Karam, A. In order to metallize a support made from high tem- perature polymer, the melting temperature of which is higher than 180 C, successive stages of cleaning, plasma etching, grafting and then metallizing in a metallization bath are applied. The metallizing bath is brought to a temperature between 50 C and 70 C, the plasma being a nitrogenous plasma. METHOD AND DEVICE FOR TREATING FLAT AND FLEXIBLE WORKPIECES WO 03105546 (Atotech Deutschland GmbH) Wex, 0.; Scheller, B. Electroplating and/or etching of delicate substrates such as metal foils, using protecting carriers. FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME WO 03105545 (Matsushita Electric Ind. Co. Ltd.) Fukuoka, M.; Hiranaka, K.; et al. Electroplated copper thin film with duplex structure of specified crystal structure as determined by X-ray diffraction. TIN-PLATED STEEL PLATE AND METHOD FOR PRODUCTION THEREOF WO 03104528 (Jafe Steel Corp.) Nakakoji, H.; Tanaka, T.; et al. A tin-plated steel plate which comprises a steel plate having a surface roughness of 1.5~m or less in terms of Ra, a Fe-Sn alloy layer formed on the sur- face of the steel plate, a tin plating layer having a 124 Metal Rnishing

Granted in the metal finishing field

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Granted in the Metal Finishing Field C o m p i l e d b y A n s e l m K u h n ; E - m a i l , f i n p u b s @ c o m p u s e r v e . c o m

METAL F IN ISHING PATENTS PUBLISHED IN DECEMBER 2 0 0 3

AQUEOUS SURFACE CONDITIONER AND SURFACE CONDIT IONING METHOD FOR PHOSPHATING TREATMENT EP 1368508 (Henkel KGGAA) Moriya, Y.; Suda, A.; et al. An aqueous surface conditioner for use in a phos- phating t rea tment is provided which contains crys- tals having an average diameter of 5pm or less in an amount of at least 0.1 g/L. The crystals are selected to have a two-dimensional epi taxy tha t matches within 3 % of misfit with the crystal lattice of one phosphate coating selected from among (1) hopeite /Zn3(PO4)24H20) and/or phosphophyl l i te (Zn2Fe(P4)24H20), (2) scholzite (CaZn2(PO4)22H2 O) and (3) hureauli te (Mn5(PO4)2[PO3(OH]24H20).

BATH FOR THE ELECTHODEPOSlTION OF GOLD A N D GOLD ALLOYS, A N D THE USE THEREOF EP 1366219 (Wieland Dental & Technik GmbH) Ruebel, S.; Stuemke, M.; et al.

HEAT-INSULATING LAYER MADE OF COMPLEX PEROVSKITE WO 03106372 Schwartz-Lueckge, S.; Vassen, R.; et al.

ELECTROLYTIC ETCHING OF METAL LAYERS WO 03106090 (Faraday Technology Inc.) Taylor, E.J.; Dyar, H.

METHOD FOR PRODUCING FINE METAL POWDER WO 03106083 (Sumitomo Electric Industries) Tani, Y.; Inazawa, S.; et al. Method for producing a fine metal powder, which comprises subject ing a solution containing a te t ravalent t i tanium ion and having a pH of 7 or less to a cathode electrolysis t rea tment to reduce a par t of the tetravalent t i tanium ion to a trivalent ion, so preparing an aqueous reducing agent solution con- raining both trivalent & tetravalent t i tanium ions. Adding a water-soluble compound of the metal ele- ment to the resulting mixture, followed by mixing, to

reduce an ion of the metal and precipitate the metal by the reducing action originating from the oxida- tion of the trivalent t i tanium ion to the tetravalent t i tanium ion. The method can be used for producing a high puri ty fine metal powder which is finer than a conventional fine metal powder, has a narrow par- ticle diameter distribution and is free of an impuri- ty, at a lower cost on a large scale with safety.

