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CUSTOMER SUPPORTLoomis Industries is known for providing a superior level of customer support. Application and technical advisors are ready to solve your scribing and cleaving challenges, and technicians are available to provide prompt, on-site service.
SALES OPTIONSPlease contact Loomis Industries if you’d like to have a sample processed, schedule a demonstration or discuss various sales options. Sales options may include leasing and trade in of existing Loomis Equipment toward the purchase of LSD-155 (one trade in per one LSD-155). Contact us to discuss possible lease and trade options.
©2012 Loomis Industries, Inc.All rights reserved.
1204 Church StreetSt. Helena CA 94574
p 707.963.4111f 707.963.3753
LOOMIS LSD-155Speed, product quality and yield speak for themselves.Contact Loomis Industries for information or a demonstration.
Cutting Edge automated III-VLaser Diode and Wafer Processing
28.0” H x 39.0” W x 27.0” D (71.1 x 99.0 x 68.6)cm 147 lbs (68.2 kg)
16.5” H x 7.5” W x 17.0” D (41.9, 19.1, 43.2)cm 30.1 lbs (13.7 kg)
12” H x 17.5” W x 2.5” D (30.5 x 44.5 x 6.5)cm 8 lbs (3.6 kg) 1440 X 900 resolution
75 PSI (517kPa) Air, Nitrogen or CO2 (clean, dry)
5–40°C
2000m max
80% @ 31°C, 50% @ 40°C maximum, non-condensing
150 Watts, 100–277 VAC, 50–60 HZ
100mm/sec maximum
1–2 pecks/s (depending on substrate properties)
1 cleave/2 sec
Mitutoyo 5X objective standard (1300µm field of view) 10X and 20X objective lenses are available options
1 micron utilizing pattern recognition
CE and Semi S2 Approved
• Loomis diamond tool-holder with precise force, positioning, ultra-low inertia and high speed operation capability that produces unparalleled scribe quality
• Limited-contact cleaving options
• Ring pair, saw frame and Loomis square frame compatibility
• Smooth, accurate, air-bearing control in X and Y axis
• Fully automated alignment and processing
• High-resolution digital camera with autofocus and interchangeable Mitutoyo Objective Lenses
• Advanced machine vision algorithms for pattern recognition, channel and angle alignment
• Modular construction and design that minimizes and simplifies maintenance
• Password protected access for operator, technician and maintenance level personnel
• Full 360 Degree hands-off material rotation for processing material on multiple axis
• Material: GaAs, InP, thin Silicon (for any other materials, contact Loomis for details)
• Size: configurable up to 6” (150mm)
• Thickness: 40µm–500µm (dependent on material and die size)
• Laser bar arrays, partial wafers, square wafers and round wafers
LSD Chassis
Computer
Widescreen Monitor
Pressure Requirement
Operating Temperature
Operating Altitude
Humidity
Power Requirements
Scribe and Break Speed
Peck (<800µm scribe) Speed
Cleave Speed
Optical magnification
Positioning Accuracy
Certifications
Key Features
Substrate Compatibility
SPECIFICATIONS
The Loomis Industries LSD-155 introduces many new technical features, but more importantly, it sets the standard for automation, productivity and flexibility. Combining these essential attributes with accuracy and ease-of-use, make it the product of choice for processing your laser diodes and wafers.
AutomationThe LSD-155 is a production-level tool that:
AUTOMATICALLY PROCESSES LARGE "GRIDS" OF LASER BARS FOR DICING, CLEAVING HIGH QUALITY MIRROR FACETS AND DICING WAFERS.
UTILIZES ADVANCES AUTOMATION FEATURES THAT ALLOW THE HIGH RESOLUTION VISION SYSTEM TO PROCESS YOUR MATERIAL WITH MICRON LEVEL ACCURACY.
FEATURES A TUNED, LOW-INERTIA SCRIBING MODULE THAT ENABLES FAST PECK* SPEEDS WHILE MAINTAINING OPTIMAL PECK QUALITY.
MULTIPLE CLEAVING OPTIONS ALLOW THE LSD-155 TO BE CONFIGURED TO OPTIMIZE CLEAVE QUALITY & SPEED.
*A peck is a short, controlled length scribe
KEY ADVANTAGESIntegration of the scribing and cleaving processesgive key advantages:
OPERATOR PRODUCTIVITY: Fewer transfer, alignment and process monitoring operations are necessary resulting in your operators performing other essential tasks.
REDUCED TRANSFER OPERATIONS: Minimal material handling means fewer alignment processes andhigher levels of throughput.
REDUCED REDUNDANCY REQUIREMENTS: 2 Loomis LSD-155s provide full process redundancy. Equipment limited to scribe only/break only require the purchase 4 machines for full redundancy.
PROCESS MONITORING: The LSD-155 integrated scribe and cleave processing allows for tighter process monitoring. Stand alone scribe then cleave operations suffer from large scale material loss when their scribing process fails and is only detected after large quantities of material have been ineffectively scribed.
