BESI

Semi Packaging Tech Seminar June 18th , Vila do Conde - Portugal

Agenda

2

Company Overview

Equipment portfolio

Market

Process and package Roadmap

€ 85.5

€ 378.8

25.9%

43.8%

20%

25%

30%

35%

40%

45%

0

100

200

300

400

2003 2014

Gro

ss M

arg

in (

%)

Reven

ue

(€

mill

ion

s)

Revenue Gross Margin

Company History – Founded in 1956

•2000 2002 2005 2009

Die Attach Acquisitions

•2006 Dragon I complete: € 6 million cost savings

•2008 Dragon II complete: € 15 million cost savings

•2010 Plan: € 7.0 million cost savings. Headcount and product line restructuring

•2012 : € 8.3 million cost savings. Headcount reduction. Plating unit rationalized

•2014: US die sorting operations rationalized. Transferred to Besi Austria

Restructuring

•2006-09 Standard packaging and certain die bonding systems transferred to Malaysia

•2007-09 Dutch tooling & Hungarian die bonding transferred to Asia

•2009-11 Epoxy DB transferred to Malaysia

•2003-12 Malaysian system and Chinese tooling capacity expansion.

•2013 Soft solder DB transferred to Malaysia

•2006-14 Asian headcount increased from 34% to 59%

•2015: Transfer of certain software engineering, logistics and related administrative functions from Switzerland to Singapore

Asian Production Transfer

3

Global Operations

as of 31 December 2014

Europe/NA Asia

Revenue (MMs) € 123.4 32.6% € 255.3 67.4%

Headcount 663 40.6% 969 59.4%

• Development/innovation in Europe

• Increasing engineering, production and

logistics activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

Chengdu Shanghai

Korea

Taiwan

Philippines Malaysia

Singapore*

Suzhou

Radfeld, (Austria)* Cham,

(Switzerland)*

Duiven & Drunen,

(The Netherlands)*

Chandler

Shenzhen

4

Salem

22/06/2015

VLSI Research April 21’15:

“BE Semiconductor achieves highest growth (56%) among top assembly equipment

suppliers”

5 #

Besi Has Gained Market Share In Its Addressable Markets

• Gained share in fastest growing segments of the assembly equipment market:

• Flip chip and multi module die attach and ultra thin molding for advanced packaging applications

Besi Market Share

Source: VLSI, Jan 2015 and Besi estimates 2012 2013 2014

Total Assembly Equipment Sales 8.6% 10.8% 13.4% Besi Addressable Market 21.8% 27.0% 31.7%

Total Die Attach Equipment 27.7% 33.1% 38.7% Die Bonding 29.7% 39.6% 44.0% Flip Chip 22.2% 25.4% 34.1% Other 25.9% 7.5% 10.0%

Total Packaging Equipment 11.1% 16.0% 18.0% Molds 12.0% 19.2% 21.2% Lead Trim & Form 15.0% 17.6% 18.1% Singulation 5.3% 5.1% 8.5%

Total Plating 75.8% 83.8% 90%+

22

Agenda

7

Company Overview

Equipment portfolio

Market

Process and package Roadmap

Best in Class Product Portfolio

• Molding - AMS series - AMS LM 95 - MMS series - FML

• Die Bonding - 2100 xPplus

- 2100 sDplus - 2100 sD PPPplus

- 2100 HS

- 2009 SSI - 2100 DS

Die Attach Packaging & Plating

• Multi Module Die

Attach - 2200 evo - 2200 evo plus

• Flip Chip - 8800 FC QUANTUM - 8800 CHAMEO - 8800 TCB - 2100 FC

• Trim & Form - Compact series - Power series - Compact Line XHD New

• Plating - Leadframe - Solar - Film & Foil

In Development

•Next generation Die Attach

•Next generation Packaging

•Common modules

Datacon

Datacon

Esec

Fico

Meco

Fico

New

8

Fico

• Singulation

- FSL

- FSL (shield cut)

New

New

• Die Sorting & Special - DS 9000 TRDS - DS WTT - TTR - DLA

Datacon

New

New

New

New

New

Agenda

9

Company Overview

Equipment portfolio

Market

Process and package Roadmap

Driven Primarily by Growth in Internet Connected Devices

• 35% CAGR device growth

forecast over next 5 years

• Powered by devices used for

Internet of Things (IoT)

