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레이저 미세가공 서비스
KORTherm Science Co.,Ltd.- Advanced Laser Technology
Mass production
R&D
(Out Sourcing)
Customized OrderFeasibility test
Small volume
Order
➢ Mass production
Business Area 레이저미세가공 서비스 범위
기업이나 기관에서 표준화 된 제품 또는 시리즈 제품에 필요한 레이저 미세가공 공정을의뢰받아 당사 보유 레이저로 지속적이고 장기적인 가공서비스 제공
초미세 레이저 장비의 도입을 검토 중인 기업 또는 레이저를 이용한 가공 공정이 필요한기업이나 기관의 의뢰로 테스트 진행하여 적합한 solution 제공
레이저를 이용한 가공에 어려움을 겪고 있는 고객들의 다양한 가공의뢰에 대해 당사가보유한 가공기술을 최적의 요구조건에 맞추어 제공하는 1:1 맞춤형 서비스
레이저 가공의뢰에 있어 소량이고 단기적인 샘플 시범 테스트을 의뢰하는 대학,기업 등기타 연구소에 대해 당사의 풍부하고 전문화된 기술을 제공
➢ R&D Test (Feasibility Test)
➢ Customized Order
➢ Small volume Order
LaserMicro-Machining
레이저미세가공
(주)코썸사이언스레이저미세가공서비스
✓ 10년 이상 축적된 독자적이고 전문화된레이저 응용기술을 보유하고 있어 다양한application 제공.
✓샘플의 thermal expansion 극소화로최대의 가공 정밀도와 정확한 테스트결과 제공.
✓ 다양한 파장의 Laser (CO2, Nd-YAG, Fiber) 장비를 보유하고 있어 polymer, thin-film,ceramic, metal, glass 등 여러 가지 소재의가공 가능.
➢ Laser Processing Development
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Service Process 서비스 진행절차
1. 가공 의뢰 · 기술상담2. 가공 결과 중간 점검3. 비용 결제
1. 견적서 송부2. 가공물 (샘플) 수령3. 초기가공 · 중간보고4. 최종가공 · 결과물 송부5. 비용 청구
Customer
(주)코썸사이언스
Sample test procedures
Tested Sample(Output)
레이저응용기술연구소
축적된 데이타
OptimizedSolutions
연구기관
대학기업
Customer
KORTherm Science Co.,Ltd.- Advanced Laser Technology
❖ Cutting
❖ Hole Drilling
❖ ITO / FTO Patterning
❖ Scribing
❖ Marking & Engraving
❖ Film Cutting (Polymer 계열)
❖ Transparent materials such as Glass, Quartz, Sapphire, Fused Silica(CaF2, MgF2)
❖ ITO/PI, ITO/PET, ZnO/PI, ZnO/PET
Key Applications 레이저미세가공 응용범위
❖ Solar Cell
❖ Wafer
❖ Thin Film
❖ Polymer
✓ Flex Circuits
✓ Hydrogel
✓ Kapton
❖ Natural Materials
✓ Silicon
✓ Quartz
✓ Sapphire
✓ Silica
✓ Paper/Cardboard
✓ Wood
✓ Mica
❖ Glass
✓ Aerogel
✓ Fused Silica
Materials
❖ Ceramics
✓ Alumina
✓ Aluminum Nitride (ALN)
✓ Black Ceramic
✓ Ferrite
✓ Green Ceramic
✓ LTCC / HTCC
✓ Piezo Ceramic
✓ Yttria Stabilized Zirconia
❖ Thin Metals / Foils
✓ Aluminum Foil
✓ Brass Foil
✓ Copper Foil
✓ Gold Foil
✓ Molybdenum
✓ Nickel Foil
✓ Titanium Foil
❖ Metals
✓ Bronze
✓ Cobalt
✓ Cold Rolled Steel
✓ Germanium
✓ Hardened Steel
✓ Hot Rolled Steel
✓ Mild Steel
✓ Molybdenum
✓ Silver
✓ Stainless Steel
✓ Steel
✓ Tantalum
✓ Tungsten
❖ Plastics
✓ Acrylic
✓ Lexan
✓ Lucite
✓ Polycarbonate
✓ Styrene
❖ Laminates
✓ Duroid
✓ Flex Circuits
✓ Garrolite
❖ Expoxies
✓ Conductive Epoxy
✓ Epoxy Preforms
✓ Frozen Epoxy
❖ Alloys
✓ Kovar
✓ Mild Steel
✓ Molybenum
✓ Nitinol
✓ Stainless Steel
✓ Steel
✓ Superalloys
✓ Tantalum
✓ Zircaloy
❖ Adhesives
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Polymer
Scribing of IMI film on GlassWavelength: 532nm
Wavelength: 1064nmPulse energy: Rep rate: 40kHz
Film ReleaseWavelength: 532nm
Hole Drilling(on the PI film)Wavelength: 355nm
FTO Patterning (FTO on glass)Wavelength:1060nm
FTO Patterning(on the PI film)Wavelength: 1080nm
Polyimide FilmWavelength: 532nm
PET FilmWavelength: 355nm
PET FilmWavelength: 355nm
FTO Release (FTO on glass)Wavelength: 355nm
Polyimide Film CuttingWavelength: 355nm
ITO Scribing (Including Ag)Wavelength: 355nm
Hole DrillingWavelength: 355nmThickness: 2.8mm
Polaroid Film PatterningWavelength: 355nm
ITO Scribing (Ag Including)Wavelength: 355nm
PET Easy CutWavelength: 355nm
