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EE141 1 Test Principles and Architectures Chap. 11 - Analog and Mixed- Signal Testing - P.1 Chapter 11 Chapter 11 Analog and Mixed-Signal Testing Analog and Mixed-Signal Testing

EE141 VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.1 1 Chapter 11 Analog and Mixed-Signal Testing

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EE1411

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.1

Chapter 11Chapter 11

Analog and Mixed-Signal TestingAnalog and Mixed-Signal Testing

EE1412

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.2

What is this chapter about?What is this chapter about?

Introduces AMS circuits, failure modes and fault models.

Addresses analog testing, including DC and AC parametric testing.

Discusses mixed-signal circuits, ADC and DAC, and their testing approaches.

Studies IEEE Std. 1149.4, the standard for mixed-signal test buses

EE1413

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.3

Chapter 11Chapter 11Analog and Mixed-Signal TestingAnalog and Mixed-Signal Testing

Introduction Analog Circuit Testing Mixed-Signal Testing IEEE Std. 1149.4 Standard for Mixed-

Signal Test Bus Concluding Remarks

EE1414

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.4

11.1 Introduction11.1 Introduction

Analog Circuit Properties Analog Defect Mechanism and Fault

Models

EE1415

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.5

Analog, Digital, and Mixed-Signal Signals Analog, Digital, and Mixed-Signal Signals

1

0

AnalogAnalog Mixed-SignalMixed-Signal DigitalDigital

EE1416

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.6

Analog Circuit PropertiesAnalog Circuit Properties Continuous Signal Large Range of Circuits Nonlinear Characteristics Feedback Ambiguity Complicated Cause-Effect Relationship Absence of Suitable Fault Model Accurate Measurements Required

EE1417

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.7

Properties - Properties - Continuous SignalContinuous Signal

• Logic 1, Logic 0• VIH, VIL, VOH, VOL• Rise Time, Fall Time• Propagation Delay H-L/L-H• Noise Margin High/Low

Digital Signal Analog Signal

• Voltage/Current• Slew Rate• Overshoot• Damping Factor• Frequency• Bandwidth

VH

VL

tLH tHL

SR

tSettle

VOV

VA

EE1418

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.8

Properties - Properties - Large Ranges of CircuitsLarge Ranges of Circuits

Digital Circuits Analog Circuits

•Operation •Static Logic•Dynamic Logic

•Structure•Gates•PLA•Memory

• Operation• Current Mode• Voltage Mode• Switching Cap

• Structure• Amplifier• Multiplier• Rectifier• Resonator

EE1419

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.9

Properties- Properties- Nonlinear CharacteristicsNonlinear Characteristics Analog circuits are nonlinear in nature

Nonlinear cause effect

DI

DV

2)(2

1tgsoxD VV

L

WCI TD VnV

sD eII /

EE14110

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.10

Properties- Properties- Feedback AmbiguitiesFeedback Ambiguities Feedback puts circuit parameters together Difficult to identify fault location

-

+

-

+

EE14111

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.11

Properties- Properties- Complicated Cause-Effect RelationshipComplicated Cause-Effect Relationship

Difficult to determine the cause of error.

12

i

0

RRA

1

AV

VA

)(

1

2

i

0V R

R

V

VA

EE14112

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.12

Properties – Properties – Absence of Suitable Fault Absence of Suitable Fault ModelsModels

Digital Faults

• Good Logic Fault Model• Generally Accepted

• Stuck-at-1, Stuck-at-0• Stuck-Open, Stuck-On• Short. Open• Memory Faults• PLA Faults

EE14113

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.13

Properties - Properties - Absence of Suitable Fault ModelsAbsence of Suitable Fault Models

An

alog

Fau

lts

• No Good Fault Model• Not Generally Accepted

• Open Short• Missing/Extra Devices• Parameter Variation• Performance Deviation• Circuit Structure Related• Functional Faults• ???????????

EE14114

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.14

PropertiesProperties – – Accurate Measurements RequiredAccurate Measurements Required

Digital Instrument

• Oscilloscope• Function Generator• Logic Analyzer• Frequency Counter

EE14115

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.15

An

alo

g In

stru

men

t• Oscilloscope• Function Gen• Freq. Counter• Spectrum Analyzer• Network Analyzer• Impedance Analyzer• Timing Analyzer• Communication Analyzer• RF Instrument• Optical Instrument• Microwave Instrument

Properties – Properties – Accurate Measurements RequiredAccurate Measurements Required

EE14116

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.16

11.1 Introduction11.1 Introduction

Analog Circuit Properties Analog Defect Mechanism and Fault

Models

EE14117

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.17

Defect Mechanisms (1)Defect Mechanisms (1) Material Defects

cracks crystal imperfection surface impurities ion migration

Processing Faults oxide thickness mobility change impurity density diffusion depth dielectric constants metal sheet resistance missing contacts dust

EE14118

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.18

Defect Mechanisms (2)Defect Mechanisms (2)

