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Confocal Micro-XRF and XRF imaging
based on polycapillary optics
Kouichi Tsuji, Osaka City University, Osaka, Japan
1) Confocal m-XRF imaging
(focusing polycapillary)
2) FF-XRF imaging with x-ray camera
(straight polycapillary as angular filter)
Overview
DXC2018 Workshop: Micro XRF, K. Tsuji
1) Confocal M-XRF
2DXC2018 Workshop: Micro XRF, K. Tsuji
Point analysis Line analysis
Micro-XRF analysis
Elemental mapping
3
X-ray tubeDetector
Ar
Micro x-ray beam is created by
using polycapillary focusing optic.
X-ray fluorescence emitted on the
path of micro x-ray beam is
detected.
DXC2018 Workshop: Micro XRF, K. Tsuji
Conventional micro-XRF Confocal micro-XRF
Polycapillary lens attached to the
EDS collects the x-rays emitted
from the confocal point.
Nondestructive depth-selective XRF
analysis is possible.
Micro x-ray
beam
XRF
XRF
Polycapillary
X-ray half lens
for collecting XRFEDS
X-ray scattering
XRF, not detected
⚫Small region can be analyzed
using x-ray focusing optics,
such as polycapillary optics.
DXC2018 Workshop: Micro XRF, K. Tsuji
W.-M. Gibson, M.A. Kumakhov,
Proceedings of SPIE, 1736, 172-
189 (1993).
Idea of confocal M-XRF
X. Ding, N. Gao, G. Havrilla,
Proceedings of SPIE, 4144,
174 (2000).
B. Kanngieber, W. Malzer, I. Reiche,
Nucl. Instr. and Meth. in Phys. Res.
B, 211, 259 (2003).
Confocal micro-XRF instrument
6DXC2018 Workshop: Micro XRF, K. Tsuji
Cu wire
Polymer insulator
Cable coated with
polymer insulator
1 m
m
7
Confocal m-XRF analysis of Electric cable
2 mm
DXC2018 Workshop: Micro XRF, K. Tsuji
0
500
1000
1500
2000
1 3 5 7 9 11 13
Cu wire
XR
F in
ten
sit
y / c
ou
nt
Energy / keV
0
100
200
300
400
1 3 5 7 9 11 13
Cu
K
Pb
L
Pb
L
FeK
PVC coating
XR
F in
ten
sit
y / c
ou
nt
Energy / keV
DetectorX-ray beam
Depth-selective X-ray spectra of electric cable
Cu wire
8
DXC2018 Workshop: Micro XRF, K. Tsuji
Vacuum Chamber
Detector
X-ray tube
CCD
C-M-XRF with vacuum chamber at OCU
9DXC2018 Workshop: Micro XRF, K. Tsuji
10
Baseplate
Sample stage
Stage
Polycapillary
X-ray optics
Detector snout
Vacuum chamber
Door
Stage
T. Nakazawa and K. Tsuji, Development of a high resolution confocal micro-XRF
instrument equipped with a vacuum chamber, X-Ray Spectrom., 42 (2013) 374-379.
C-M-XRF with vacuum chamber at OCU
The sample is placed
horizontally.
Side view
DXC2018 Workshop: Micro XRF, K. Tsuji
Confocal-XRF setup
Sample
X-Ray Spectrom., 42 (2013) 374-379.
Polycapillary X-ray lens
Polycapillary full lens for primary x-ray beam
- Focal spot size: ≤10 mm, [email protected]
Input focal distance : 30.0 mm
Output focal distance : 2.5 mm
Optic enclosure length: 99.5 mm
12
Polycapillary half lens for detection of XRF
- Focal spot size: ≤10 mm, at 17.4 keV
Input focal distance : 3.0 mm; Outer diameter : 10 mm
Optic enclosure length: 36 mm
DXC2018 Workshop: Micro XRF, K. Tsuji
Confocal volume
Primary x-ray Fluorescent
x-ray
A depth resolution of the confocal micro-
XRF spectrometer can be evaluated by a
thin layer scanning method.
Si substrate
thin film (layer)
≃Corresponding
Depth resolution
Newly developed thin metal layersX
RF
inte
nsity
Scanned distance
surface depth
FWHM : estimated from XRF intensity profileTfoil : thickness of the thin layer
Evaluation of confocal volume and depth resolution
X-Ray Spectrom., 42 (2013) 374-379.
