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0000950152-06-008920.txt : 200611070000950152-06-008920.hdr.sgml : 2006110720061107125533ACCESSION NUMBER:0000950152-06-008920CONFORMED SUBMISSION TYPE:8-KPUBLIC DOCUMENT COUNT:110CONFORMED PERIOD OF REPORT:20061107ITEM INFORMATION:Regulation FD DisclosureITEM INFORMATION:Financial Statements and ExhibitsFILED AS OF DATE:20061107DATE AS OF CHANGE:20061107

FILER:

COMPANY DATA:COMPANY CONFORMED NAME:BRUSH ENGINEERED MATERIALS INCCENTRAL INDEX KEY:0001104657STANDARD INDUSTRIAL CLASSIFICATION:PRIMARY SMELTING & REFINING OF NONFERROUS METALS [3330]IRS NUMBER:341919973FISCAL YEAR END:1231

FILING VALUES:FORM TYPE:8-KSEC ACT:1934 ActSEC FILE NUMBER:001-15885FILM NUMBER:061192974

BUSINESS ADDRESS:STREET 1:17876 ST. CLAIR AVE.CITY:CLEVELANDSTATE:OHZIP:44110BUSINESS PHONE:2163834062

MAIL ADDRESS:STREET 1:17876 ST. CLAIR AVE.CITY:CLEVELANDSTATE:OHZIP:44110

8-K1l22871ae8vk.htmBRUSH ENGINEERED MATERIALS INC. 8-K

Brush Engineered Materials Inc. 8-K

UNITED STATES SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 8-K

CURRENT REPORT
Pursuant to Section13 OR 15(d) of The
Securities Exchange Act of 1934

Date of Report (Date of earliest event reported) November7, 2006

Brush Engineered Materials Inc.

(Exact name of registrant as specified in its charter)

Ohio

001-15885

34-1919973

(State or other jurisdiction

(Commission

(IRS Employer

of incorporation)

File Number)

Identification No.)

17876 St. Clair Avenue, Cleveland, Ohio
44110

(Address of principal executive offices)
(Zip Code)

Registrants telephone number, including area code 216-486-4200

Not Applicable
(Former name or former address, if changed since last report.)

Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy thefiling obligation of the registrant under any of the following provisions (see General InstructionA.2. below):

o Written communications pursuant to Rule425 under the Securities Act (17 CFR 230.425)

o Soliciting material pursuant to Rule14a-12 under the Exchange Act (17 CFR 240.14a-12)

o Pre-commencement communications pursuant to Rule14d-2(b) under the Exchange Act (17 CFR240.14d-2(b))

o Pre-commencement communications pursuant to Rule13e-4(c) under the Exchange Act (17 CFR240.13e-4(c))

Item7.01 RegulationFD Disclosure

On November7, 2006, Brush Engineered Materials Inc., an Ohio corporation (the Company),updated the Current Investor Update, a slide presentation on its website, a copy of which isattached hereto as Exhibit99.1. This slide presentation shows the Companys corporate strategyand the financial results through the third quarter of 2006.

Item9.01 Financial Statements and Exhibits

Exhibits:

Exhibit Number Description of Exhibit

99.1

Current Investor Update

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has dulycaused this report to be signed on its behalf by the undersigned hereunto duly authorized.

Brush Engineered Materials Inc.

November 7, 2006 By: Michael C. Hasychak

Michael C. Hasychak

Vice President, Treasurer and Secretary

2

EX-99.12l22871aexv99w1.htmEX-99.1

EX-99.1

Brush Engineered Materials Inc.

Profile

Publicly traded since 1956: NYSE-listed since 1972

Founded 1931 as Brush Beryllium Company, recently celebrated 75thanniversary

Building off earlier pioneering technical work at Brush Laboratories

Initial scope was development of commercial markets

With onset of WW II and post war period, significant growth in defenseand eventually, aerospace applications

Mid-70s: major expansion of new commercial markets

Today, commercial markets represent 90% + of revenues

A leading manufacturer of high performance engineeredmaterials - a materials technology company

Operations, service centers and major office locations inNorth America, Europe and Asia

Serving long-term growth oriented global markets:

Telecommunications and computers

Magnetic and optical data storage

Aerospace and defense

Automotive electronics

Industrial components

Appliance

Medical

Brush Engineered Materials Inc.

Profile

Global Leader in High Performance

Engineered Materials

Note: 2005 revenues were $541.3 million

Handsets

PDAs

DVDs

2005 Revenue by Segment

2005 Revenue by Market

Applications

Routers

Servers

Connectors

Plastic Molds

X-RayWindows

Shielding

Bushings

Bearings

NotebookComputers

Lasers

Switches

Fine Wire

Relays

Thin FilmCircuits

Microelectronics

Group

Metal Systems

Group Other Telecommunications Automotive Magnetic and Data Storage Industrial Components Aeorspace & Defense Appliance 0.1 0.39 0.1 0.12 0.09 0.11 0.09