Time-Dependent Failures dielectric breakdown electron migration

Packaging Failures contact degradation seal leakage

EE14119

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.19

Analog Fault Model Analog Fault Model

Defects/Failure

Hard Faults Soft Faults

EE14120

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.20

Analog Faults - Analog Faults - DefectDefect

• Defects• Extra Defects• Etching Defects

• Source• Dust• Lithography

• Layout Oriented• Statistical Model

EE14121

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.21

Analog Faults - Analog Faults - Hard FaultsHard Faults

•Fault Models•Open•Short•Missing Device•Extra Devices

•Faulty Effects•Catastrophic Error•Module Malfunction•System Failure

EE14122

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.22

Analog Faults - Analog Faults - Soft FaultsSoft Faults

• Parametric Faults• Io: 100uA -> 50uA• W: 20um -> 10um

• Deviation Faults• fo: 10MHz -> 5MHz• Gain: 10000 -> 2000

• Sources• Mobility• Oxide Thickness• Impurity Density• Defusion Depth• Dielectric Constants• Metal Sheet Resistance

EE14123

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.23

Analog Fault - Analog Fault - Model MappingModel Mapping

Deviation Faults

Parametric Faults

Functional Level

Circuit Level

Layout Level Extra Defects Etching Defects

EE14124

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.24

Analog Faults - Analog Faults - Model MappingModel Mapping

Layout to Parametric• Defect Statistics

– Randomly insert dusts of random size.

• Parameter Statistics– Simulate the effect of dust on

transistor parameters

L

WCK ox

Ko

EE14125

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.25

Analog Faults - Analog Faults - Model MappingModel Mapping

Parametric to Deviation• Use SPICE simulation

and statistics to derive the performance deviation.

L

WCK ox

Ko Fto

EE14126

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.26

Studied the analog test properties Nonlinearity, Feedback Ambiguity No good fault model

Overview the analog test plan Test Code, Binning, Sequence Control Focused Calibrations, DIB Checkers Characterization and Simulation Code

Analog Fault Model Extra and Etching Defects Parametric and Deviation faults Model Mapping

11.1 Summary11.1 Summary

EE14127

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.27

11.2 Analog Circuit Testing11.2 Analog Circuit Testing

Analog Test Approaches Analog Test Waveforms DC Parametric Testing AC Parametric Testing

EE14128

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.28

Analog Testing Analog Testing

Spec Oriented

WaveformOriented

EE14129

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.29

Specification Oriented TestSpecification Oriented Test

Analog Devices, Inc.TM

EE14130

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.30

Specification Oriented TestSpecification Oriented Test Specification Oriented Test

Check whether all the specs are metTedious and inflexible

Example: Operational AmplifierDC Specifications

–Input Offset Voltage–Input Bias Offset Current–Open-Loop Gain–Noise–Common Rejection Ratio–Temperature Drift

AC Specifications– Bandwidth– Harmonic Distortion– Slew Rate– Settling Time– Noise

EE14131

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.31

Waveform Oriented TestWaveform Oriented Test

Waveform Oriented Test Compare waveform to the simulated ones

EE14132

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.32

Waveform Oriented TestWaveform Oriented Test

A DC Bias, Input Offset

B Slew Rate, Damping Factor

C Overshoot, Damping Factor, Bandwidth

D Settling Time, DC Gain

A

B

C

D

EE14133

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.33

Analog Testing - Analog Testing - ComparisonComparison Specification Oriented Test

Require more test runs and time Require accurate instrument Specifications are guaranteed Low defect level

Waveform Oriented Test Less test runs and test time More forgiving on instrument Specifications are not guaranteed Low cost

EE14134

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.34

11.2 Analog Circuit Testing11.2 Analog Circuit Testing

Analog Test Approaches Analog Test Waveforms DC Parametric Testing AC Parametric Testing

EE14135

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.35

Analog Test WaveformsAnalog Test Waveforms

Sine Square (Step) Ramp Triangular

Chirp (Sweep Sine) Arbitrary Modulated

EE14136

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.36

For transient response testing Application: Filter, OPs, VCO, etc Difficult to generate good steps

Waveform - StepWaveform - Step

Trr

r

oo

Tf

Tf

5.3

1)3~4(

160~45

EE14137

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.37

Step change in voltage: Transient testing Step change in frequency: PLL testing Step change in amplitude: AGC testing

Waveform - StepWaveform - Step

Frequency StepVoltage Step Amplitude Step

EE14138

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.38

Waveform - RampWaveform - Ramp

Sawtooth Wave Generation

-

+

Triangular Wave Generation

EE14139

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.39

Also called Sweep Sine Generation: Triangular to VCO Application: Frequency response plotting

Waveform - ChirpWaveform - Chirp

+-

VCO Chirp

EE14140

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.40

Application: Frequency response plotting

Waveform - ChirpWaveform - Chirp

+-

VCOCUTFilter

LPF

EE14141

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.41

Synthesized by DACsCombinations of all kinds of waveform

Waveform - ArbitraryWaveform - Arbitrary

DAC LPF

EE14142

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.42

Modulated/Synthesized Waveforms Communication System Testing

–GSM, CDMA, 1394, USB2, etc.

