Features: BRIGHT LED ELECTRONICS CORP. Package Dimensions · equipment. 8. This product doesn’t contain restriction ... Measuring items Symbol Measuring conditions Judgment criteria

BBRRIIGGHHTT LLEEDD EELLEECCTTRROONNIICCSS CCOORRPP.. BL-HJD32X-TRB

Ver.1.0 Page: 1 of 7

SINCE 1981

● Features: 1. Emitted Color: Super Orange Red.

2. Lens Appearance: Water Clear.

3. Mono-color type.

4. 2.8x3.5x1.9mm standard package.

5. Suitable for all SMT assembly methods.

6. Compatible with infrared and vapor phase

reflow solder process.

7. Compatible with automatic placement

equipment.

8. This product doesn’t contain restriction

Substance, comply ROHS standard.

● Applications: 1. Automotive: Dashboards, stop lamps

, turn signals.

2. Backlighting: LCDs, Key pads advertising.

3. Status indicators: Consumer & industrial

electronics.

4. General use.

● Absolute Maximum Ratings(Ta=25℃)

Parameter Symbol Rating Unit Power Dissipation Pd 75 mW

Forward Current IF 30 mA

Peak Forward Current*1 IFP 100 mA

Reverse Voltage VR 5 V

Operating Temperature Topr -40℃~100℃ -

Storage Temperature Tstg -40℃~100℃ -

Soldering Temperature Tsol See Page 7 - *1 Condition for IFP is pulse of 1/10 duty and 3 msec width.

●Package Dimensions: NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice.



SINCE 1981

● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit

Forward Voltage Vf IF=20mA - 2.0 2.6 V

Luminous Intensity Iv IF=20mA 63 100 - mcd

Peak Wavelength λp IF=20mA - 630 - nm

Dominant Wavelength λd IF=20mA 620 - 632 nm

Spectral Line Half-width Δλ IF=20mA - 20 - nm

Reverse Current IR VR=5V - - 100 µA

Viewing Angle 2θ1/2 IF=20mA - 120 - deg

● Typical Electro-Optical Characteristics Curves

VS. FORWARD CURRENTFig.5 RELATIVE LUMINOUS INTENSITY

10

REL

ATI

VE

LUM

INO

US IN

TEN

SITY

(@20

mA

)

0

0.5

1.0

1.5

2.0

FORWARD CURRENT (mA)

20 30 40 50

AMBIENT TEMPERATURE Ta( )℃

0

A

RE

LATI

VE

LUM

INO

US IN

TENS

ITY

(NO

RM

ALI

ZED

AT

20m

A)

0.5

1.0

1.5

2.0

2.5

3.0

80


VS. AMBIENT TEMPERATUREFig.4 RELATIVE LUMINOUS INTENSITY

FO

RW

AR

D C

URR

ENT

(mA

)1010

0

20

30

40

50

60

20 40 60 100

VS. AMBIENT TEMPERATUREFig.2 FORWARD CURRENT

50

01

FO

RW

AR

D C

URR

ENT

(mA

)

10

20

30

40

FORWARD VOLTAGE (V)

2 3 4 5

FORWARD VOLTAGEFig.3 FORWARD CURRENT VS.

10

0.2

0.8

0.7

0.30.5 0.1

0.9

1.0

0

60

0.4 0.6

80

90

70

50

40

30

20

Fig.6 RADIATION DIAGRAM

REL

ATI

VE

RAD

IANT

INTE

NSIT

Y

1007550250-25

Fig.1 RELATIVE INTENSITY VS. WAVELENGTH

REL

ATI

VE

RAD

IAN

T IN

TEN

SITY

0580

0.5

1.0

WAVELENGTH λ (nm)

630 680



SINCE 1981

● Tapping and packaging specifications(Units: mm)

0.3

●Package Method:(unit:mm)

220

245

470

Aluminum Foil Bag220

645

210

185

6 box/carton

Bar Code Label

12 bag/box

200

3000 pcs/reel



SINCE 1981

● Intensi ty Bin L imi ts (At 20 mA)

BIN CODE Min. (mcd) Max. (mcd) P 63 94

Q 94 140

Tolerance for each Bin limit is ±10%.

