Lowest cost per watt

High throughput up to 6,000 w/h Minimum running and maintenance costs 30% cost savings to market standard 50% less power consumption Lowest breakage rates for standard and thin wafers Bio-degradable insulation material (CE-certified, no additional safety measures required)

Innovative tool concept

Ceramic roller transport system for metal free and smooth cell transport Inline furnace with up to 8 lanes for multiple applications like diffusion, annealing and curing No yield loss in case of power shut down

Superior process results

No metal contamination Precise temperature control and excellent temperature uniformity Gas flow engineering via adjustable gas inlets and exhausts

CALiPSOFlexible Heat Treatment Furnace

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Steady state time between some minutes and hours (ill. 1) Low and high temperature applications (200°C – 1,000°C) (ill. 2) Individually closed loop controlled heating zones per module Up to 8-lane processing of 6 cells (other substrates of 4» to 40» possible) Heating length from 4.5 to 50 m Simple and safe process chamber access Innovative solution for easy maintainability Versatile gasflow engineering options Combination with various inline doper possible

EmitterDiffusion

Phosphor Glass (PSG)

Etching

Anti-Reflection Coating, Rear and Front Side

Passivation (Al2O3, SiNx)

LaserAblation

Screen Print

Contact Firing

MB-PERC process

Module B - Smallm x Process zone1,300mm

Module ALoading zone3,900 mm

Module C - Largen x Process zone5,000mm

Tem

pe

ratu

re [

°C]

Time [min]

4.7 m

7.0 m

14.1 m

28.2 m

35.2 m

Heating time [min]

4800

4000

3200

2400

1600

800

0

Th

rou

gh

pu

t [w

afe

r/h

]

Heating length as function of heating time and throughput

0 10 20 30 40 50 60 0 10 20 30 40 50 60

1200

1000

800

600

400

200

0

Curing Cell Tester& Sorter

Screen Printing

PECVD 2Front Side i/p

PECVD 1Back Side i/nTexturing

Heterojunction Technology process

PVDTCO Front/ Back Side

Back Contact

Module DUnloading zone3,900 mm

CALiPSO: Modular design

ill. 2ill. 1

1760

2361

1765 965

3900 4992 1248 3900

Technical data at a glance

Meyer Burger (Germany) AG, sales@meyerburger.com, www.meyerburger.com

Width ~ 2,360 mm

Height ~1,765 mm

Length Depending on application

Transport speed 0.1 – 10 m/min*

Process temperature up to 1,000 °C

Typical power consumption (@850 °C)

– for 15 m heating zone

– for 25 m heating zone35 kW50 kW

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Contact Firing

Cell Tester& Sorter

Anti-Reflection Coating,

Passivation

Screen Printing

EmitterDiffusion

Phosphor Glass (PSG)

Etching

Saw DamageEtching &Texturing

Standard c-Si process

EmitterDiffusion

Phosphor Glass (PSG)

Etching

Anti-Reflection Coating, Rear and Front Side Passivation

(Al2O3, SiNx)

LaserAblation

ScreenPrint

Contact Firing

MB-PERC process

Curing Cell Tester& Sorter

Screen Printing

PECVD 2Front Side i/p

PECVD 1Back Side i/nTexturing

Heterojunction Technology process

PVDTCO Front/ Back Side

Back Contact

Phosphorous Doping

* Depending on tool configuration