Modulation–AM, FM, PCM, PWM, QAM, PSK, QPSK

Generated by dedicated instrument

Waveform - Waveform - Modulated/SynthesizedModulated/Synthesized

EE14143

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.43

11.2 Analog Circuit Testing11.2 Analog Circuit Testing

Analog Test Approaches Analog Test WaveformsDC Parametric Testing AC Parametric Testing

EE14144

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.44

DC Parametric TestingDC Parametric TestingRated output current Rated output voltage

Open-loop gain Slewing rate

Unity gain full power response

Unity gain small signal response

Overload recovery Input bias current

Input offset voltage Input offset current

Input noise Input impedance

Supply voltage sensitivity Common mode rejection

Maximum voltage between inputs

Maximum common mode voltage

Temperature drift Source: [Sata 1967]

EE14145

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.45

DC Test – DC Test – Open-Loop Gain MeasurementOpen-Loop Gain Measurement

y

xo V

VA

101

Vi

10K 10K

10K

100

100

y

xo V

VA

101

OctavedB /6

102 103 104 105 106101

20

80

60

40 Ao

tf

dBf3

o

oL I

VR

yV xV

EE14146

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.46

DC Test – DC Test – Unit Gain Bandwidth MeasurementUnit Gain Bandwidth Measurement

dBot fAf 3

100

ti f

SRV

2

o

of I

VR

fR

Inverting Configuration

1k

100

ti f

SRV

2

o

oL I

VR

yV xV yV xV

Noninverting Configuration

ti f

SRV

2

EE14147

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.47

DC Test – DC Test – Common Mode Rejection RatioCommon Mode Rejection Ratio

100

CMV

R1

R1R2

R2

oVCMV

1

2/R

RV

A

VV o

o

oiCM

)/log(20CM

oo V

VACMRR

EE14148

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.48

DC Test – DC Test – Power Supply Rejection RatioPower Supply Rejection Ratio

)/log(20DD

oo V

VAPSRR

DDV

oVDDV

EE14149

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.49

11.2 Analog Circuit Testing11.2 Analog Circuit Testing

Analog Test Approaches Analog Test Waveforms DC Parametric Testing AC Parametric Testing

EE14150

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.50

Test Types Gain Phase Distortion Signal Rejection Noise

Test Setup AGW: Arbitrary Waveform Generator (DAC) Digitizer: Sample and convert to digital (ADC)

Analog AC TestingAnalog AC Testing

AWG CUT Digitizer

DSP

EE14151

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.51

Input sine wave (1KHz) with fixed amplitude Digitize the output waveform DSP (FFT) to eliminate distortion and noise. Check the fundamental amplitude. Detect first order defects in a circuit. Voltage in dBV or dBm

AC – AC – Maximal Output AmplitudeMaximal Output Amplitude

DUTAWG Digitizer

VPP

Clipped

DSP

EE14152

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.52

AC - AC - Frequency ResponseFrequency Response

LPF

Low Pass Filter

HPF

High Pass Filter

BPF

Band Pass Filter

BRF

Band Reject Filter

EE14153

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.53

AC - AC - Frequency ResponseFrequency Response

A (dB)

101 102 103 104 105 106 107

0

-45

-90

-135

-180

Phase

40

20

0

-20

-40

-20dB/dec

-40dB/dec

-20dB/dec

-45/dec

45/dec

))((

)()(

42

62

10

jw1

10

jw1

10

jw110

jwA

• Open Loop Gain 102

• Pole 1: 102

• Pole 2: 104

• Zero: 106

Bode Plot

EE14154

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.54

AC - AC - Frequency ResponseFrequency Response

Pass BandStop Band Stop Band

F

A(dB)Pass Band Ripple

Stop BandRejection

Stop BandRejection

EE14155

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.55

AC - AC - Frequency ResponseFrequency Response

F

A(dB)

Upper LimitMask

Lower LimitMask

EE14156

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.56

AC - AC - Frequency ResponseFrequency ResponseFrequencies of special interests

EE14157

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.57

AC - AC - Frequency ResponseFrequency Response

•Multi-tone Test Waveform

ki

1iiii tAtA )sin()(

EE14158

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.58

AC - AC - Frequency ResponseFrequency Response

•Multi-tone Test Waveform

ki

1iiii tAtA )sin()(

EE14159

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.59

•Distortion•Harmonic Distortion• Intermodulation Distortion•Crossover

•Cause•Nonlinearity of the circuit•Clip (saturation)•Mismatch of the devices

AC – AC – Noise and DistortionNoise and Distortion

EE14160

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.60

AC – AC – Noise and DistortionNoise and Distortion•Apply sinusoidal waveform•Do Fourier transform on response waveform

•Obtain F domain properties mathematically. Filter FFT

dB Fundamental

Peak Harm.