Standard thin layers
Mo Ti Al
Cu Au Cr
Ni Fe Zn
⚫ These samples were prepared using a magnetron sputtering
technique at NTT-AT, Japan.
⚫ The certified thickness was determined with a stylus-type surface
profiler.
ElementEnergy (K-line)
Certified thickness
Al 1.487 480 nm
Ti 4.510 478 nm
Cr 5.414 498 nm
Fe 6.403 500 nm
Ni 7.477 517 nm
Cu 8.047 483 nm
Zr 15.774 493 nm
Mo 17.478 507 nm
Au 9.711 (L) 501 nm
Photograph of the thin layers
X-Ray Spectrom., 42 (2013) 374-379.
0.0
10.0
20.0
30.0
40.0
50.0
60.0
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0
Dep
th r
eso
luti
on
/ m
m
Energy / keV
Depth resolution
Mo
Au
Confocal setup in vacuum
Confocal setup in air
X-Ray Spectrom., 42 (2013) 374-379.
Confocal micro-XRF spectra in air and in vacuum
1
10
100
1000
10000
100000
0 2 4 6 8 10 12 14
XR
F In
ten
sity
/ 1
00
0 s
ec
Energy / keV
air
vacuum
NIST SRM 621
Na
Al
Si
S Fe
K
As
Ca
Ca
Ba, Ti
Rh
16
Si
(Mo target)
(Rh target)
In air
In vac.
17DXC2018 Workshop: Micro XRF, K. Tsuji
LLDs of
confocal setups
for SRM621
(glass standards)
in air and in
vacuum
Element In air [ppm]
In vaccum[ppm]
Na - 5504
Al - 80
Si 17842 46
S 254 46
K 91 36
Ca 47 28
Fe 7 19
W : concentration (%)t : measuring time (s)INet : net intensity(cps)IBG : background intensity (cps)
QXAS, developed by The IAEA
Seibersdorf Laboratories, was
used for analysis.
Shaping time: 3 ms (SRM621),
18
Confocal micro-XRF analysis in air and in vacuum
DXC2018 Workshop: Micro XRF, K. Tsuji
Secondary effects
in confocal M-XRF
19DXC2018 Workshop: Micro XRF, K. Tsuji
Secondary excitation in XRF analysis
X-ray
Fluorescence
35DXC2018 Workshop: Micro XRF, K. Tsuji
Secondary excitation in confocal m-XRF setup
Layered sample
Depth scan (Polyimide film)
Cu (5 mm)
Co (25 mm)
Cu (5 mm)
Kapton
Kapton
Cu K can excite Co K.Si wafer substrate
Fe K absorption edge Co K absorption edge
Ni K absorption edge
Secondary excitation of Co by Cu
Thickness of Kapton film was 0, 7.5, 75, 150 mm
Without Kapton film With Kapton film of 7.5 mm
With Kapton film of 75 mm With Kapton film of 150 mm
Cu
(5 m
m)
Co (
25 m
m)
Cu
(5 m
m)
Kap
ton
Kap
ton
Shoulder peak Additional peak 38
③①Cu
②
Co
③
Cu
Co
Kapton
Kapton
Analytical point
Primary X-rayDetector
Secondary excitation process in confocal m-XRF
Fluorescent X-ray of CuPrimary X-ray
Fluorescent X-ray of Co
②
Analytical volume②③①
Cu Foil
Co FoilKapton
39DXC2018 Workshop: Micro XRF, K. Tsuji
Step 1
Step 2 Step 3
Ti
Ti Ti
K. Tsuji, A. Tabe, P. Wobrauscheck
and C. Streli, Powder Diffraction, 30
(2015) 109-112.
