FOXCONN English Explain(Rev.1)

4 51.1 5 1.2 7 1.3 8 1.4 9 1.5 1.6 1.7 10 10 11

(17)2.1 17 2.2 20-1-

FOXCONN Microsystem Corporation

AMBIT

2.3 24 2.4 24 2.5 30 2.6 31 2.7 33 2.8 SFIS 36

413.1 SOP 41 3.1.1 41 3.1.2 42 3.1.3 43 3.1.4 44 3.2 47

654.1 65-2-


AMBIT

4.2 (66) 4.3 (75)

77

-3-


AMBIT

1. 2. 3. COM

-4-


AMBIT

1.1

Hon Hai CMM (Component module move) CEM (Contract Manufaction service) IBSC (Internet Business Solution Center) PCEG (Personal Computer Enclosure group) FOXTEQ CCBG (Connector & cable business group) CPBG (Competition business group) ESBG (Enterprise system business group) SABG (system assembly business group) NWE (Net Work Enclosure) NSE (Network system enclosure) Stamping tool shop II NSG (Network system group) Prototype workshop NFE (Network flexible enclosure) Steel factory Foxcavity = HZ = Hong Zhun PCE molding tooling workshop Stamping tool shop I -5-


AMBIT

PCE Hua Nan test and measurement center MPE (mobile phone enclosure) MBE (mobile phone and notebook enclosure) MGE (Alloy magnesium alloy enclosure) Engineer standard Document center (database center) Design Center Painting () Assembly () Stamping () Education and Training proposal improvement/creative suggestion Technological exchange and study Technology and Development Committee -6-

BS Brain Storming QCC Quality Control Circle PDCA :Plan Do Check Action DCC delivery control center Quality control system Manufacturing control system Management control system 7S Classification (sorting, organization)-seiri Regulation (arrangement, tidiness)-seiton Cleanliness (sweeping, purity)-seiso Conservation (cleaning/cleanliness) -seiktsu Culture (discipline)-shitsuke Save Safety .


AMBIT

1.2 QC FQC IPQC OQC IQC TQC POC QA OQA QE FAI FAA CP CPK SSQA FMEA FQC quality control final quality control in process quality control output quality control incoming quality control total quality control passage quality control quality assurance output quality assurance quality engineering first article inspection first article assurance capability index capability process index standardized supplier quality audit failure model effectiveness analysis

-7-


AMBIT

AQL S/S ACC REE CR MAJ MIN Q/R/S P/N L/N AOD UAI FPIR PPM

Acceptable Quality Level Sample size Accept Reject Critical Major Minor Quality/Reliability/Service Part Number Lot Number Accept On Deviation Use As It First Piece Inspection Report Percent Per Million

//

1.3 SPC SQC-8-

Statistical Process Control Statistical Quality Control

AMBIT


GRR DIM DIA N QIT ZD QI QP TQM RMA 7QCTools

Gauge Reproductiveness & Repeatability Dimension Diameter Number Quality Improvement Team Zero Defect Quality Improvement Quality Policy Total Quality Management Return Material Audit 7 Quality Control Tools

1.4 ECN ECO PCN PMP SIP Engineering Change Notice Engineering Change Order Process Change Notice Product Management Plan Standard Inspection Procedure () () -9-


AMBIT

SOP IS BOM PS SPEC DWG

Standard Operation Procedure Inspection Specification Bill Of Material Package Specification Specification Drawing

1.5 ES CGOO IWS ISO GS Engineering Standard China General International Workman Standard International Standard Organization General Specification PCE

1.6 PMC- 10 -

Production & Material Control

AMBIT


PCC PPC MC DC QE QA QC PD LAB IE R&D

Product control center Production Plan Control Material Control Document Center Quality Engineering Quality Assurance Quality Control Product Department Laboratory Industrial Engineering Research & Design

() () ()

1.7 PCS PRS CTN PAL Pieces Pairs Carton Pallet/skid (,) () - 11 -


AMBIT

PO MO D/C ID/C SWR L/N P/N OEM PC CPU A.S.A.P E-MAIL N/A QTY I/O NG C=0 APP- 12 -

Purchasing Order Manufacture Order Date Code Identification Code Special Work Request Lot Number Part Number Original Equipment Manufacture Personal Computer Central Processing Unit As Soon As Possible Electrical-Mail Not Applicable Quantity input/output Not Good Critical=0 Approve