Noise Flour

Offset

Analysis

EE14161

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.61

AC – AC – Noise and DistortionNoise and Distortion

dBFundamental

Harmonics

DCOffset

F

NoiseF

H2 H3H4

H5Ni

2

2log10

iN

FSNR%100log10

2

2

2

2

ii H

F

H

FTHD

22

2log10

ii NH

FSNDR

EE14162

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.62

AC – AC – Intermodulation DistortionIntermodulation Distortion

tfAtfAtv 2211 2sin2sin)(

2 4 6 8 10 12 14 16 18 200 22 24

f2 – f12f1 – f2 2f 2 – f1

f1 f2

f1 + f2

2f12f2

3f1 3f 2

7 8

f1 f2

EE14163

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.63

Studied the analog test approaches Specification oriented testing Waveform oriented testing

Outlined the analog test waveforms Sine, step, triangular, chirp, arbitrary, modulated

Discussed DC parametric testing Open-loop gain, unit gain bandwidth CMRR, PSRR

Discussed AC parametric testing Use AWG, Digitizer, and DSP Frequency response, Noise, and Distortion

11.2 Summary11.2 Summary

EE14164

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.64

11.3 Mixed-Signal Testing 11.3 Mixed-Signal Testing

Introduction to Analog-Digital Conversion ADC and DAC Circuit Structure ADC/DAC Specification and Fault Models IEEE Std. 1057 Time-Domain ADC Testing Frequency-Domain ADC Testing

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.65

X in

X out LSBs121110

9876543210

1 2 3 4

1

2

3

4

AD Model - AD Model - QuantizationQuantization

X in

EE14166

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.66

• Quantization error is sawtooth-like. • Uniform distribute between (-q/2, q/2) (q=LSB).

q

)t(x Original signal Quantized signal

t

t

2/q

2/q

)t(nq Quantization error

Quantizatoin – Quantizatoin – Noise ModelNoise Model

EE14167

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.67

• The error contains a lot of jumps.• Error spectral is much wider than the original signal.• The bandwidth of the quantization is proportional to

the slop of the signal and inversely proportional to the quantum size q.

Quantizatoin – Quantizatoin – Noise ModelNoise Model

t

2/q

2/q

)t(nq Quantization error

EE14168

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.68

A sine wave is quantized by a B-bit ADC. How large is the SNR.

Quantization Quantization - Noise Model - Noise Model

qVpn22

2

2p

S

VP

123

22

2

qq

PN

q

)t(x

Original signal

Quantized signal

t

t

2/q

2/q

)t(nq Quantization error

EE14169

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.69

Quantization Quantization - Noise Model - Noise Model

)46log(10

12

2log10log10 12

2

n

p

N

s

q

V

P

PSNR

dBSNR 8.61 For n=10,

dBnSNR )676.1(

EE14170

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.70

11.3 Mixed-Signal Testing 11.3 Mixed-Signal Testing

Introduction to Analog-Digital Conversion ADC and DAC Circuit Structure ADC/DAC Specification and Fault Models IEEE Std. 1057 Time-Domain ADC Testing Frequency-Domain ADC Testing

EE14171

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.71

ADC Architecture - ADC Architecture - Gain StageGain Stage

Gain Filter MUX S/H

ADC

Gain: Provide offset and full scale conversion Filter: Reject off-band noise (anti-aliasing filter) MUX: Provide multiple channel access S/H: Provide steady signal for A-to-D conversion ADC: Actual analog to digital conversion

EE14172

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.72

ADC Architecture - ADC Architecture - Gain StageGain Stage

Gain Filter MUX S/H

ADC

Function: Provides gain and offset Achieve the maximal A/D resolution by scaling the input signal to

match the full A/D input range. Drawbacks:

Introduces noise, nonlinearity, drift Expense of tight-tolerance Require calibration

EE14173

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.73

ADC Architecture - ADC Architecture - Filter StageFilter Stage

Gain Filter MUX S/H

ADC

Function: Attenuate the out-of-band noise to prevent aliasing

Filter Position Before the MUX (1 per channel) : maximize speed in

switching channels. After the MUX: minimize mismatching among channels.

EE14174

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.74

ADC Architecture - ADC Architecture - Filter StageFilter Stage

Anti-Aliasing Filter

A(w) A(w) A(w)

Signal Spectrum

Nyquist Rate Sampling

4X Over Sampling

Anti Aliasing Filter Anti Aliasing Filter

EE14175

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.75

ADC Architecture - ADC Architecture - MUX StageMUX Stage

Gain Filter MUX S/H

ADC

Function: Provides multiple access Crosstalk:

The most severe problem Frequency dependent Can be minimized by placing amplifier before the MUX.

Load Issues Avoid too many fanins. Use hierarchical structure.

EE14176

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.76

ADC Architecture - ADC Architecture - S/H StageS/H Stage

Gain Filter MUX S/H

ADC

Function: Provides steady signal Provides signal synchronization,

S/H position: After the MUX for cost reason Before MUX for synchronization and

crosstalk reduction.