EASE OF OPERATIONThe LSD-155 Software control package was developed with extensive customer input and has the features for processing your material efficiently. Straight-forward menu structures, intuitive operation and simple recipe setups allow easy setup for automated processing. Once a recipe has been developed, an operator only needs to load the material and press “Start”, allowing the machine operator to perform other tasks without monitoring the process. The LSD-155 uses highly refined vision algorithms to find, align and process your material with minimal operator supervision.
FLEXIBILITYThe LSD-155 can be configured to function with your existing equipment and process requirement by utilizing common wafer holding media. These include 6" and 7" ring pairs, saw frames, vacuum chuck and the Loomis square frame. A variety of scribe tools, objective lenses and mandrels and cleaving options are available to optimize the process to your specific application.
YIELDLoomis Customers consistently experience industry-leading yields with clean, efficient and debris-free die. These results are the culmination of:
PRECISION MADE SCRIBE TOOLS MANUFACTURED BY LOOMIS INDUSTRIES USING PROPRIETARY POLISHING TECHNOLOGY. THE RESULT IS A SCRIBE THAT CLEAVES OPTIMALLY, LEAVING THE RESULTANT EDGES WITH BOTH INTEGRITY AND STRENGTH.
PRECISION TOOLHOLDER DESIGN TO PROPERLY HOLD AND ACCURATELY APPLY THE SCRIBE TOOL TO YOUR SPECIFIC MATERIAL AT THE OPTIMUM ANGLE, FORCE AND SPEED.
CONTROLLED STRAIN CLEAVING CONFIGURED TO MEET YOUR APPLICATION NEEDS.
PROCESSES DEVELOPED TO MEET YOUR UNIQUE APPLICATION NEEDS.
LSD-155
40 YEARS OF INTELLIGENT
The hardware behind the LSD-155 is keyto its speed, precision and accuracy.
HIGH-RESOLUTION SERVO MOTORS CONTROL
SMOOTH, ACCURATE MULTI-AXIS MOTION
ON AN AIR-BEARING PLATFORM.
QUALITY MITUTOYO OPTICS ENSURE
AN OPTICALLY CORRECT FIELD OF VIEW THAT
CAN BE CUSTOMIZED WITH INTERCHANGEABLE
OBJECTIVE LENSES FOR APPLICATIONS
REQUIRING VERY HIGH MAGNIFICATION.
ULTRA-HIGH RESOLUTION MICROMETER
HEADS ENSURE THAT SCRIBE TOOL ALIGNMENT
IS SIMPLE AND YOUR SCRIBE PLACEMENT
IS PERFECT.
The Loomis Industries LSD-155 introduces many new technical features, but more importantly, it sets the standard for automation, productivity and flexibility. Combining these essential attributes with accuracy and ease-of-use, make it the product of choice for processing your laser diodes and wafers.
AutomationThe LSD-155 is a production-level tool that:
AUTOMATICALLY PROCESSES LARGE "GRIDS" OF LASER BARS FOR DICING, CLEAVING HIGH QUALITY MIRROR FACETS AND DICING WAFERS.
UTILIZES ADVANCES AUTOMATION FEATURES THAT ALLOW THE HIGH RESOLUTION VISION SYSTEM TO PROCESS YOUR MATERIAL WITH MICRON LEVEL ACCURACY.
FEATURES A TUNED, LOW-INERTIA SCRIBING MODULE THAT ENABLES FAST PECK* SPEEDS WHILE MAINTAINING OPTIMAL PECK QUALITY.
MULTIPLE CLEAVING OPTIONS ALLOW THE LSD-155 TO BE CONFIGURED TO OPTIMIZE CLEAVE QUALITY & SPEED.
*A peck is a short, controlled length scribe
KEY ADVANTAGESIntegration of the scribing and cleaving processesgive key advantages:
OPERATOR PRODUCTIVITY: Fewer transfer, alignment and process monitoring operations are necessary resulting in your operators performing other essential tasks.
REDUCED TRANSFER OPERATIONS: Minimal material handling means fewer alignment processes andhigher levels of throughput.
REDUCED REDUNDANCY REQUIREMENTS: 2 Loomis LSD-155s provide full process redundancy. Equipment limited to scribe only/break only require the purchase 4 machines for full redundancy.
PROCESS MONITORING: The LSD-155 integrated scribe and cleave processing allows for tighter process monitoring. Stand alone scribe then cleave operations suffer from large scale material loss when their scribing process fails and is only detected after large quantities of material have been ineffectively scribed.
EASE OF OPERATIONThe LSD-155 Software control package was developed with extensive customer input and has the features for processing your material efficiently. Straight-forward menu structures, intuitive operation and simple recipe setups allow easy setup for automated processing. Once a recipe has been developed, an operator only needs to load the material and press “Start”, allowing the machine operator to perform other tasks without monitoring the process. The LSD-155 uses highly refined vision algorithms to find, align and process your material with minimal operator supervision.
FLEXIBILITYThe LSD-155 can be configured to function with your existing equipment and process requirement by utilizing common wafer holding media. These include 6" and 7" ring pairs, saw frames, vacuum chuck and the Loomis square frame. A variety of scribe tools, objective lenses and mandrels and cleaving options are available to optimize the process to your specific application.
