1
ducted in a vacuum, said process chambers including a sputter chamber for sputtering; and a de- gas chamber for degassing a sub- strate, said degas chamber being provided with a plurality of heat stages so as to simultaneously heat a plurality of substrates. ROTOGRAVURE PLATING PROCESS U.S. Patent 5,925,231. July 20, 1999 H.F. Metzger, Brookfield, Wis. A method for electroplating a ro- togravure cylinder using ultra- sonic energy, FORMING A HIDDEN IDENTIFICATION USING POWDER COATING U.S. Patent 5,925,402. July 20, 1999 W.E. Nacker and R.M. Didrick, assignors to Morton International Inc., Chicago A method of providing a hidden identification on a substrate com- prising forming a first patterned coating on a substrate by applying a layer of a coating powder se- lected from the group consisting of thermoplastic, thermoset, and UV-curable coating powders to a substrate, subjecting selected pat- terned portions of the coating powder layer to a laser beam so as to generate sufficient heat to fuse the selected patterned portions in the case of a thermoplastic coat- ing powder, sufficient heat to fuse and cure the selected patterned portions in the case of a thermoset coating powder, and sufficient heat and UV light to fuse and cure a UV-curable coating powder; and removing unfused powder; plus forming a second coating from a coating powder over the first pat- terned coating so as to cover the first patterned coating, the second coating being formed by applying a coating powder layer of gener- ally uniform thickness over the substrate and then fusing or fus- ing and curing the coating powder layer; the patterned coating being subsequently identified by remov- ing the second coating thereover. ELECTROLESS PLATING PROCESS U.S. Patent .5,925,415. July 20, 1999 J.L. Fry et al., assignors to The University of Toledo, Toledo, Ohio INCI.lJl)I NG 11/\ ' KFI.WS, ' 151 V ISIT US AT SUR/ FIN BOOTH 1612 T&./ lnrlust ries scializes in anodizing rucks an d rack components. O UI' hrond 1i1H' of products include: • FOI 'IIl l'd Disc liucks •I • Fishhon« •l t ilit,\' Rucks • I'nuels • Clips • stottI'd Hunuers l' i l' l'l'I'd 11 011' II angel':- • Arurle Bal':- • Crnss l\lemhl'I'l' & Hunlwiur- 10' 01' a FJ{ EE cata log call 0 111' Oml'l' at 0 1' E-mail tjim lmn all I. CII III , OJ{ call 11111' California ol'lin' at (,'0:) :!:n -XIOI , 0 1' 1 ';-llI a il lj illll(o\tl wg l'id,l·olll. NErrHER D()ES Onus. At Dcimco you don', pay high prices for features you llilIL1 need- Automatic, Manuol, & Walk-III Powder Systems 'hain-On-Edge Systems . Support Equipment Deimco DoES YOUR POWDER B OOTH DO BACKFLIPS? Benefits: • Coats small parts in a variety of situations • Economical operation • Self-contained www.deimco.com • Compact design Circle 014 on reader Information card Circle 055 on reader Information card May 2000 93

Forming a hidden identification using powder coating

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Page 1: Forming a hidden identification using powder coating

ducted in a vacuum, said processchambers including a sputterchamber for sputtering; and a de­gas chamber for degassing a sub­strate, said degas chamber beingprovided with a plurality of heatstages so as to simultaneouslyheat a plurality of substrates.

ROTOGRAVURE PLATING PROCESSU.S. Patent 5,925,231. July 20, 1999H.F. Metzger, Brookfield, Wis.

A method for electroplating a ro­togravure cylinder using ultra­sonic energy,

FORMING A HIDDENIDENTIFICATION USING POWDERCOATINGU.S. Patent 5,925,402. July 20, 1999W.E. Nacker and R.M. Didrick,

assignors to Morton InternationalInc., Chicago

A method of providing a hiddenidentification on a substrate com­prising forming a first patternedcoating on a substrate by applyinga layer of a coating powder se­lected from the group consistingof thermoplastic, thermoset, andUV-curable coating powders to asubstrate, subjecting selected pat­terned portions of the coatingpowder layer to a laser beam so asto generate sufficient heat to fusethe selected patterned portions inthe case of a thermoplastic coat­ing powder, sufficient heat to fuseand cure the selected patternedportions in the case of a thermosetcoating powder, and sufficient

heat and UV light to fuse and curea UV-curable coating powder; andremoving unfused powder; plusforming a second coating from acoating powder over the first pat­terned coating so as to cover thefirst patterned coating, the secondcoating being formed by applyinga coating powder layer of gener­ally uniform thickness over thesubstrate and then fusing or fus­ing and curing the coating powderlayer; the patterned coating beingsubsequently identified by remov­ing the second coating thereover.

ELECTROLESS PLATING PROCESSU.S. Patent .5,925,415. July 20, 1999J.L. Fry et al., assignors to TheUniversity of Toledo, Toledo, Ohio

INCI.lJl)I NG 11/\ ' KFI.WS,

~NDUS1'lXES '151 VISIT US AT SUR/FIN

BOOTH 1612

T&./ lnrlust ries ~ Jl scializes inanodizing rucks an d rackcompone nts. O UI' hrond 1i1H'

of products include:• FOI'IIl l'd Disc li ucks• I )i ~c:-

• Fishhon« H il cl{~

• l t ilit,\' Rucks• I'nuels• Clips• s tott I'd Hunuers• l'il' l 'l' I 'd 11 011' II angel':-• A rurle Bal':-• Crnss l\lemhl'I'l' & Hunlwiur-

10'01' a FJ{ EE cata log call 0 111' l\ l inll l'~ot il Oml'l'at ( ! l:)~) ~:!li - 17!)~, 0 1' E-mail tjim lmnr« allI.CII III ,OJ{ call 11111' California ol'lin' at (, '0:) :!:n -XIOI , 0 1'

1';-llIail lj illll(o\tlwgl'id,l·olll.

NErrHERD()ES Onus.

At Dcimco you don',pay high prices for

features you llilIL1 need-

A utomatic, Manuol, & Walk-III Powder Sys tems'hain-On-Edge Sys tems . Support Equipm ent

Deimco

DoES YOUR POWDER B OOTH DO

BACKFLIPS?

Benef its:• Coats small parts in a variety of situations• Economical operation• Self-contained www.deimco.com• Compact design

Circle 014 on reader Information card Circle 055 on reader Information card

May 200093