METALLIZED PARTS MADE FROM PLASTIC MATERIAL WO 03105548 (Framatome Connectors Int.) Fares-Karam, A. In order to metallize a support made from high tem- perature polymer, the melting temperature of which is higher than 180 C, successive stages of cleaning, plasma etching, grafting and then metallizing in a metallization bath are applied. The metallizing bath is brought to a temperature between 50 C and 70 C, the plasma being a nitrogenous plasma.

METHOD AND DEVICE FOR TREATING FLAT AND FLEXIBLE WORKPIECES WO 03105546 (Atotech Deutschland GmbH) Wex, 0.; Scheller, B. Electroplating and/or etching of delicate substrates such as metal foils, using protecting carriers.

FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME WO 03105545 (Matsushita Electric Ind. Co. Ltd.) Fukuoka, M.; Hiranaka, K.; et al. Electroplated copper thin film with duplex structure of specified crystal structure as determined by X-ray diffraction.

TIN-PLATED STEEL PLATE AND METHOD FOR PRODUCTION THEREOF WO 03104528 (Jafe Steel Corp.) Nakakoji, H.; Tanaka, T.; et al. A t in-plated steel plate which comprises a steel plate having a surface roughness of 1.5~m or less in terms of Ra, a Fe-Sn alloy layer formed on the sur- face of the steel plate, a tin plating layer having a

124 Metal Rnishing

Page 2: Granted in the metal finishing field

coating percentage of more than 99% and a plated amount of 5 to 20 g/m 2 formed on the Fe-Sn alloy layer and a chemical coating film containing P and Si formed on the t in pla t ing layer, where in the chemical coating film has an at tached amount for P of 0.5 to 10 mg/m ~ and that for Si of 3 to 30 mg/m2; and a method for producing the t in-plated steel plate, which comprises immersing a steel plate hav- ing the plating layer provided thereon in a chemical t rea tment fluid containing a phosphorus ion and a silane coupling agent or applying the chemical t rea tment fluid on the steel plate having the plating layer provided thereon, and then heating the result- ing steel plate for drying.

PROCESS FOR METALLIZ ING SUPPORT M E D I A M A D E FROM PLASTIC MATERIAL WO 03104526 (Framatome Connectors Int. Fares-Karam, A. In order to metallize a support made from high tern- perature polymer, the melting temperature of which Js higher than 180 C, it is shown that the stages of cleaning, plasma etching, grafting and then metal- lizing in a metal l izat ion ba th can be applied. According to the invention, the metallization bath is brought to a temperature between 50 C and 70 C, the plasma being a nitrogenous plasma.

M E T H O D OF GAS C A R B U R I Z I N G WO 03104516 (Koyo Thermo Systems Co. Ltd.) Tachisato, S. Method of gas carburizing wherein the carburizing is performed at a t empera tu re that is not higher than a peri tect ic point inducing t ransformat ion from delta-iron and liquid phase to gamma-iron but rLot lower than a eutectic point inducing transfor- mat ion from liquid phase to gamma-iron and cementite. In particular, the method comprises a

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step of determining in advance such critical carbur- izing conditions that the surface layer of steel-made t rea tment object sample in carburizing atmosphere is austenitized without fusing and a step of gas car- burizing the t r ea tmen t object under carburizing conditions set so as not to disagree with the critical carburizing conditions at a carburizing temperature that is not higher than the peritectic point but not lower than the eutectic point. The critical carburiz- ing conditions involve the upper limit value of car- burizing gas partial pressure under which the sam- ple surface layer is austenitized without fusing.

M E T H O D OF GAS C A R B U R I Z I N G WO 03104515 (Koyo Thermo Systems Co. Ltd.) Tachisato, S.

WEAR RESISTANT COATED VEHICLE C O M P O N E N T WO 03104513 (Scania CVAbp) Bergstroem, M.; Andesson, H.; et al. Coated vehicle component made of a substantial ly metallic base material and comprising at least one working face ar ranged to be exer ted to relat ive movement friction wear and comprising a wear res i s tan t coating. The coated vehicle component comprises a top coating comprising about 99% or more molybdenum by weight, the balance being normal impurit ies, on the working face. The top coating is finished or terminated on a surface form- ing an angle with the working face.