Simulation of confocal M-XRF intensity
DXC2018 Workshop: Micro XRF, K. Tsuji
0
5
10
15
20
25
30
-100 -80 -60 -40 -20 0 20 40 60 80 100
Z=-40μm
TiKa CuKa
0
5
10
15
20
25
30
-100 -80 -60 -40 -20 0 20 40 60 80 100
Z=-40μm
TiKa CuKa
0
50
100
150
200
-100 -80 -60 -40 -20 0 20 40 60 80 100
Z=41.0μm
CuKa TiKaP TiKaS
0
50
100
150
200
-100 -80 -60 -40 -20 0 20 40 60 80 100
Z=41.0μm
CuKa TiKaP TiKaS
Cu - Ti Ti - Cu
Exp
erim
en
tal
Sim
ula
tio
nComparison of Experimental and simulation profiles
Analyzing depth: 40 mm in depth
Cu
Ti Cu
Ti
DXC2018 Workshop: Micro XRF, K. Tsuji
Wire sample
8 mm Stainless steel frame
Double-sided tapePP base adhesive tape5 μm Polypropylene film
φ30 μm Cu wireφ30 μm Fe wire
Cross sectional view
Fe Cu
Top view
Confocal point
DXC2018 Workshop: Micro XRF, K. Tsuji
In air
Comparison of Experimental and simulation maps
-120 -100 -80 -60 -40 -20 0 20 40 60 80 100
-60
-40
-20
0
20
40
60
80
100
Cu K
X /μm
Z /
μm
0.2512
0.3981
0.6310
1.000
1.585
2.512
3.981
6.310
10.00
15.85
25.12
39.81
63.10
100.0
158.5
251.2
398.1
631.0
1000Fe K
Wire distance ~156 μmExperimental Simulation
DXC2018 Workshop: Micro XRF, K. Tsuji
Applications of C-M-XRF
29DXC2018 Workshop: Micro XRF, K. Tsuji
30
◆ Micro analysis of small volume
◆ Analysis of inside of the sample in solid or
solution
◆ Elemental depth profiling
◆ Depth XRF imaging (cross sectional)
◆ Depth-selective XRF imaging
Advantages of confocal m-XRF in the laboratory
DXC2018 Workshop: Micro XRF, K. Tsuji
1 st
2nd
3rd
4th
Base
1st
4th
3rd2nd
5th
6th
7th
8th
1st2nd
5th
3rd
4th
Sample No.1: Red paint Sample No.3: Blue paint
1 mm 1 mm3 mm
Sample No.2: Black paint
Thickness: 110 mm Thickness: 170 mm Thickness: 280 mm
Elemental depth profiling of paint chip of car
Surface coating paint chips of cars after car traffic accidents
(Forensic Science Laboratory, Hyogo Prefecture Police Headquarters, Japan)
31Optical microscope images of cross-sections after angle-polishing.
0.0
0.2
0.4
0.6
0.8
1.0
0 50 100 150 200 250 300 350
: Fe
: Zn
: Ti
: Cu
: Cl
: K
No
rmalized
in
ten
sit
y / a
.u.
Scanned distance (Depth) / mm
1st Base2nd 3rd 4th 6th – 8th
Elemental depth profiling of car paint chip
Cl :automotive topcoat, K :mica, Fe
Cu, Cl: CuPc, K: micaTi: TiO2, Fe: Fe2O3, FeTiO3
Cu, Cl: CuPc,: K: micaTi: TiO2, Fe: Fe2O3, FeTiO3
K: mica, Zn: ZnO, Ti: TiO2, Fe: Fe2O3, FeTiO3
Zn corrosion inhibitor
Zn, Fe: zinc-coated steel plate
1st
2nd
3rd
4th
6-8th
Base
1 mm
Layer structure of paint chip
Surface
5th
CuPc: Cu-phthalocyanine
Anal. Chem., 83 (2011) 3477-3483
Automobile paint chip at car traffic accident was analyzed
in cooperation with Japanese police forensic laboratory.
Analytical modes by Confocal M-XRF
Depth selective
elemental mappingCross sectional,
Depth elemental imaging
33DXC2018 Workshop: Micro XRF, K. Tsuji
213
0
Inte
nsi
ty /
cp
s
1448
0
Inte
nsi
ty /
cp
s
Red:200 cpsBlue:100 cps
Red:1300 cpsGreen:800 cps
Elemental images obtained by micro-XRF
Ni KAu L
Contact pad Contact pad
34
11 mm
15
mm
Micro-SD memory card
used for mobile phone
Thickness : 0.8 mm
Elemental imaging of the
industrial materials is
important for defective and
quality examination.
X-Ray Spectrom., 42 (2013) 123-127.
50 kV- 0.5 mA
Mapping area: 11 × 15 mm
Step size : 100 mm, 10s/ step
252
0
Inte
nsi
ty /
cp
s
2238
0
Inte
nsi
ty /
cp
s
149
0
Inte
nsi
ty /
cp
s
(Yellow:1600 cps) (Blue:60 cps)(Green:100 cps)
Ti K Cu K Br K
Elemental images obtained by micro-XRF
Ti : hard plastics Cu : printed circuit Br : epoxy resin
35
X-Ray Spectrom., 42 (2013) 123-127.