• Positive trajectory for smart

phone, tables, wearables, and

automotive

10

Advanced Packaging Growth Favors Besi

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage

• <20 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2014E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, ES2100

• Flip Chip: DC 8800, ES2100

• TCB: DC 8800

• Multi Module: DC evo 2200

Packaging

• Molding: AMS-LM 95

• Singulation: FSL

High Growth End

User Areas:

Mobile internet

devices, Autos,

MEMS, Internet of

Things, wearable

devices

Datacon Esec Fico

11

Agenda

12

Company Overview

Equipment portfolio

Market

Process and package Roadmap

Package and interconnect Roadmap

Flip Chip on LF

coarse pitch ≥ 200µ

C2 Flip Chip **)

fine pitch ≥ 50µ

TC Flip Chip

ultra fine pitch ≤40µ

Cu-pillar

Flip Chip

C4 Flip Chip *)

standard pitch ≥ 130µ

Mass Reflow FC Processes

*) C4: Controlled Collapse Chip Connect (IBM)

**) C2: Chip Connect (IBM)

Die Attach (interconnection): • From C4 to copper pillar and thermal

compression • Placement accuracy below < 3um • Different technologies will run

in parrallel

Molding (Packaging): • From PoP WB to (exposed) flipchip with

molded underfill • Thin moldcap down to 120um and below • Underfill below 30 um • Different technologies will run

in parrallel

Inter

connection

TC-NCP Process (pre-applied nonconductive paste)

TC-CUF/MUF Process (capillary underfill,

or molded underfill)

TC-NCF Process (WL applied nonconductive film,

or TC-WLU: wafer level underfill)

Jan-2015

TC Bonding Processes

14 European 3D TSV Summit 2015

T F

T F

T F

Jan-2015

TSV Stacking – High Volume Production

15 European 3D TSV Summit 2015

(Source: 2014 Hongkong Analyst Conference) Current Driver: HMC

Oct-2014

• Thermo compression bonder

• +200/-100 °C temperature

ramping

• 2µ @ 3 sigma accuracy

• 250 N bond force

• C2S / C2W

• TC/NCP, TC/NCF, TC/CUF

Datacon 8800 TC Thermo Compression Bonder

16 Confidential

8800 TC

Launch: March 2014

Now 12 x 8800 TC installed base

Preparing for 5 bonder / month shipment

Wafer and Panel transfer molding

Successor of compression molding

LARGE AREA MOLDING UP 340MMX340MM

eWLB and C2 WAFER APPLICATIONS

OVERMOLDED AND EXPOSED CAPABILITIES

GLASS AND SILICON INTERPOSER MOLDING

THIN MOLDCAP MOVING TO <0.150 MM

Key Advantages

Mold underfill (MUF) , proven on 30 um standoff: CUF, NCP, NCF obsolete

Use of Low cost compound : upto factor 3 x less

With use of topfoil : Exposed die without backgrind process

Compression molding Transfer molding

Backgrinding process is required

To expose the Die

Minimum mold

Gap over die

NCP or NCF required

Compound is coming from one side and

Can underfill and expose the die

Compound flow

Co

mp

ou

nd

flo

w

Equipment FML New wafer/panel molding system

Fico 19

Capability

• Wafer max Ǿ340 mm

• Panels max 300 x 300 mm

• Max. clampforce 1200 kN

• Max. compound pressure 180 bar

• Max. cavity temp diff. 3ºC

• Cavity vacuum control

• Board vacuum

• Dynamic clamping control

• Topfoil handling for exposed die

• Output max. 20 wafer/hour

Technical data

• Power rating 7.5 kVA

• Compressed air 5 – 10 bar

• Average air consumption 1.5 m³ at 6 bar

• Factory exhaust 100 m³/h

• Noise level 73 db(A)

• Dimensions (W x D x H) 720 x 1800 x 1700 mm

• Weight approx. 2000 kg

SEMI certified for S2; S8; S10; S14; S22

Thank You! April 2015