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Dr. Anthony J. TetherDARPA Director
Defense Advanced Research Projects Agency
Defense Advanced Research Projects Agency
Director, Tony TetherDeputy Director, Bob Leheny
DARPA Organization
Tactical TechnologySteve WelbySteve Walker
Air/Space/Land/Sea PlatformsUnmanned SystemsSpace Operations
Laser SystemsPrecision Strike
Information ExploitationBob TenneyMark Davis
Sensors
Exploitation Systems
Command & Control
Strategic TechnologyDave Honey
Larry Stotts/Brian PierceSpace Sensors/Structures
Strategic & Tactical NetworksInformation Assurance
Underground Facility Detection& CharacterizationChem/Bio Defense
Maritime Operations
Information Processing TechnologyCharlie Holland
Barbara Yoon/Chuck MorefieldCognitive Systems
High Productivity Computing Systems
Language Translation
Microsystems TechnologyJohn ZolperDean Collins
ElectronicsPhotonics
MEMSAlgorithms
Integrated Microsystems
Defense SciencesBrett Giroir
Barbara McQuistonPhysical Sciences
MaterialsBiology
MathematicsHuman EffectivenessBio Warfare Defense
NEAR MID FAR
Scie
nce
& T
echn
olog
y $
(FY0
7)DARPA Role in Science and Technology
10B -
5B -
0 -
Fundamental Research, Leading Edge Discovery, System Concept Invention
Science and Technology
Programs for the Armed Services
NEAR MID FAR
Scie
nce
& T
echn
olog
y $
(FY0
7)
DARPA
DARPA Role in Science and Technology
10B -
5B -
0 -
Fundamental Research, Leading Edge Discovery, System Concept Invention
Science and Technology
Programs for the Armed Services
0
0.1
0.2
0.3
FY94
FY95
FY96
FY97
FY98
FY99
FY00
FY01
FY02
FY03
FY04
FY05
FY06
FY07
FY08
DARPA Basic Research Funding ($B)Budget Activity 6.1 (“University” funding)
Bill
ions
($)
PB 08 Request
$152.6m
Basic Research Examples
• Defense Science Studies Group• Computer Science Studies Group• Computer Sciences Futures Group• Young Squirrels Awards• Finding the Fundamental Laws of Biology
Autonomous Ground Vehicles
GroundSurveillance
Radar
DARPA Accomplishments
LSTAT
Speech Recognition
SATURN
Assault Breaker
ARPANET
JSTARS
MIMIC
TALON GOLD
Mobile Robots
JSF Engine
X-45
Command Post of the Future
MEMS
Pegasus LaunchVehicle
Global Hawk
DARPASAT
VELA Hotel
ALTAIR
Mouse
GPS
ATACMS
Sea Shadow
Stealth
Fighter
Center forMonitoring Research
M-16
Uncooled IR
Exoskeleton
Phraselator
1970
Predator
SUO SASSUO SAS
Advanced Cruise Missile
BAT
Taurus Launch Vehicle
Transit
1960
1970
1980
1990
2000
• Low-cost titanium to enable routine use ($3.5/lb military grade alloy)
• Accelerate Development & Production of Therapeutics & Vaccines from 12+ years to 16 weeks or less
• Alternative Energy Sources for military operations, such as jet fuel from plants
• Prosthetics to enable a Soldier’s return to the unit without loss of capability
• Quantum Information Science for new computational capabilities
• Networks - Self-forming, Robust, Self-defending to enable true network centric operations
• Chip Scale Atomic Clock to replace communication devices’ reliance on GPS time signal
• Networked Sensors – Determine, track, and neutralize elusive threats, such as IED factories
• High-productivity computing system – peta scale computer for important DoD applications
• Air Vehicles - Fast Access, long loiter
• High Energy Liquid Laser Area Defense System as a penetration aid to replace stealth
• Submarines – reduce size and cost while maintaining existing capabilites
• Space capabilities to enable global military operations
• Real time language translation to replace linguists (Defense Language Institute, III IV)
• Solid State for the next generation of systems
Future Icons
FOR OFFICIAL USE ONLY – Not Cleared for Open Release
Ultraperformance NanophotonicIntrachip Communication (UNIC)Ultraperformance NanophotonicIntrachip Communication (UNIC)
Vision:• Create enhanced pathway to high-bandwidth, high-
performance and low power intra-chip communication for ultra-dense 2D and 3D systems on a chip
Goal:• Demonstrate nano-photonic technology using CMOS
compatible fabrication processes that would significantly exceed electrical global interconnect performance (and hence total performance) for IC microprocessor chips
