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position consisting essentially of from 0.01 to 45% by weight poly- vinylidene fluoride based poly- mer; and from greater than 55 to 99.99% polyamide polymer se- lected from the group consisting of polyamide 11 and polyamide 12 .
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Chemical Milling Conversion Coating I
COMPOSITE PMTING APPARATUS U.S. Patent 6,086,731. July 11, 2000
0. Ishigami et al., assignors to Honda Giken Kogyo KK, Tokyo An apparatus for forming a com- posite plating film on an inner surface of a hollow section of a workpiece, which comprises a cy-
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lindrical electrode adapted to be disposed in the hollow section of the workpiece with a surrounding gap left between a surface of an outer wall of the electrode and the inner surface of the hollow sec- tion; and a plating liquid circulat- ing mechanism for supplying com- posite plating liquid, consisting of ceramic particles mixed in plating liquid, to an interior of the cylin- drical electrode, for passing the composite plating liquid through the through-holes of the outer wall of the electrode to be then jetted onto the inner surface of the hollow section, and for collect- ing the jetted composite plating liquid f-rum a region surrounding the cylindrical electrode.
ELECTROPLA’IING BATH FOR SLIDING BEARINGS U.S. Patent 6,086,?42. July 11, 2000 H.U. Huhn et al., assignors to Glyco- Metall-Werke, Glyco B. v. & Co. KG, Weisbaden
A process for producing multi- layer materials for plain bearings comprising preparing a metallic backing layer; applying a bronze layer to the backing layer; elec- trodepositing a binary layer on the bronze layer selected from a group of materials consisting es- sentially of lead-based and tin- based alloys in an electroplating bath having a nonionic wetting agent and a benzene derivative anodically activating at least one surface layer of t and electroplati num-based runn 1 the binary layer.
le binary layer; lg a molybde- ng-in layer on
ELECfROLESS GOLD DEPOSITION U.S. Patent 6,086,946. July 11, 2000 G.L. Ballard et al., assignors to International Business Machines Corp., Armonk, N. Y.
A method for electroless gold dep- osition comprising forming copper circuit features on a substrate by an additive process employing a