Other

Telecommunications

& Computer

Industrial

Components

Magnetic &

Data Storage

Automotive

Aerospace

& Defense

Appliance Metal Systems Group Microelectronics Group 0.57 0.43

Global Leader in High Performance

Engineered Materials

Note: 2005 revenues were $541.3 million

Handsets

PDAs

DVDs

2006 Revenue by Segment

2006 Revenue by Market

Applications

Routers

Servers

Connectors

Plastic Molds

X-RayWindows

Shielding

Bushings

Bearings

NotebookComputers

Lasers

Switches

Fine Wire

Relays

Thin FilmCircuits

Microelectronics

Group

Metal Systems

Group Other Telecommunications Automotive Magnetic and Data Storage Industrial Components Aeorspace & Defense Appliance 0.15 0.41 0.09 0.11 0.09 0.09 0.06

Other

Telecommunications

& Computer

Industrial

Components

Magnetic &

Data Storage

Automotive

Aerospace

& Defense

Appliance Metal Systems Group Microelectronics Group 0.57 0.43

BEM Materials are found in a wide range of criticaland demanding applications requiring:

- Strength - Reliability

- Thermal & electrical - Miniaturization

conductivity

- Weight reduction - Corrosion resistance

- Reflectivity

Brush Engineered Materials Inc.

"Advancing the World's Technologies"

Brush Engineered Materials Inc.

End Uses

Magnetic & OpticalData Storage

Industrial products

Life enhancing devices

Cellular phones and other wireless communications

Notebook and network computers

Electronic components in cars and trucks

Investment Highlights and Strengths

Global Leader in High Performance Engineered Materials

Unique Status as Fully Integrated Provider of Beryllium-Containing Products

Broad Metallurgical Capabilities in Precious and Non-precious Metals

Global Sales and Distribution Network

Sales Based on End User Specifications

Strong Value Proposition in Served Markets

Strategic Customer Relationships

Significant Technical Capabilities

Positive Long-term Market Trends

Strong Growth in New Products

High Barriers to Entry

Capacity to Support Profitable Market Growth

Strong Balance Sheet

Microelectronics

Electronic Products

Williams Advanced Materials Inc.

Metal Systems

Alloy Products

Beryllium Products

Technical Materials, Inc.

Brush Resources Inc.

Brush Engineered Materials Inc.

Organized into Two Separate Reportable Segments

Microelectronics Group - YTD Q3-2006 Sales: $271.7 million

$250.3 million; 45%

Precious metal and specialty alloys for highreliability applications

Products include precious and non-precious metalvapor deposition targets, frame lid assemblies,clad and precious metal preforms, high-temperature braze materials and ultra fine wire

Industries served include magnetic and opticaldata storage, semi-conductor, performance film,wireless/photonics and precision optics

$21.4 million; 4%

Products include beryllia ceramic materials,electronic packaging and thick-film circuitry

Products designed to meet exacting performancerequirements of target customers

Industries served include wirelesstelecommunications, medical laser, aerospace,defense and automotive

WilliamsAdvancedMaterials

(WAM)

ElectronicProducts

Metal Systems Group - YTD Q3-2006 Sales: $283.5 million

$53.0 million; 10%

Engineered material systems, including clad, plated andelectron beam welded metals used in demandingconnector applications

Combines precious and non-precious metals in strip formfor use in complex electrical components fortelecommunications systems, computers and automotiveelectronics

$200.1 million; 36%

Copper and nickel-based alloy materials, most of whichincorporate beryllium

Strip products are used in electronic connectors includingPDA's, wireless communications equipment, notebookand network computers and automotive electronics thatrequire high strength, formability and electricalconductivity

Bulk products are rod, bar, tube and plate products forheavy equipment and aerospace bushings and bearings,oil & gas components and plastic mold materials wherestrength, corrosion and wear resistance, thermalconductivity and lubricity are critical performancerequirements

TechnicalMaterials,Inc. (TMI)

AlloyProducts

Metal Systems Group - YTD Q3-2006 Sales: $283.5 million

$28.0 million; 5%

Pure beryllium and aluminum-beryllium compositesfor high-performance applications, principally formedical, space and defense applications wherestiffness, strength, lightweight, dimensional stability,reflectivity and x-ray/nuclear properties are critical.

$2.4 million; 0%

Brush Resources sells beryllium hydroxide producedthrough its Utah operations to outside customers andto businesses within the Metal Systems Group.

BerylliumProducts

BrushResources

Continued

Fully Integrated Beryllium Producer

Beryllium and beryllium alloys are critical to many highperformance applications

Strong

Lightweight

Good formability

Operate the only active bertrandite ore mine in the developed world

7,500 acres in Juab County, Utah

Approximately 100 years of proven reserves

Bertrandite Ore

Mining & Extraction

High reliability

Thermal and electrical conductivity

Corrosion and wear resistant

Delta, UT

Casting, Rolling

& Finishing

Elmore, OH

Thin Gauge Rolling

& Finishing

Reading, PA

Service &Distribution Centers

Global Network

Global Sales and Distribution Network

Operations in the U.S. and ten foreign locations

Recent expansion to Taiwan, China and Korea

International sales for YTD Q3 were 34%

?-------------- Asia / Pacific ------------? ? ---------------- Europe -------------- ? ? - Exports from USA -?