• Develop nano-photonic architecture/system design that would enable such performance superiority
• Demonstrate a functional chip with all necessary components working together
Technical Challenges:• High integration density • Low power dissipation devices• High speed devices (Low latency)• Low loss waveguides and devices• Small physical size• Fabrication fully compatible and integrable with
mainstream electronicsImpact:
• >10X increase in processing performance as a function of power dissipation
The Ultimate OnThe Ultimate On--Chip Data Link: Eliminating the Interconnect BottleneckChip Data Link: Eliminating the Interconnect Bottleneck
Nanophotonic LayerNanophotonic Layer
Electronic LayerElectronic Layer
IntrachipIntrachipCommunicationCommunication
Proc
esso
r Per
form
ance
Time
PEAK PerformanceOps/s
ACTUAL Performance(Application Runtime)
GROWINGGROWINGPERFORMANCEPERFORMANCE
GAPGAP
On and off-chip communications
becoming performance bottleneck
UN
IC
FOR OFFICIAL USE ONLY – Not Cleared for Open Release
3-Dimensional Electronic Circuits (3-D IC)3-Dimensional Electronic Circuits (3-D IC)
Goal: • Develop the Design and Process Technology for
True 3D Integrated Circuits (multiple active layers)
Challenges: • Achieve dense 3D Interconnections of Multi-layer
Circuits• Design Tools that Optimize Place & Route of
Circuit Blocks, Synthesis of 3D circuits with Electro-Thermal Analysis
• Thermal mitigationKey Accomplishments:
• 3D-IC technology development based on thin layer wafer transfer methods.
• High density 3D vias demonstrated. • Through wafer vias in development for mm-wave
applications. • 3D Supercomputer chip designed.
Impact:• Higher speed/lower power system-scale circuits• Larger chip effective area, more transistors/unit
volume. Improved computational density.
DD
AA AA RR
D D RR AA DD A A
DDDDRR AA RR
Interconnectlevels
BondingPads
DDR R
Isolationlevels
DeviceLevels
D=DigitalA=Analog
R=Reconfigurable
Inter-layervia
Thermalvias
Layer 1Layer 2
Layer 3
DD
AA AA RR
D D RR AA DD A A
DDDDRR AA RR
Interconnectlevels
Interconnectlevels
BondingPads
DDR R
Isolationlevels
DeviceLevels
D=DigitalA=Analog
R=Reconfigurable
Inter-layervia
Thermalvias
Layer 1Layer 2
Layer 3
InterconnectsArchitecture
2D
3D
The Next Revolution in Digital ElectronicsThe Next Revolution in Digital Electronics
Slow LightSlow Light
ωω
ddnn
cvgroup
+=
Group velocity – velocity at which a pulse of light propagates through a material
Transmission
Refractive IndexUltra-slow
group velocity
High transmission with large effective nonlinearity
Exploring the limits and applications of slowing, storing, and manipulating light in various media (Slow light n group << C)
Exploring the limits and applications of slowing, storing, and manipulating light in various media (Slow light n group << C)
Demonstrated fiber-based technique to produce delays > 1200 pulse widths.
Demonstrated 10 bit buffering at 20 Gbps using 10μm ring resonators
All optical delay of images using slow light(left) 3ns delay of 2-d image, 0.8 photons per pulse and (right) 2d image propagating through air, 0.8 photons per pulse.
Delays shown at many different bandwidths and material systems open range of applications
www.darpa.mil/dso
Current Sensor Heads
Precision Inertial Navigation Systems:Ultra-cold Atom-based Inertial Measurements
▪ Ultracold atom navigation relies on precise measurements of forces acting on atom cloud∙ Platform motion decoupled from
acceleration, rotation measurements∙ System measures gravity to compensate
for local variations in gravity vector▪ Available regardless of geography,
jamming, etc.▪ Will drive atom-based navigation
system across country to demonstrate system performance
The Future
• DARPA Always Interested in Innovative Ideas• Solicitations: www.darpa.mil• Talk to DARPA Program Managers• Become a DARPA Program Manager
• Upcoming Events• 25th DARPA Systems & Technology
Symposium (DARPATech 2007) August 7 - 9 2007, Anaheim, California
• Urban Challenge, November 3, 2007
• 50th Anniversary Conference / Dinner
• April 10, 2008 – Washington, D.C.
DARPA Strategic Plan
www.darpa.mil/body/mission.html