MUX

S/H

S/H

S/H

S/H

EE14177

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.77

ADC Architecture - ADC Architecture - S/H Check ListS/H Check List Aperture Time: The time aperture (t3) Acquisition Time: The total time for the S/H to

acquire a full-scale step input signal. (t3 - t1) Aperture Jitter: The uncertainty of aperture time due to

noise or jitter in clock. (t4-t2)

Sample Hold

1t 2t 3t 4t

LSBXVc %S

VinVc

HC

R

H

leakdroop C

IV

EE14178

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.78

ADC Architecture - ADC Architecture - ADC StageADC Stage

Gain Filter MUX S/H

ADC

Executes analog to digital conversionCheck List:

Bit length Accuracy Conversion Rate System Error Budget

▪ Input Signal Range▪ Total System Cost Target▪ Input Impedance▪ AC or DC Inputs BW

EE14179

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.79

DAC Example - DAC Example - R-2R LadderR-2R Ladder

-+

Vref

S1 S2 S3 S4 S5 S6

2R 2RRf=R

Vout

2R 2R 2R 2R

2RRR R R R

60

01

12

23

34

45

5

605142332415

2)222222(

222222

ref

refrefrefrefrefrefo

VSSSSSS

VS

VS

VS

VS

VS

VSV

EE14180

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.80

ADC Example – ADC Example – Pipelined ADCPipelined ADC

S/H

ADC DAC

X 4

3 bits

S/H

ADC

X 4

3 bits

S/H

ADC DAC

X 4

3 bits

S/H

ADC

2 bits

DAC

s1 s2 s3 s4da3da2da1iV

Calibration and Correction Circuit

d0 d7

EE14181

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.81

ADC – ADC – Bits v.s. ThroughputBits v.s. Throughput

ADC Bit-Length Throughput

Flash ~ 6 bits 100 M ~

Pipelined 8 ~ 16 bits 10 ~ 100 MHz

Sigma-Delta 14 ~ bits ~ 10 M

EE14182

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.82

ADC – ADC – Selection MatrixSelection Matrix

17+

14-16

12-13

10-11

8-9

<8

Bits <10kbps 10Kbps to

100Kbps

100Kbps

to 1Mbps

1Mbps to

10Mbps

10 to 100Mbps

100Mbps+

From Analog Devices Inc.

EE14183

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.83

ADC – ADC – Example Example AD775AD775

From Analog Devices Inc.

EE14184

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.84

11.3 Mixed-Signal Testing 11.3 Mixed-Signal Testing

Introduction to Analog-Digital Conversion ADC and DAC Circuit Structure ADC/DAC Specification and Fault Models IEEE Std. 1057 Time-Domain ADC Testing Frequency-Domain ADC Testing

EE14185

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.85

ADC – Offset ErrorADC – Offset Error

Offset

X in

X out

•Offset: constant component of the error that is independent of the inputs

EE14186

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.86

ADC – Gain ErrorADC – Gain Error

X in

X out

•Gain Error: difference between the actual transfer ratio and the ideal ratio

• Also called Calibration Error

EE14187

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.87

ADC – Nonlinearity ErrorADC – Nonlinearity Error

X in

X out

•Nonlinearity error: The deviation of the output quantity from a specified linear reference

EE14188

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.88

ADC – Nonlinearity ErrorADC – Nonlinearity Error

• Integral Nonlinearity:Worst-case deviation from the ideal transfer characteristic curve

• Differential Nonlinearity:Difference between the actual transfer ratio and the ideal ratio

IN = 2 LSB

DN = 0.5 LSB

EE14189

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.89

ADC – Temperature-Dependent ErrorADC – Temperature-Dependent Error•Temperature-Dependent Error: Due to the change in ambient temperature or temperature variation due to self-heating (temperature stability, temperature coefficient)

X in

X out T 3

T 2

T1

EE14190

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.90

ADC – Load-Dependent ErrorADC – Load-Dependent Error

•Load Error: Loading error is due to the effect of a load impedance upon the converter or signal source driving it.

X in

X out RL1

RL2RL1RL1

EE14191

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.91

ADC – Hysteresis ErrorADC – Hysteresis Error

X in

X out

•Hysterisis Error: The difference between the increasing and decreasing input values that produce the same output

EE14192

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.92

ADC – Resolution ErrorADC – Resolution Error

X in

X out

• Resolution Error: The error due to the inability to respond to change of a variable smaller than a given increment

EE14193

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.93

ADC – Missing Code ErrorADC – Missing Code Error

Missing Codes

Ideal Input Waveform

Quantized with missing Code

Quantization Error

EE14194

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.94

11.3 Mixed-Signal Testing 11.3 Mixed-Signal Testing

Introduction to Analog-Digital Conversion ADC and DAC Circuit Structure ADC/DAC Specification and Fault Models IEEE Std. 1057 Time-Domain ADC Testing Frequency-Domain ADC Testing

EE14195

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.95

IEEE 1057 StandardIEEE 1057 Standard

Scope Covers electronic digitizing waveform

recorders, waveform analyzers and digitizing oscilloscopes with digital outputs.

