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COMPLETE TEARDOWN WITH: Detailed photos Precise measurements Material analysis Manufacturing process flow Supply chain evaluation Manufacturing cost analysis Selling price estimation Comparison between Rohm’s planar and trench SiC MOSFETs Comparison between Rohm’s and Cree’s 1200V MOSFET modules ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module Title: ROHM BSM180D12P3C007 Module Pages: 94 Date: July 2016 Format: PDF & Excel file Price: Full report: EUR 3,490 The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on- The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation resistance and reduces switching losses by 42%. The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module. The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package. The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure. It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.

ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module · Manufacturing Process Flow • Overview • MOSFET and Diode Process Flow • Package Process Flow • Description of Wafer

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Page 1: ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module · Manufacturing Process Flow • Overview • MOSFET and Diode Process Flow • Package Process Flow • Description of Wafer

COMPLETE TEARDOWN WITH:

• Detailed photos

• Precise measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Selling price estimation

• Comparison between Rohm’s planar and trench SiC MOSFETs

• Comparison between Rohm’s and Cree’s 1200V MOSFET modules

ROHM 1200V Trench SiC MOSFETBSM180D12P3C007 Module

Title: ROHM BSM180D12P3C007 ModulePages: 94

Date: July 2016

Format: PDF & Excel file

Price: Full report: EUR 3,490

The BSM180D12P3C007 is a1200V 180A SiC MOSFET modulefrom Rohm for high powerapplications like motor drives,inverters, photovoltaics andinduction heating equipment. Incomparison with the previousgeneration of SiC MOSFETs,which have a planar structure,the trench structure halves on-

The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio

than the previous generation

resistance and reduces switching losses by 42%.

The BSM180D12P3C007 integrates the third generation high-voltage SiCpower MOSFET dies with a current of 36A and the innovative trenchstructure. Ten SiC Schottky Barrier diodes are also integrated into thepower module.

The BSM180D12P3C007 offers a higher operating temperature (up to150°C) in a 45mm x 122mm x 21mm package.

The report goes into depth in its analysisof the packaging and the components,with images of the complex trench SiCstructure.

It also includes production cost analysisand overall comparison with the planar SiCMOSFET from Rohm and the CreeCAS120M12BM2 module.

Page 2: ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module · Manufacturing Process Flow • Overview • MOSFET and Diode Process Flow • Package Process Flow • Description of Wafer

Performed by

TABLE OF CONTENTS

Overview/Introduction

• Executive Summary• Reverse Costing Methodology

Company Profile

Physical Analysis

• Synthesis of the Physical Analysis• Package Analysis View, dimensions and marking Housing Base plate cross-section DBC cross-section

• MOSFET Analysis Dimension Die process Die cross-section

• SBD Diode Analysis Dimension Die process Die cross-section

• Comparison between Rohm’s planar and trench MOSFETs

Manufacturing Process Flow

• Overview• MOSFET and Diode Process Flow• Package Process Flow• Description of Wafer Fabrication

Units

Cost Analysis

• Synthesis of the Cost Analysis• Main Steps of Economic Analysis• Yields Explanation• MOSFET Cost Analysis Wafer cost hypothesis MOSFET wafer cost Breakdown by process step MOSFET probe cost MOSFET die cost

• Cost Analysis Diode• Cost Analysis BSM180D12P3C007 Assessing BOM DBC cost BSM180D12P3C007 module

cost

Comparison between BSM180D12P3C007 and CAS120M12BM2

• Module• MOSFET• Diode• Cost

Estimated Manufacturer Price Analysis

• Manufacturers’ ratios• Estimated manufacturer price

Author:Elena Barbarini

Elena is in charge of costinganalyses for MEMS, IC andPower Semiconductors. She hasa deep knowledge of ElectronicsR&D and Manufacturingenvironment. Elena holds aMaster in Nanotechnologies anda PhD in Power Electronics.

Nicolas is in charge of physicalanalysis. He has a deepknowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&Dfor CEA/LETI in Grenoble and forSTMicroelectronics in Crolles.

Author (Lab):NicolasRadufe

POWER Cosim+

Cost simulation tool toevaluate the cost of anyPOWER process or device:from single chip to complexstructures.

POWER CoSim+ is a process-based costing tool used toevaluate the manufacturingcost per wafer using your owninputs or using the pre-defined parameters includedin the tool.

All these tools are on saleunder corporate licence.

ANALYSIS PERFORMED WITH OUR COSTING TOOL POWER COSIM+

Power CoSim+

Page 3: ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module · Manufacturing Process Flow • Overview • MOSFET and Diode Process Flow • Package Process Flow • Description of Wafer

Wolfspeed C3MTM Platform SiC 900V MOSFET

(coming soon)

CREE 1200V SiC Module - 2nd

Generation SiC MOSFET with Z-Rec Diode SiC

Rohm SCH2080KE SiC

Transistor - 2nd Generation

SiC MOSFET with SiC-SBD

Wolfspeed’s C3MTM platform isthe first 900V SiC MOSFET on themarket. Thanks to its highercurrent density and low Rdson, itcompetes directly with SJMosfetsand GaN HEMTs!

The CAS120M12BM2 from CREESemiconductor is a power moduleof 2 transistors with a breakdownvoltage of 1200V for a current of138A (90°C), an ultra low on-resistance (13mΩ) and more…

With a breakdown voltage of1200V for a current of 28A(100°C), the SCH2080KE offers avery low on-resistance (80mΩ), afast switching speed and a fastreverse recovery.

Pages: 100Date: July 2016Full report: EUR 3,290*

Pages: 136Date: February 2015Full report: EUR 3,490*

Pages: 100Date: March 2014Full report: EUR 2,990*

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Page 4: ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module · Manufacturing Process Flow • Overview • MOSFET and Diode Process Flow • Package Process Flow • Description of Wafer

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Page 5: ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module · Manufacturing Process Flow • Overview • MOSFET and Diode Process Flow • Package Process Flow • Description of Wafer

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