ITO Patterning (on the PET film)Wavelength: 355nm
PET Film Wavelength: 10.6 μm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Polymer
PMMA CuttingWavelength: 10.6 μm
Acrylic Resin PatterningWavelength: 10.6 μmThickness: 5mm
PI Film DrillingWavelength: 355nm
ITO Patterning Wavelength: 1,080nm(PICO Laser)
Ag Film Punching(Ag & Polymer Film)Wavelength: 10.6 μm
PI Film DrillingWavelength: 355nm
FTO ScribingWavelength: 532nm
Polymer Deposition Thin-film PatterningWavelength: 355nm
ITO Scribing Wavelength: 1,080nm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Wafer (Ceramics)
Ceramic Film PatterningWavelength: 532nm
Solar Cell Wafer DopingWavelength: 532nm
LED CELLWavelength: 532nm
Scribing of CeramicWavelength: 1080nm
Solar cell Wafer Edge isolation Wavelength : 532nm
Wafer DopingWavelength : 532nm
Drilling of Si-WaferWavelength: 1064nmPulse energy: Rep rate: 10kHz
Edge Isolation of Si SolarcellWavelength: 1064nmPulse energy: Rep rate: 500kHz
Removal of CIGS on Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHz
Removal of TCO on CIGS +Mo Glass
Wavelength: 1064nm
Si Wafer Round CuttingWavelength: 532nmThickness: 520 μm
Si Wafer Pattern CuttingWavelength: 532nm
Silicone SheetHole DrillingWavelength: 355nm
AIN Wafer HoleDrillingWavelength: 355nm
Si Wafer Pattern CuttingWavelength: 532nm
Ceramic HoleWavelength: 10.6 μm
Si Wafer DrillingWavelength : 532nm
Si Wafer Align Key MarkingWavelength: 355nm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Wafer (Ceramics)
Patterned Si-Wafer Cutting(Membrane Pattern)Wavelength: 355nm
ARC Ablation(Anti-Reflective Coating)Wavelength: 355nm
Si Wafer CuttingWavelength: 532nm
Green Sheet Scribing(Unfired Ceramic Sheet)Wavelength: 532nm
Si Wafer Full CuttingWavelength: 532nm
LGBC Scribing (Laser Grooved Buried Contracts)Wavelength: 355nm
Ceramic Cutting(Ni Oxide + YSZ)Wavelength: 1064nm
Si Wafer Round CuttingWavelength: 532nm
Si Wafer Cutting(Membrane Pattern)Wavelength: 532nm
Si Wafer Full Cutting(Cross-Section)Wavelength: 532nmThickness: 0.3mm
Ceramic Cutting(Ni Oxide + YSZ)Wavelength: 1064nm
Si Wafer Hatching PatterningWavelength: 355nm
Fired Ceramic Sheet (Via Hole)Wavelength: 355nm
Si Wafer PatterningWavelength: 532nm
Si Wafer ScribingWavelength: 532nm(Scanner Type)
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Metal
Via HoleWavelength: 355nm
Ferrite CompoundCutting(Cross-Section)Wavelength: 355nmThickness: 150μm
Metal on PETWavelength: 10.6μm
SUS Thin Film Hole DrillingWavelength: 355nm
Metal Hole DrillingWavelength: 355nm
Cu Thin Film DrillingWavelength: 355nm
Tungsten-Carbide Hole Drilling(Via Hole)Wavelength: 355nm
Wafer DopingWavelength : 532nm
Gold Thin FilmPatterning(Inner PDMA Film)Wavelength: 532nm
Mo (Molybdenum)Thin Film Hole DrillingWavelength: 355nm
Tungsten-Carbide& Nickel Complex Hole Drilling(Via Hole)Wavelength: 355nm
Mg Surface PatterningWavelength: 355nm
Cu Wafer CuttingWavelength: 532nm
Aluminium Oxide Wafer Hole DrillingWavelength:355nm
Scribing of ZnOon glassWavelength: 532nm
Removing of ZnO on GlassWavelength: 355nmRep rate: 30kHz
Mo Scribing(Solar Cell Thin Film)Wavelength: 532nm
Tantalum (Ta)Hole DrillingWavelength: 532nm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Metal
SUS ScribingWavelength: 355nm