Applies to, but is not restricted to, general-purpose waveform recorders and analyzers.

EE14196

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.96

IEEE 1057 StandardIEEE 1057 Standard

Purpose Provides common methods for testing and

terminology for describing the performance of waveform recorders.

Benefits users and manufacturers of such devices.

Presents many performance features, sources of error, and test methods.

EE14197

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.97

IEEE 1057 – IEEE 1057 – General InformationGeneral Information

Model Number

Dimensions and weight

Power Requirement

Environmental conditions (tem., humidity, EMC/EMI, etc.)

Any special or peculiar characteristics

Available options and accessories

Exception to the above parameters where applicable

Calibration interval

EE14198

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.98

IEEE 1057 – IEEE 1057 – Minimum SpecificationMinimum Specification

Number of digitizing bits Input impedance

Sample rates Analog bandwidth

Memory length Input signal ranges

EE14199

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.99

IEEE 1057 – IEEE 1057 – Additional SpecificationsAdditional SpecificationsGain Fixed error in sample time

Offset Trigger delay and jitter

Differential nonlinearity Trigger sensitivity

Integral nonlinearity Trigger minimum rate of change

Harmonic distortion Trigger hysteresis band

Spurious response Trigger coupling to signal

Maximal static error Crosstalk

Signal to noise ratio Monotonicity

Effective bits Hystersis

Peak error Over voltage recovery

Random noise Word error rate

Frequency response Cycle time

Settling time Common mode rejection ratio

Slew limit Differential input impedance

Overshoot and precursors Maximum operating common

Aperture uncertainty mode signal level

Long-term stability Transition duration of step response

Maximum common mode signal level

EE141100

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.100

IEEE 1057 – IEEE 1057 – Test MethodsTest Methods

General methods Triggering

Input impedance Crosstalk

Gain and offset Monotonicity

Noise Hysteresis

Analog bandwidth Overvoltage Recovery

Frequency response Word Error Rate

Step Response parameters Cycle Time

Time base errors Differential Input Specification

Linearity, harmonic distortion, and spurious responses

EE141101

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.101

11.3 Mixed-Signal Testing 11.3 Mixed-Signal Testing

Introduction to Analog-Digital Conversion ADC and DAC Circuit Structure ADC/DAC Specification and Fault Models IEEE Std. 1057 Time-Domain ADC Testing Frequency-Domain ADC Testing

EE141102

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.102

Histogram – Histogram – Code BinsCode BinsCode Bin

T[1]

T[2]

T[6]

T[6]

T[5]

T[4]

T[3]

7

6

5

4

3

2

1

0

W[7]

W[6]

W[5]

W[4]

W[3]

W[2]

W[1]

W[0]Code Level

Code Width W[k]

245

543

456

372

345

472

529

302

Bin Count H[k]

EE141103

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.103

Test Methods Test Methods - Code Transition Level- Code Transition Level

Code Bin

T[1]

T[2]

T[6]

T[6]

T[5]

T[4]

T[3]

7

6

5

4

3

2

1

0

0

0

12

45

443

454

30

16

Static Test Method• Start from 2% below the transition level.• Take a number of samples.• Adjust the input level until the 50% codes

are greater than k.

Samples

Precision

64

45%

256

23%

1024

12%

4096

6% % of rms noise

500

500

EE141104

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.104

Test Methods Test Methods - Code Transition Level- Code Transition LevelDynamic Test Method• Apply full range sine wave• Calculate the transition level from the bin count

T[1]

T[2]

T[6]

T[6]

T[5]

T[4]

T[3]

7

6

5

4

3

2

1

0

245

543

456

372

345

472

529

302

M

kHACkT c ]1[

cos][

• A: Amplitude C: Offset• H[j]: The code count of bin j.• M: Total number of samples • Record Length M and Number of Cycles Mc must not have common term.

j

ic iHjH

0][][

EE141105

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.105

Test Methods Test Methods - Gain and Offset- Gain and Offset• Apply a slow ramp signal• Construct the code bin table

1)1(][][ TkQkVkTG os

T[1]

T[2]

T[6]

T[6]

T[5]

T[4]

T[3]

7

6

5

4

3

2

1

0

203

443

440

435

439

429

447

330

Q: ideal width of the code bin

12

1

212

1

2

12

1

1

12

1

212

1

2

12

1

12

212

12

12

N N

N

N N

N

k k

N

k

NN

k k

N

k

N

kTkT

kT

Q

kTkT

kkT

QG

12

11 12

12N

kN

Nos kT

GQTV

EE141106

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.106

Test Methods Test Methods - Gain and Offset (Example)- Gain and Offset (Example)

Ideal Gain Error Offset Error

Transfer Curves

Histograms

128 128 128 128

Game/Offset

EE141107

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.107

Test Methods Test Methods - Nonlinearity- Nonlinearity

Q

QkWGDNL

Q

QkWGkDNL

max

NQ

TkQkTMSE

2

1max100 1

NQ

kINL

2

max100

Differential Nonlinearity

IntegralNonlinearity

MaximalStatic Error

T[1]

T[2]

T[6]

T[6]

T[5]

T[4]

T[3]

7

6

5

4

3

2

1

0

203

443

440

435

439

429

447

330

EE141108

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.108

Test Methods Test Methods - Sine Wave Fitting- Sine Wave Fitting

oioi CtAy sin

• Try to fit the sine wave to find the gain A’, offset Co, and phase shift .

