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Architectural Considerations for Optimizing SSDs Santa Clara, CA August 2014 1 Michael Abraham ([email protected]) Advanced Engineering Architect Micron Technology, Inc.

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Architectural Considerations for Optimizing SSDs

Santa Clara, CA August 2014

1

Michael Abraham ([email protected]) Advanced Engineering Architect Micron Technology, Inc.

Abstract

• NAND Flash continues to shrink and is making the transition to 3D memories.

• What are some of the challenges that SSD designers face?

• This talk focuses on the NAND and other technologies that are bridging these gaps to improve SSD architecture, performance, reliability, and energy.

Santa Clara, CA August 2014

2

The Beginnings of Flash • 1984 – Toshiba announces “Flash” (IEDM) • 1987 – Toshiba announces NAND Flash (IEDM) • 1994 – Compact Flash: Starts with NOR and later moves to

NAND Flash • 1995 – SmartMedia • 1999 – USB Flash Drive • 1999 – Flash-based Solid State Disk

Santa Clara, CA August 2014

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Early Storage Optimizations

Faster Upgradeable

Slightly more expensive

Slow Early obsolescence Relatively inexpensive

Santa Clara, CA August 2014

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µC NAND

SmartMedia Camera

µC/ SRAM NAND

CF/USB/SD

SSDs: Optimize for Performance

• Fastest use of Flash memory • More expensive ($/bit) than previous solutions

Santa Clara, CA USA August 2014

5

µC NAND Ch0

Ch(n-1)

Power Supplies Host Vcc

DRAM C

O N

N E

C T

O R

SATA/SAS/PCIe

SSD Product Priorities

Lower Cost ($/bit) Higher Performance (MB/s, IOPS) Sufficient Reliability (3-5 years) Smaller Form Factors (area/volume) Lower Energy (pJ/bit)

Santa Clara, CA August 2014

6

10

20

30

40Q

4-08

Q1-

09Q

2-09

Q3-

09Q

4-09

Q1-

10Q

2-10

Q3-

10Q

4-10

Q1-

11Q

2-11

Q3-

11Q

4-11

Q1-

12Q

2-12

Q3-

12Q

4-12

Q1-

13Q

2-13

Q3-

13Q

4-13

Q1-

14Q

2-14

Q3-

14Q

4-14

Proc

ess

Nod

e (n

m)

Volume Production Dates

Company A Company B Company C Company D

Lowering SSD Costs: Shrink the NAND

Industry is continuing transition to 3D NAND technologies Santa Clara, CA August 2014

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Data based on publicly available information

30nm Class

25nm Class 20nm Class 10nm Class

Lowering SSD Costs: Add More NAND Bits per Cell

Santa Clara, CA August 2014

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0%10%20%30%40%50%60%70%80%90%

100%

SLC MLC TLCSource: iSuppli 2Q14

SLC is less than 1.5% of the market!

Less Expensive SSDs

Mission Accomplished?

Santa Clara, CA August 2014

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SSD Performance Trends

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Read Throughput • NAND Flash interface speed

Read/Write Latency • Bits per cell • # of die in the SSD • ECC correction time

Write Throughput • Sequential: Bits per cell, # of die in the SSD • Random: Block size

Trend Throughput Latency Read Saturated Increasing Write “Optimized” Increasing

NV-DDR3 NV-SDR NV-DDR

NAND Interface Speed: Going the Right Direction

Read operations are still interface limited when two or more NAND die share the same I/O bus

Almost all SSDs today use NAND interface speeds of 200MT/s or faster

ONFI 4.0 is published • Up to 800MT/s throughput • Reduces energy per bit

with 1.2V interface

Santa Clara, CA August 2014

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NV-DDR2

0

200

400

600

800

1,000

1,200

1,400

1,600

ONFI 1.0 ONFI 2.x ONFI 3.0 ONFI 4.0

MT/

s

Single Channel Package Dual Channel Package

Latency: Programming Times Also Affect Read Latencies

Most applications favor read operations over write operations Most read operations are 4KB data sectors As monolithic NAND density increases, less NAND die are being used for a fixed

system density As tPROG increases, the latency of random 4KB sector reads becomes more

variable in mixed-operation environments as the probability of needing to read from a die that is busy increases

Santa Clara, CA USA August 2014

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0200400600800

1,0001,2001,4001,6001,800

25 / 250 25 / 300 50 / 600 50 / 900 50 / 1,200 65 / 1,500

Rea

d La

tenc

y (µ

s)

tR / tPROG (µs)