Singapore

Japan

Hong Kong

UK

Germany

Philippines

Taiwan

China

Ireland

Korea

Corporate Structure

Key Financial Statistics

$in millions

In 2001, the computer and telecom market decline drove sales back to mid-90's levels

In 2003, growth began to return to historical rates

In 2004 and 2005 growth accelerated 92 93 94 95 96 97 98 99 0 1 2 3 4 5 Sales 265 295 346 370 376 434 410 456 564 473 373 401 495 541 % Growth 0.11 0.17 0.07 0.02 0.15 -0.05 0.11 0.24 -0.16 -0.21 0.05

Historic Growth Rates

1992 - 1997 10.4%

1992 - 1999 8.2%

Computer &Telecom marketdecline

Year

ReturningtoHistoricalGrowthRates

The decline in the telecom/computer market resulted in a50% drop in the market segment's revenue comparing2003 to 2000. Since 2004, this market continues to grow.

$ in millions

Change

2000 2003 2004 2005 04-05

Telecom/Computer $277 $139 $206 213 $7

Automotive 62 53 59 53 (6)

Industrial 62 42 43 51 8

Magnetic and Optical Data Storage 56 53 52 67 15

Defense/Aerospace 34 37 49 58 9

Appliance 19 27 33 46 13

All Other 54 50 55 53 (2)

$564 $401 $497 $541 $44

The 3rd quarter 2006 was the fifteenth consecutivequarter where sales were higher than the comparablequarter of the prior year. Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 143.9 147.2 145.5 128.2 106.2 92.4 89.6 100.8 93.5 89.6 99.5 101.8 94.2 105.6 125.9 128.6 125.8 116 130.4 134.7 135.6 140.6 167.7 187.1 200.4

2000

2001

2002

2003

2005

2004

2006

Positive Market Trends

Electronic component manufacturers are being driven by end userdemands to produce products that are smaller, lighter and faster

Increased electronic component performance characteristics requirematerials that have enhanced mechanical, electrical and thermalproperties

Growing opportunity for thin film physical vapor deposition (PVD)products in the LCD, data storage and semiconductor markets

Spending and conditions in the telecommunications and computermarket have improved

Conditions have improved in the oil and gas, undersea, aerospaceand heavy equipment markets.

Brush has generated year-over-year sales growth in fifteen consecutive quarters

Capacity to Support Profitable Market Growth

Operating with significant available excess capacity

$140 million invested between 1996 and 2000

Alloy Products capacity utilization is currently at 50%

Significant productivity gains in recent years

Well-positioned to support rapid sales growth withoutsignificant incremental cash investment

Financial and Operational Initiatives

Expanding and diversifying the revenue base

New products

New applications

Improving margins through increased operating efficiency

Six Sigma and Lean Manufacturing

Controlling overhead costs

Maintaining a strong balance sheet

Positioning for global market growth

Improve quality, cost, speed and service

Our on-going performance improvement initiatives are

focused on five key areas

New markets

New geographies

Expand and Diversify Revenue Base

New Products

Alloy 390 - Telecom &Datacom

PM Plated Strip -Telecom & Auto

Toughmet - Bushings &Bearings

MoldMax XL - PlasticMolds

Welded Tube - Oil & Gas

Silver DVD Alloy (Silx) -DVD

Visi-Lid - Telecom &Military

New End Use Markets

Alloy

Heavy Equipment

Pumps, Valves,Fittings

Oil & Gas SafetyComponents

WAM

Semiconductors

Data Storage

Magnetic Media

Thin FilmTransistor/LiquidCrystal Display

New High-Growth Regions

Singapore

Taiwan

Hong Kong

Korea

China

BEM continues to aggressively work to broaden its base with initiatives targetedat new products, new end use markets and new high-growth regions

Improving Margins Through IncreasedOperating Efficiency

Increased pounds sold per employee 18%

Increased pounds shipped 50%

Reduced inventory1 41%

Improved yields 12%

Reduced manufacturing overhead 20%

Improved safety performance 43%

Reduced unplanned equipment downtime 35%

1days of sales on hand

Lean Manufacturing and Six Sigma initiatives enabled Brush's AlloyProducts business to improve operational efficiency and reduce costs from2002 to 2005

Debt Obligations

($ in millions) YTD

Q3

2000 2004 2005 2006

Balance Sheet Debt & AEP Lease $128.4 $ 72.5 $57.2 80.5

**Off-balance Sheet Leases 17.9 13.1 11.8 10.6

Total $146.3 $85.6 $69.0 $91.1

Debt to Debt Plus Equity 36% 26% 21% 24%

*2000 Balance Sheet debt includes major equipment lease

**Note - Excludes precious metal consignment

and leases of: $51.0 $17.1 $43.7 $59.1

*

Historical Gross Margins 2000 2001 2002 2003 2004 2005 2006F Margin% 0.21 0.14 0.13 0.18 0.22 0.2 0.21 Sales 564 473 373 401 496 541 740

$564

21%

$473

14%

$373

13%

$401

$496

18%

Sales ($M)

Margin %

22%

$740

Growth % +24% -16% -21% +8% +24% +9% +36-38%

20%

$541

21%

Segment Sales Review

2002 2003

$ % $ %

Microelectronics $139.2 37% $157.3 39%

WAM 109.1 29% 127.8 32%

Electronic Products 30.1 8% 29.5 7%

Metal Systems $233.6 63% $243.7 61%

Alloy 151.9 41% 162.3 40%

TMI 44.4 12% 41.9 11%

Beryllium Products 31.6 8% 35.2 9%

Brush Resources* 5.7 2% 4.3 1%

TOTAL $372.8 100% $401.0 100%

$ in millions

*Effective 1/1/05 Brush Resources Inc. is included in Metal Systems Group.

Prior years have been restated to reflect this change.