• There are matrix based and nonmatrix methods. myyy ,, 21

mttt ,, 21

m

iiii CtBtAyMin

1

2)coscos(

CtAy ii )sin(''

CtBtAy iii )cos()sin('

EE141109

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.109

Test Methods Test Methods - Sine Wave Fitting- Sine Wave Fitting

ooo CtAty )sin()(

CtBtAty )cos()sin()('

o

o

A

ABA 22

oCC

A

B1tan

o

o

)(

Original Signal:

Curve Fitted:

Gain Error:

Offset Error:

Phase Error:

Frequency Error:

EE141110

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.110

11.3 Mixed-Signal Testing 11.3 Mixed-Signal Testing

Introduction to Analog-Digital Conversion ADC and DAC Circuit Structure ADC/DAC Specification and Fault Models IEEE Std. 1057 Time-Domain ADC Testing Frequency-Domain ADC Testing

EE141111

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.111

ADC – ADC – Frequency Domain TestingFrequency Domain Testing•Similar to Analog AC Testing•Apply sinusoidal waveform•Do Fourier transform on response waveform•Obtain F domain properties mathematically.

Filter FFT

dB Fundamental

Peak Harm.

Noise Flour

Offset

Analysis

EE141112

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.112

ADC – ADC – Frequency Domain TestingFrequency Domain Testing

dBFundamental

Harmonics

DCOffset

F

NoiseF

H2 H3H4

H5Ni

2

2log10

iN

FSNR%100log10

2

2

2

2

ii H

F

H

FTHD

22

2log10

ii NH

FSNDR

EE141113

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.113

11.4 IEEE Std. 1149.4 Standard for a 11.4 IEEE Std. 1149.4 Standard for a Mixed-Signal Test Bus Mixed-Signal Test Bus

IEEE Std. 1149.4 Overview IEEE Std. 1149.4 Circuit Structures IEEE Std. 1149.4 Instructions IEEE Std. 1149.4 Test Modes

EE141114

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.114

IEEE 1149.4 - IEEE 1149.4 - OverviewOverview Target mixed signal Printed Circuit Assembles (PCA). Components:

Mixed Signal Digital Analog Discrete

D D

A A

M MC

C

CInterconnect

DiscreteComponent

M: Mixed-signal Component A: Analog Component D: Digital Component

EE141115

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.115

IEEE 1149.4 - IEEE 1149.4 - ScopeScope

Provide standardized approaches to Interconnect Test Parametric Test Internal Test

EE141116

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.116

IEEE 1149.4 IEEE 1149.4 - Interconnect Test- Interconnect Test

A

A

D

D

D

A

A

A

D

D

D

A

A

A

D

D

D

A

A

A

D

D

D

A

Open Defects Short Defects

EE141117

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.117

IEEE 1149.4 - IEEE 1149.4 - Parametric TestParametric Test

A

A

A

D

D-A

A

A

A

D

D-A

Simple Interconnect Extended Interconnect

EE141118

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.118

IEEE 1149.4 - IEEE 1149.4 - Internal TestInternal Test

A

A

A

D

D-A

Analog

Analog

Analog

Digital

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.119

IEEE 1149.4 - IEEE 1149.4 - ArchitectureArchitecture

IC1 IC2 ICnIC Under Test

Analog

AT1

AT2

AB1AB2

Test Waveform Response Waveform

EE141120

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.120

11.4 IEEE Std. 1149.4 Standard for a 11.4 IEEE Std. 1149.4 Standard for a Mixed-Signal Test Bus Mixed-Signal Test Bus

IEEE Std. 1149.4 Overview IEEE Std. 1149.4 Circuit Structures IEEE Std. 1149.4 Instructions IEEE Std. 1149.4 Test Modes

