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Chemical Machining
Presented by
Dr. P. SahaDepartment of Mechanical Engineering IIT Kharagpur
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2/17/2018 P Saha, Mech Engg, IIT Kharagpur 2
Skin of aluminum aircraft wing
(after removal of unnecessary metal from numerous surface
pockets for better strength/weight ratio)
(source Chemcut Corporation)
Case Study 1 mech14.weebly.com
2/17/2018 P Saha, Mech Engg, IIT Kharagpur 3
Beryllium-copper alloy encoder disc (125 micron thick, Total 200 slits regularly spaced at 1.80 separation)
Case Study 2 mech14.weebly.com
2/17/2018 P Saha, Mech Engg, IIT Kharagpur 4
Solution
?
…… Chemical Machining(CHM)
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2/17/2018 P Saha, Mech Engg, IIT Kharagpur 5
Basic Scheme
MASK
WORK MATERIALETCHANT
AGITATIOREXHAUST
RequirementsMaskWorkpiece or substrateEtchant (acid or alkali)AgitationFume extraction (for reaction products)
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Finished part
Maskant coating Development of etching surface
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CHM Classification
Chemical Milling weight reduction
blind detailing
Chemical Blanking through detailing
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Classification of masks
1. Vinyl, Neoprene rubber, Bee wax
2. Applied by flow, dip or spray
3. Mask thickness: 0.03-0.13 mm
4. Unnecessary portion cut & peeled
Cut & Peel type
masking material is first applied on the entire surface of
the substrate,
the masking is cut along a template with a sharp cutter,
peeled off to expose the area to be milled.
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Classification of masks
1. Silk or stainless steel mesh which has a stencil placed upon the material to be machined
Screenprint
Uses screens (mesh) made of silk, synthetic fiber suchas nylon and polyester, or fine filament of stainless steel.
Negative images of the needed patterns are created onthe screen, then resistive ink is applied by press-roller
onto the substrate through the screen to create the finalpatterns.
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Screen print mech14.weebly.com
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A. Ink, B. Press roller/ Squeeze, C. Image, D. Photo-emulsion, E. Screen, F. Printed image.
Screen print mech14.weebly.com
2/17/2018 P Saha, Mech Engg, IIT Kharagpur 13
Classification of masks
1. Naturally occurring and synthetic photosensitive resins
2. Applied by spin coater and photographic projection technique. so high production rate
3. Mask thickknees: extremely thin (few microns). Not used for parts more than 1.25mm thick and 1.5 m long
4. Can handle highly corrosive etchants
Photoresist
The photo resist method creates very fine and accuratebut thin resist patterns that provide small chemicalresistances to strong alkali and acidic etchants. It is
mostly used only for small depth applications.
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Applying photo resist by Spin Coater
Rotation (@ around 5000 rpm) is continued while the fluid spins off the edges of the substrate, until the desired thickness of the film is achieved.
The applied solvent is usually volatile, and simultaneously evaporates.
The thickness of the film also depends on the concentration of the solution and the solvent.
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Chemical Resistance
Deeper etching is possible with
thicker mask
Part Configuration Some masks are only applicable to
flat parts
Quantity of parts Masking process should be less
labour intensive for high quantity parts
Cost Cost affordabilty
Ease of removal Delicate parts require easy removal
of mask
Required resolution
Thicker masks result in less
resolution
Selection criteria for masks
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Uses of different masks
1. Big structural parts
2. Milling of aircraft components
3. Missiles
4. Space components
1. Small and thin components
2. Never used for big components
3. PCB
4. Watch components like gears, small spiral rings
5. Flat sheet metal components
1. Used for mass production
2. But less accurate as compared to photo resist technique
Cut & Peel type
Photoresist
Screenprint
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UndercutEtchFactor
Depth of etch=
Undercut and Etch factor mech14.weebly.com
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MetalPreferred etchant
Etch rate (mm/min)
Etch factor
Aluminum FeCl3 0.025 1.7:1
Copper FeCl3 0.050 2.7:1
Nickel alloys
FeCl3 0.018 2.0:1
Phosphor-bronze
Chromic acid
0.013 2.0:1
Silver FeNO3 0.020 1.5:1
Titanium HF 0.025 2.0:1
Tool steel HNO3 0.018 1.5:1
Etchant Applications and Their Characteristicsmech14.weebly.com
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Etchant selection
Required surface finish
Some combinations of material and enchant result in the formation of surface oxides, which degrades the finish
Removal rate Faster rate lowers the cost, but attacks the resist bond, results in poor finish, or produces high heat
Material type Enchant must attack the material without causing intra granular attack or stress corrosion cracking
Etch depth Some etchants produce surface finishes that worsen with increasing depth
Type of resist Etchant must not destroy resist during the process time
Cost Cost of the etchant, maintenance, and disposal
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Under cut in partially etched and fully etched parts
• Advantage of double-sided etching.• Sidewise straightness (zero taper) can be achieved eventually
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Process Sequence in Stepped Etching
Target object
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Taper achieved in CHM through controlled volume withdrawal
Very slow
withdrawalTarget object
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Advantages of CHM
No conventional tools & dies (as required in
stamping process)
Dimensional repeatability
Design flexibility (from prototype to mass
production)
Low cost
Metal properties remain unchanged
Burr free, crack & stress free parts
Well-suited for too complex, too thin and too small
parts
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