● Color Bin Limits (At 20 mA)

Tolerance for each Bin limit is ± 1 nm

● Forward Voltage Bin Limits (At 20 mA)

BIN CODE Min.(V) Max.(V) B 1 .8 2 .0

C 2 .0 2 .2

D 2 .2 2 .4

E 2 .4 2 .6

Tolerance for each Bin limit is ± 0.02V. ● BIN： x x x V F B I N C O D E

C o l o r B I N C O D E

I n t en s i t y BI N CO D E

BIN CODE Min. (nm) Max. (nm)

6 620 624

7 624 628

8 628 632



SINCE 1981

● Reliability Test Classification Test Item Reference Standard Test Conditions Result

Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1

IF=20mA Ta=Under room temperature Test time=1,000hrs

0/20

High Temperature High Humidity Storage

MIL-STD-202:103B JIS-C-7021 :B-11

Ta=+65℃±5℃ RH=90%-95% Test time=240hrs

0/20

High Temperature Storage

MIL-STD-883:1008 JIS-C-7021 :B-10

High Ta=+85℃±5℃ Test time=1,000hrs 0/20

Endurance Test

Low Temperature Storage

JIS-C-7021 :B-12 Low Ta=-35℃±5℃ Test time=1,000hrs 0/20

Temperature Cycling

MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4

-35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle

0/20

Thermal Shock MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1011

-35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle

0/20Environmental

Test

Solder Resistance

MIL-STD-202:201A MIL-STD-750:2031 JIS-C-7021 :A-1

Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.)

0/20

● Judgment criteria of failure for the reliability

Measuring items Symbol Measuring conditions Judgment criteria for failure Forward voltage VF (V) IF=20mA Over U1x1.2 Reverse current IR (uA) VR=5V Over U1x2

Luminous intensity Iv ( mcd ) IF=20mA Below S1X0.5

Note: 1. U means the upper limit of specified characteristics. S means initial value.

2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient

temperature, then take next measurement.



SINCE 1981

● Soldering :

1. Manual Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering time to be within 3 seconds per solder-pad.

2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).

3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching).

● Handling :

Care must be taken not to damage LED’s epoxy resin while exposing to high temperature or contact LED’s epoxy resin with hard or sharp objects, such as metal hook, tweezer or sand blasting.

Temperature

Time

OVER 2 MIN.

4℃ /SEC. MAX.

4℃ /SEC. MAX.

10 SEC. MAX.

260℃ MAX.140~160℃

Temperature

Time

120~180 sec.

Preheat

245 ±5℃ within 5 sec.

Soldering heat Max. 260 ℃

120~150℃

BBRRIIGGHHTT LLEEDD EELLEECCTTRROONNIICCSS CCOORRPP.. BL-HGE32X-TRB


SINCE 1981

● Features: 1. Emitted Color: Green.


3. Mono-color type.






equipment.




, turn signals.



electronics.

4. General use.








Soldering Temperature Tsol See Page 7 - *1 Condition for IFP is pulse of 1/10 duty and 3 msec width.




SINCE 1981




Peak Wavelength λp IF=20mA - 570 - nm

Dominant Wavelength λd IF=20mA 566 - 576 nm

Spectral Line Half-width Δλ IF=20mA - 30 - nm





10

RE

LATI

VE

LU

MIN

OU

S IN

TEN

SITY

(@20

mA)

0

0.5

1.0

1.5

2.0


20 30 40 50


0

REL

ATIV

E LU

MIN

OU

S IN

TEN

SITY

(NO

RM

ALI

ZED

AT

20m

A)

0.5

1.0

1.5

2.0

2.5

3.0

80



FOR

WA

RD

CU

RR

EN

T (m

A)

