Global Joint Guidance for 300 mm Semiconductor Factories

Japan300mm SemiconductorTechnology Conference

INTERNATIONAL300 mmINITIATIVE

Global Joint Guidancefor

300 mm Semiconductor Factories

I300I and J300

July 1997

Version 1.0

i

TABLE OF CONTENTSTABLE OF CONTENTS............................................................................................................................................... i

PREFACE................................................................................................................................................................... iii

INTRODUCTION....................................................................................................................................................... 1

PURPOSE........................................................................................................................................................................ 1HISTORY........................................................................................................................................................................ 2

DEFINITIONS ............................................................................................................................................................ 3

REQUIREMENTS ON IC MANUFACTURERS .................................................................................................... 4

MIGRATION TO LARGER WAFERS SIZES......................................................................................................................... 4OPTIMIZATION............................................................................................................................................................... 5

GUIDELINES FOR SUPPLIERS ........................................................................................................................... 10

GENERAL GUIDELINES................................................................................................................................................. 10CARRIER GUIDELINES.................................................................................................................................................. 12EQUIPMENT CONFIGURATION GUIDELINES................................................................................................................... 13EQUIPMENT OPERATION GUIDELINES .......................................................................................................................... 15FACILITIES GUIDELINES ............................................................................................................................................... 17OTHER GUIDELINES..................................................................................................................................................... 18

APPENDIX A - STANDARDS CROSS REFERENCE ......................................................................................... 21

OTHER STANDARDS:.................................................................................................................................................... 32

APPENDIX B - CONTACT INFORMATION....................................................................................................... 33

J300............................................................................................................................................................................. 33I300I............................................................................................................................................................................ 33

iii

Preface

July 1997

The opportunity to minimize the cost of 300 mm factories through standardization is being pursued by a number ofglobal organizations. The International 300 mm Initiative (I300I) and the Japan 300 mm Semiconductor TechnologyConference (J300) have cooperated to establish joint guidance on 300 mm factories. This document providesinformation on equipment configuration to the global supplier community and identifies standards requirements tothe standards development process in Semiconductor Equipment and Materials International (SEMI).

The capabilities required to support 300 mm factory systems must be supported by the standards and designed intothe equipment from the beginning. This approach will minimize development costs for suppliers and cost ofequipment and operations for device makers. For the first time in our history, we are coming together to identifystandardization needs and develop standards globally, coordinating in advance of the transition to a major newindustry manufacturing platform.

Frank RobertsonVice President and General Manager

International 300 mm InitiativeAustin, Texas

Standardization activities in a pre-competitive phase are important to minimize costs and earlier development in 300mm technology. The Japan 300 mm Semiconductor Technology Conference (J300), which consists of the fiveparties among device makers, material suppliers, and equipment suppliers in Japan, has been working on 300 mmstandardization. This sort of activity has never been accomplished before.

Since internationalization of the standards is essential, J300 has been working together with the International300 mm Initiative (I300I) since last summer. This Global Joint Guidance contains what J300 and I300I agreed to asguidelines for the 300 mm standards based on device makers’ requirements.

This will be a guide for SEMI to develop international standards. As 300 mm technology evaluation has just startedrecently, technology development and newly obtained data will make progress in SEMI standards too. We hopethose who refer to the guidance will keep collaborating and watching standards progress in the future.

Toshio Nohara(Hitachi, Ltd.)

ChairpersonThe Japan 300 mm Semiconductor Conference

Tokyo, Japan

Page 1

IntroductionThis document was assembled by the International 300 mm Initiative (I300I) and Japan 300 mm SemiconductorTechnology Conference (J300) consortia for the purpose of providing joint consensus guidelines for and tosemiconductor industries and silicon suppliers. This guidance is limited to joint (agreed to) expectations the membersemiconductor device companies of these consortia have on suppliers in the area of manufacturing equipment andsupport systems.

MARKETand

BUSINESS

SUPPLIERS

STANDARDS

IC FABSCONSENSUSGUIDANCE

(RECOMMENDATIONS)

REQUIREMENTS

FULFILLMENT - Products

RESPONSE - Equipment - Materials - Services

USERSPEC

REFERENCEDocuments

IC COMPANY INTERNALREQUIREMENTS

Revenue

Revenue

Figure 1. Joint Guidance Target

Purpose

Page 2

February 20, 1997I300I / J300 Video Conference

Strategy for “Areas of Consensus” ⇒ Joint Guidance

December 3, 1996J300 2nd Lecture andConsensus Statement

April 9, 1996 J300 1st Lecture on IC Factory Design

September 20, 1996I300I FourteenGuidelines on

Carriers and ToolInterfaces

I300I and J300Discussion

“Areas of Consensus”Identified

December 6, 1996Agreement to Develop Joint Guidelines

January 21, 1997I300I Global Supplier

Workshop2nd Lecture “Mark-

ups”

I300I New FactoryGuidelines

J300 2nd LectureDocument

Several GuidelineDevelopment Meetings:April 2nd, 8th and 26th

May 14th, June 12th 1997

Publish Global Joint GuidanceJuly 16, 1997 in USA (SEMICON West)

July 23, 1997 in Japan (Tojyo Hall, Tokyo)

Figure 2. History of I300I and J300 Interactions

History

Page 3

Definitions

The following key words are used in this document with very specific meanings:

Requirements - Business drivers that determine what the device manufacturing companies mustaccomplish in their operations to meet cost and technology goals.

Guidelines - Statements that define device companies’ intended and/or projected configurations andmodes of operations for factories and equipment.

Standards - Voluntary technical agreement between suppliers and customers to ensure compatibilityand inter-operability of goods and services to reduce overall cost.

Note 1: It is the responsibility of the user of this document to be aware of currentversion(s) of referenced SEMI Standards.

Note 2: This document refers to certain preferred standards and options that support therequired capabilities for 300 mm factories. Other standards and options may also exist.

References - Other readily available documents and statements containing additional informationregarding the subject. Does not necessarily imply authority of these documents andstatements.

Recommendations - Preferred approaches for design consideration, but supplier may propose equivalent orbetter design or approach.

Page 4

Requirements on IC ManufacturersThe next two sections describe the shared requirements on J300 and I300I IC manufacturers. Theserequirements are in terms of business drivers for IC manufacturers as defined above. They fall intoseveral categories, but are primarily divided between what is required for IC manufacturers to migrate tolarger wafer sizes and what is required to optimize the factory.

Historically, IC manufacturers have migrated to larger wafer sizes to gain productivity improvements.As they transition to larger silicon wafers, they must meet the following key requirements to receive theneeded gain from the investment and strategic risks involved.

1. Decrease Cost/cm2

For an IC manufacturer to remain continuously competitive, the cost per unit area of manufacturingsemiconductor devices must decrease continuously. It is the expectation of all IC makers that a wafersize increase shall result in a reduction in cost/cm2 of silicon. To achieve this, the equipment and factorycosts should not increase as much as the wafer area increases, and the equipment throughput (or output)in wafers/hour should be equal to or greater than the previous wafer size generation.

See Guideline 20.

2. Learn from Past Conversions

2.1. Early standardization reduces options which suppliers must develop and support.See Figure 3 below and Guidelines 1.1, 1.2, 2.3, 4, 7, 7.1, 9, 13, 17, and 20.

