16
1 ECE 261 Krish Chakrabarty 1 CMOS Testing-2 Design and test Design for testability (DFT) Scan design Built-in self-test IDDQ testing ECE 261 Krish Chakrabarty 2 Design and Test Flow: Old View Test was merely an afterthought Specication Design Design errors Fabrication Testing Random defects Synthesis, full-custom simulation, verication, test generation Accept Reject Pass Fail

CMOS Testing-2people.ee.duke.edu/~krish/teaching/Lectures/Testing.2.pdf · CMOS Testing-2 • Design and test • Design for testability (DFT) – Scan design • Built-in self-test

  • Upload
    others

  • View
    3

  • Download
    0

Embed Size (px)

Citation preview

1

ECE 261 Krish Chakrabarty 1

CMOS Testing-2• Design and test

• Design for testability (DFT)– Scan design

• Built-in self-test

• IDDQ testing

ECE 261 Krish Chakrabarty 2

Design and Test Flow: Old View• Test was merely an afterthought

Specification

DesignDesignerrors

Fabrication

Testing

Randomdefects

Synthesis, full-customsimulation, verification,test generation

Accept Reject

Pass Fail

2

ECE 261 Krish Chakrabarty 3

Design and Test Flow: New ViewDesign and test are tightly coupled

Specification

Design fortestability

Designerrors

Fabrication

Testing

Randomdefects

Accept Reject

Pass Fail

Processimprovements

Designimprovements

Diagnosis

ECE 261 Krish Chakrabarty 4

Testing Sequential CircuitsDifficult problem-internal states cannot be directly controlled and observedLong test sequences are necessarySolution: Scan design-simplify to combinational circuit testing

Combinational

logic

Registers

Primary

inputs

Primary outputs

(controllable) (observable)

State outputs (not observable) State inputs

(not controllable)

3

ECE 261 Krish Chakrabarty 5

Design for Test

• Design the chip to increase observability and controllability

• If each register could be observed and controlled, test problem reduces to testing combinational logic between registers.

• Better yet, logic blocks could enter test mode where they generate test patterns and report the results automatically.

ECE 261 Krish Chakrabarty 6

Scan DesignMake all flip-flops directly controllable and observable by adding multiplexersPopular design-for-test (DFT) technique-circuit is now combinational for testing purposes

Combinational

logic

Primary inputs

Primary outputs

Scan in

Scan out

Scan cells

State inputs State outputs (controllable) (observable)

4

ECE 261 Krish Chakrabarty 7

Scan Design• Convert each flip-flop to a scan register

– Only costs one extra multiplexer

• Normal mode: flip-flops behave as usual• Scan mode: flip-flops behave as shift register

• Contents of flopscan be scannedout and new values scannedin

ECE 261 Krish Chakrabarty 8

Scan Cell Design0

1D Q

Scan in(Test data)

Data(Functional)

N/T

N/T = 1: Test mode

N/T = 0: Normal mode

Scan in

Clock

D0 D1 D2 D3

Scanout

N/TQ0 Q1 Q2 Q3Clock

5

ECE 261 Krish Chakrabarty 9

Scannable Flip-flops

ECE 261 Krish Chakrabarty 10

Scan Design• Separate input and output 4-bit scan registers

• Test sequence: {01100, 11011}, first 4 bits are for flip-flops

Combinational circuit

Scan chain/Scan path

Test data

Test responses

01101101

1

0

Controllableprimaryinput

N/T

N/T

6

ECE 261 Krish Chakrabarty 11

Steps in Scan Testing• N/T = 1: Scan in test pattern, hold appropriate bit

pattern on controllable primary inputs

• N/T = 0: Apply test pattern to combinational circuit

• N/T=1: Scan out test responses

• Scan provides complete controllability and observability

• Testing time? How many cycles? How to test scan registers?

ECE 261 Krish Chakrabarty 12

Long Scan Chains

Test vectors need to be translated to scan format

Nor

mal

dat

a

Scan chainTest data

7

ECE 261 Krish Chakrabarty 13

Built-in Self-test

• Built-in self-test lets blocks test themselves– Generate pseudo-random inputs to comb. logic

– Combine outputs into a syndrome

– With high probability, block is fault-free if it produces the expected syndrome

ECE 261 Krish Chakrabarty 14

Built-in Self Testing (BIST)

On-chip test generator and response monitor

Test

generator

(TGC)

(CUT)

Control

Inputs Outputs

Error

0

1

Response

monitor

(RM)

Circuit

under test

8

ECE 261 Krish Chakrabarty 15

BIST: Advantages• Lower cost due to elimination of external tester• In-system, at-system, high-quality testing• Faster fault detection, ease of diagnosis• Overcomes pin limitations and related interfacing problems• Reduces maintenance and repair costs at system level

ECE 261 Krish Chakrabarty 16

BIST: IssuesTest strategy (random, exhaustive, deterministic)Circuit partitioningTest pattern generation

Exhaustive: countersRandom: Linear-feedback shift registers (LFSRs)Deterministic: ROM, other methods?