36
20 mm 35 mm 50 mm 65 mm 90 mm 120 mmSurface Inside
Mic
ro-X
RF
3D–X
RF
Depth selective elemental imaging(micro SD memory card) Cu K image
Depth = 35 mm Depth = 90 mm
1st printed circuit near surface
X-Ray Spectrom., 42 (2013) 123-127.
37
Monitoring of chemical reactions in the
solution by confocal m-XRF
Advantages of confocal m-XRF
In situ XRF analysis of the inside of the sample
in solutions.
➢ K. Tsuji, T. Yonehara, K. Nakano, Application of confocal 3D micro XRF for solid/liquid interface analysis, Anal. Sci., 24 (2008) 99-103.
➢ S. Hirano, K. Akioka, T. Doi, M. Arai, and K. Tsuji, Elemental depth imaging of solutions for monitoring corrosion process of steel sheet by confocal micro-XRF, X-Ray Spectrom., 43 (2014) 216-220. (monitoring of
corrosion process)
DXC2018 Workshop: Micro XRF, K. Tsuji
Analytical modes by Confocal M-XRF
Depth selective
elemental imagingCross sectional,
Depth elemental imaging
38
Liquid
Solid
DXC2018 Workshop: Micro XRF, K. Tsuji
SampleX-ray tube
SDD
Confocal Micro-XRF setup and sample
Mo target, 50 kV, 0.6 mA
X-ray tube
MCBM 50-0.6 B (rtw, Germany)
Sens. area: 50 mm2 <130 eV at Mn Ka
Polycapillary X-ray lens (XOS) :10 mm
Vortex EX-60 (Hitachi high-tech science co.)
SDD and lens
Spatial resolution: 14.5 mm@Au Lα
Steel sheet with plating Zn layer
Thickness
C Si P
Mn Fe
Al Fe Zn
P Mn Ni Zn
Al Si Ti SnCoating layer
Chem. conversion
Plating Zn layer
Steel sheet
15 mm
2 ~ 3 mm
10 mm
Element
Scratch
X-ray tube (Mo)
SDD
X-Y-Z stages
Sample
3.5% NaClsolution
450 mmKapton
Sample cell and experimental procedure
Teflon (PTFE) case
40
CupCap
Polycapillaries
Steel sheet was placed in the sample
cell.
NaCl solution (3.5 mass%) was filled
in the sample cell.
DXC2018 Workshop: Micro XRF, K. Tsuji
Scanned distance / mm
Fe
Ti
Zn
Mn
NaCl solution
Steel sheet
0
200
400
600
0
200
400
600
0
200
400
600
0
200
400
600Sca
nn
ed
dis
tan
ce in
dep
th / m
mElemental maps in 0-24 hours (after one day)
24 hours / image
Start
End
Analyzed area: 1680 mm x 600 mm
Step size : 15 mm x 10 mm
Scratch
Zn
Mn
Fe
Ti
0
200
400
600
0
200
400
600
0
200
400
600
0
200
400
600
Elemental maps in 96-120 hours (after 5 days)
Pre-blister was
observed
Scanned distance / mm
Scan
ned
dis
tan
ce
in
dep
th / m
m
Zn
Mn
Fe
Ti
0
200
400
600
0
200
400
600
0
200
400
600
0
200
400
600
Elemental maps in 120-144 hours (after 6 days)
Blister-type corrosion
was observed
Scanned distance / mm
Scan
ned
dis
tan
ce
in
dep
th / m
m
Fe and Zn were dissolved and enriched inside the blister.
Zn
Mn
Fe
Ti
0
100
200
300
400
500
0
100
200
300
400
500
0
100
200
300
400
500
0
100
200
300
400
500
Dissolved Fe, Zn, and Mn were diffused into the solution.
Elemental maps in 192-240 hours (after 9-10 days)
Scanned distance / mm
Scan
ned
dis
tan
ce
in
dep
th / m
m
Zn
Mn
Fe
Ti
0
100
200
300
400
500
0
100
200
300
400
500
0
100
200
300
400
500
0
100
200
300
400
500
Elemental maps in 240-288 hours (after 11-12 days)
Scanned distance / mm
Sca
nn
ed
dis
tan
ce in
dep
th / m
m
Zn, Fe and Mn under the blister were diffused in the
solution, and enriched near the Kapton film.
Corrosion process was successfully visualized.