Cathode/Anode Electrode Cutting(Copper & Aluminium)Wavelength: 355nmThickness: 25μm
Invar Steel (Fe-NI) ScribingWavelength: 355nm
SUS420J2 ScribingWavelength: 355nm
Pure Mg Cutting(Magnesium)Wavelength: 355nm
Ag Coated GdBCO on STS Cutting(Cross-Section) Wavelength: 355nm
Au Pad Full ScribingWavelength: 355nm
Copper Foil Hole DrillingWavelength: 532nm
Back Electrode Film Ablation (ZnO on the Glass)Wavelength: 355nm
Ag Nano Wire Thin-film ScribingWavelength: 1064nm
Cu Hole DrillingWavelength: 355nmThickness: 0.1mm
SUS Hole DrillingWavelength: 355nmThickness: 0.1mm
Alumina Tube Hole DrillingWavelength: 10.6μm
SUS304 Hole DrillingWavelength: 355nm
Metal Film PatterningWavelength: 355nm
AluminiumThrough Line PatterningWavelength: 532nm
Si Wafer Metal Layer AblationWavelength: 355nm
Metal Oxide Film AblationWavelength: 532nm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Transparent Materials & Etc.
Graphite PatterningWavelength: 355nm
Artificial Diamond PatterningWavelength: 532nm
Scribing of GlassWavelength: 532nmRep rate: 30kHz
Hole Drillingon the AluminiumWavelength : 355nm
Glass PatterningWavelength: 355nm
Quartz PatterningWavelength: 355nm
Quartz Micro-HoleDrilling(Cross-Section)Wavelength: 355nm
Epoxy Resin PatterningWavelength: 10.6μm
Quartz ScribingWavelength: 10.6μm
Slide Glass CuttingWavelength: 355nm
Sapphire Micro-HoleDrillingWavelength: 355nmThickness: 420μm
Soda-Lime Glass HoleScribing (Via Hole)Wavelength : 355nm
Superconductor GdBCO Thin Film Scribing(Cross-Section)Wavelength: 355nm
Superconductor GdBCO Thin Film Hole Drilling(Through Hole)Wavelength: 355nm
Flexible Gorilla Glass CuttingWavelength: 355nm
Graphene CuttingWavelength: 355nm
Quartz Hole Patterning(Via Hole)Wavelength: 355nm
Carbon Disk Hole Drilling(100% Carbon)Wavelength: 355nm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Samples 레이저미세가공 결과
Transparent Materials & Etc.
Sapphire Wafer Cutting(Cross-Section)Wavelength: 355nm
PMN-PT Patterning(Piezoelectric Element)Wavelength: 532nm
Gold/Pt/CVD Diamond Pattern Scribing(Using Edge Alignment)Wavelength: 355nm
Glass Full CuttingWavelength: 355nmThickness: 0.5T
Glass Microwire CuttingWavelength: 355nm
Quartz Thin Film CuttingWavelength: 355nm
Sapphire Wafer ScribingWavelength: 355nm
OLED Light Hole DrillingWavelength: 355nmThickness: 0.88mm
Glass Channel Patterning(Lab-on-a-chip)Wavelength: 355nm
Quartz Wafer Hole DrillingWavelength: 10.6μmThickness: 500μm
Glass Full Cutting Wavelength: 355nm
Quartz Wafer Round CuttingWavelength: 10.6μmThickness: 680μm
Transparent Electrode ScribingWavelength: 355nmThickness: 0.71mm
KORTherm Science Co.,Ltd.- Best choice for Laser Applications
Laser Micro-Machining System 레이저미세가공 시스템
❖ Nd-YAG (DPSS) LASER
- 355nm / 532nm / 1064nm
❖ CO2 LASER
- 10.6㎛ / 9.35㎛ / 9.4㎛
❖ FIBER LASER
- 1080nm
❖ EXCIMER LASER
- 193nm / 248nm
레이저 미세가공 서비스
.
주 소 : 인천광역시 부평구 청천동 425 우림라이온스밸리 C동 1203B호
phone : 032) 623-6320~4 | fax : 032) 623-6325 | e-mail : [email protected]
032) 623-6326~7 [email protected]
(주)코썸사이언스
http://www.kortherm.co.kr
(주)코썸사이언스는 다양한 파장의 레이저를 보유하고 있습니다.
문의 주시면 다양한 응용분야에 맞는 샘플테스트를 실비로 이용 가능합니다.
We have wide range of selection for laser and we can provide the complete sample test work
corresponding to required applications.