() / , ,,


AMBIT

CHK ASS'Y T/P 5WIH 6M 4MTH SQA DQA MQA SSQA LRR SPS DT MT DVD VCD LCD CAD

Check Assembly , True Position When, Where, Who, What, Why, How to Man, Machine, Material, Method, Measurement, Message Man, Material, Money, Method, Time, How ,,,,() Strategy Quality Assurance Design Quality Assurance Manufacture Quality Assurance Sales and service Quality Assurance Lot Reject Rate Switching power supply Desk Top () Mini-Tower () Digital Video Disk Video Compact Disk Liquid Crystal Display Computer Aided Design- 13 -


AMBIT

CAM CAE PCB CAR NG WDR PPM TPM MRP OS TBA D/C P/P EMI RFI MMC MMS- 14 -

Computer Aided Manufacturing Computer Aided Engineering Printed Circuit Board Correction Action Report Not Good Weekly Delivery Requirement Percent Per Million Total Production Maintenance Material Requirement Planning Operation System To Be Assured Drawing Change Plans & Procedure Electrical-Music Industry Electrical Magnetic Interference Read Frequency Input Maximum Material Condition Maximum Material Size

,


AMBIT

LMC LMS LED QBR CIP FGI CNC B2C B2B AVL POP EOL VDCS PDCS GRN A/R A/P

Least Material Condition Least Material Size lighting-emitting diode Quarter Business Record Continuous improvement process Forecasted Goal Inventory Computerized numeral controller Business to customer Business to business Approved vendor list Procedure of packaging End of life Vender defect correcting sheet Process defect correcting sheet Goods receiving note Accounting receivable Accounting payable

- 15 -


AMBIT

NOTE:

- 16 -


AMBIT

2.1 president operator position general manager special assistant deputy manager |'depjuti| =vice manager deputy supervisor=vice= supervisor group leader line leader supervisor responsible department Human Resources Department Head count production department planning department QC Section stamping factory painting factory molding factory administration / general affairs dept./ production unit meeting minutes distribution department subject conclusion decision items pre-fixed finishing date Color management Visual management production capacity first count first check second count second check quantity of physical inventory second count physical inventory physical count quantity difference quantity spare parts physical inventory- 17 -


AMBIT

list cause analysis waste materials description specification model work order revision remark registration registration card to control application form for purchase consume, consumption to notify to fill in to collect, to gather - 18 -

statistics cosmetic inspection standard computer case () personal computer enclosure front plate rear plate chassis |'si| bezel panel Hood base pan bezel riser card flat cable Top driver cage bottom driver cage resin film

raw materials materials steel plate roll/coil material spare parts =buffer plastic parts sheet metal parts/stamping parts material check list finished product semi-finished product good product/accepted goods/ accepted parts/good parts defective product/non-good parts disposed goods warehouse/hub packing material


AMBIT

basket plastic basket flow chart production tempo lots of production manufacture procedure to revise, modify to switch over to, switchto, switching over engineering bottleneck, project difficulty glove(s) glove(s) with exposed fingers bottleneck Band-Aid Industrial alcohol broom

mop vacuum cleaner rag garbage container garbage can garbage bag liaison lamp holder to mop the floor to clean a table air pipe delivery deadline die worker production, to produce equipment resistance beacon coolant

crusher club car plate power button reset button forklift Workshop traveler trailer =long vehicle Hydraulic trolley hydraulic hand jack casing = containerization velocity patent coordinate supply and demand career card barricade carton box - 19 -


AMBIT

to pull and stretch

work cell/work shop

sub-line

2.2 plain die pierce die forming die progressive die stage die compound die shearing die riveting die feature die male die female die cavity core - 20 -

die change to fix a die to repair a die punch set punch pad punch holder stripper pad up stripper upper plate lower plate die pad die holder die set

bottom block bottom plate () upper supporting blank upper padding plate blank top plate top block stripping plate () outer stripper inner stripper lower stripper punch insert () deburring punch AMBIT


groove punch stamped punch round punch special shape punch bending block roller baffle plate located block supporting block for location air cushion plate air-cushion eject-rod trimming punch stiffening rib punch = stinger ribbon punch reel-stretch punch guide plate

sliding block sliding dowel block die locker pressure plate =plate pinch thickness gauge cutting die, blanking die die block folded block sliding block location pin lifting pin die plate, front board padding block stepping bar panel board to load a die to unload a die active plate

lower sliding plate upper holder block upper mid plate spring box spring-box eject-rod spring-box eject-plate bushing block cover plate guide pad pilot trim pierce pocket for the punch head slug hole radius shim/wedge/heel/pad/spacer/gas ket torch-flame cut - 21 -