Random 4KB Read Latency

Min Latency Max Latency

0.0

20.0

40.0

60.0

80.0

Data Bytes per Operation (Page Size * # of Planes)

Sequential Programming Throughput (MB/s)

Sequential Write Performance

For a fixed page size across process nodes, write throughput decreases as the NAND process shrinks

NAND vendors increase the page size to compensate for slowing array performance

Write throughput decreases with more bits per cell

Santa Clara, CA August 2014

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SLC MLC-2 MLC-3

8

32

128

512

2048

8192

32768

131072

524288

2097152

8388608

Block size (B) Data Bytes per Operation Pages per Block

NAND Block Size Is Increasing The block is the smallest erasable unit made up of programmable and

readable pages Block size impacts garbage collection times and random write throughput

Santa Clara, CA August 2014

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Performance Optimizations

• Overprovision the amount of NAND die (slightly higher cost) • Use smaller NAND die on the latest litho • Use largest NAND die on the latest litho and add a few

• Write data sequentially to the NAND • Improve garbage collection algorithms (e.g.

TRIM) and scheduling

Santa Clara, CA August 2014

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Node NAND Density Data size # of Die Seq Write (MB/s) Gen 1 32Gb (4GB) 8192 32 230 Gen 2 64Gb (8GB) 16,384 16 184 Gen 3 128Gb (16GB) 32,768 8 133 Gen 3 64Gb (8GB) 32,768 16 324

Reliability: Endurance and Data Retention

Santa Clara, CA August 2014

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Process shrinks lead to less electrons per floating gate ECC improves data retention and endurance ECC algorithms are transitioning from BCH to LDPC and codeword sizes are

increasing Data retention is measured at max endurance cycles Possible to optimize endurance for data retention (examples below)

• Consumer MLC NAND: 3K cycles, 1 year retention • Enterprise MLC NAND: 10K cycles, 3 months data retention

Overprovisioning also helps: More die or a few more blocks per die

10

100

1,000

10,000

Num

ber o

f Ele

ctro

ns

MLC-2 SLC0

10

20

30

40

50

60

70

1,000

10,000

100,000

ECC

(bits

)

Endu

ranc

e (c

ycle

s)

SLC Endurance MLC-2 EnduranceSLC ECC MLC-2 ECC

SSD Form Factors Are Shrinking

2.5” form factor for SSDs is becoming obsolete M.2 form factor enables Ultrabooks, tablets Fewer NAND placements drives 8- and 16-die package

development • Can increase component cost because of reduced package

yield

Santa Clara, CA USA August 2014

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Source: PCIe M.2 Electromechanical Spec Rev1.0

Energy

Energy was previously not a high priority Becoming very important in battery-powered

systems Rule of thumb: “Hurry up and wait” Ways to reduce energy

• Queue and burst operations • Reduce write amplification • Increase interface speed and lower its voltage

Santa Clara, CA USA

August 2014

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SLC Mode

Some MLC and TLC NAND Flash have the ability to write and read data in SLC mode

Smaller block size; mode is determined block by block and managed by the SSD controller • MLC (X pages per block) SLC Mode (1/2 X) • TLC (Y pages per block) SLC Mode (1/3 Y)

Array times decrease, particularly for tPROG to 300-500µs resulting in higher burst performance

Excellent enabler for TLC-based SSDs for lower SSD costs

Initial write uses less energy as tPROG is shorter Best improvement with bursty workloads (e.g.

consumer applications) Santa Clara, CA USA

August 2014

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SSD Optimization Summary

Desired Features NA

ND

Lith

ogra

phy;

M

LC

TLC

DR

AM

cac

he

Fast

er in

terfa

ces

(S

SD

, NA

ND

)

Ove

rpro

visi

onin

g

Blo

ck M

anag

emen

t O

ptim

izat

ions

Die

Sta

ckin

g

SLC

Mod

e

Lower Cost X X

Higher Performance X X X X X

Sufficient Reliability X X X X

Smaller Form Factors X X

Lower Energy X X X X X

Santa Clara, CA USA August 2014

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Questions?

Santa Clara, CA August 2014

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About Michael Abraham

• Advanced Engineering Architect in the Storage Business Unit at Micron

• Covers advanced NAND Flash and emerging memories

• IEEE Senior Member

• BS degree in Computer Engineering from Brigham Young University

Santa Clara, CA August 2014

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©2007-2014 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.