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25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 1
ESTEC TOS-MCThermal and Structures Division
SIMULOG
STEP for Space Applications -TAS and NRF Development
Hans Peter de Koning (ESA/ESTEC D/TOS-MCV)[email protected]
Eric Lebègue (SIMULOG)[email protected]
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 2
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Topics of this presentation
• Overview of Application Protocols
• Current status of implementations
• Brief demo with ESARAD
• STEP-TAS Converter Development Toolkit
STEP-NRFNetwork-modelResults Format
Application Protocol
STEP-TASThermal Analysis
for Space
Application Protocol
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 3
ESTEC TOS-MCThermal and Structures Division
SIMULOG
NRF and TAS main documents
STEP-NRFNetwork-modelResults Format
Application Protocol
STEP-TASThermal Analysis
for Space
Application Protocol
Definition and Resultsof Analyses, Tests
& Operations
Integrated Application Resource
SpaceDomain
Integrated Application Resource
ThermalAnalysis
Integrated Application Resource
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 4
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Application Reference Model& Units of Functionality
TASspace_mission_aspects
geometric_modelkinematic_model
thermal_radiative_modelvisual_presentationmaterial_properties
additional_physical_quantities_and_measures
NRFproduct_structurenetwork_model_representationbulk_resultsparameterized_functionsdate_and_timegeneral_support
The ARM is organised in UoFsUoFs are collections of application objects and their relationships specified in the terminology of the application domain
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 5
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Main characteristics of NRF (1)
• Generic discipline-independent protocol
• Scope is definition and representation of:– engineering objects represented by a network-model of discrete
nodes and relationships between the nodes -network-model may contain a submodel hierarchy
– representation of properties of engineering objects for which result values can be predicted / observed at discrete states
– analysis, test or operational campaigns / cases / phases
– analysis, test or operational runs with associated results
– product structure compliant with AP203 CC1 / PDM schema
– relationships between product structure and network-model
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 6
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Main characteristics of NRF (2)
• Results are properties with value and unit– Descriptive values (text string, item from enumerated list)
– Numerical values (scalar, vector, tensor)
– Parameterised function values (tabular interpolation, polynomial, limited expressions)
• NRF protocol has two separate parts:– “Static protocol”, discipline-independent data structures
– Dictionairies defining node and node-relationship classes, properties, property-qualifiers, property-value-range, ...
• Purpose of dictionairies is to enable flexible / adaptable use without need to re-issue the standard
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 7
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Main characteristics of NRF (3)
• Great care is taken to define light, efficient data structures
– Sparsely populated results value space
– Properties only one kind of unit in a data set
• Starting on development of a “best of both worlds” solution
– NRF for semantics
– HDF5 for efficient binary portable implementation method (HDF = Hierarchical Data Format by NCSA)
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 8
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Main characteristics of TAS (1)
• Self contained, complete Application Protocol– AAM, ARM, Mapping Table, AIM, Express-G (586 pages)
– Conforms to TC184/SC4 methods and guidelines
• Geometry defined as AP203 CC4 surfaces
• Thermal-radiative model faces added as associated features– Including possibility to support hierarchical submodel tree
– Associated notional thickness, surface material and bulk material
– Thermo-optical, thermo-physical properties for named material
– Concept of material property environment (Part 45)
• Kinematic model conform STEP Part 105 for articulating rigid bodies (e.g. rotating solar arrays, gimballed antennas)
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 9
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Main characteristics of TAS (2)
• Space mission aspects– orbit arc (Keplerian and discrete ephemeris)
– space co-ordinate system, celestial bodies
– orientation, general and named pointing, spinning, linear rotation rates
– space thermal environment, including constant or lat/long dependent albedo / planetshine tables
• Boolean construction surfaces available for advanced tools
• STEP-TAS CC1 Abstract Test Suite– conform STEP Part 3xx series
– test suite has been used in validation of TAS processors
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 10
ESTEC TOS-MCThermal and Structures Division
SIMULOG
TAS geometry and thermal-radiative models
p2
direction-1
direction-2
p3
p1
diameter
start_angle
end_angle
• Shapes– Primitives: triangle, rectangle,
quadrilateral, disc, cylinder, cone, sphere, paraboloid
– Compound shapes
– Shapes conform to AP203 CC4 non-manifold surfaces
• Thermal-radiative model– associates thermal-radiative
faces with surface shapes
– thermal mesh
– surface and bulk material
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 11
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Illustration of basic TAS Keplerian orbit definition
periapsis
apoapsis
true_anomaly
North
ascending_node
right_ascension_of_ascending_node
argument_of_periapsis
main body (of spacecraft)
to star
declination
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 12
ESTEC TOS-MCThermal and Structures Division
SIMULOG
STEP-TAS Conformance Classes
thermal-radiative model with basic geometry
kinematic model
constructivegeometry
space missionaspects
CC-1
CC-2
CC-3
CC-4
CC-5
CC-6
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 13
ESTEC TOS-MCThermal and Structures Division
SIMULOG
STEP-NRF implementation status
• Read/write library available with C and FORTRAN binding
• Prototypes produced with CNES and Electricité de France
• Being prepared for use in ESA’s next generation integrated thermal analysis tool code-named ‘Polytan’ as an open post-processing interface
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 14
ESTEC TOS-MCThermal and Structures Division
SIMULOG
STEP-TAS Implementation Status
• Read/write libraries available with C and FORTRAN bindings – Including programming tutorials / manuals (HTML and PDF)
– Ported and verified on 5 platforms: PC/Windows, Sun/Solaris, HP/HP-UX, Compaq-Dec/Tru64, SGI/Irix
– High level interface layer included at ARM/user domain level; Provides very significant savings in processor development effort
• Working processors– CC1 processor in ESARAD 4.1.x (released summer 1999)
– CC1 processor in THERMICA release April 2000
– Currently large model cross validation ESARAD - THERMICA
– Proof-of-concept prototypes developed with NASA-JPL for TRASYS and TSS (1998)
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 15
ESTEC TOS-MCThermal and Structures Division
SIMULOG
ROSETTA in ESARAD
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 16
ESTEC TOS-MCThermal and Structures Division
SIMULOG
ROSETTA in Baghera View
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 17
ESTEC TOS-MCThermal and Structures Division
SIMULOG
ROSETTA in THERMICA
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 18
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Doris in THERMICA
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 19
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Doris in Baghera View
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 20
ESTEC TOS-MCThermal and Structures Division
SIMULOG
DORIS in ESARAD
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 21
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Mars Rover in TSS
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 22
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Mars Rover in Baghera View
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 23
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Mars Rover in ESARAD
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 24
ESTEC TOS-MCThermal and Structures Division
SIMULOG
Mars Rover in THERMICA
25-27 January 2000
NASA's STEP for Aerospace Workshop at JPL Sheet 25
ESTEC TOS-MCThermal and Structures Division
SIMULOG
STEP-TAS future
• STEP-TAS Processor Development Kit available to thermal analysis tool vendors– From SIMULOG at nominal cost EURO/USD 1000 (Jan-2000)
Including initial e-mail tech-support
– Baghera View is available in addition (Contact Eric Lebègue)
• ESA is considering proposing STEP-TAS to ISO TC184/SC4– New Work Item leading to new ISO 10303 part
• Continue large model cross-validation and performance tuning
• Initiate support for other conformance classes