ProcessEquipment

MetrologyEquipment

Intrabay Vehicleinterfaces & standards

ada a;;ldkaaddd’;ad’adkd;da[

Wafer & Carrierstandards

Operator interface& stds to CIM systems

Intrabay Vehiclesafety stds

Utility interfaces &stds

Chemical and Gasinterfaces & stdsExhaust

interfaces & stds

Drainsinterfacestandards

Interbaytransportstandards

Operatorinterface toEquipment

stds

Standards for safety countermeasures:(Gases, Chemicals, and Fire)

Lot IDstandard

Cleanroom floor interface stds

Cleanroom wallsinterface stds

Cleanroom

Maintenance & sparesstds

Facilities &Hook-up stds

Cleanroom standards:• Environment:• Temp, humidity• Equipment height• Max weight, size• Others ..

Stocker

Overhead Transport (OHT)interface standards

Protection from Earthquake & Glitchesi.e., power, exhaust, compressed air, process and cooling water, etc.

Figure 3 How Standards Benefit Manufacturing

Migration to Larger Wafers Sizes

Page 5

2.2. First 300 mm pilot line production equipment set should have full production levelmaturity.This eliminates the need for IC manufacturers to upgrade or replace equipment when going from 300 mmstart-up phase to full volume production.

3. International Participation is Essential

3.1. Participation from the international IC semiconductor industry is essential in giving clear,uniform and global direction to equipment suppliers. This synergy will minimize the number ofdifferent options that equipment makers have to develop and test, reduce development cost andtime, and provide equipment to the IC manufacturers at the right time.

See Guidelines 2.2, 2.4, and 3.

Every IC manufacturer must optimize various resources and costs according to their individual businessdirection or strategy.

The principle of optimization applies at all levels; i.e., equipment, factory, business principles, etc.

Therefore, the process of optimization demands balancing several parameters. This requires someparameters to be increased while others must be decreased, which forms a structure for the followingrequirements.

Therefore, IC manufacturers must do the following (4—23):

4. Increase Investment Effectiveness

4.1. A fab shall be upgradeable to produce the next generation technology with minimumintroduction of new equipment and with minimum impact to layout and material logistics.

4.2. Capital outlay shall be optimized with respect to increasing production capacityrequirements and be commensurate with market growth during the ramp to full volumeproduction.

5. Increase Equipment UtilizationIn general, IC manufacturers will desire to continually increase the equipment utilization and reduceprocessing delay that results from queuing in their factories to increase the return on the equipment andother factory resource investment. The key requirement is to maximize the factory productivity. Thismay require balancing the cost of ownership (COO) of constraint equipment against the equipmentutilization of the non-constraint equipment. Therefore, these non-constraint equipment may not requireadditional buffering beyond the two standard load ports.

See Figure 4 below and Guidelines 13 and 16.

6. Increase Uninterrupted ProductionThe amount of factory output is generally proportional to the amount of uninterrupted production time.This is similar to equipment utilization in that the IC manufacturer will desire to maximize theinvestment placed in the equipment and factory. This can be accomplished when the factory is able torun with the highest production support systems and equipment reliability available.

See Figure 4 below and Guidelines 13, 16, and 19.

Optimization

Page 6

Time

Time

Lot 1 Lot 2 Lot 3 Lot 4

Lot 1 Lot 2 Lot 3 Lot 4

Time delay before2nd lot starts

No time delay

Improvement

WithoutContinuousProcessing

WithContinuousProcessing

Lot 5

Figure 4. Equipment Output Improves When Idle Time is Eliminated

7. Increase Factory OutputIn a volume market, an IC manufacturer will need to produce as much good product as possible. Thefactory output required to meet the market demand is critical for a company to maintain profitability andmarket share. This is accomplished through meeting the following three requirements.

See Guidelines 13 and 16.

7.1. Increase ThroughputIncrease the quantity of wafers that can be processed through the factory in a given time period.

See Guidelines 10 and 13.

7.2. Increase Wafer YieldIncrease the percentage of wafers that successfully complete the processing route.

See Guideline 20.

7.3. Increase Die YieldIncrease the percentage of good die produced on each wafer.

8. Increase Yield LearningThe rate at which the factory acquires knowledge about the process/technology during the processdevelopment and ongoing problem solving must be increased to allow for faster increases in both yieldand throughput.

9. Increase Control of Factory Logistics and Production SchedulingWith the increased demand for IC products and the ever faster changes in the market place, a factory’sspeed and flexibility are key to meeting the market at the right time. For IC factories to accomplish this,they must have increased control over the operations (logistics) and production schedules.

See Guidelines 2.4, 10, and 15.

Page 7

10. Increase Die per WaferIncreased demand for IC products require IC manufacturers to produce greater quantities of product at areduced cost while increasing the complexity of the chip. This increased complexity requires a larger diesizes at least initially. One of the largest leverages to accomplish both of these requirements is toincrease the number of die that can be manufactured on a wafer.

11. Increase Worker Productivity and Product SafetySee Guidelines 1.1, 9, and 10.

11.1. ErgonomicsThe weight of twenty-five 300 mm diameter wafers plus a front opening unified pod (FOUP) carrier isapproximately 8 kg. This is difficult for humans to repeatedly lift and carry. Because of this ergonomiclimitation, 300 mm factories will require essentially automated or mechanized carrier handling.

See Guidelines 11 and 20

11.2. Product SafetyThe value of twenty-five 300 mm diameter processed wafers could exceed $1,000,000 (U.S.). Becauseof this high value, 300 mm factories will require precision controlled and highly reliable automatedcarrier handling.

See Guideline 6.

11.3. Factory AutomationThe technological solution to increasing productivity while addressing the above ergonomic issues is toprovide an increase in factory automation both in wafer and carrier handling.

See Guideline 6.

12. Decrease Time to Volume ProductionTo meet the ever faster market changes and demands, a factory ramp-up time to full volume productionmust be decreased.

13. Decrease Equipment Installation / Start-up Time and Cost.To support faster factory ramps, equipment installation and start-up time must be decreased.

See Guidelines 18, 25, and 26.

14. Decrease Operational CostFor an IC factory to maintain profitability, the ongoing operational cost must continue to decrease as theproducts’ market value continues to decline.

See Guidelines 1.2, 2.1, 5, 8, 9, 10, 13, 16, and 23.

15. Decrease Inventory (work-in-process and final product)A factory must reduce its risks and liabilities associated with WIP inventory in the line and final productwaiting at the backdoor.

Page 8

16. Decrease Factory FootprintThe footprint of a factory directly corresponds to several costs: i.e., building capital costs and associateddepreciation, operational facilities costs in clean air supply, temperature and humidity control, etc. Tocontrol costs, the cleanroom space of a factory should be reduced as much as possible while maintaininga balance between demand for output and costs. This reduction can be realized by increasing thethroughput of each equipment set while maintaining or reducing the footprint, allowing for morethroughput per factory footprint.

See Guideline 11 and 24.

17. Decrease Equipment CostsThe cost of equipment, versus the equipment throughput, both in initial capital cost and operational costs,can directly impact the available profit a product can provide. These equipment costs must be reducedon a per-wafers-processed per hour basis.