1010

0

20

30

40

50

60

20 40 60 100


50

01

FOR

WA

RD

CU

RR

EN

T (m

A)

10

20

30

40

FORWARD VOLTAGE (V)2 3 4 5


10

0.2

0.8

0.7

0.30.5 0.1

0.9

1.0

0

60

0.4 0.6

80

90

70

50

40

30

20


RE

LATI

VE

RA

DIA

NT

INTE

NS

ITY

1007550250-25

WAVELENGTH λ (nm)


RE

LATI

VE

RA

DIA

NT

INTE

NS

ITY

0520

0.5

1.0

570 620



SINCE 1981


0.3


220

245

470


645

210

185

6 box/carton

Bar Code Label

12 bag/box

200

3000 pcs/reel



SINCE 1981




Tolerance for each Bin limit is ± 1 nm.


BIN CODE Min.(V) Max.(V) B 1 .8 2 .0

C 2 .0 2 .2

D 2 .2 2 .4

E 2 .4 2 .6

Tolerance for each Bin limit is ± 0.02V. ● BIN： x x x V F B I N C O D E



BIN CODE Min. (mcd) Max. (mcd) M 28 42

N 42 63

P 63 94


4 566 568

5 568 570

6 570 572

7 572 574

8 574 576



SINCE 1981




0/20


MIL-STD-202:103B JIS-C-7021 :B-11


0/20


MIL-STD-883:1008 JIS-C-7021 :B-10


Endurance Test



Temperature Cycling



0/20



0/20Environmental

Test

Solder Resistance



0/20









SINCE 1981

● Soldering :




● Handling :


Temperature

Time

OVER 2 MIN.

4℃ /SEC. MAX.

4℃ /SEC. MAX.

10 SEC. MAX.

260℃ MAX.140~160℃

Temperature

Time

120~180 sec.

Preheat



120~150℃

BBRRIIGGHHTT LLEEDD EELLEECCTTRROONNIICCSS CCOORRPP.. BL-HB532X-TRB


SINCE 1981

3.50(.138)±0.2

3.2(.126)±0.2

0.90(.035)

PIN 1 Mark

2.8(.110)±0.22.2(.19)±0.2

1.8(.07)

(2)

(1)

Polarity

● Features: 1. Emitted Color: Super Blue







equipment. 7. This product doesn’t contain restriction


● Applications: 1. Automotive lighting.



electronics.

4. General use.








Soldering Temperature Tsol See Page 6 -

*1 Condition for IFP is pulse of 1/10 duty and 3 msec width.

●Package Dimensions: NOTES: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3. Specifications are subject to change without notice.



SINCE 1981



Luminous Intensity Iv IF=20mA 63 120 210 mcd

Peak Wavelength IR VR=5V - - 10 µA

Dominant Wavelength λp IF=20mA - 470 - Nm

Spectral Line Half-width λd IF=20mA 465 - 470 Nm

Reverse Current Δλ IF=20mA - 30 - Nm

Viewing Angle 2θ1/2 IF=20mA - 120 - Deg


10

Fig.5 Relative luminous intensity vs. forward current

1

Rel

ativ

e lu

min

ous

inte

nsity

(@20

mA

)

0

0.5

1.0

1.5

2.0

Forw

ard

curre

nt (m

A)

20

0

10

30

40

Forward current (mA)

20 30 40 50

Forward voltage(V)2 3 4 5

Fig.3 Forward current vs. forward voltage

Fig.1 Relative intensity vs. wavelength

Rel

ativ

e ra

dian

t int

ensi

ty

50

4200

0.5

1.0

Wavelength (nm)

470 520

2.5

40

0.4

REL

ATI

VE

RA

DIA

NT

INTE

NS

ITY

0.5

0.7

0.8

0.9

1.0

0.10.3 0.2

Rel

ativ

e lu

min

ous

inte

nsity

(Nor

mal

ized

@ 2

0mA)

-400

0.5

1.0

1.5

2.0

Fig.6 Radiation diagramFig.6 Radiation diagram

Ambient temperature Ta( C)A

0 10

-20 0 20

40

0.6

90

80

60

70

50

20

30

60

Fig.4 Relative luminous intensity vs.