AMBIT

set screw form block round pierce punch =die button shape punch =die insert stock located block metal plate miller grinder tolerance score =groove sliding block lathe active plate baffle plate cover plate groove punch air-cushion eject-rod spring-box eject-plate - 22 -

capability parameter factor driller set up die height of die setting up analog-mode device inner guiding post inner hexagon screw dowel pin coil spring lifter pin eq-height sleeves =spool pin lifter guide pin guide pin

wire spring outer guiding post stop screw located pin outer bush press specification die height flow mark welding mark post screw insert self tapping screw stripper plate piston handle mold flash mold positive mold split mold die lifter


AMBIT

top stop bottom stop one stroke to continue, cont. to grip(material) location lump, locating piece, location block reset to file burr embedded lump |in'bed| |lmp| stamping-missing to tight a bolt to loosen a bolt punched hole to cut edge =side cut =side scrap to bending

to pull, to stretch engraving, to engrave stamping to stake designing, to design design modification gauge(or jig) pedal stopper flow board torque spline =the multiple keys quenching tempering annealing carbonization alloy

tungsten high speed steel moly high speed steel forming (,) draw hole bending emboss dome semi-shearing stamp mark deburr or coin punch riveting side stretch reel stretch groove stamp letter () tick-mark nearside tick-mark farside extension DWG - 23 -


AMBIT

procedure DWG

die structure DWG

2.3 punch, press punching machine hydraulic machine jack decoiler manufacture management stamping, press feeder rack, shelf, stack taker to reverse material to load material to unload material to return material/stock to scraped |'skrpid| scrape ..v.; robot production line packaging tool packaging

2.4 well type insulated runner - 24 -

hot runner runner plat

valve gate band heater AMBIT


spindle spear head slag well cold slag air vent welding line eject pin knock pin return pin sleeve stripper plate insert core runner stripper plate guide pin eject rod (bar) subzero three plate runner system

stress crack orientation sprue gate nozzle sprue lock pin ( ) slag well side gate edge gate tab gate film gate flash gate slit gate fan gate dish gate diaphragm gate ring gate submarine gate

tunnel gate pin gate runner less sprue less long nozzle spur ; waste board sliding rack to impose lines to compress, compressing character die to feed, feeding material change, stock change feature change prepare for, make preparations for - 29 -


AMBIT

rotating speed, revolution

abnormal handling

2.5 Assembly line Layout Conveyer Rivet machine Rivet gun Screw driver Electric screw driver Hydraulic machine Pneumatic screw driver automation to stake, staking, riveting add lubricant oil argon welding - 30 -

cylinder robot conveying belt transmission rack to draw holes bolt nut screw identification tag screwdriver plug automatic screwdriver to move, to carry, to handle be put in storage

packing staker = riveting machine fit together fasten () fixture () pallet/skid barcode barcode scanner fuse together fuse machine/heat stake processing, to process delivery, to deliver to return delivery to. to send AMBIT


delivery back to return of goods easily damaged parts standard parts

to lubricate spring spare tools location/buffer

spare molds location tox machine

2.6 phosphate viscosity alkalidipping main manifold organic solvent demagnetization ; high-speed transmission heat dissipation rack volatile degrease rinse alkaline etch desmot D.I. rinse Chromate Anodize seal scraped products disposed products dismantle the die auxiliary function heater band thermocouple derusting machine degate dryer induction induction light - 31 -