See Guidelines 2.1, 2.3, 7.1, 7.2, 7.3, 18, 19, 23, 24, 25, 26, 27, and 28.

18. Decrease Cost to Configure EquipmentFlexibility is a key requirement for factories to maintain cost effectiveness. The cost to configureequipment to a variety of processing situations must be reduced to maintain this flexibility.

See Guidelines 1.2, 2.1, 2.2, 2.3, 3, 7.1, 7.2, 7.3, 11, 13, 18, 27, and 28.

19. Decrease Material ConsumptionTo reduce the cost of IC manufacturing, the level of material (i.e., silicon, chemicals, gases, and liquids)consumed by the processing equipment must be continually reduced per wafers processed per hour.

See Guideline 17 and 20.

20. Decrease Turn Around TimeThe time for a wafer to travel through and complete all process steps in a route depend on the individualprocessing time required at each equipment plus material logistics (e.g., scheduling, staging, handling,etc.) and equipment idle time. To optimize the use of equipment, people, and other resources and toreduce response time to the market and customers, this turnaround time must be continually decreased.

21. Decrease Lead Time from Order to Equipment DeliveryThe time for an equipment to arrive from the time it is ordered must be reduced in order to decrease thetime it takes an IC manufacturer to ramp a factory to full production level. Equipment delivery timeshould also be reduced to less that the time it takes to build a factory.

22. Address Safety and ErgonomicsIC manufacturers must provide a safe fab working environment. This includes providing equipment andprocedures for operators and process and maintenance personnel that are engineered for safety andergonomics.

See Guidelines 1.1, 11, 16, and 22.

Page 9

23. Address Environmental IssuesIC manufacturers must design factories and processes such that they do not impact the environment. Thisincludes not only controlling, but continually reducing the amount of effluent and wastes released intothe environment.

See Guidelines 22.

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Guidelines for SuppliersThe following sections list guidelines from IC manufacturers to semiconductor industrial and materialsuppliers. The first section lists the general expectations that IC manufacturer have of suppliers. Thesubsequent sections identify key areas of IC manufacturers’ joint consensus and provide specificdirections for carrier and equipment configuration and operation. For each guideline, the relevantREQUIREMENTS on the IC manufacturers (listed in the previous section) are noted. These indicate thedriving forces for the guideline. Related SEMI and other standards are listed under the STANDARDSheading. Additional information on the guideline topic (from the prospective of each group) is listed asREFERENCES. These refer principally to the J300 2nd Lecture Document and the I300I FactoryGuidelines.

1. Automation is a must in 300 mm semiconductor factories.

1.1. All process/metrology equipment suppliers must provide automation interfaces (i.e., loadports, Front-opening Interface Mechanical Standard (FIMS), and electronic interfaces) to supportintrabay and interbay automated material handling.

REQUIREMENTS: 2.1. Early standardization, 11. Increase Worker Productivity and Product Safety, 22.Address Safety and Ergonomics

STANDARDS: SEMI S8

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-2-4a, Bullet 2a

I300I Factory Guideline #2.1 of ESH #2

1.2. Cost-effective and simplified automated material handling interfaces (load ports andelectronic interfaces) must be provided for all process/metrology equipment. These interfacesmust be based on agreed to SEMI standards.

REQUIREMENTS: 2.1. Early standardization, 14. Decrease Operational Cost, 18. Decrease Cost toConfigure Equipment

STANDARDS: SEMI E15.1

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-2-4a, Bullet 2a, Figure 5 below

I300I Factory Guideline #4

2. Standardization is very important to controlling costs.

2.1. There must be a minimum number of wafer carrier types accepted by the industry. This canbe accomplished by equipment and silicon supplier participation in the SEMI standards processto create and support a set of globally adopted carrier types.

REQUIREMENTS: 14. Decrease Operational Cost, 17. Decrease Equipment Costs, 18. Decrease Cost toConfigure Equipment

STANDARDS: Not Applicable

REFERENCES: J300 2nd Lecture Document, p. 5, Section 1-2-2b, Paragraph 2, Bullet 2, Figure 5below

General Guidelines

Page 11

E-37(HSMS)

E-5-SECS II Std.E-10 Reliab, Avail, Maint.tracking Std.E-30-GEM Std.IEEE 446 Voltage Drop out immunity

E-6 Facilities Interface SpecE-51 Facilities Service & Termination MatrixProcess and Metrology

Equipment(side view)

ToolEmbeddedController

Floor-runningIntrabayvehicle

AGV/RGV/PGV

E-64Cart Docking Std

E-44 Mini-environment Acceptance Std.E-62 Front Opening Interface Mech Std.E1.9 Open Cassette & E-47.1 Pods Std.E-57 Kinematic coupling Std.E-15.1 Loadports Std.

Equipment Footprint / HeightStd.

(Doc 2708)

Equipment Footprint/Height Std.(Doc 2708)

E63Box Opener/Loaderto Tool I/F Std.

E-15 Loadports

Station orCell Controller(User’s scope)

FactoryNetwork

E-37(HSMS)

Wall (if present)

E-23handshake

(for PGV,RGV, &AGV)

E-23 handshake(for OHT)OHT S2 Safety Guidelines

S8 ErgonomicGuidelines

Figure 5 Applicable Interface and Automation Standards

2.2. Front Opening Unified Pod (FOUP) and Open Cassette (OC) are the most compatible wafercarriers with the SEMI E15.1 standard load port.

REQUIREMENTS: 3. International Participation is Essential, 18. Decrease Cost to ConfigureEquipment

STANDARDS: SEMI E1.9 (Doc 2471), E47 (Doc 2472), E62 (Doc 2502), E15.1, E57 (Doc. 2470)

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-2-4c; Paragraphs 2-3; 300I FactoryGuideline #4

2.3. The goal is for immediate compatibility between carrier options (FOUP and OC) withrespect to load port interfaces and handling systems.

Note: A number of potential solutions exist to achieve this compatibility. I300I and J300 will continue towork together to identify the best approach with the support of SEMI by SEMICON Japan 1997.

2.3.1. Carriers should be designed for handling by robots as listed in the Table 1 below.REQUIREMENTS: 2.1. Early standardization, 17. Decrease Equipment Costs, 18. Decrease Cost to

Configure Equipment

STANDARDS: Action required for SEMI to modify standards E1.9 (Transport Open Cassette) andE62 (FOUP) as required to provide handling options in Table 1 below

Page 12

Handling Requirement FOUP - Grip Location OC - Grip LocationAGV Handling Top or Bottom Bottom onlyHandling Inside Stocker or Buffer Top or Bottom Bottom onlyOHT Handling Top only Not applicablePGV Handling Top or Bottom Bottom only

Table 1: Handling Configurations for 300 mm Carriers

2.4. Computer Integrated Manufacturing (CIM) system standardization must be adopted by theindustry. I300I and J300 have identified this area for continuing discussion. Standardization canbe accomplished through global participation by IC manufacturers and suppliers in the SEMIStandards process.

