AMC1305x High-Precision, Reinforced Isolated Delta-Sigma

DOUT

CLKIN

DVDD

DGNDAGND

AINP

AINN

AVDD

AMC1305

HV+

HV-

To Load

Floating

Power Supply

SD-Cx

SD-Dx

TMS320F2837x

3.3 V, or 5.0 V

Gate Driver

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5.0 V

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

AMC1305L25, AMC1305M05, AMC1305M25SBAS654G –JUNE 2014–REVISED JANUARY 2020

AMC1305xHigh-Precision, Reinforced Isolated Delta-Sigma Modulators

1

1 Features1• Pin-compatible family optimized for shunt-resistor-

based current measurements:– ±50-mV or ±250-mV input voltage ranges– CMOS or LVDS digital interface options

• Excellent DC performance supporting high-precision sensing on system level:– Offset error: ±50 µV or ±150 µV (max)– Offset drift: 1.3 µV/°C (max)– Gain error: ±0.3% (max)– Gain drift: ±40 ppm/°C (max)

• Safety-related certifications:– 7000-VPK reinforced isolation per

DIN VDE V 0884-11: 2017-01– 5000-VRMS isolation for 1 minute per UL1577– CAN/CSA no. 5A-component acceptance

service notice and IEC 62368-1 end equipmentstandard

• Transient immunity: 15 kV/µs (min)• High electromagnetic field immunity

(see application note SLLA181A)• External 5-MHz to 20-MHz clock input for

easier system-level synchronization• Fully specified over the extended industrial

temperature range

2 Applications• Shunt-resistor-based current sensing in:

– Industrial motor drives– Photovoltaic inverters– Uninterruptible power supplies

• Isolated voltage sensing

3 DescriptionThe AMC1305 is a precision, delta-sigma (ΔΣ)modulator with the output separated from the inputcircuitry by a capacitive double isolation barrier that ishighly resistant to magnetic interference. This barrieris certified to provide reinforced isolation of up to7000 VPEAK according to the DIN VDE V 0884-11,UL1577, and CSA standards. Used in conjunctionwith isolated power supplies, the device preventsnoise currents on a high common-mode voltage linefrom entering the local system ground and interferingwith or damaging low voltage circuitry.

The AMC1305 is optimized for direct connection toshunt resistors or other low voltage level signalsources and supports excellent dc and acperformance. Shunt resistors are typically used tosense currents in motor drives, green energygeneration systems, or other industrial applications.By using an appropriate digital filter (that is, asintegrated on the TMS320F2837x) to decimate the bitstream, the device can achieve 16 bits of resolutionwith a dynamic range of 85 dB (13.8 ENOB) at a datarate of 78 kSPS.

On the high-side, the modulator is supplied with anominal voltage of 5 V (AVDD), whereas the isolateddigital interface operates from a 3.3-V or 5-V powersupply (DVDD).

The AMC1305 is available in a wide-body SOIC-16(DW) package and is specified from –40°C to+125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)AMC1305x SOIC (16) 10.30 mm × 7.50 mm

(1) For all available packages, see the orderable addendum atthe end of the datasheet.

Simplified Schematic

http://www.ti.com/product/amc1305l25?qgpn=amc1305l25

http://www.ti.com/product/amc1305m05?qgpn=amc1305m05


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2

AMC1305L25, AMC1305M05, AMC1305M25SBAS654G –JUNE 2014–REVISED JANUARY 2020 www.ti.com

Product Folder Links: AMC1305L25 AMC1305M05 AMC1305M25

Submit Documentation Feedback Copyright © 2014–2020, Texas Instruments Incorporated

Table of Contents1 Features .................................................................. 12 Applications ........................................................... 13 Description ............................................................. 14 Revision History..................................................... 25 Device Comparison Table ..................................... 46 Pin Configuration and Functions ......................... 47 Specifications......................................................... 5

7.1 Absolute Maximum Ratings ...................................... 57.2 ESD Ratings.............................................................. 57.3 Recommended Operating Conditions....................... 57.4 Thermal Information .................................................. 57.5 Power Ratings........................................................... 57.6 Insulation Specifications............................................ 67.7 Safety-Related Certifications..................................... 77.8 Safety Limiting Values .............................................. 77.9 Electrical Characteristics: AMC1305M05.................. 87.10 Electrical Characteristics: AMC1305x25............... 107.11 Switching Characteristics ...................................... 127.12 Insulation Characteristics Curves ......................... 137.13 Typical Characteristics .......................................... 14