AMBIT

response =reaction =interaction ram edge finder concave convex cold slug blush

gouge ; satin texture witness line grit granule =pellet =grain sand blasting grit maker cushion

fillet ; roller pin formality cam driver shank crank shaft

2.7 qualified products, up-to-grade products defective products, not up-to-grade products defective product box poor processing poor incoming part - 33 -

exposed metal/bare metal excessive defect critical defect major defect minor defect not up to standard

cosmetic defect lack of painting slipped screw head/slippery slipped thread missing part wrong part oxidation AMBIT


defective threading poor staking deficient purchase deficient manufacturing procedure cosmetic inspection inner parts inspection blister angular offset dent scratch deformation filings defective label abrasion Breaking. (be)broken,(be)cracked short

nick speck shine splay gas mark delaminating speckle mildewed =moldy = mouldy deformation burr()flash() poor staking excessive gap grease/oil stains inclusion shrinking/shrinkage mixed color fold of packaging belt painting make-up

discoloration water spots impurity Mismatch failure, trouble deformation rust peel Shrink Contamination water spots Gap label error Missing label rejection criteria Suspected rejects abrasion Texture surface - 34 -


AMBIT

Streak stains Blotch discoloration Inclusion slug mark

dirt grime blush sink Hickey labels and logos Configuration labels

corrugated containe Delaminating splattering Gouge puckering

2.8 SFIS 1. SFIS 2. SMO 3. DCT- 35 -

Shop Floor Integrated System. SFIS Monitor. SFIS Data Control Terminal. .


AMBIT

4. DIC 5. Wireless Gun 6. Receiver 7. Charger 8. Barcode Printer 9. Laser Printer 10. Employee Barcode 11. Error Code 12. Reason Code 13. Key Parts 14. Route 15. Vender 16. Customer 17. SN

Data Interface Controller. SMO DCT . SFIS Serial Number.

- 36 -


AMBIT

INSP R_INSP SMT_TU SMT_IN SMT_OUT ATE R_ATE T_INPUT T_ICT R_T_ICT ASSY- 37 -

SMT ICT INSP SMT (PCBA ) SMT SMT 1. Hi-PotOpen ShortFunction Test 2. Tray Serial Number ATE ADSL W/S . T_ICT ADSL .


AMBIT

RI R_RI FT R_FT PACK_BOX PACK_CTN PACK_PALT FQA R_FQA STOCKIN LOADING SHIPPING WS SC_SMT

ADSL Run-in ( Run-in ) Run-in ADSL Final Test Final Test Tray Carton FQA FQA () PPM SMT - 38 -


AMBIT

SMT_PRE_SC SC_TEST TEST_PRE_SC SC_FG FG_PRE_SC SC_RE

SMT PCBA PCBA

- 39 -


AMBIT

NOTE:

- 40 -


AMBIT

3.1 3.1.1 MTMini-Tower() DVDDigital Video Disk VCDVideo Compact Disk LCDLiquid Crystal Display CADComputer Aided Design CAMComputer Aided Manufacturing CAEComputer Aided Engineering PCBPrinted Circuit Board EMIElectrical-Music Industry Electrical Magnetic Interference

ADSL(Asymmetrical Digital Subscriber Loop) DC/DC Charger (~) Gauge Hybrid IC Inverter LAN Modem SPSSwitching power supply DTDesk Top()

- 41 -


AMBIT

3.1.2 RT : Receiving Ticket IQC : Incoming Quality Control SMT : Surface mounting technology ICT:In circuit tester AOI : Auto optical inspection V/I:Visual inspection T/U: Touch Up SNAP : Hi-pot Test : F/T : Final test Programming : Programming check : O/S (Open / short test)/ B/I (Burn-In) R/I (RUN-IN ) ORT (On-going Reliability Test) ATE(Automatic Test Equipment) Inspection LCR Meter ,, Pack FQA (Final Quality Assurance) CQA Customer Quality Assurance OOBOut Of Box Repair (T/S; Trouble Shooting) R/WRework IPQCIn-Process Quality Control PCBA(Printed Circuit Board Assembly) Open Short Test

- 42 -


AMBIT

3.1.3 1. Constant Temperature Soldering Iron 2. Conveyor 3. ESD Wrist strap 4. Fixture 5. Furnace 6. High Speed Machine 7. Laser Scribe 8. Microscope 9. Oven 10. Partition 11. Paste Roller 12. Printer 13. Probe 14. Probe Card 15. Reflow- 43 -