M E T H O D FOR SELECTING MATERIAL OF COATING F ILM A N D COATING FILM WO 03104512 (Ebara Corp.) Nakahama, S.; Kawamura, S.; et al. A method for selecting the material of a coating film comprising a ceramic and a metal for use in the

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June2004 125

Page 3: Granted in the metal finishing field

coating of the surface of a substrate using the ther- mal spraying method, character ized in tha t the selection is carried out through independently eval- uating a material factor affecting the resistance to slurry erosion and a mater ia l factor affecting the resistance to cavitation erosion. The method allows the selection of the mater ia l factor affecting the resistance to cavitation erosion. The method allows the selection of the material of the coating film with- out the evaluation test for individual hard coating films, which leads to the significant saving of the time and cost required for the selection of the mate- rial of a coating film.

HARD METALLIC MATERIALS, HARD METALLIC COATINGS, METHODS OF PROCESSING METALLIC MATERIALS AND METHODS OF PRODUCING METALLIC COATINGS WO 03106718 (Bechtel Bwxt Idaho LLC) Branagan, D.J. Method of producing a hard metallic mater ia l by forming a mixture containing at least 55% iron and at least one of B, C, Si and P. The mixture is formed into an alloy and cooled to form a metallic material having a hardness of greater than about 9.2 GPa. The claim a method of forming a wire by combining a metal strip and a powder. The strip and the powder are roiled to form a wire containing at least 55% iron

and from 2-7 additional elements including at least one of C, Si and B,. The invention also includes a method of forming a hardened surface on a substrate by processing a solid mass to form a powder, applying the powder to a surface to form a layer containing metallic glass, and converting the glass to a crys- talline material having a nanocrystalline grain size.

METHOD OF MAKING AUTOMOTIVE TRIM WITH CHROMIUM INCLUSIVE COATING THEREON, AND CORRESPONDING AUTOMOTIVE TRIM PRODUCT WO 03106729 (Guardian Industries) Veerasamy, V.S. Method for making vehicle trim components with a layer(s) including chromium (Cr), in metallic, oxide, nitride, and/or carbide form. In cer tain embodi- ments, a Cr inclusive gas is used in conjunction with a vapor deposition apparatus (e.g., PECVD appara- tus) in order to form a Cr inclusive layer on a sub- strate. Optionally, the substrate may be provided with a conductive layer thereon, and may be elec- trically biased in the deposition chamber. The Cr inclusive layer may be at least partially amorphous.

METALLISATION WO 03106734 (Univ. Dundee) Thomson, J. Photosensi t ive organometallic compounds are used

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126 Metal Rnishing

Page 4: Granted in the metal finishing field

in the product ion of meta l deposits, esp. cmpds such as bis-(pefluoropropyl)- l ,5-cyclooctadiene pla t inum (II) (i.e. (C3F7,)2PtCs,H12), which on expo- sure to W radiat ion and then a reduction process forms a pla t inum metal deposit such as a substan- tially continuous thin sheet-like film or a substan- t ia l ly nar row line which is capable of electrical conduction.

METHOD FOR SCALE REMOVAL WO 03106735 (BASF Corp.) Guidry, F.; Kampen, W.H. Method for removing scale from heat exchangers, evaporators, heaters or other equipment where scale formation causes problems, comprising treat ing the scaled equipment surfaces with a solution of a sodi- um salt of a polycarboxylic acid chelating agent.

COPPER-TIN-OXYGEN BASED ALLOY PLATING WO 03106739 (YKK Newmax Co. Ltd.) Kitagawa, K.; Ogawa, Y.; et al. A Cu-Sn-O based alloy plating comprising 0.3 at % r,o 50 at % of oxygen, 20 at % to 80 at % of copper, and 10 at% to 70 at % of tin. The Cu-Sn-O based alloy plating provides a copper-tin alloy with excel- lent adhesion and in the stabil i ty of unbut toning force, and further provides a Cu-Sn-O based alloy plating containing no regulated material and having a black or blackish color tone.