8 Detailed Description ............................................ 21

8.1 Overview ................................................................. 218.2 Functional Block Diagram ....................................... 218.3 Feature Description................................................. 228.4 Device Functional Modes........................................ 24

9 Application and Implementation ........................ 259.1 Application Information............................................ 259.2 Typical Applications ................................................ 26

10 Power Supply Recommendations ..................... 3011 Layout................................................................... 31

11.1 Layout Guidelines ................................................. 3111.2 Layout Examples................................................... 31

12 Device and Documentation Support ................. 3312.1 Documentation Support ........................................ 3312.2 Related Links ........................................................ 3312.3 Receiving Notification of Documentation Updates 3312.4 Support Resources ............................................... 3312.5 Trademarks ........................................................... 3312.6 Electrostatic Discharge Caution............................ 3312.7 Glossary ................................................................ 33

13 Mechanical, Packaging, and OrderableInformation ........................................................... 34

4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (March 2017) to Revision G Page

• Changed VDE certificate revision from DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 to DIN VDE V 0884-11:2017-01 in Safety-related certifications Features bullet ......................................................................................................... 1

• Changed IEC standard revision from IEC 60950-1, and IEC 60065 to IEC 62368-1 in CAN/CSA no. 5A-componentacceptance service notice Features bullet ............................................................................................................................. 1

• Changed DIN V VDE V 0884-10 to DIN VDE V 0884-11 in Description section ................................................................... 1• Changed DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 header row to DIN VDE V 0884-11: 2017-01 in

Insulation Specifications table ................................................................................................................................................ 6• VDE certificate details in Safety-Related Certifications table ................................................................................................. 7• Changed Safety Limiting Values table as per ISO standard: deleted last sentence from condition statement,

changed footnotes, deleted paragraph below table ............................................................................................................... 7

Changes from Revision E (January 2017) to Revision F Page

• Changed minimum specification from DGND – 0.3 to DGND – 0.5 and maximum specification from DVDD + 0.3 toDVDD + 0.5 in Digital input voltage parameter row of Absolute Maximum Ratings table...................................................... 5

Changes from Revision D (August 2016) to Revision E Page

• Changed V(ESD) for Human-body model (HBM) from ±1000 V to ±2500 V............................................................................. 5




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AMC1305L25, AMC1305M05, AMC1305M25www.ti.com SBAS654G –JUNE 2014–REVISED JANUARY 2020


Submit Documentation FeedbackCopyright © 2014–2020, Texas Instruments Incorporated

Changes from Revision C (December 2014) to Revision D Page

• Added last two Features bullets ............................................................................................................................................. 1• Changed Simplified Schematic figure..................................................................................................................................... 1• Moved Power Rating, Insulation Specifications, Regulatory Information, and Safety Limiting Values tables ....................... 5• Changed Insulation Specifications table as per ISO standard .............................................................................................. 6• Added Insulation Characteristics Curves section ................................................................................................................ 13• Changed Figure 54 .............................................................................................................................................................. 26• Changed Figure 58 .............................................................................................................................................................. 30

Changes from Revision B (October 2014) to Revision C Page

• Changed device status of AMC1305M05 to Production Data................................................................................................ 1• Changed document status from Mixed Status to Production Data ........................................................................................ 1• Updated ESD Ratings table to latest standard ...................................................................................................................... 5

Changes from Revision A (November 2014) to Revision B Page

• Changed device status of AMC1305M25 to Production Data................................................................................................ 1• Changed Features bullet from "Safety and Regulatory Approvals" to "Safety-Related Certifications" .................................. 1

Changes from Original (June 2014) to Revision A Page

• Made changes to product preview data sheet........................................................................................................................ 1




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5 Device Comparison Table

PART NUMBERINPUT VOLTAGE

RANGEDIFFERENTIAL INPUT

RESISTANCESNR (sinc3 Filter,

78 kSPS) OUTPUT INTERFACEAMC1305L25 ±250 mV 25 kΩ 82 dB LVDSAMC1305M05 ±50 mV 5 kΩ 76 dB CMOSAMC1305M25 ±250 mV 25 kΩ 82 dB CMOS

6 Pin Configuration and Functions

DW Package16-Pin SOIC

Top View

LVDS Versions (AMC1305L25)

DW Package16-Pin SOIC

Top View

CMOS Versions (AMC1305Mx)

Pin FunctionsPIN

I/ODESCRIPTIONNAME NO.