Segment Sales Review

YTD

2004 2005 Q3-2006

$ % $ % $ %

Microelectronics 195.6 39% 235.0 43% 271.7 49%

WAM 165.7 33% 209.6 38% 250.3 45%

Electronic Products 29.9 6% 25.4 5% 21.4 4%

Metal Systems $300.7 61% $306.3 57% $283.5 51%

Alloy 202.9 41% 208.2 39% 200.1 36%

TMI 53.6 11% 49.9 9% 53.0 10%

Beryllium Products 39.5 8% 42.6 8% 28.0 5%

Brush Resources* 4.7 1% 5.6 1% 2.4 0%

TOTAL $496.3 100% $541.3 100% $555.2 100%

$ in millions

*Effective 1/1/05 Brush Resources Inc. is included in Metal Systems Group.

Prior years have been restated to reflect this change.

Segment Earnings 2002 - 2006

YTD Q3

2002 2003 2004 2005 2006

Microelectronics $3.8 $12.6 $18.5 $19.0 $24.1

Metal Systems (34.8) (16.0) 4.5 6.3 10.0

Other 8.2 (5.5) 2.0 (5.8) (3.3)

Total Operating Profit $(22.8) $(8.9) $25.0 $19.5 $30.8

$ in millions

What We Do

Williams Advanced Materials develops, manufactures andmarkets materials and services of unique value for the DataStorage, Wireless/Photonics, Semiconductor, Optics,Hybrid Microelectronics and Performance Coatingindustries. We also support emerging technologies such asTFT/LCD, MRAM and Nanotechnology. Williamsproducts are primarily based on specialty metal productsused in high reliability and performance applications.

Sales History 1990 1994 1999 2004 2005 2006 Q3 East 38 72 110 168 218

$253MMYTD

Revenue by Market

1st Qtr 2nd Qtr 3rd Qtr 4th Qtr East 20.4 27.4 90 20.4 West 30.6 38.6 34.6 31.6 North 45.9 46.9 45 43.9

2004

2006 DVD Traditional Micro. Magnetic Data Storage Semiconductor Wireless and Photonics Other 5500 13900 13300 2600 13400 11300

DVD Traditional Micro. Magnetic and Data Storage Semiconductor Wireless and Photonics Other 1800 16000 21000 6000 19000 7100

International/Domestic Revenue

2006 Intl. U.S. 25 75

WilliamsAdvancedMaterials Inc.

WAMCorporate

ThinFilmProducts

ElectronicPackagingProducts

Business Structure Today andEvolving

ThinFilmServices

FabServices

SpecialtyInorganicMaterials

WAM Headquarters

Buffalo, NY USA - Manufacturing Facility

100,000 Sq. Ft. overall, 6,500 Sq. Ft. of cleanroom, state-of-the-artmachining/ milling/rolling/stamping/ cladding centers, target bonding,hydrostatic wire extrusion, high purity refining/recycling, metals casting,automated plating, full analytical capabilities, product Research &Development.

Specialty Alloys Operations

Wheatfield, NY USA- Williams Specialty Alloys

30,000 Sq. Ft. with volume vacuum casting, rolling, annealing,powder atomizing and machining. 10 acres for expansion.

Williams Thin Film Products Operations

Brewster, NY USA -

35,000 Sq. Ft. with vacuum melting, hot-pressing, milling, hot & coldrolling automated machining and target bonding capabilities.

Acreage to more than double our facility as needed.

Far East Operations

Singapore - WAM Far East Pte. Ltd.

Target bonding, bonding wireproduction, Combo-Lids(r). assembly

Taoyuan County, Taiwan - WAM Taiwan

Target bonding, evaporation materials & bonding wire.

Subic Bay, Philippines

Combo-Lids(r), low-cost lids andpreform - assembly, inspection andpackaging.

Limerick, Ireland - OMC Scientific, Ltd.

Subsidiary of WAM

Provides precision parts cleaning and reconditioning services for filmPhysical Vapor Deposition (PVD) customers in Europe.

Unique technology applied to opportunities in North America andAsia.

Efforts focused in the semiconductor, magnetic media and othertechnology based markets.

European Operation

Thin Film Technology (TFT)

Buellton, CA

Subsidiary of WAM

Thin film coating and substrate patterning.

Visi-Lid(tm) supply chain management.

Capabilities: Electron Beam Evaporation, DC/RF Magnetron Sputtering,

Photolithography (Substrate Patterning), Dicing, Tooling design,

In House Machine shop

CERAC

Milwaukee, WI

Subsidiary of WAM

Physical Vapor Deposition (PVD) materials for opthalmic, optic andperformance applications.