YIELDLoomis Customers consistently experience industry-leading yields with clean, efficient and debris-free die. These results are the culmination of:
PRECISION MADE SCRIBE TOOLS MANUFACTURED BY LOOMIS INDUSTRIES USING PROPRIETARY POLISHING TECHNOLOGY. THE RESULT IS A SCRIBE THAT CLEAVES OPTIMALLY, LEAVING THE RESULTANT EDGES WITH BOTH INTEGRITY AND STRENGTH.
PRECISION TOOLHOLDER DESIGN TO PROPERLY HOLD AND ACCURATELY APPLY THE SCRIBE TOOL TO YOUR SPECIFIC MATERIAL AT THE OPTIMUM ANGLE, FORCE AND SPEED.
CONTROLLED STRAIN CLEAVING CONFIGURED TO MEET YOUR APPLICATION NEEDS.
PROCESSES DEVELOPED TO MEET YOUR UNIQUE APPLICATION NEEDS.
LSD-155
40 YEARS OF INTELLIGENT
The hardware behind the LSD-155 is keyto its speed, precision and accuracy.
HIGH-RESOLUTION SERVO MOTORS CONTROL
SMOOTH, ACCURATE MULTI-AXIS MOTION
ON AN AIR-BEARING PLATFORM.
QUALITY MITUTOYO OPTICS ENSURE
AN OPTICALLY CORRECT FIELD OF VIEW THAT
CAN BE CUSTOMIZED WITH INTERCHANGEABLE
OBJECTIVE LENSES FOR APPLICATIONS
REQUIRING VERY HIGH MAGNIFICATION.
ULTRA-HIGH RESOLUTION MICROMETER
HEADS ENSURE THAT SCRIBE TOOL ALIGNMENT
IS SIMPLE AND YOUR SCRIBE PLACEMENT
IS PERFECT.
CUSTOMER SUPPORTLoomis Industries is known for providing a superior level of customer support. Application and technical advisors are ready to solve your scribing and cleaving challenges, and technicians are available to provide prompt, on-site service.
SALES OPTIONSPlease contact Loomis Industries if you’d like to have a sample processed, schedule a demonstration or discuss various sales options. Sales options may include leasing and trade in of existing Loomis Equipment toward the purchase of LSD-155 (one trade in per one LSD-155). Contact us to discuss possible lease and trade options.
©2012 Loomis Industries, Inc.All rights reserved.
1204 Church StreetSt. Helena CA 94574
p 707.963.4111f 707.963.3753
LOOMIS LSD-155Speed, product quality and yield speak for themselves.Contact Loomis Industries for information or a demonstration.
Cutting Edge automated III-VLaser Diode and Wafer Processing
28.0” H x 39.0” W x 27.0” D (71.1 x 99.0 x 68.6)cm 147 lbs (68.2 kg)
16.5” H x 7.5” W x 17.0” D (41.9, 19.1, 43.2)cm 30.1 lbs (13.7 kg)
12” H x 17.5” W x 2.5” D (30.5 x 44.5 x 6.5)cm 8 lbs (3.6 kg) 1440 X 900 resolution
75 PSI (517kPa) Air, Nitrogen or CO2 (clean, dry)
5–40°C
2000m max
80% @ 31°C, 50% @ 40°C maximum, non-condensing
150 Watts, 100–277 VAC, 50–60 HZ
100mm/sec maximum
1–2 pecks/s (depending on substrate properties)
1 cleave/2 sec
Mitutoyo 5X objective standard (1300µm field of view) 10X and 20X objective lenses are available options
1 micron utilizing pattern recognition
CE and Semi S2 Approved
• Loomis diamond tool-holder with precise force, positioning, ultra-low inertia and high speed operation capability that produces unparalleled scribe quality
• Limited-contact cleaving options
• Ring pair, saw frame and Loomis square frame compatibility
• Smooth, accurate, air-bearing control in X and Y axis
• Fully automated alignment and processing
• High-resolution digital camera with autofocus and interchangeable Mitutoyo Objective Lenses
• Advanced machine vision algorithms for pattern recognition, channel and angle alignment
• Modular construction and design that minimizes and simplifies maintenance
• Password protected access for operator, technician and maintenance level personnel
• Full 360 Degree hands-off material rotation for processing material on multiple axis
• Material: GaAs, InP, thin Silicon (for any other materials, contact Loomis for details)
• Size: configurable up to 6” (150mm)
• Thickness: 40µm–500µm (dependent on material and die size)
• Laser bar arrays, partial wafers, square wafers and round wafers
LSD Chassis
Computer
Widescreen Monitor
Pressure Requirement
Operating Temperature
Operating Altitude
Humidity
Power Requirements
Scribe and Break Speed
Peck (<800µm scribe) Speed
Cleave Speed
Optical magnification
Positioning Accuracy
Certifications
Key Features
Substrate Compatibility
SPECIFICATIONS