/ AMBIT


16. Scanner 17. Screen Cleaner

3.1.4 - 44 -

1. Barcode 2. Bracket 3. Capacitor 4. Capillary 5. Carton 6. Ceramic Substrate 7. Coil 8. Conductive Sponge 9. Conductor Paste 10. Connector 11. Crystal (XTAL)


AMBIT

12. Dielectric Paste 13. Diode 14. Epoxy 15. EPROM (Erasable and Programmable Read Only Memory) 16. Fuse 17. Golden Finger 18. Header 19. Heat Sink 20. IC (Integrated Circuit) 21. Inductor 22. Insulator 23. Jack 24. Mylar 25. Over-glass Paste 26.PRO(Programmable Read Only Memory)- 45 -

() () ()


AMBIT

27. Resistor 28. Resistor Array 29. Resistor Paste 30. Silicone 31. SIMM Socket 32. Socket 33. Solder Paste 34. Switch 35. Thermal 36. Transformer 37. Transistor

IC

- 46 -


AMBIT

3.2 5S 5S (SEIRI)(SEITON) (SEISO)(SEIKETSU)(SHITSUKE) ()"S"5S 5S

ABC (Activity-Based Costing)ABC ABM(Activity-Base Management)

ASP Application Service Provider IT - 47 -


AMBIT

AVL (Approved Vendor List)

BOM (Bill Of Material) BOM MRP BOM 90 PCBA 95 Driver Bundle 97 Engine 98 ()

BPR (Business Process Reengineering) (Function-Organization) Process-Oriented Organization - 48 -


AMBIT

BPR 1. 2. 3.

BSC (Balanced Score Card) (Balanced Scorecard)

CPM (Critical Path Method)(critical path)(chain of activities) (critical activities)(management efforts)- 49 -


AMBIT

CPM (Complaint per Million) 1 1 100 1 1 20

CRM (Customer Relationship Management) Data Mining

CRP (Capacity Requirement Planning) CRP MPS CRP

DBE (Drum-Buffer-Rope) TOC (Drum Schedule) (Rope Schedule)( Murphys Law)- 50 -


AMBIT

Drum-Buffer-Rope Drum Buffer Rope Drum (drum) Buffer (buffer) Rope (feedback) (rope)

DMT (Design Maturing Testing) EMC

DVT- 51 -

(Design Verification Testing)

Debug


AMBIT

DSS (Decision Support System) Vlugt,1989

ECRN

(Engineer Change Request Notice)

BOM

EIS (Executive Information System)

EMC (Electric Magnetic Capability)

EOQ (Economic Order Quantity)

ERP (Enterprise Resource Planning) 1998 ERP - 52 -


AMBIT

FAE

(Field Application Engineer)

(PM)

FCST (Forecast)

FMS (Flexible Manufacture System) 1960 - 53 -


AMBIT

FQC (Finish or Final Quality Control)

IPQC (In-Process Quality Control)

IQC (Incoming Quality Control) IQC

ISO (International Organization for Standardization) 1946 9000 14000 18000 ISO

ISAR (Initial Sample Approval Request) ISAR- 54 -


AMBIT

JIT (Just In Time)JIT () JIT 1. 2. 3.JIT JIT Lead Time

KM (Knowledge Management) - 55 -


AMBIT

L4L (Lot-for-Lot)

LTC (Least Total Cost)

LUC (Least Unit Cost)

MES (Manufacturing Execution System) MES (Customer Order Management ,COM)(Material Management System, MMS) (Work In Process Tracking , WIP)(Production Scheduling System , PSS) (Statistical Process Control , SPC) (Equipment Management System, EMS) PDM (PDM Integration Interface) ERP (ERP Integration Interface) MES - 56 -


AMBIT

MPS (Master Production Scheduling) ...