AGND4 — This pin is internally connected to pin 8 and can be left unconnected or tied to high-side

ground8 — High-side ground reference

AINN 3 I Inverting analog inputAINP 2 I Noninverting analog input

AVDD 7 — High-side power supply, 4.5 V to 5.5 V.See the Power-Supply Recommendations section for decoupling recommendations.

CLKIN 13 I Modulator clock input, 5 MHz to 20.1 MHzCLKIN_N 12 I AMC1305L25 only: inverted modulator clock input

DGND 9, 16 — Controller-side ground referenceDOUT 11 O Modulator data output

DOUT_N 10 O AMC1305L25 only: inverted modulator data outputDVDD 14 — Controller-side power supply, 3.0 to 5.5 V

NC

1 — This pin can be connected to AVDD or can be left unconnected5 — This pin can be left unconnected or tied to AGND only

6, 10, 12 — These pins have no internal connection (pins 10 and 12 on the AMC1305Mx only).15 — This pin can be left unconnected or tied to DVDD only




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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratingsover the operating ambient temperature range (unless otherwise noted) (1)

MIN MAX UNITSupply voltage, AVDD to AGND or DVDD to DGND –0.3 6.5 VAnalog input voltage at AINP, AINN AGND – 6 AVDD + 0.5 VDigital input voltage at CLKIN, CLKIN_N DGND – 0.5 DVDD + 0.5 VInput current to any pin except supply pins –10 10 mAMaximum virtual junction temperature, TJ 150 °CStorage temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD RatingsVALUE UNIT

V(ESD) Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2500

VCharged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000

7.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNITAVDD High-side (analog) supply voltage 4.5 5.0 5.5 VDVDD Controller-side (digital) supply voltage 3.0 3.3 5.5 VTA Operating ambient temperature range –40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics applicationreport.

7.4 Thermal Information

THERMAL METRIC (1)AMC1305x

UNITDW (SOIC)16 PINS

RθJA Junction-to-ambient thermal resistance 80.2 °C/WRθJC(top) Junction-to-case (top) thermal resistance 40.5 °C/WRθJB Junction-to-board thermal resistance 45.1 °C/WψJT Junction-to-top characterization parameter 11.9 °C/WψJB Junction-to-board characterization parameter 44.5 °C/WRθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W

7.5 Power RatingsPARAMETER TEST CONDITIONS VALUE UNIT

PDMaximum power dissipation(both sides) AVDD = 5.5 V, DVDD = 5.5 V, LVDS, RLOAD = 100 Ω 89.1 mW

PD1Maximum power dissipation(high-side supply) AVDD = 5.5 V 45.1 mW

PD2Maximum power dissipation(low-side supply) DVDD = 5.5 V, LVDS, RLOAD = 100 Ω 44 mW




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http://www.ti.com/lit/pdf/spra953

http://www.ti.com/lit/pdf/spra953

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(1) Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must betaken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printedcircuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal in certain cases. Techniques such asinserting grooves or ribs on the PCB are used to help increase these specifications.

(2) This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured bymeans of suitable protective circuits.

(3) Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.(4) Apparent charge is electrical discharge caused by a partial discharge (pd).(5) All pins on each side of the barrier are tied together, creating a two-pin device.

7.6 Insulation SpecificationsPARAMETER TEST CONDITIONS VALUE UNIT

GENERALCLR Minimum air gap (clearance) (1) Shortest pin-to-pin distance through air ≥ 8 mm

CPG Minimum external tracking (creepage) (1) Shortest pin-to-pin distance across the packagesurface ≥ 8 mm

DTI Distance through insulation Minimum internal gap (internal clearance) of thedouble insulation (2 × 0.0135 mm) 0.027 mm

CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 ≥ 600 VMaterial group According to IEC 60664-1 I