Response analysisTest control and scheduling

9

ECE 261 Krish Chakrabarty 17

BIST Logic Circuits

Test patterns

• Linear-feedback shift-register (LFSR)

• Multiple-input signature register (MISR) Test responses

Signature

ECE 261 Krish Chakrabarty 18

BIST Pattern Generation• Linear Feedback Shift Register

– Shift register with input taken from XOR of state

– Pseudo-Random Sequence GeneratorStep Q

0 111

1

2

3

4

5

6

7

10

ECE 261 Krish Chakrabarty 19

BIST Pattern Generation• Linear Feedback Shift Register

– Shift register with input taken from XOR of state

– Pseudo-Random Sequence GeneratorStep Q

0 111

1 110

2

3

4

5

6

7

ECE 261 Krish Chakrabarty 20

PRSG• Linear Feedback Shift Register

– Shift register with input taken from XOR of state

– Pseudo-Random Sequence Generator

Step Q

0 111

1 110

2 101

3

4

5

6

7

11

ECE 261 Krish Chakrabarty 21

PRSG• Linear Feedback Shift Register

– Shift register with input taken from XOR of state

– Pseudo-Random Sequence Generator

Step Q

0 111

1 110

2 101

3 010

4

5

6

7

ECE 261 Krish Chakrabarty 22

PRSG• Linear Feedback Shift Register

– Shift register with input taken from XOR of state

– Pseudo-Random Sequence Generator

Step Q

0 111

1 110

2 101

3 010

4 100

5

6

7

12

ECE 261 Krish Chakrabarty 23

PRSG• Linear Feedback Shift Register

– Shift register with input taken from XOR of state

– Pseudo-Random Sequence GeneratorStep Q

0 111

1 110

2 101

3 010

4 100

5 001

6

7

ECE 261 Krish Chakrabarty 24

PRPG

• Linear Feedback Shift Register– Shift register with input taken from XOR of state

– Pseudo-Random Sequence GeneratorStep Q

0 111

1 110

2 101

3 010

4 100

5 001

6 011

7

13

ECE 261 Krish Chakrabarty 25

PRSG

• Linear Feedback Shift Register– Shift register with input taken from XOR of state

– Pseudo-Random Sequence GeneratorStep Q

0 111

1 110

2 101

3 010

4 100

5 001

6 011

7 111 (repeats)

ECE 261 Krish Chakrabarty 26

BILBO• Built-in Logic Block Observer

– Combine scan with PRSG & signature analysis

14

ECE 261 Krish Chakrabarty 27

Boundary Scan

• Testing boards is also difficult– Need to verify solder joints are good

• Drive a pin to 0, then to 1

• Check that all connected pins get the values

• Through-hold boards used “bed of nails”

• SMT and BGA boards cannot easily contact pins

• Build capability of observing and controlling pins into each chip to make board test easier

ECE 261 Krish Chakrabarty 28

Boundary Scan Example

15

ECE 261 Krish Chakrabarty 29

Boundary Scan InterfaceIEEE 1149.1 JTAG standard

• Boundary scan is accessed through five pins– TCK: test clock

– TMS: test mode select

– TDI: test data in

– TDO: test data out

– TRST*: test reset (optional)

• Chips with internal scan chains can access the chains through boundary scan for unified test strategy.

ECE 261 Krish Chakrabarty 30

BIST in IndustryEarly days: AT&T (Lucent) incorporated BIST in hundreds of commercial chips Intel: 80386, Pentium, Pentium ProHardware overhead typically 15% of self-tested portion (around 5% for entire chip, e.g. 6% for the Pentium Pro)Regular embedded arrays (RAMs, PLAs) almost always tested using BIST: DEC Alpha, PowerPCBIST for irregular logic not so widespread

16

ECE 261 Krish Chakrabarty 31

IDDQ Testing• Based on current measurements, not voltage

– IDDQ = IDD quiescent

• In CMOS technology, quiescent current is very low

• Testing idea: check for faults by detecting current spikes– Advantage: Massive observability, good for detecting shorts

– Disadvantage: slow, leakage current closer to quiescent current for deep submicron