MRP (Material Requirement Planning)MRP Joseph A. OrlickyGeorge W. Plossl Oliver W. Wight 1970 American Production and Inventory Control Society APICS MRP MPS BOM Forward Scheduling () Backward Scheduling () Independent Demand () - 57 -


AMBIT

Dependant Demand ()

MRPII (Manufacturing Resource Planning) Wight 1981 MRP MRP

OLAP (On-Line Analytical Processing)(Data Warehouse) OLAP 1.2. 3.OLAP OLAP OLAP (Historical data)(aggregate data) OLAP OLTP (On-Line Transaction Processing) - 58 -


AMBIT

OLAP OLTP OLTP (Data Warehouse) (Relational Database, RDB)OLAP OLTP OLAP

OPT (Optimized Production Technology) Eli Goldratt 70 (Optimized Production Timetable)80 Goldratt (Theory of Constraints)OPT

OQC (Out-going Quality Control)

PDM (Product Data Management) CAD 3D NC CAE - 59 -


AMBIT

(common data)

PERT (Program Evaluation and Review Technique) (project) (net-work) (activity) (project duration) (bottle neck) (scheme) PERT (planning)(doing) (controlling)

POH (Product on Hand)

QCC (Quality Control Circle)

RCCP (Rough Cut Capacity Planning)(RRP) (RCCP)(CRP)- 60 -


AMBIT

/(I/O) MRP RCCP MPS MRP CRP RCCP RCCP 1. Capacity planning using overall factors(CPOF) 2. The Bill of Labor approach(BOL) 3. Resource Profile Approach(RPA)

SCM (Supply Chain Management) 1. 2. 3. - 61 -


AMBIT

SIS (Strategic Information System) EIS EIS SIS

SPC (Statistic Process Control) Cp Cpk

TOC (Theory Of Constraints)( ) ()

TPM (Total Production Management)- 62 -


AMBIT

8 Total Preventive Maintenance Total Production Management Total Productivity Management JIPM 500

TQM (Total Quality Management)

- 63 -


AMBIT

NOTE:

- 64 -


AMBIT

4.1 5S,,,, 6sigma6 AIAuto Insertion AQLAccept Quality Level B/IBurn In () BOMBill Of Material BTOBuild To Order CAD/CAMComputer Aided Design / Manufacturing / CALalibration () CARCorrective Action Response CCRCustomer Complain Requirement / Charge CNDCannot Duplicate ,- 65 -

CR Critical (CR>MA>MI) CSCustomer Service CTOConfigure To Order Debit Note () DELL's Survey Form DELL ECNEngineering Change Notice ECREngineering Change Request EMIElectro Magnetic Interference ENGEngineering () ESDElectro static Discharge FAE Field Application Engineering FAIFirst Article Inspection FNFactory Notice AMBIT


FRRField Return Rate FRUField Replacement Unit Hi-Pot Hold (shipping, production) (,) ICTIn-Circuit Test (PC ) IEIndustrial Engineering IPQCIn-Process Quality Control

IQCIncoming Quality Control ISOInternational Organization for Standardization JITJust In Time (,) MAMajor MEMechanical Engineering MFGManufacturing ()

4.2 4.2.1 (Specification or Spec).1.1 BOM: Bill of material 1.2 S/N: Spec notice 1.3: ES : Electrical Spec 1.4: PK: Schematic 1.5: PD: Physical dimension ES: Input characteristics 1.1 Input voltage range 1.2 Input frequency range 1.3 Max .input AC current 1.4 Inrush current(cold start) 1.5 Efficency:60% Min. At nomall line 60% 115/230V, - 66 -


AMBIT

Noise test Static output characteristics Dynamic output characteristics Rise time DC Hold up time DC Short circuit protection Hi-pot(dielectric withstand voltage) Primary to secondary AC TO DC. Primary to safety ground AC TO FG. Secondary to protection) DC TO FG. Insulation resistance . Leakage current . Electrical regulation voltage / current ripple / noise / buzz frequency / load - 67 -

Protection: OVP(over voltage protection) OPP(over power protection) OCP(over current protection) OTP(over temp protection) no power (NOP full load / low load broken / blow out (BRO) damage / adjust open / short oscilloscope SPEC( model: revision: issued date: P/N: description: remark:


AMBIT

reported by: checked by:

approved by:

4.2.2 FN(factory notice):/ ECN (engineering change notice)Immediated change Running change ECN: old rev.( new rev. ( drawing no / customer / alteration ref (// )

4.2.3 Department MFG: manufacturing AI: auto insertion Performing SMD QA: quality assurance VQA PQC ,FQC Calibration , safety PE: production engineering TE: test engineering ME: mechanical engineering IE: industrial engineering HR: human resources Material PC: production control purchasing warehouse ENG: engineering - 68 -


AMBIT

document center

4.2.4 Safety UL (Underwriters Laboratories) CSA (Canadian Standards Association) TUV VDE NEMKO DEMKO CCEE (China Commission for Conformity Certification of Electronal Equipment ) CCIB (China Commodity Inspection Bureau)

4.2.5 Other FAX (): date, to, fm, subject, dear, TKS, best regards. FAR: issue, description, corrective action, preventive action, analysis, defect, failure, supplier /vendor. ISO: International Organization for Standardization Quality Manual: Procedure: Quality policy: Quality ,Reliability , Excellence .