REQUIREMENTS: 3. International Participation is Essential, 9. Increase Control of Factory Logisticsand Production Scheduling

STANDARDS: Action required for SEMI to develop standards in addition to GEM, HSMS, SEC II,and modification of E23 for OHT

REFERENCES: J300 2nd Lecture Document, pp. 179-186; I300I Factory Guideline #13

3. Front opening unified pod and open cassette are the number one priority for 1997–1998.

Number 1 Priority CarriersFront Opening Unified Pod Open Cassette

Equal PriorityTable 2: Carrier Priority

REQUIREMENTS: 3. International Participation is Essential, 18. Decrease Cost to ConfigureEquipment

STANDARDS: SEMI E1.9 (Doc 2471), E47 (Doc 2472), E62 (Doc 2502), E15.1, E57 (Doc 2470)

REFERENCES: J300 2nd Lecture Document, p. 5, Section 1-2-3; p. 14, Figure 1-16; p. 15; p. 18


4. Carrier capacities should be provided with 13 and 25 wafer slots, 10 mm pitch, and horizontalwafer orientation during transportation and storage. Equipment designs should allow cost-effective configuration for 13 or 25 wafer carriers.

REQUIREMENTS: 2.1. Early standardization

STANDARDS: SEMI E1.9 (Doc 2471), E47.1 (Doc 2472)

REFERENCES: J300 2nd Lecture Document, p. 5, Section 1-2-4c, Paragraph 2

I300I Factory Guideline #1 and #2

Carrier Guidelines

Page 13

5. If a process/metrology equipment requires “internal wafer carrier(s)” to perform waferprocessing, then the equipment supplier is responsible for providing the specific internal carrier.In addition, the equipment supplier should provide the necessary wafer transfer mechanismbetween this internal carrier and the standard transport carrier.

REQUIREMENTS: 14. Decrease Operational Cost


REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-2-4c, Paragraph 1, bullet 2

6. A shipping box must prevent (or control) wafer damage or movement when shipped. Ashipping box must also provide the appropriate automation and handling compatibility and levelof contamination control. It is desirable that shipping boxes be designed for reuse and/orrecycling.

REQUIREMENTS: 11.2. Product Safety, 11.3. Factory Automation

STANDARDS: Note that M29 standard for manual shipping box exists. Action required for SEMIto develop a standard for shipping boxes compatible with automated handling

REFERENCES: J300 2nd Lecture Document, p. 128; pp. 148-149, Fig 6-28 – Figure 6-30

7. Process/metrology equipment shall have standardized load port(s) configured for the ICmanufacturer’s choice of carriers (FOUP or OC) with easement space for selected materialhandling systems. See Figure 6 below for examples.

REQUIREMENTS: 2.1. Early standardization

STANDARDS: SEMI E15.1, E1.9 (Doc 2471), E47.1 (Doc 2472), Action required for SEMI tomodify E15.1 and other related standards to provide for configurations shown inFigure 6 below

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-2-4c, Paragraph 3; p 9; p 15, Figure 1-18

I300I Factory Guideline #2, #4, and #5

carrierAGVor PGV

OHT

carrierAGVor PGV

Figure 6 Load port and Material Handling Compatibility(Concept provided from the SEMI E15.1 standard)

Equipment Configuration Guidelines

Page 14

7.1. Load port(s) shall be mounted only on one side of the process/metrology equipment. SeeFigure 7 below.

REQUIREMENTS: 2.1. Early standardization, 17. Decrease Equipment Costs, 18. Decrease Cost toConfigure Equipment

STANDARDS: SEMI E15.1

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-2-4c, Paragraph 2-3; pp. 15-21


7.2. The front side of the transport carrier shall be oriented towards the process/metrologyequipment during the carrier placement and removal by the material handling system. See Figure7 below.

REQUIREMENTS: 17. Decrease Equipment Costs, 18. Decrease Cost to Configure Equipment

STANDARDS: SEMI E15.1, E62 (Doc 2502)


Carrier

Carrier Front Side

Equipment

Load port

Figure 7 Carrier and Load Port Orientation

7.3. Process/metrology equipment shall be configured to use SEMI standard kinematic couplingfor precise positioning of carrier on the load port.


STANDARDS: SEMI E15.1, E57 (Doc 2470)



8. Load ports must be equipped with standard interface(s) for Person Guided Vehicle (PGV)docking and loading/unloading of first priority carriers (OC and FOUP).

REQUIREMENTS: 14. Decrease Operational Cost

STANDARDS: SEMI E64 (Doc 2622), E1.9 (Doc 2471), E47 (Doc 2472), E15.1, E57 (Doc 2470)

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-3, Item 1


Page 15

9. Automated Guided Vehicle (AGV) and PGV transportation systems must be compatible withboth FOUP and Open Cassette carriers.

REQUIREMENTS: 2.1. Early standardization, 11. Increase Worker Productivity and Product Safety, 14.Decrease Operational Cost

STANDARDS: SEMI Doc 2622, E1.9 (Doc 2471), E47 (Doc 2472), E15.1, E57 (Doc 2470)

REFERENCES: J300 2nd Lecture Document, p. 6, Section 1-3, Item 1; p. 9, Figure 1-6; p. 10,Figure 1-7


10. Overhead transport (OHT) systems must be compatible with FOUP carriers.REQUIREMENTS: 7.1. Increase Throughput, 9. Increase Control of Factory Logistics and Production

Scheduling, 11. Increase Worker Productivity and Product Safety, 14. DecreaseOperational Cost

STANDARDS: SEMI E47.1 (Doc 2472), E15.1, E57 (Doc 2470)

REFERENCES: J300 2nd Lecture Document, p. 10, Figure 1-8


11. When supplying equipment with load port(s) to be used with FOUP carriers, the zone forpod door opener/closer should be included inside of the equipment.

REQUIREMENTS: 16. Decrease Factory Footprint, 18. Decrease Cost to Configure Equipment

STANDARDS: SEMI E63 (BOLTS), E15.1, E62 (Doc. 2502)

REFERENCES: J300 2nd Lecture Document, p 16, Figures 1-19 and 1-20, p 15, Figure 1-17

12. In addition to the user interface(s) (i.e., operator controls and displays) on the front side (i.e.,bay or clean aisle side) of the equipment, another user interface connection should be provided toeliminate the need for front operator access during automated material handling. For safetyreasons, only one user interface should be active any given time through the use of a physical orlogical switch.

REQUIREMENTS: 11.1 Ergonomics, 22. Address Safety and Ergonomics

STANDARDS: Action required for SEMI to develop document 2708 and other standards

REFERENCES: J300 2nd Lecture Document, pp. 179-180


13. Automation solutions for material handling and equipment interface, based on SEMIstandards, must be inter-operable and inter-changeable. Load ports, carriers, carrier interfaces,and transport systems provided by any mix of suppliers must be inter-operable. All carriers ofthe same type must be inter-changeable.

REQUIREMENTS: 2.1. Early standardization, 14. Decrease Operational Cost, 18. Decrease Cost toConfigure Equipment

STANDARDS: All 300 mm standards. Further standardization is encouraged (e.g., E63 BOLTSstandard) to allow additional areas of inter-changeability

REFERENCES: J300 2nd Lecture Document, p 129; pp. 156-158, Figures 6-46 and 6-47

See Figure 8 below

Equipment Operation Guidelines

Page 16

SEMI stdOC & FOUPsuppliers

E15.1Loadportsuppliers

A

B

C

N

A’

B’

C’

N’

25 waferwith Door Openerand Closer

Tested andProven for

InteroperabilityInteroperability

testing andstandardsvalidation

Figure 8 - Open Cassette, FOUP, and Load Port Suppliers Shall Demonstrate Inter-Operability

14. Equipment should be designed to enable non-stop or continuous processing in most cases.For certain equipment (e.g., off-line metrology equipment), cost-effective operation may notrequire continuous processing.