Specialty Inorganic Materials

Unique technologies in chemical and powder processing

Target Bonding Centers

Localized debonding/bonding of PVD targets tobacking plates:

Buffalo, NY

Brewster, NY

Santa Clara, CA

Limerick, Ireland

Singapore

Taiwan

Global Service and Support

Regional Offices (Sales and Applications Engineering support)

Buffalo, NY Tokyo, Japan

Brewster, NY Taoyuan, Taiwan

Boston, MA Singapore

Tucson, AZ Manila, Philippines

Santa Clara, CA London, England

Buellton, CA Seoul, Korea

Milwaukee, WI Limerick, Ireland

Worldwide Representatives

Florida Italy France

India China Germany

Sweden Israel

Product Mix Thin Film Products Packaging Materials 62 38

Thin Film Products

PVD Materials

Precious Metal Target Materials

Non-Precious Metal, Cermets, Ceramics

Vacuum Induction Melting

Hot Pressing

Hot Isostatic Pressing

EVAPro(tm) Evaporation Materials

Localized Target Bonding

Chamber Services

Shield Cleaning and conditioning

PM Refining and Upgrading

Logistics Support

Buffalo

Brewster

Milwaukee

Wheatfield

Singapore

WAM

Taiwan

Santa Clara

Ireland

End Product Examples Utilizing

Thin Film Deposition Materials

Packaging Materials

FLA/Combo-Lid(r)

Seam Seal/Microlid(tm)

Preforms

Clad Materials

Braze Materials

Ni Alloys

Dental

Coating, patterning and Visi-Lid(tm) (TFT)

Packages (Zentrix)

Buffalo

Singapore

Wheatfield

Buellton

WAM

Taiwan

WAMPhilippines

New Product and TechnologyDevelopment

Visi-Lid(tm) - A transparent lid for Photonics applications

Semiconductor Target designs and enhancements for waferfabrication

Silver Alloys for HD-DVD and Blue Ray Discmanufacturing

UBM Grade(tm) materials for Flip Chip applications

Expanded refining/chamber services supporting the thinfilm materials business

TFT-LCD services

Magnetic Media materials

Nanotechnology Materials

Key Markets - Wireless and Photonics

Thin Film and Packagingmaterials for variedwireless and photonicapplications including RFPower Amplifiers, HBT's,SAW Devices, LightEmitting Diodes (LEDs),Laser Recorders andMicro Electro MechanicalSystems (MEMS)

Key Markets - Semiconductor WaferFabrication

Thin film materials andchamber services for siliconwafer and UBM (Under BumpMetallization) technologies.

Numerous commercial andmilitary microelectronicapplications.

Key Markets - SemiconductorPackaging

High reliability semiconductorpackaging materials.

Applications focused in space,military and satellite marketsegments.

Thin film materials forboth the read/write headand disc platter.

Chamber Servicescomplement materialsoffering.

Applications growing intomany commercial andmobile electronicproducts.

Key Markets - Magnetic Head andMedia

Customer Service

Value "Packaging"

Niche Exploitation

Flexible Manufacturing

Cost Model

Product Breadth

Global Presence

Reputation

Distinctive Competencies

Wireless/Photonics

Semiconductor Fab

Magnetic Media

Optical Media

High Temp. Joining

Semiconductor Pck.

Magnetic Head

Memory

TFT/LCD

Nanotechnology

New Platforms by Market

New Thin Film Materials and Designs for:

Magnetic Media

Semiconductor Wafer Fabrication

Under Bump Metallization (UBM) for Flip Chip

Wireless and Photonics

Our focus is on materials, circuitry, subassemblies andpackaging for the wireless and fiber-optic telecom market,military, medical and automotive applications

Signal amplifiers transmit signals through air (wireless) oroptical fiber media by boosting signal strength whilemaintaining integrity. Thermal management andreliability properties are of paramount importance.

Signal amplifiers are critical active components located inbase stations for wireless (cellular) and in regeneratorstations along fiber-optic (Internet) links.

Our Overall Strategy

Vertically integrate materials to subsystem assembly,providing customized solutions

Meet the Customer's needs

Materials or subassemblies

Fast Flexible Manufacturing Systems

Responsive to market needs

Revenue by Market

1st Qtr 2nd Qtr 3rd Qtr 4th Qtr East 20.4 27.4 90 20.4 West 30.6 38.6 34.6 31.6 North 45.9 46.9 45 43.9

2005

YTD 3Q 2006 Telecom and computer Automotive Aerospace & Defense Other Medical 0.3758 0.0826 0.2416 0.1408 0.1592

Telecom and computer Automotive Aerospace & Defense Other Medical 0.3082 0.0942 0.3204 0.1183 0.1589

International/Domestic Revenue

2006 Intl. U.S. 0.3172 0.6828

Electronic Products

Business Groups

Packaging

Electronic Packaging Products

Circuitry

Circuits Processing Technology

Materials

Brush Ceramic Products

Electronic Packaging Products

Located in Newburyport, Massachusetts

Products

RF Power Packages for base stations in cellular phone& wireless data networks, for cellular handsets, formilitary radar applications and for digital TV

Automotive Components for ignition systems in carsand trucks

Power Circuit Assemblies for DC motor controls

Circuits Processing Technology (CPT)

Located in Oceanside, California

Products

High Frequency Military and Aerospace Circuitry usedin military radar and missile guidance

High Frequency Wireless circuitry for satellitecommunications, flight hardware and other telecomapplications

Fiber Optic Package components for amplifiers in fiberoptic networks

Medical equipment and implant circuitry

Brush Ceramic Products

Located in Tucson, Arizona

Products

Ceramic substrates used in commercial and militarypackaging applications

Ceramic laser bores for gas lasers used in medical andindustrial applications

Machined ceramic components used in military, oil andgas, semiconductor and microwave applications

New Products & Platforms by Market

Electronic Products

BW 1000 Substrate sales started this year

E-materials Packaging applications

Luxtel reflectors - development program in final stages.