- 69 -


AMBIT

4.2.6 Contraction()AQL: accept quality lecer ATS: auto test system CR: critical ESD: electrostatic discharge FET: field effective transistor ICT: in - circuil test MA: major MI: minor MRB: material review board NTC: negative temperature characteristic O/I: operation instruction PWM: pulse width modification S/N: series number SMD: surface mounting device WIP: work in progress () JIT: just in time IR: infra-red PDPC: process, decisionprogram, chart QCCA: quality control circle activities CWQC: company-wide quality control QCCA: quality control circle activities CWQC: company-wide quality control

4.2.7 Component()bobbin shield bridge diode triode cable tie tape capactitor(cap) screw tapping case screw machine ceramic capacitor - 70 -


AMBIT

terminal chip capacitor transformer(X'FMR) chip resistor transistor choke tube connector varistor control board VR(variableresistance)

diode washer epoxy zener fan jumper wire lock washer PCB nut tubber foot TEFLON stand-off

LED label output wire NTC inductor star washer IC sping washer heat sink socket glue solder bar FET regulator

filter resistor insulator switch output cable photo couple fuse ricer fuse clip screw fuse holder

4.2.8 Time()month period - 71 -

quarter since ..

week

after before AMBIT


date Jan. (Janury) Feb.(February) Mar.(March) Apr.(April)

May Jun.(June) Jul.(July) Aug.(August) Sept.(September) Oct.(October)

Nov.(November) Dec.(December) Mon=Monday Tue=Tuesday

Wed=Wednesday Thu=Thursday Fri=Friday Sat=Saturday Sun=Sunday

4.2.9 Ver. ()change pay check produce come provide damage receive find replace fix send data defect disposition go take , happen touch improve wind (,), engineer failure file insert issue make ,

4.2.10 Non()action , analysis condition inspector

- 72 -


AMBIT

4.2.11 Process ()assembly method burn-in(B/I) model component noise flux pallet function test paper gravity plan Hi-pot test position insertion problem ORT procedure packing product solder machine production gold gray green station record supplier/vendor remark temperature report humidity requirement torque sample touch-up(T/U)( ) target layout trace() location waybill manager operator technician

4.2.12 Color()black blue brown orange red silver violet(purple) white yellow

4.2.13 :- 73 -


AMBIT

1m=10dm=10*10cm=10*10*10 mm 1inch=25.4mm : 1 =10*10 =104 =106=1.5-e3 : 1 =10+e3=10+e6=10+e9=10+e3=

10+e6=264.2 : 1 =1 =103 (g) 1 =453.59 (g) : (L) 1 (H)=103 =106 (R) 1 =103 =106

(C) 1 =106 =1012 (V) 1 =103 =106 (A) 1 =103 =106 (f) 1(MHz)=103 (KHz)=106 (Hz)

4.3 1. Bottom side of PCB 2. Cold Solder 3. Component Damage 4. Empty Solder - 74 -


AMBIT

5. Float 6. Oxidation 7. P/N (Part Number) 8. Polarity 9. Shift 10. Short 11. Solder Ball 12. Solder Icicle 13. Solder Residue 14. Substrate 15. Top side of PCB

- 75 -


AMBIT

NOTE:

- 76 -


AMBIT

(2003/07/01)

1.: 2 3.: () 4.,: + () ++ 5.+ = = = ISO9001 = = = ISO9002 6. 7. () 8. (1.BTN: Build To Need (2.BTO: Build To Order (3.BTI:Build To Inventory (4.DTN: Delivery To Need (5.DTO: Delivery To Order (6.CCP: Channel Configuration Program Compaq - 77 -