REQUIREMENTS: 5. Increase Equipment Utilization, 6. Increase Uninterrupted Production, 7. IncreaseFactory Output, 7.1. Increase Throughput

STANDARDS: Action required for SEMI to develop appropriate standards


I300I Factory Guideline #6, Appendix D “White Paper on Equipment Buffering”

See Figure 4 of Requirements section

15. Generally, equipment should have the capability of loading wafers to and from the same slotin the same carrier to maintain wafer slot-to-slot integrity. (Uni-cassette is the terminology usedfor this capability in 200 mm equipment.)

REQUIREMENTS: 9. Increase Control of Factory Logistics and Production Scheduling




Page 17

16. Equipment should require no regularly scheduled maintenance on the carrier delivery side(commonly referred to as the front side) of the equipment.

REQUIREMENTS: 5. Increase Equipment Utilization, 6. Increase Uninterrupted Production, 7. IncreaseFactory Output, 14. Decrease Operational Cost, 22. Address Safety and Ergonomics

RECOMMENDATION: First priority maintenance access should be rear of equipment. Secondarypriority should be Left or Right side of equipment. Last priority should be frontof equipment




REQUIREMENTS: 2.1. Early standardization, 19. Decrease Material Consumption

STANDARDS: Action required for SEMI to develop standards for specifying the material supplycontainers based on input from the J300 Facilities/Utilities Working Group and theI300I Facilities Study Group

REFERENCES: J300 2nd Lecture Document, p 164, Bullet 2; pp. 172-174

18. In principle, equipment utilities hook-up connections and quality must be compatible withthe standards below. Equipment suppliers are responsible for supplying equipment with requiredelectrical connection brackets, cable fixing brackets and access areas, valves, dampers, gauges,meters, filters and other controlling components (e.g., pressure valves, temp controllers).

REQUIREMENTS: 13. Decrease Equipment Installation / Start-up Time and Cost., 17. DecreaseEquipment Costs, 18. Decrease Cost to Configure Equipment

STANDARDS: SEMI E49.1 through E49.9 and E51, Action required for SEMI to develop E51using reference below for input

REFERENCES: J300 2nd Lecture Document, p.163, pp. 166-169

19. Equipment should be supplied with countermeasures for power glitch voltage drop-outimmunity to provide conformance to standards below.

REQUIREMENTS: 6. Increase Uninterrupted Production, 17. Decrease Equipment Costs

STANDARDS: SEMI E51, CBEMA curve, IEEE 446 and 1250

Note: J300 has its own proposal shown in the references below. I300I and J300will continue to discuss toward reaching consensus and drive for E51 review bySEMI with J300’s input

REFERENCES: J300 2nd Lecture Document, pp. 164, 170 - 171

Facilities Guidelines

17. Equipment should be compatible with material supply containers to be standardized throughthe global SEMI process. These containers are to include standard cylinder types and sizes.

Page 18

20. Equipment should be provided with operator (human) interface screens of PC grade orbetter.

REQUIREMENTS: 11.1. Ergonomics

STANDARDS: SEMI Human Computer Interface (HCI) Style Guide, SCCUI Style Guide.

REFERENCES: J300 2nd Lecture Document, p 180 Sections 2-1 and 2-2; pp. 182-184, Table 1,Figures 1 through 2b, Table 2

I300I Original 14 point Guideline #11

21. Silicon wafers compliant with global standards (see standards below) should be supplied.REQUIREMENTS: 1. Decrease Cost/cm2, 2.1. Early standardization, 7.2. Increase Wafer Yield, 19.

Decrease Material Consumption

STANDARDS: SEMI M1, M28; JEIDA 27, Action required for SEMI and JEIDA to developstandards for wafer edge profile, ID marking and chip coordinates for the corner ofthe chip and not the center of the channel. J300 is planning to investigate IDmarking activity in the future


22. Equipment must be supplied with equipment anchor points sufficient to allow thisequipment to be secured for stability (restricted movement) during local seismic activity (i.e.,earthquake), in accordance with SEMI S2. Use references below for examples of possible anchorapplications for different equipment types.

REQUIREMENTS: 22. Address Safety and Ergonomics, 23. Address Environmental Issues

STANDARDS: SEMI S2, Section 17

REFERENCES: J300 2nd Lecture Document, pp. 195-239, Figures 9-1 through 9-41

23. Process/metrology equipment should be compatible with a cleanroom temperature range of21C to 24C (Note: 23 ± 1C for J300) and a cleanroom humidity range of 35 to 55 % relativehumidity.

REQUIREMENTS: 14. Decrease Operational Cost, 17. Decrease Equipment Costs


REFERENCES: J300 2nd Lecture Document, p 34

24. Process/metrology and sub-fab equipment should conform to standard height and weightlimits. “Cost foot print,” equal to the area defined by A = ¼(Wt + Ws)×(Lt + Ls) in the Figure 9below, will be used in cost modeling.

REQUIREMENTS: 16. Decrease Factory Footprint, 17. Decrease Equipment Costs

STANDARDS: SEMI Draft Doc. 2708 (Equipment Footprint, Height, and Weight). Action requiredfor SEMI to continue development of Doc. 2708 into approved standard


Other Guidelines

Page 19

rear userinterface

utilities supply

access doorswing-out

load ports andcarrier buffers(micro-stockers)

front userinterface

load face planeof the tool

Wt

Ws

Lt Ls

easement space(required spacearound the tool)

shadow footprint(includes all

parts of the tool)

Figure 9 Equipment Cost Footprint Dimensions(Drawing provided from the SEMI Standard Document 2708.)

25. Process/metrology equipment should be compatible with standard gas supplying systemswith respect to dimensions and mechanical/electrical connections. Also, related symbols used inlayout drawings should conform to standards below.

REQUIREMENTS: 13. Decrease Equipment Installation / Start-up Time and Cost., 17. DecreaseEquipment Costs

Note: See guideline #26 below

STANDARDS: SEMI Doc. 2659

Note: ANSI / ASME Y32.2.3 applicable in USA

REFERENCES: J300 2nd Lecture Document, pp. 38-43 tables

Page 20

26. Process/metrology equipment should include (if applicable) and/or be compatible withstandard chemical system components. Also, related symbols used in layout drawings shouldconform to standards below. This is an area of future/continuous discussions between I300I andJ300. See references below for examples.

REQUIREMENTS: 13. Decrease Equipment Installation / Start-up Time and Cost., 17. DecreaseEquipment Costs

STANDARDS: Action required for SEMI to develop standards for dimension of PFA tubes anddiaphragm valves

Note: ANSI / ASME Y32.2.3 applicable in USA

REFERENCES: J300 2nd Lecture Document, p 44-47 including tables

27. Pump control and status signals for dry pumps (including dry pumps supplied withequipment) should conform to standards below.