2) FF-XRF imaging
with x-ray camera
46DXC2018 Workshop: Micro XRF, K. Tsuji
X-ray fluorescence imaging
Scanning type XRF imaging
Polycapillary lens
Primary
X-rays
Full Field type XRF imaging
Primary X-rays
2D detector
SDD◆ Micro x-ray beam is created.
◆ XRF image is obtained with
high spatial resolution.
◆ Scanning process needs a
long acquisition time.
◆ X-rays irradiate a large area
of a sample.
◆ X-ray camera is applied for
taking x-ray images (gray
scale image).
⚫ WD-XRF imaging spectrometer
⚫ ED-XRF imaging camera
Spectroscopic techniques
2q
q
Sample
Soller
slits
S.C.
P.C.
X-ray
tube
Dispersive
crystal
Conventional WD-XRF
Bragg's law:2d sinq = nl
Diffracted
x-rays
48
Soller slits
DXC2018 Workshop: Micro XRF, K. Tsuji
Analyzing crystal
Primary
X-rays
X-ray tube
Sample
X-ray fluorescence
Entrance
straight
polycapillary
X-ray
2D-detector
Exit straight
polycapillary
Concept of WD-XRF imaging spectrometer
K. Tsuji, et al, Anal. Chem., 83 (2011) 6389-6394.
K. Tsuji. et al. Spectrochim. Acta, Part B, 83-84 (2015) 43-53.49
Previous results were reported in the following papers:
2D collimator2d sinq = nl
DXC2018 Workshop: Micro XRF, K. Tsuji
WD-XRF imaging spectrometer
θ2θ
Vacuum chamber (20 Pa)X-ray tube
W target
50 kV, 60 mA
SampleStraightpolycapillary
24 mm
Polymer window
Based on Rigaku RIX-1000
Straight polycapilalry(XOS)
5.0 µm
10.7 mm
Length :10.5 mm
DXC2018 Workshop: Micro XRF, K. Tsuji
PLATUS detector was applied
X-ray images with diffraction angles
DXC2018 Workshop: Micro XRF, K. Tsuji
45.03 °(Cu Kα) 45.5 ° 46.0 ° 46.5 °
47.5 ° 48.5 ° 48.65 °(Ni Kα)48.0 °
10 mm 10 mm 10 mm
10 mm 10 mm
10 mm
10 mm 10 mm
0 170 ( count )
10 mm
Ni (50 mm)
Cu
A triangle Ni thin film (50 mm in thickness) was places on a Cu sheet.
Exposure time for each image: 1 s
48.645 °48.545 °
48.445 °
48.745 °
48.845 °
49.345 °49.245 °49.145 °
49.045 °48.945 °
47.945 ° 48.045 ° 48.145 °
48.245 ° 48.345 °
W target
60 kV , 50 mA
Exposure time : 60 s
In air
2θ (deg.)
Inte
ns
ity (
cp
s/p
ixe
l)
FWHM
= 0.545 °
77 eV at Ni K (7.47 keV)
Energy resolution
10 mm
Ni (50 mm)
Cu
DXC2018 Workshop: Micro XRF, K. Tsuji
Ni K
Cu K
Zn K
1 s0.5 s0.1 s
48.65°
45.01°
41.78°
Exposure timeW target
50 kV , 60 mA
53
Elemental images of 1 Euro coin
K. Tsuji. et al.
SAB, 83-84
(2015) 43.
DXC2018 Workshop: Micro XRF, K. Tsuji
FF-ED-XRF imaging spectrometer
Fig. 2. Energy response of the CCD detector. CCD counts indicate the raw and digitized data generated by the analog to digital converter of the CCD.
Fig. 3. The fluorescence spectrum of Fe measured using the X-ray pinhole camera. The energy resolution is 157 eV at Fe–Kα line.
F. P. Romano, et al., Spectrochimica Acta Part B, 86 (2013) 60–65.
Photon counting
DXC2018 Workshop: Micro XRF, K. Tsuji
< Straight polycapillary
by XOS >
X-ray ShutterMo target
(30 kV, 2mA)
X-ray
tubeX-ray
CCD
e-
e-
FF-ED-XRF imaging spectrometer
⚫ Backside illumination type⚫ Pixels : 1024 pixel x 1024 pixel
(512 x 512), (256 x 256)⚫ Pixel size : 13 mm x 13 mm⚫ Area : 13.3 mm x 13.3 mm⚫ Cooling : - 90 ℃
Andor iKon-M
e-
DXC2018 Workshop: Micro XRF, K. Tsuji
To perform a single photon counting,an x-ray shutter was used.A straight polycapillary gives 1:1 imagefor the sample to the CCD.