EE141121

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.121

IEEE 1149.4 - IEEE 1149.4 - ArchitectureArchitecture

ICCore

DigitalBM

ABM

ABM

AnalogBM

A Pins

TBIC

Analog TAP

AT1AT2

TAP Controller1149.1

TAP

TDITDOTMSTCK

D Pins

InternalA Bus

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.122

IEEE 1149.4 - IEEE 1149.4 - TBICTBIC

VH

VL

VTH

ABMABM

TBIC

Core

TAP

AB1AB2

AT2

Vc

AB1 AB2

Switch

AT1

AT1AT2

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.123

IEEE 1149.4 - IEEE 1149.4 - ABMABM

AT1AT2

AB1AB2

VH VLVTH VG

A PinCD

ACUT

TBIC

ABM

ABM

TBIC

CoreCircuit

Test Control CircuitryTAP Controller

AB1AB2 AT1

AT2

EE141124

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.124

1149.4 – 1149.4 – Mixed-Signal ArchitectureMixed-Signal Architecture

DigitalCore

Circuit

AnalogInputs

A/D

AnalogCore

TDI TDO

AnalogOutputs

Digital

Inputs

Digital

Outputs

DBMABM

EE141125

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.125

11.4 IEEE Std. 1149.4 Standard for a 11.4 IEEE Std. 1149.4 Standard for a Mixed-Signal Test Bus Mixed-Signal Test Bus

IEEE Std. 1149.4 Overview IEEE Std. 1149.4 Circuit Structures IEEE Std. 1149.4 Instructions IEEE Std. 1149.4 Test Modes

EE141126

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.126

IEEE 1149.4 - IEEE 1149.4 - InstructionsInstructions

Mandatory Instructions BYPASS SAMPLE/PRELOAD EXTEST PROBE

Same as IEEE 1149.1

EE141127

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.127

IEEE 1149.4 - IEEE 1149.4 - InstructionsInstructions

Optional Instructions INTEST IDCODE/USERCODE RUNBIST CLAMP HIGHZ

Same as IEEE 1149.1

EE141128

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.128

11.4 IEEE Std. 1149.4 Standard for a 11.4 IEEE Std. 1149.4 Standard for a Mixed-Signal Test Bus Mixed-Signal Test Bus

IEEE Std. 1149.4 Overview IEEE Std. 1149.4 Circuit Structures IEEE Std. 1149.4 Instructions IEEE Std. 1149.4 Test Modes

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.129

1149.4 – 1149.4 – Open/Short Interconnect TestOpen/Short Interconnect Test

AB1AB2

VH VL

AB1AB2

VTH

Chip 1 Chip 2

10

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.130

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

AB1

AB2

TBIC

ABM

V

DUT

IV

• Grounded Impedance Measurement• Apply current and measure voltage

ZD

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.131

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

• Equivalent Circuit Model.

M

SIOR

SVIR

)(tIs

)(tVm

1PZ

2PZ

DUTZ DUTI

DUTV

DUTPSIO

SIOsDUT ZZR

RtItI

1)()(

DUTPSVI

SVIDUTM ZZR

RtVtV

2)()(

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.132

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

AB1

AB2

TBIC

ABM

VDUT

VG

I

V

• Floating Impedance Zd Measurement

ZD

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.133

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

AB1

AB2

TBIC

ABM

V

DUT

VG

I

V

Vg Option withNonzero Vg

• Floating Impedance ZD with optional Vg

ZD

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.134

TBIC

ABM

VABM

TBIC

• Apply voltage and measure current

ZD

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.135

• Equivalent Circuit Model

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

SIIR)(tIm

V

SVOR

)(tVs

1PZ

2PZ

DUTZ

DUTV

DUTI

M

SIIPDUTPSVO

DUTsDUT RZZZR

ZtVtV

21)()(

SIIPDUTPSVO

sm RZZZR

tVtI

21

)()(

21)()(

PDUTP

DUTsDUT ZZZ

ZtVtV

21

)()(

PDUTP

sm ZZZ

tVtI

With Ideal Voltage Source and Current Meter

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.136

• Measure complex interconnect network

V

P1

P2 P4

P3

Z1Z2

Z3V34V12

V13

Vg

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.137

V

P1

P2 P4

P3

Z1Z2

Z3

Vg

1149.4 – 1149.4 – Extended Interconnect TestExtended Interconnect Test

02

222

02

112

01

221

01

111

11

22

II

VV

V

Ih

V

Vh

I

Ih

I

Vh

H P1 P2 P3 P4

h11 Is/Vm GND GND GND

h12 Vm GND Vs GND

h21 Is GND Im GND

h22 Open GND Vs/Im GND

Notations Is: Apply Current Vm: Measure Voltage

Vs: Apply Voltage Im: Measure Current

EE141VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.138

1149.4 - 1149.4 - High Speed ApplicationsHigh Speed Applications

• Use buffers for better frequency response

AB2

VHVL VTHVG

AB1TBIC

ABM

AnalogCore

Current BufferVoltage Buffer

EE141139

VLSI Test Principles and Architectures Chap. 11 - Analog and Mixed-Signal Testing - P.139

11.5 Concluding Remarks11.5 Concluding Remarks AMS testing requires specialized approaches

and experienced engineers because of the large varieties of signals, functions and circuits.

DSP approaches are so pervasive that even basic analog test items can be accomplished.

IEEE 1057 with formal terminologies and standardized test methods provides a solid theoretical background for ADC/DAC testing.

IEEE 1149.4 is one solution to extending and incorporating the digital counterpart.