STANDARDS: Action required for SEMI to develop a standard set of pump control signalsrequired. Use J300 2nd lecture document referenced below for input

REFERENCES: J300 2nd Lecture Document, pp. 48-50 tables

28. Pump control and status signals, safety countermeasures, mechanical connections, andpower supplies for turbomolecular pumps (including turbomolecular pumps supplied withequipment) should conform to standards below.


STANDARDS: Action required for SEMI to develop a standard set of pump control signalsrequired. Use J300 2nd lecture document referenced below for input


Page 21

Appendix A - Standards Cross ReferenceAnalysis of 2nd J300 Lecture, December 3, 1996

Comparison with SEMI Standards Activities

Standards Activity Summary: Overall Comparison*

Topic Item J300 2nd Lecture Doc SEMI Standard

Silicon Wafers Developmental M28 (Rev 2698, appvd TC)

Prime JEIDA 27† M1.15‡ (Rev 2627A, appvd TC)

Test M8.12

Cassette Transport √ E1.9 (Rev 2710, on ballot)

Shipping √ M29 (2566); Task Force developingautomated version

Pod/Box E47.1 (Rev 2711, on ballot)

Tool Interface Kinematic Coupling √ E57 (Rev 2743, on ballot)

Load Port √ E15.1 (Rev 2715, on ballot)

Front Opening Box E62‡ (Rev 2712, on ballot)

Bottom Opening Pod E19.5 (2469)

Cart Docking E64‡ (Rev 2713, on ballot)

BOLTS Plane E63‡ (Rev 2716, on ballot)

Cluster Tool E21.1 (2584)

End Effector E22.1 (2605)

Equipment Weight, Height, Footprint √ Doc 2708 (on ballot)

Clean Room Temperature √Humidity √

Cleanliness √Utility Supply, Exhaust, Hookup √ E6,7,31,49,51 F5,13,14

CIM Human Interface √ Task Force Established

High Speed Communication(SECS II, GEM, HSMS)

√ E5, E30, E37

CTMC Cluster Communications E38

Recipe Management E42

Cassette Transfer Parallel I/O E23

Wafer Chip Coordinate Systems √ M20, M21

E S H Safety √ S2

Ergonomics S8

Minienvironments E44, E45, E46

Equipment RAM Metrics E10; E58 (ARAMS)

* Note that parallel activity does not necessarily mean equivalent specifications.† Approved standard.‡ Designation tentatively assigned pending completion of procedural review by NA Regional Standards Committee.

Page 22

Standards Activity Summary: J300 Factory Model WG

J300 RequirementsSEMI Std Value SEMI T F Comments

Page Fig/T Topic Value Notes

8 1-4 Eqpt footprintEqpt aisle widthMaintenance areaCleanliness

t b d2.5 m0.9 m0.1-1

100-10001000-10000

Processing zoneBall room (FOUP)Other areas (Open cassette)

2708 On ballot Equipment Footprint &Height TF

14 1-15,16 Carrier architecture OC, FOUPFORCPBORCP

First prioritySecond priorityThird priority E19.5

300 mm Waf CarrierTF

15 Load port, OC/FOUP 1. Common loader2. Optimize for OC; add interface for FOUP3. Two types (only OC illustra- ted); incl vacuum load port

18 1-24 Standard cassette/pod

Load ports

Wafer lot architecture

13 or 25 wafers10 mm pitch

horizontal positionkinematic coupling

front facing orientation/horizontal position

FOUPOC flush mount

OC vacuum load lockProduction or test onlyNo filler or conditioning

E1.9, 59*

E1.9, 59*

E1.9, 59*

E57

E1.9, 59*

E1.9, 59*

E62*

nonenone

E1.9, 59*

E1.9, 59*

samesamesamesamesamesame

21 1-29 Equipment load port E15.1 OC/FOUP E15.1 same Optimization requirements being discussed

1-30 Equipment load port OC Flush mount none

22 1-31 Equipment load port OC Vac load lock none

23 1-34 Equipment spec Non stop operationUni cassette operationNo sched maintenance

≥2 load portsSame slot or same cassetteFrom load port side of eqpt

I300I requirements

25 1-34 Docking cart spec PGV to load port E64*

* Designation tentatively assigned pending completion of procedural review by NA Regional Standards Committee.

Page 23

Standards Activity Summary: J300 Equipment 1 WG*



Plasma CVD

Sputter

Ion Implantation

Dry Etcher

Stepper

* NOTE: This WG has identified the listed process equipments as ones for which various numbers of items can and should be standardized. However, not enough informationis provided in the WG report to make any comparison with SEMI or other available standards that may cover the same topics.

Page 24

Standards Activity Summary: J300 Equipment 2 WG


Page Topic Value Notes

34 Clean Room: TR.H.Eqp htInst wgt

Ship wtShip size

Below floor: HtFoot print

23±1°C35-55%

≤3,500 mm≤1,500 kg/m2 &

≤1,000 kg/grating≤6,000 kg

≤2.2x2.8x2.8 m≤2,000 mm

≤ foot print at floor

Not requiredIncl maintenance space

(600 mm x 600 mm grating)

Under discussionException: ≤2,500 mm(incl maintenance space)

. . . . . . . .2708

. . . . . . . .On ballot

. . . . . . . . . . . . . . .Equipment Footprintand Height T F

36

37

Interface; Open CassetteHD

Cassette Orientation Pitch Wafer Stage Tilt

900±10 mm≤250 mm

Waf trav⊥face plane420-500 mm

0° (horizontal)

SEMI E15.1SEMI E15.1

“SEMI E15.1”

E15.1 samesamesame

in rangesame

E15.1 requires full adjustability over range

E15.1 recommends 475 mm

38 ¼" Metal Diaphragm Valve for Cv=0.1 and 0.3 2659 similar But not identical

39 Gas Filters see table on p 39 similar But not identical

40 Analog MFC table, fig pp 40,41 similar But not identical

42 Terminology Cylinder cabinetRegulator box

MFC boxGas control box

These terms are not defined indoc 2659

43 Symbols see table on p 43 {NEED TO COMPARE} Compare ANSI/ASME Y32.2.3-1949(1994)

45 Dimensions of PFA Tubes 25/22, 19/16, 13/10, 10/7,6/4, & 3/2

13/10 and 10/7 not now onmarket in Japan

46 Diaphragm Valves For above PFA tube sizes

47 Chemical System Symbols see table on p 47 {NEED TO COMPARE} Compare ANSI/ASME Y32.2.3-1949(1994)

48 Dry Pumps (DRP) see tables pp 49,50

51 Turbomolecular Pumps see tables pp 52,53 For 300-2000 L/s pumps

54 Elec-EMO Function see tables pp 54-56 S2 Revision T F* Also doc 2322 (Japan)

57 Elec-Leakage Prevention see tables pp 57,58 S2 Revision T F* Also doc 2387 (Japan)

59 Mech-Industrial Robots see tables pp 59-65 S2 Revision T F* Compare ANSI R15.02-92

* NOTE: For items being reviewed by S2 Revision T F (an international T F), J300 comments are being considered.