METIHIOO FOR iVU~UFACTIJRING PLATED FILM. CATIiODE ROLL FOR PLATING. AND METHOD FOR ClR¢IUmr BOARD WO 03106740 (Toray Industries) Harada, H.; Nomura, F. A method for manufacturing a plated film by bringing a film having a conductive surface into electrical con-

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tact with a cathode roll with a liquid film interposed between the film and the cathode and forming a metal plating on the conductive surface of the film, charac- terized in that the relation E0> [(1/Cs)xd]/sigma where E0 is the reduction potential of the metal forming the plating, I is the value of the current flowing through the cathode roll for plating, Cs is the area of the con- ductive surface of the film in electrical contact with the cathode roll with a liquid film interposed therebe- tween, d is the thickness of the gap between the cath- ode roll and the conductive film, and sigma is the con- ductivity of the liquid forming the liquid film present in the gap. A cathode roll having a surface roughness Rmax of I mum or less is also disclosed, as is a cath- ode roll having a Vickers hardness of the surface of 200 or more.

METHOD FOR DETERMINING CONCENTRATIONS OF ADDITIVES IN ACID COPPER ELECTROCHEMICAL DEPOSITION BATHS WO 03106990 (Advanced Tech Materials) Robertson, P.M.; Han, J.; et al. Method for analyzing concentration of brightener

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Page 5: Granted in the metal finishing field

and leveler contained in an aqueous acid metal elec- t roplat ing solution, which minimizes the interfer- ence between the effects of the brightener and the effects of the leveler, by firstly determining the con- centration of the brightener at a first set of meas- u rement conditions, and secondly determining the concentration of the leveler at a second set of meas- u remen t conditions, provided tha t the first set of measurement conditions differ from the second set of measurement conditions on either (1) the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electro- plating solution, or (2) the electroplating duration at which the pla t ing potent ia l of said aqueous acid metal electroplating solution is measured, such that the rotation speed of the first set of measurement conditions is lower than the rotation sped of the sec- ond set of m e a s u r e m e n t conditions, and tha t the electroplating durat ion of the first set of measure- ment conditions is shorter than that of the second set of measurement conditions.

OXIDE FILM FORMING METHOD A N D OXIDE FILM FORMING APPARATUS, WO 03107409 (Sekisui Chemical Co. Ltd.) Kawasaki, S.; Eguchi, Y.; et al.

AN OSTEOINTEGRATIVE INTERFACE FOR IMPLANTABLE PROSTHESES A N D METHOD FOR ITS MANUFACTURE WO 2004000378

Santin, M.; Chiesa, R.; et al. Osteointegrative interface for implantable prosthe- ses and to a method for the t rea tment of the osteoin- tegrative interface (1); the method can modify the surface of the osteoingrative interface, which is made of transition metals such as titanium, tanta lum and their alloys, in order to produce so-called "biomimet- ic" surfaces which have innovative compositional and morphological characteristics, and is based on the use of an anodic spark deposition (ASD) anodizing technique performed firstly in a Ca-GP solution and subsequently in a Ca (OH) 2 solution.

PVD COATED CUTTING TOOL MEMBER WO 2004000494 (Materials Kobe Tool) Takaoka, H.; Nakamura, K. Based on nitride and carbonitride if t i tanium and/or aluminum.

COATING DEVICE WO 2004001088 (Band Zink GmbH) Plaetzer, W. Continuous hot-dip galvanizing of metal strip.

CERAMIC PARTICLE-CONTAINING SELF= MELTING ALLOY THERMAL SPRAYING MATERIAL WO 2004001090 (Ebara Corp.) Nakahama, S.; Nagasaka, H.; et al. Including carbides, oxides, borides, ni tr ides with alloy matrix of nickel, cobalt or iron based alloy.

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June 2004 129