80

Fig.2 Forward current derating curve

3.0

0

1010

40

20

30

50

60

ambient temperature

Ambient temperature Ta( C)

20 40 60

vs. ambient temperature

100



SINCE 1981


0.3

● Package Method:(unit: mm)Vacuum

220

245

470


645

210

185

6 box/carton

Bar Code Label

2000 pcs/reel

12 bag/box

200



SINCE 1981


BIN CODE Min. (mcd) Max. (mcd) P 63 94

Q 94 140

R 140 210



Tolerance for each Bin limit is ± 1 nm.


BIN CODE Min.(V) Max.(V) G 2 .8 3 .0

H 3 .0 3 .2

J 3 .2 3 .4

K 3 .4 3 .6

Tolerance for each Bin limit is ± 0.02V.

● BIN： x x x V F B I N C O D E




4 465 470



SINCE 1981




0/20


MIL-STD-202:103B JIS-C-7021 :B-11


0/20


MIL-STD-883:1008 JIS-C-7021 :B-10


Endurance Test



Temperature Cycling



0/20



0/20Environmental

Test

Solder Resistance



0/20









SINCE 1981

● Soldering :




● Handling :


Temperature

Time

OVER 2 MIN.

4℃ /SEC. MAX.

4℃ /SEC. MAX.

10 SEC. MAX.

260℃ MAX.140~160℃

Temperature

Time

120~180 sec.

Preheat



120~150℃

BBRRIIGGHHTT LLEEDD EELLEECCTTRROONNIICCSS CCOORRPP.. BL-HZD32X-LWB-TRB


SINCE 1981

● Features: 1. Emitted Color: White.


3. Mono-color type.






equipment. 8. Non-YAG phosphor.




, turn signals.



electronics.

4. General use.








Soldering Temperature Tsol See Page 7 -

*1 Condition for IFP is pulse of 1/10 duty and 3 msec width.




SINCE 1981





x 0.26 0.28 0.30 Chromaticity Coordinates

y IF=20mA

0.24 0.27 0.30 -




10

REL

ATIV

E LU

MIN

OU

S IN

TEN

SITY

(@20

mA)

0

0.5

1.0

1.5

2.0


20 30 40 50


RE

LATI

VE

RA

DIA

NT

INTE

NSI

TY

3500

400

0.5

1.0

WAVELENGTH λ (nm)

450 500 550 600 650 700 750 800

40


-20-400

A

REL

ATIV

E LU

MIN

OU

S IN

TEN

SITY

(NO

RM

ALIZ

ED A

T 20

mA)

0.5

1.0

1.5

2.0

2.5

3.0

0 20 60

80



FOR

WA

RD

CU

RR

EN

T (m

A)

1010

0

20

30

40

50

60

20 40 60 100


50

01

FOR

WA

RD

CU

RR

EN

T (m

A)

10

20

30

40

FORWARD VOLTAGE (V)2 3 4 5


10

0.2

0.8

0.7

0.30.5 0.1

0.9

1.0

0

60

0.4 0.6

80

90

70

50

40

30

20


RE

LATI

VE

RA

DIA

NT

INTE

NSI

TY

CHROMATICITY COORDINATEFig.7 FORWARD CURRENT VS.

y

CHROMATICITY COORDINATEFig.8 AMBIENT TEMPERATURE VS.