Page 25

Standards Activity Summary: J300 Equipment 2 WG, continued



66 Signal Tower & Buzzer see tables pp 66-68 PIC Committee considering forming T F

69 Safety Labels see tables pp 69-72 S1(2656) S2 Revision T F* Contents differ, doc 2656 beingreworked to include int’l visualhazard alert information

74 Chemicals see table S2,§6 S2 Revision T F* Compare OSHA requirements

75 Ionizing Radiation see table S2,§7 S2 Revision T F* Compare OSHA requirements

76 Non-Ionizing Radiation see table S2,§8 S2 Revision T F* Compare OSHA requirements

77 Audio Noise see table S2,§9 S2 Revision T F* Compare OSHA requirements

78 Ventilation and Exhaust see tables pp 78,79 S2,§10 S2 Revision T F* Compare OSHA requirements

80 Electrical see tables pp 80-83 S2,§11 S2 Revision T F*

84 Heated Chemical Baths see table No comment to S2,§13

85 Fire Protection see table S2,§19 S2 Revision T F*

86 Lockout/Tagout see tables pp 86-90 S2 Revision T F* Compare OSHA requirements

91 Over Current Protection see tables pp 91,92 S2 Revision T F*

93 Drafting Safety Manuals see tables pp 93-98 2417B SEMI Japan

99 Gas Jungle System tables pp 99-111 Compare High Pressure GasControl Law (Japan)

Elements in F1, F4, F6, F13, F14, S4, & S5; comparealso Toxic Gas Ordinance and NFPA

112 Liquid Chemical System tables pp 112-117 2652 Liquid Chemical Dis-tribution System S C

Doc 2652 under development

118 Safety Interlock New J300 proposal S2, §5 S2 revision T F* Different requirements

* NOTE: For items being reviewed by S2 Revision T F (an international T F), J300 comments are being considered.

Page 26

Standards Activity Summary: J300 Wafer WG

J300 Requirements SEMIStd

Value* SEMI T F Comments


126 T 4 Diameter 300±0.2 mm M28,M1.15

same

Surface Orientation (100)±1° same Notation is different but meaning is the same

Orientation Fiducial Notch same

Notch Axis <110>±1° same

Notch Depth 1.00 +0.25, -0.00 mm Distance OA same

Notch Angle 90 +5, -1° same

Wafer Thickness 775±25 µm same

Thickness Variation 10 µm Nine point same But some application specific wafers in SEMI M28(2698) and prime wafers in SEMI M1.15 (2627A) requirefull scan TTV (GBIR)

Warp ≤100 µm same

Back Surface Finish Gloss (60°) ≥0.8 Normalized by mirrorpolished silicon surface

brightetched/polished

Some application specific wafers in SEMI M28 (2698)and prime wafers in SEMI M1.15 (2627A) has the sameback surface finish requirement as JEIDA 27

Edge Shape Rounded template Edge ProfileTF

T.F. considering even blunter profile shape to avoidproblems associated with CMP processing; roundedprofile may be less blunt than required by SEMI template

Edge Finish Polished same

Edge Exclusion 3 mm same But SEMI uses FQA, with nominal edge exclusion

Laser Mark Soft (≤3 µm deep) Front surface, x=5.0 mm,y=2.0 mm from intersectionof fiducial axis andcircumference; content, style,and size undefined

optional WaferDimensionsSC

No guidance in SEMI M28 but SEMI M1.15 (2627A) hasoptional back surface data matrix 2-D symbol; hard mark

*NOTE: The basic SEMI M28 and J300 (JEIDA 27) wafer dimensional specifications are the same except for the following items: back surface finish, edge profileshape, and laser mark. The SEMI M1.15 wafer dimensional specifications differ from those in JEIDA 27 only in the following ways: measurement pattern forthickness variation, edge profile shape, and laser mark. Of these differences, only the edge profile shape and laser mark are considered significant.Negotiations and experiments are underway to attempt to resolve these differences. Note that the designation M1.15 is assigned tentatively pendingprocedural review by the NA Regional Standards Committee. Standardization of other polished and epitaxial wafer parameters is being considered by SEMISilicon Wafer Committee. Non-prime wafer specifications being considered by SEMI Japan Silicon Wafer Committee in cooperation with JSNM and JEIDA.

Page 27

Standards Activity Summary: J300 Cassette WG


Value SEMI T F Comments


127 N A Transfer CassetteWafers/CassetteWafer PitchOrientation

13 & 2510 mm

Horizontal

E1.9samesamesame

300 mm WaferCarrier T F

134 6-6 Cassette Bottom Domain multiple same Figure 4 of SEMI E1.9

135 6-7 Cassette Side Domain multiple same Figure 1 of SEMI E1.9

135 6-8 Cassette Top Domain multiple same Figure 2 of SEMI E1.9

136 6-9 Cassette Registration Two kinematiccoupling sets

E57 sameconcept

Figure 2 of SEMI E57 for concept; Figure 3gives dimensions

137 6-11 Cassette Sensing Pads See Fig 6-11 E1.9 sameconcept

Figure 5 of SEMI E1.9 gives dimensions; notgiven by J300

138 6-12 K C/Sensing Pad Example See Fig 6-12 E57 sameconcept

Fig 1 of SEMI E57 gives more detailed pindim; no desc of mating features or sensingpads

138 6-13 Cassette Optical SensingHole

See Fig 6-13 E1.9 sameconcept

No detailed information in SEMI E1.9; see Fig13

139 6-14 Cassette Wafer Plane r1, r2, r3, seat vol samedimensions

No similar figure in SEMI E1.9

140 no # Cassette Wafer Placement See figure samedimensions

Text in SEMI E1.9; see 6.7.1

140 6-15 Cassette Wafer SensingPaths

See figure optional inSEMI E1.9

Similar design; less detail in SEMI E1.9

141 6-16 Cassette Fork-LiftSlots/Rails

no dimensions sameconcept

141 6-17 Cassette Side Grip Pits Optional sameconcept

142 6-18,19 Cassette Top Flange Optional,see Fig 6-19

sameconcept

Dimensions differ slightly from SEMI E1.9

143 6-20 Cassette ID Right, Top (Opt) Revision to E1.9 Doc 2710, line items 7-9

143 6-21 End Effector Compatibility See figure E22.1 recentrevision

Page 28

Standards Activity Summary: J300 Cassette WG, continued




145 6-25 Wafer Stopper See figure Has more detail than E1.9(as revised)

E1.9 sameenvelope

300 mm WaferCarrier T F

SEMI E1.9 revised to conform in doc 2662,line item 4

146 6-27 Slanting Fork Lift Slot See figure Not required for FOUP

149 6-29,30 Wafer Shipping Box See figures M29 International T F activity begun to developwafer shipping box with auto loading; TF a partof Silicon Wafer Committee in SEMI Japan

154ff 6-40-42 Monitor Wafer CleaningCassette

See figures Appears to be a machinedrawing for a proposedcassette design

none

156,7 6-44,45 Side Door UnifiedCassette

See figures Seem to be examples ofpilot designs

E62* multiple 300 mm WaferCarrier T F

Approved by technical committee at WinterMeetings March 1997

*Designation tentatively assigned pending completion of procedural review by NA Regional Standards Committee.