High-strength metallization for military applications

High Conductivity ceramic packages booked over $0.5M

Licensed plastic ACP technology from RJR Polymers

Brush Wellman Inc. Alloy Vision

Brush Wellman Alloy Products is the leading global supplier ofHigh Performance Copper Alloys providing technical,manufacturing, supply chain, and commercial excellence in theform of high reliability products and tailored services to satisfyour customers most demanding applications.

We provide these services in a culture of local support andglobal teamwork.

Safely and reliably provide the highest quality,innovative products and services, fast and on-time toall customers, when they want them at the lowestpossible cost.

Brush Wellman Inc. Alloy Mission

Alloy Products

Operations Strategy-Lean Sigma

Safety practices to provide an injury and illness free workplace

Lean Manufacturing to reduce cycle times, further increasecapacity, and provide industry leading service to our customers

Six Sigma to provide industry leading product quality and toreduce costs

Supply Chain Management to provide exactly what is needed,when it's needed, to where it's needed in exactly the rightquantity

Total Productive Maintenance to provide industry leadingequipment reliability

Sales Based on End UserSpecifications

Component Fabrication

ComponentManufacturing

Sourcing

Demand

Generator

Distribution Sales Marketing

Brush Wellman Inc.

Specifications

Products

Brush Wellman Inc. Alloy Products

Product families:

Strip products include thin gauge precision strip and thindiameter rod and wire. These products provide acombination of high strength, formability and electricalconductivity for connectors, contacts, switches, relaysand shielding used in mobile communications devices,wireless communications equipment, storage areanetwork systems, data networking equipment, servers,personal computers, appliances, and automotiveelectronics.

Bulk products include rod, bar, tube and plate. Theseproducts are known for superior strength, corrosion andwear resistance, thermal conductivity and lubricity.Applications include bearings and bushings foraerospace and heavy equipment, welding rods, oil & gasdrilling components, plastic mold tooling andtelecommunications housing equipment Strip Bulk East 90694000 41952000

The largest business within the Metal Systems Group, Alloy Products represents $203million, or 70% of the Metal Systems Group (YTD September 2006 data)

Manufactures and sells copper and nickel based alloy systems metallurgically tailoredto meet customers' specific performance requirements

Appliance Automotive Computer & Telecom Aerospace & Defense Industrial Process Other 9900000 8100000 24600000 6200000 13700000

Alloy Products Revenue by Market

Nine Months 2006

Strip Alloy Applications

(strength, conductivity, spring characteristics)

Automotive electronics

Appliance switches

Pressure ResponsiveDevices

Fire Extinguisher SprinklerHeads

EMI Shielding

Current Carrying Springsand Relays

Integrated Circuit Sockets

Electrical and ElectronicConnectors in MobileHandsets, PDA's, BaseStations, Storage AreaNetworks, Servers, andPersonal Computers

Strip Products - Strategy

Maintain focus on major end-use markets

Computer

Telecommunications (mobile & Infrastructure)

Automotive

Appliance

Military

Medical

Defend leadership in traditional alloy strip, rod & wire

Reduce total cost of manufacture to allow penetration of mid-range alloy applications

Enhance product properties to provide additional value to customers

Introduce new alloys to meet needs of targeted marketopportunities

Geographic Growth

Strip Products Strong Value Proposition

(Formability, Conductivity,Stress Relax)

$ per Pound

Performance Parameter

High

Low

TraditionalCopper-Beryllium Alloys

390

Brush 60

Alloy 174

CuNiSi

HS PhosBronze

PhosBronze

Brass

Brush Value Proposition

Unique, high-performancematerials

Technical designcapabilities

Outstanding service centernetwork

Global marketing, salesand distribution

Competitive Alloy Comparison

Copper-beryllium alloys, while premium priced, provide best-in-class performance

Note: Blue denotes Brush Engineered Materials' alloys; beige represents competitive materials.

BF 47

Bulk Alloy Applications

(strength, corrosion resistance, non-galling, conductivity)

Aircraft Bushings

Heavy Equipment Bearing andWear Applications

Oilfield well drilling,completion and productionequipment

Plastic Injection & Blow Molds

Power Generation

Tooling for Metalworking

Undersea/Marine Housings forTelecom & Instrumentation

Welding Electrodes & Dies

Bulk Products - Strategy

Maintain focus on traditional end-use markets

Aerospace

Oil & Gas

Plastics

Power Generation

Resistance Welding

Undersea

Introduce new alloys or product forms to meet needs of targeted marketopportunities

Focus on new non-traditional growth markets

Bearings, Condensers, Heat Exchangers, Heavy Equipment & Mining, Marine,Offshore & Downhole power cables, Oil & Gas well completions, and Pumps

Geographic Growth

Expand commercial operations in Asia Pacific, improve customer awareness anddistribution

MoldMAX(r) Alloys for the PlasticsIndustry

Value Proposition

Provides molders with 20-40%increase in productivity

Capital avoidance due to increasedproductivity

Enables improved quality of moldedparts

ROI < 3 months

Technical advantages

Hardness of steel with the thermalconductivity of copper

Fast machining rates

High polishability

Brush Wellman engineers useinfrared imaging at the customersfacility to pinpoint whereMoldMAX(r) will provide themaximum benefit.

Lorain Casting Facility

Spinodal and EquacastTM Technology-Winning!