AMBIT

(7.CTO:Configuration To Order 9.: TIER 1:PC ,(COMPAQ,DELL, HP, IBM) TIER 2: PC , 5-20 (ACER, GATEWAY 2000, PACKARD BELL NEC) TIER 3:PC (,,) TIER 4:CLONE PC (,) 10.: Time To Market Time To Volume Time To Money , 11. 12. + 13. 14. 15. () 16. =+++(/:+)- 78 -


AMBIT

17. 18. 19. : ,, 20. : == 21. : () (/) 22. : (/) 23. : 24. : : : 25. : +. 26. (1. (2. (3. (4. 27. : (1.2.3.(4.. 28. Designing Review(): . 29. OEM: 30. ODM: 31. Connector & Cable Designing Review: DR1 DR2 DR3 DR4 - 79 -


AMBIT

DR5 DR6 DR7 32. PCE Designing Review: DR1 DR2 DR3 DR4 DR5 DR6 33.PC : . 34. PC : 1. (High speed transmission) 2. (Heat dissipation) 3. / (EMI/RFI) 4. (Acoustics) 5.(Power distribution) 6. (Mechanical design) 7. (Product styling & Cosmetics) 8. (Environmental protection & recycling) 35. Barebone 36. PCE Level--IV Level 1 Parts manufacturing, Non-painted stamping parts + Molding parts , + Level 2 Parts assembly + Cover painted + Level 3 Computer case Level 4 Computer case +SPS and /or Flat cable and / or Backplane +// Level 5 Level 4 +FDD kitted with Heatsink and /or fan 4 + /- 80 -


AMBIT

37.PCE Level--VIXI Level 6 Level 5 +Mother board and test Level 7 System kitted with I/O devices (key board ,mouse) & user manual & power cord accessories / Level 8 Assembly high-price & customer-optioned: CPU,DRAM,HDD, CD-ROM,Add-on cards : ,,,, Level 9 Install OS and system test and ship-out , Level 10 Software Download and Diagnostic Test. ,, Level 11 Racked Monitor with PC.system and Diliver PC 38.PCE 39.MRP Material Requirement Planning 40.MRP Manufacturing Resource Planning 41.ERP: Enterprise Resource Planning 42.SCM: Supply Chain Management 43. --(,... ) 44.-- 45. JIT (Just in time) () WELL PLANNING = = ZERO- 81 -


AMBIT

DEFECT (). 46. "",: ", " 47. : 48. : () 49. (1.; (2.;3. ; (4.; (5. JIT ; (6.. 50. : +. 51. : Proforma Inv. . 52.: Bill Inv. . 53. : ,. 54. : ,. 55. ISO9001: --/... 56. ISO9002: --. 57. TPM: (Total Production Management). 57. 5S: . 58. : . 59. : ; . 60. 3C : COMPUTER COMMUNICATION CONSUMER -ELECTRONIC(- 82 -


AMBIT

) 61. : (). 62. (): . 63. : (1. (2.(3.(4.(5.(6.(7. (8. (9. 64. : (). 65. : (1. (2. (3. (4. 66. : "". 67. : . 68. : ,. 69. 4 : +. 70. : "". 71. : . 72. : (1.,; ( 2. ,. 73. :(1. (2. (3.. 74. : ,. 75. : .- 83 -


AMBIT

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87. : //. 88. : 1. //()2. // 89. 90. ()// 91. (1. (2. (3. (4. (5. (6. (7. 92. (1. (2. (3. (4. (5. (6. (7. 93. , 94. ()//() 95. / / / / 96. (1. (2. (3. (4. (5. (6. (7. (8. (9. (10. (11. (12. 97. CEM(CM)Contract Electronic Manufacture 98. / / / / 99. CMMComponet + Module + Move + + - 85 -


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100. CMMSComponet + Module + Move + Service + + + 101. / / 102. 1. 2. 3. () 4. 5.6. (7. 103. // 104. Execution (E=SAP) Speed (S)+ Accuracy(A)+(P)Precison 105. + 106. (KPI)1. Key Performance Index.2. . 107. : (1.(2., ,. 108. : (1.(2.? ? 109. : , (1.,;(2.,. 110.: ,,. 111. : (1. (2. (3. (4. (5.+.

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NOTE:

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FOXCONN English Explain(Rev.1)