Page 29

Standards Activity Summary: J300 Facility/Utility WG



166 Utility Supply (p) See Table Equipment 2 WG agreement

167 Hook-up Connection (p) See T, Fig p 168 Equipment 2 WG agreement

169 Standard parts to be fitted See Table Equipment 2 WG agreement

170 Power glitch & failure Glitch: 0.2 s Defs & Countermeasures 2621 SEMI Japan Draft document not yet

172 Cylinder TypesFilling volume/pressure

See ListSee Tables

Proposal of tech div of Specialty GasMfgrs Assoc

173 Cylinder SizeDimensions of Fittings

See Table; W22/14 screws(flammable gas: ccw; other

gas: cw) w/someexceptions

174 Container Size (p)Chemical Concentration (p)

No standardizationH2SO4: 96.0±1.0%HNO3: 70.5±0.5%HCl: 36.0±1.0%HF: 50.0±0.2%

H3PO4: 86.0±1.0%H2O2: 31.0±1.0%

NH4OH: 29.0±1.0%

175 Cleanroom Cleanness # of particles ≥0.1 µm in0.283 m3 (1 ft3) air

Specifies class 1, 10, 100, 1000; Evalproc based on JIS B 9920, 9921

May differ from Fed Std 209E,ISO draft (which differ fromeach other)

176 Microvibration (p) Measurement Method Further discusssion with Equip 2 WG

177 Cylinder Cabinets (p) See Table To conform to Control High PressureGases Act

Page 30

Standards Activity Summary: J300 CIM-1 WG



Human Interface Task force initiated March 1997 to reviewproposals

182 T 1 Function Layers First Layer only; others notstandardized

183 1,2 Panel Layouts No overlap Examples of applicationsshown

184 T 2 Visual Components Recommended icons

180 Color, Sound Not stated Based on Sematech StyleGuide

High Speed Communications

186 T 3 Reduced Message Set 41 Messages + SECS-2 & SECS-1/HSMS

Based on GEM (SEMIE30)

E30, E5, E4/E37 Activity underconsideration

Standards Activity Summary: J300 CIM-2 WG

J300 RequirementsSEMIStd



Yield Management System

191 8-3 Wafer Coordinates Use SEMI M20 M20 same complete J300 adopting existing SEMIStd

192 8-4 Chip Address Prop 1: SEMI M21Prop 2: 1st Quad

Requires m, n to be odd;Alternate convention (¶7.2)

M21 J300 more restrictive thanSEMI M21; SEMI NA TFinvestigating differences

193 8-5 Chip Coordinates Proposals 1, 2 Not at all clear why chip corner iseasier to find in Proposal 2

194 Image Data Handling (p) JPEG or TIFF JPEG-Joint Photographic ExpertGroup IS10918-1

Page 31

Standards Activity Summary: J300 Earthquake WG




198 9-1 Fastening jig See figure GENERAL NOTE: Earthquake on

199 9-2 Jig for grating (ex) See figure countermeasure requirements are

200 9-3 Gas supply piping (ex) See figure covered in §17 of SEMI S2. This

201 9-4 Exhaust piping (ex) See figure section concentrates on the

202 9-5 Duct system (ex) See figure availability or furnishing of data

203 9-6 Waste fluid piping (ex) See figure equipment center of gravity,

204 9-7 Gas monitoring system See figure height, and weight so that a

205 9-8 Chemical supply method See figure correct engineering or risk

206 9-9 Fixing of floor grating See figure analysis can be carried out for

207 9-10 Fixing steel partition (floor) See figure each case by the customer or

208 9-11 Fixing steel partition (ceil) See figure installer, as appropriate. This

209 9-12 Ceiling (AC, FFU) See figure approach assures that each

210 9-13 Stepper See figure installation can withstand

211212

9-14 Ion Implanter (#1)Ion Implanter (#2)

See figure expected local conditions. J300approach provides standardized

213 9-15 Vertical furnace See figure fittings which may or may not be

214 9-16 Sputtering System See figure suitable for any particular

215 9-17 Dry Etching System See figure installation. Discussions are

216 9-18 Coater/Developer See figure underway to try to resolve these

217 9-19 Wet Etcher/Wet Station See figure differences in approach.

218 9-20 Backgrinder See figure

219 9-21 Chem-mechanical Polisher See figure

220 9-22 Chemical Supply System See figure

221 9-23 Gas Supply System See figure

222 9-24 Recycling Tank See figure

223 9-25 Mid-Pump See figure

224 9-26 Cartridge Polisher See figure

225 9-27 Free Access Floor See figure

Page 32

Standards Activity Summary: J300 Earthquake WG, continued




226 9-28 Al Die Cast Grating (#1) See figure

227 9-29 Al Die Cast Grating (#2) See figure

228 9-30 Scrubber See figure

229 9-31 Chiller See figure

230 9-32 Vacuum Pump See figure

231 9-33 Racks See figure

232 9-34 Chemical Stocker See figure

233 9-35 Fire Extinguisher See figure

234 9-36 Stocker See figure

235 9-37 Gas Piping Protection See figure

236 9-38 Pipe Penetration of Wall See figure

237 9-39 Adding Flexibility to Piping See figure

238 9-40 Chem Overflow Protection See figure

239 9-41 Anti-Vibration (Chem Eqpt) See figure

Note: The current status of referenced SEMI standards should be acquired from SEMI.

CBEMA Computer Business Equipment Manufacturer’s Association. Renamed as ITI (Information Technology Industry Council). Reference IEEE 446 Standard

IEEE Standards: 446 - Recommended Practice for Emergency and Standby Power Systems for Industrial and Commercial Applications IEEE Orange Book.1250 - Guide for Service to Equipment Sensitive to Momentary Voltage Disturbances

Other Standards:

Page 33

Appendix B - Contact InformationFor more information about this document or referenced material, please contact the following:

J300J300 (Secretary - EIAJ)

Address: Electronic Industries Association of Japan (EIAJ)3-2-2 Marunouchi, Chiyoda-kuTokyo 100 Japan

Phone: 81-3-3213-1065Fax: 81-3-3211-0993

Name Company Phone Fax Tetsuya Takagaki EIAJ 81-3-3213-1065 81-3-3211-0993

Masahiro Iiri Toshiba 81-44-549-2739 81-44-549-2748

Toshihiko Osada Fujitsu 81-44-754-2469 81-44-754-2575

Fumikazu Itoh Hitachi 81-423-20-7300 81-423-27-8367

Makoto Hirayama Mitsubishi 81-727-84-7327 81-727-80-2675

Atsuyoshi Koike Hitachi 81-423-22-0934 81-423-27-8379

Seiichiro Takabayashi NEC 81-427-71-0947 81-427-71-0896

Address: International 300 mm Initiative2706 Montopolis DriveAustin, Texas 78741

Phone: (512) 356-3232Fax: (512) 356-3305

Name Company I300I Position Phone Ashwin Ghatalia IBM Support Technology Director (512) 356-7165

Randy Goodall I300I Support Technology Associate Director (512) 356-7622

Paul Jai TSMC Factory Integration Program Manager (512) 356-3665

Eddy Bass Intel Factory Integration Project Leader (512) 356-3828

Kishore Potti AMD Modeling and Analysis Engineer (512) 356-3752

Semiconductor Equipment and Materials International (SEMI)W. Murray Bullis, Ph. D. Vice President of International Standards

Phone: (415) 940-7980 Fax: (415) 940-7943

SEMI - JapanNaoko Tani Vice President of Japan Standards

Phone 81-03-3222-5155 Fax: 81-03-3222-5757

I300I