4
12 mm
25 mm
20 m
m
< Straight polycapillary (XOS) >
Optic dimention(flat to flat) 20 mm
Channel diameter 12 mm
Enclosure Diameter 25 mm
Optic length 13 mm
Open area 65 %
Straight polycapillary as angular filter
DXC2018 Workshop: Micro XRF, K. Tsuji
y = 6.4288x + 107.43R² = 0.9627
0
50
100
150
200
250
300
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28En
erg
y r
eso
luti
on
/ e
V
Energy / keV
142 eV @ Fe K
⚫ Mo tube : 30 kV, 2 mA
⚫ Pure metals: Ag, Au, Co, Cu,
Fe, Ni, Ti, Zn
⚫ Exposure time: 1s / frame
⚫ Total frames: 100 frames
⚫ 256 pixel x 256 pixel Inte
nsit
y /
co
un
ts
Energy / keV
XRF spectrum of
pure Fe metal
FWHM
Energy resolution
DXC2018 Workshop: Micro XRF, K. Tsuji
Element
FWHM (mm)
256 x 256
(Bin = 4)
512 x 512
(Bin = 2)
Co K 337 51
Cu K 241 33
Fe K 352 52
Ni K 297 41
Pb L 150 16
Ti K 521 73
Zn K 241 30
⚫ Mo tube : 30 kV, 2 mA
⚫ Pure metals: Co, Cu, Fe, Ni, Ti, Zn foils
(50 mm in thickness), and Pb (1 mm)
⚫ Exposure time : 1 s / frame
⚫ Total frames: 900 frames
⚫ Effective pixels : 256 pixel x 256 pixel
512 pixel x 512 pixel
13.3 mm
Image of
Cu K13.3 mm
0
70
90
110
130
150
170
0 20 40 60 80 100 120
Inte
nsit
y /
co
un
ts
pixel
0
25counts
FWHM
Spatial resolution
0
2000
4000
6000
8000
0 5 10 15 20
Cu K
Cu K
Pb L
Br KPb L
Br K
Energy (keV)
Inte
nsit
y (
co
un
ts)
⚫ Mo tube:
30 kV, 10 mA
⚫ Exposure
time: 0.05 s
⚫ Total frames:
9000 frames
⚫ 256 pixel x
256 pixel
FF-ED-XRF imaging of electronic circuit card
5 mm2 mm
Ti K Counts
Total exposure time: 7.5 min.
⚫ Mo tube:
30kV, 10 mA
⚫ Exposure
time: 0.05 s
⚫ Total
frames: 9000
frames
⚫ 256 pixel x
256 pixel
FF-ED-XRF imaging of electronic circuit card
5 mm2 mm
Simultaneous elemental images were obtained.
Total exposure time: 7.5 min.
Scanning type FF (projection) type
SEM-EDS (C)-M-XRF WDXRF ED-camera
Source Electrons X-ray tube X-ray tube X-ray tube
scanningElectron beam
scanningSample scanning
Without scan
(but angle scan)Without scan
Spatial
resolution1 mm 10 mm ~ 300 mm < 50 mm
Energy
resolution~ 140 eV ~ 140 eV < 70 eV (~ 40 eV) ~ 140 eV
AdvantageHigh spatial
resolution
3D analysis by C-
M-XRF
Short exposure time
(~ 1 s)
High energy-reso.
Simultaneous multi-
elemental imaging
Drawback
Vacuum
Damages
Electrical
conductivity
Long acquisition
time for large
sample
Large equipment
Ange scan
Photon counting for
weak x-rays
Long acquisition time
Comparison of XRF imaging techniques
DXC2018 Workshop: Micro XRF, K. Tsuji
Summary• Scanning-confocal M-XRF was applied for
elemental depth profiling, depth-selective XRF imaging, also monitoring the corrosion process of the steel sheet in the solution.
• FF-WD-XRF imaging was introduced. The advantage of this technique is a fast imaging less than 1 s with good energy resolution.
• FF-ED-XRF imaging with CCD camera was introduced. Elemental distribution on the surface was imaged through straight polycapillary (angular filter) by single photon counting analysis.
62DXC2018 Workshop: Micro XRF, K. Tsuji