100℃

50℃25℃

0℃

-30℃

IFP=20mA

100mA 50mA

20mA5mA

1mA

Ta=25℃

y

0.300.280.270.260.25

0.31

0.30

0.29

0.28

0.27

0.29 0.31

0.26

0.250.300.280.270.260.25

0.31

0.30

0.29

0.28

0.27

0.29 0.31

0.26

0.25



SINCE 1981


0.3


220

245

470


645

210

185

6 box/carton

Bar Code Label

12 bag/box

200

3000 pcs/reel



SINCE 1981

x

y

0.22 0.23 0.24 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32

0.23

0.24

0.25

0.26

0.27

0.28

0.29

0.30

0.31

0.32

3-3

3-6

3-5

4-7

4-6 4-16

4-17

3-15

3-16

3-17

3-4

3-13

3-14

4-5

4-4

4-15

4-8 4-183-18

C.I.E CHROMATICITY DIAGRAM


BIN CODE Min. (mcd) Max. (mcd) VB 873 1070

WA 1070 1305

WB 1305 1600

XA 1600 1958



BIN CODE Min.(V) Max.(V) G2 2 .9 3 .0

H1 3 .0 3 .1

H2 3 .1 3 .2

J1 3 .2 3 .3

J2 3 .3 3 .4

K1 3 .4 3 .5

Tolerance for each Bin limit is ± 0.02V.




SINCE 1981

BIN Chromaticity Coordinates x 0.270 0.260 0.260 0.270 3-3 y 0.240 0.240 0.250 0.250 x 0.270 0.260 0.260 0.270 3-4 y 0.250 0.250 0.260 0.260 x 0.270 0.260 0.260 0.270 3-5 y 0.260 0.260 0.270 0.270 x 0.270 0.260 0.260 0.270 3-6 y 0.270 0.270 0.280 0.280 x 0.280 0.270 0.260 0.280 3-13 y 0.240 0.240 0.250 0.250 x 0.280 0.270 0.260 0.280 3-14 y 0.250 0.250 0.260 0.260 x 0.280 0.270 0.270 0.280 3-15 y 0.260 0.260 0.270 0.270 x 0.280 0.270 0.270 0.280 3-16 y 0.270 0.270 0.280 0.280 x 0.280 0.270 0.270 0.280 3-17 y 0.280 0.280 0.290 0.290 x 0.28 0.270 0.270 0.280 3-18 y 0.290 0.290 0.300 0.300 x 0.290 0.280 0.280 0.290 4-4 y 0.250 0.250 0.260 0.260 x 0.290 0.280 0.280 0.290 4-5 y 0.260 0.260 0.270 0.270 x 0.290 0.280 0.280 0.290 4-6 y 0.270 0.270 0.280 0.280 x 0.290 0.280 0.280 0.290 4-7 y 0.280 0.280 0.290 0.290 X 0.290 0.280 0.280 0.290 4-8 y 0.290 0.290 0.300 0.300 x 0.300 0.290 0.290 0.300 4-15 y 0.260 0.260 0.270 0.270 x 0.300 0.290 0.290 0.300 4-16 y 0.270 0.270 0.280 0.280 x 0.300 0.290 0.290 0.300 4-17 y 0.280 0.280 0.290 0.290 x 0.300 0.290 0.290 0.300 4-18 y 0.290 0.290 0.300 0.300

Tolerance for each Bin limit is ± 0.005. ● BIN： x x x V F B I N C O D E





SINCE 1981




0/20


MIL-STD-202:103B JIS-C-7021 :B-11


0/20


MIL-STD-883:1008 JIS-C-7021 :B-10


Endurance Test



Temperature Cycling



0/20



0/20Environmental

Test

Solder Resistance



0/20


Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage VF ( V) IF=20mA Over U1x1.2 Reverse current IR(uA) VR=5V Over U1x2







SINCE 1981

● Soldering :




● Handling :


Temperature

Time

OVER 2 MIN.

4℃ /SEC. MAX.

4℃ /SEC. MAX.

10 SEC. MAX.

260℃ MAX.140~160℃

Temperature

Time

120~180 sec.

Preheat



120~150℃

Documents

Features: BRIGHT LED ELECTRONICS CORP. Package Dimensions · equipment. 8. This product doesn’t contain restriction ... Measuring items Symbol Measuring conditions Judgment criteria