Strength and hardness found inCuBe products

Thermal conductivity

The value proposition differentiates:

Corrosion resistance

Superb tribological properties (lowfriction, excellent wear resistance)adding value in reliability, uptime,and maintenance savings

Machinability and design simplicityadding cost benefits to offsetincreased material costs

Casting capability including size,shapes, tubes and quality

No EH&S issues

Lorain Technology: ExpandingBrush Wellman's market andapplication reach

Developing applications inmarkets where we are strong:

Drilling Equipment, AircraftParts, Mold Tooling

High performance copper basedengineered materials:

Developing markets/applicationswhere technology is strong:

Oil Well Completion Equipment,Mining, Heavy Equipment,Drivetrain Components, HydraulicSystems, Engine Bearings,Semiconductor Fabrication

ToughMet(r) Outlasts Conventional Bearing Materials

in 300-ton Mining Truck Steering Test

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 Hardened Steel 0 0.009 0.013 0.0375 Aluminum Bronze 0 0.0075 0.009 0.01 0.011 0.011 0.0125 0.015 0.016 0.019 0.02 0.022 0.025 0.0275 0.03 0.0325 0.035 0.0365 0.038 0.0405 0.0425 ToughMet 3 0 0 0 0 0 0 0 0 0 0 0.0005 0.001 0.0015 0.002 0.0026 0.0032 0.0038 0.004 0.0046 0.0051 0.006

Simulated Steering Wheel Turns (x1,000)

Surface Wear (inches)

Using identical bearing designs,this tests proved the averagewear rate of steel was 90xgreater than ToughMet 3, andthe average wear rate ofAluminum Bronze was 7xgreater than ToughMet 3.

ToughMet Bushings Protect Steel Mating Parts.Example: Lubrication failure on bulldozer undercarriage

Left side pin after 500 running hoursagainst ToughMet 3 CX105 bushing.

Right side pin after 500 running hoursagainst hardened steel (HRC 50)bushing.

Pin hardness = HRC60.

Steel pin damagedby steel bushing

Steel pin protected byToughMet bushing

ToughMet(r) Industrial Components Results:

Significantly Higher Durability has beenConfirmed for ToughMet(r)

Brush International, Inc.

Brush International Inc. is awholly owned subsidiary ofBrush Engineered Materials

Service centers in Germany,England, Japan and Singapore

Representative offices in Korea,China and Taiwan

Primary focus on the distributionof alloy products while providinglocal support to other BrushEngineered Materials'subsidiaries operatinginternationally Domestic International 0.47 0.53000000013148

International/Domestic Revenue

Nine Months 2006

Singapore

BW Technical / Marketing & BW Service Centers

Tokyo / Fukaya

Dongguang

Hong Kong

Reading, UK

Stuttgart

Taipei

Shanghai

Seoul

Italy

Spain/

Portugal

BWS BWC BWT BWJ BWK

S.E. Asia China Taiwan Japan Korea

ASIA

EUROPE

EXPORT

BWL BWG BWG BWG

UK/ Ireland Germany Italy Spain

BWI

Export

Brush International, Inc.

TMI - From a Customer Perspective

WHAT TMI provides our customers the ability to demand variedperformance (electrical, thermal, or mechanical) from ametal surface area or section.

WHO We provide this "service" to the telecommunication,automotive, computer, semiconductor and otherindustries.

HOW By offering various forms of strip metal products: cladmetals, plated metals, electron beam welded, solderplated, reflowed or printed-on, milled and/or skived metalstrip or various combinations of the above.

Sales Growth

1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 Fcst. Sales 22.8 28 33.8 43 47 51.5 50.45 63 83.5 50 45 42.8 55.7 50.8 69

$ Millions

Our Major Markets

Automotive

Telecommunications

Computer

Jewelry

Semiconductor

Appliances

Medical

Aircraft Automotive Telecom Computer Misc. 40 20 25 15

Misc.

11%

Telecom

13%

Computer

27%

Automotive

49%

International/Domestic Revenue

2006 Fcst. Intl. U.S. 10 88

Technical Materials Inc.

International 10%

Domestic 90%

Major Applications, New Products

and Platforms

1st Qtr 2nd Qtr 3rd Qtr 4th Qtr East 20.4 27.4 90 20.4 West 30.6 38.6 34.6 31.6 North 45.9 46.9 45 43.9

Data Storage Energy Systems Medical Electronics Other Automotive 20 10 10 20 10 30

Our Major Applications

Capacitors

Coins and Tokens

Connectors

Contact Probes

Fuses

Leadframes

Micro Motor

Microwave

Potentiometers

Relays

Sensors

Solder Clips

Switches

Air Bag Sensor

Leadframe

Connectors

Electroplating

Precious and non-precious metals

Overall and selective stripe capabilities

Combination with current TMI technologies

Stripe Plating Application

Cellular Phone Battery Contact

Base Material: BeCu

Overall Ni plating

Selective Au (one side)

Selective SnPb (bothsides)

Base Material

Competitive Advantage

Quality

ISO 9001:2000 / ISO 14001

State-of-the-art equipment

Vision Systems / PLC Systems for consistent quality

Design Support

Technical knowledge

Engineering expertise

Overall Capabilities

Slitting and leveling

Inlay / Electron-Beam Welding / Solder / Milling / Skiving / Plating

Any combination of the above processes

Large coil handling capability

Strategic Concept

Total capability under one roof

Make it easy for our customers to get what theyneed to satisfy their customers' requirements

Make our customers competitive with reliableproducts

Solve problems for our customers with engineeredstrip metal solutions

Explore and develop new markets and geographicregions for manufacturing (China).

Growth in Electroplating

Precious and non-precious metals

Overall and selective stripe plating capabilities

Combination with other TMI technologies

Proprietary closed contact plating technology

Building additional lines to further increase capacity

New Products & Platforms by Market

Technical Materials Inc.

Surgical devices

Digital cameras & hi-res copier leadframes

Micromotor components for consumer electronics

Resistors and fuses for automotive applications

Disk drive suspension materials

Coatings for automotive

Summary

From 1992-2000 TMI sales more than quadrupled.

2001 and 2003 proved to be extremely difficult years due to major servedmarkets being severely depressed; however, TMI remained profitable allthree years.

2004 sales improved only to be followed by a drop-off in 2005. In bothyears product mix impacted overall profitability.

We have added major new technical capabilities using state-of-the-artequipment in precious metal electroplating to better serve worldwidecustomer demand (both technical & capacity).

We are ISO 9001:2000 and ISO 14001 registered.

We will add additional Plating technology and capacity to service marketdemand as required.

We are making further inroads into new markets (disc drives) and othermarkets (consumer, medical, appliance, energy) in order to broaden ourserved market base and will have a much different served market profile bythe year 2007.

Brush Wellman

Beryllium Products

Products

Beryllium Metal - One of the lightest metals known

- Family of vacuum hot and hot/cold isostatically pressed powder-derived metals

AlBeMet? - Family of lightweight alloy composites

- Extruded, rolled sheet and hot isostatically pressed powder-derived metals

Brush Wellman

Beryllium Products

Products - Cont.

E-Materials - Family of low expansion, lightweight electronic packaging materials

- Composites of beryllium metal and beryllium oxide

Beryllium Oxide/

Chemicals - Ceramic-grade beryllium oxide powder

- Specialty beryllium-containing chemicals

Brush Wellman

Beryllium Products

Facilities

Elmore, Ohio

Fremont, California

Key Product Attributes

Be/AlBeMet(tm)

Light Weight (Density)

High Stiffness (Elastic Modulus)

High Thermal Conductance/Capacity

Low Thermal Expansion

Be

Transparent to X-Rays

Neutron Reflector

Brush Wellman

Beryllium Products

Primary Competition...Alternative Materials

Organic Composites (e.g. Carbon epoxy)

Silicon carbide

Metal Matrix Composites (e.g. Al - silicon carbide)

Pyrolytic graphite

Aluminum (high strength grades)

Major Defense/Aerospace Applications forBrush Wellman Beryllium Products

Optics

Optical substrate and support structure for visual and infrared targetacquisition systems (fighter aircraft, helicopters, unmanned aerialvehicles, tanks), surveillance systems and astronomical telescopes.

Satellites

Structures and sensors for defense and commercial telecommuni-cations satellites.

Electronics

Electronic packaging for defense avionics, radar and electroniccountermeasures systems for helicopters and fighter aircraft.Applications include circuit boards, covers and packages.

Major Commercial Applications for BrushWellman Beryllium Products

X-ray Windows

Radiographic tube components for ? medical diagnostic (x-ray, mammography,CAT-scan), ? industrial and ? scientific equipment.

Optical Scanners

Mirrors for laser scanners used in reprographic and other high-performance laserapplications.

Motion control

Structural components for high-precision semiconductor processing andindustrial robotic equipment

Acoustics

High performance speaker components

Revenue by Market

2005 1st Qtr 2nd Qtr 3rd Qtr 4th Qtr East 20.4 27.4 90 20.4 West 30.6 38.6 34.6 31.6 North 45.9 46.9 45 43.9

Telecom/Computer Defense/Aerospace Industrial Componenst Medical Other 0.01 0.7 0.05 0.1 0.14

Telecom/Computer

1%

Revenue by Market

3rd Quarter 2006 1st Qtr 2nd Qtr 3rd Qtr 4th Qtr East 20.4 27.4 90 20.4 West 30.6 38.6 34.6 31.6 North 45.9 46.9 45 43.9

Telecom/Computer Defense/Aerospace Industrial Componenst Medical Other 0 0.57 0.1 0.22 0.11

International/Domestic Revenue

2006 Intl. U.S. 10 90

Beryllium Products

International 10%

Domestic90%

Major Applications, New Products

and Platforms

Beryllium Products

Product Market

New AlBeMet Products Defense

Fabricated Products Defense

Acoustic Speakers

High grade Be foil Medical x-ray

Beryllium Health and Safety

Improved worker protection programs in place

Rates of sensitization down among new workers

Strong focus on regulations related to beryllium exposure

Brush has continued to make progress on issuesrelated to beryllium health and safety

Litigation

Total Plaintiffs

Total Cases Pending (including spouses)

12/31/04 12 56

09/30/05 15 60

12/31/05 13 54

06/30/06 14 56

09/29/06 12 53

Litigation

In Q-3 2006, one purported class action wasdismissed, and one third party case was settled anddismissed. No cases were filed during the thirdquarter.

Our caseload and number of plaintiffs will vary fromquarter to quarter depending on new cases, additionalplaintiffs, settlements, dismissals, amendments tocomplaints, etc.

The Company believes it has substantial defenses inpending cases.

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