Overvoltage category per IEC 60664-1Rated mains voltage ≤ 300 VRMS I-IVRated mains voltage ≤ 600 VRMS I-IIIRated mains voltage ≤ 1000 VRMS I-II

DIN VDE V 0884-11: 2017-01 (2)

VIORMMaximum repetitive peak isolationvoltage At ac voltage (bipolar or unipolar) 1414 VPK

VIOWMMaximum-rated isolation workingvoltage

At ac voltage (sine wave) 1000 VRMS

At dc voltage 1500 VDC

VIOTM Maximum transient isolation voltageVTEST = VIOTM, t = 60 s (qualification test) 7000

VPKVTEST = 1.2 x VIOTM, t = 1 s (100% productiontest) 8400

VIOSM Maximum surge isolation voltage (3)Test method per IEC 60065, 1.2/50-μswaveform, VTEST = 1.6 x VIOSM = 10000 VPK(qualification)

6250 VPK

qpd Apparent charge (4)

Method a, after input/output safety test subgroup2 / 3, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.2 x VIORM= 1697 VPK, tm = 10 s

≤ 5 pC

Method a, after environmental tests subgroup 1,Vini = VIOTM, tini = 60 s, Vpd(m) = 1.6 x VIORM =2263 VPK, tm = 10 s

≤ 5 pC

Method b1, at routine test (100% production) andpreconditioning (type test), Vini = VIOTM, tini = 1 s,Vpd(m) = 1.875 x VIORM = 2652 VPK, tm = 1 s

≤ 5 pC

CIO Barrier capacitance, input to output (5) VIO = 0.5 VPP at 1 MHz 1.2 pFRIO Insulation resistance, input to output (5) VIO = 500 V at TS = 150°C > 109 Ω

Pollution degree 2Climatic category 40/125/21

UL1577

VISO Withstand isolation voltageVTEST = VISO = 5000 VRMS or 7000 VDC, t = 60 s(qualification test), VTEST = 1.2 x VISO = 6000VRMS, t = 1 s (100% production test)

5000 VRMS




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7.7 Safety-Related CertificationsVDE UL

Certified according to DIN VDE V 0884-11: 2017-01,DIN EN 62368-1: 2016-05, EN 62368-1: 2014,

and IEC 62368-1: 2014

Recognized under UL1577 component recognition and CSAcomponent acceptance NO 5 programs

Reinforced insulation Single protectionCertificate number: 40040142 File number: E181974

(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The ISand PS parameters represent the safety current and safety power, respectively. Do not exceed the maximum limits of IS and PS. Theselimits vary with the ambient temperature, TA.The junction-to-air thermal resistance, RθJA, in the Thermal Information table is that of a device installed on a high-K test board forleaded surface-mount packages. Use these equations to calculate the value for each parameter:TJ = TA + RθJA × P, where P is the power dissipated in the device.TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum junction temperature.PS = IS × AVDDmax + IS × DVDDmax, where AVDDmax is the maximum high-side voltage and DVDDmax is the maximum controller-sidesupply voltage.

7.8 Safety Limiting ValuesSafety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

IS Safety input, output, or supply current

RθJA = 80.2°C/W, AVDD = DVDD = 5.5 V, TJ =150°C, TA = 25°C, see Figure 3 283 mA

RθJA = 80.2°C/W, AVDD = DVDD = 3.6 V, TJ =150°C, TA = 25°C, see Figure 3 432 mA

PS Safety input, output, or total power RθJA = 80.2°C/W, TJ = 150°C, TA = 25°C, seeFigure 4 1558 (1) mW

TS Maximum safety temperature 150 °C




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(1) Integral nonlinearity is defined as the maximum deviation from a straight line passing through the end-points of the ideal ADC transferfunction expressed as number of LSBs or as a percent of the specified linear full-scale range FSR.

(2) Offset error drift is calculated using the box method as described by the following equation:

(3) Gain error drift is calculated using the box method as described by the following equation:

7.9 Electrical Characteristics: AMC1305M05All minimum and maximum specifications at TA = –40°C to +125°C, AVDD = 4.5 V to 5.5 V, DVDD = 3.0 V to 5.5 V, AINP =–50 mV to 50 mV, AINN = 0 V, and sinc3 filter with OSR = 256, unless otherwise noted. Typical values are at TA = 25°C,CLKIN = 20 MHz, AVDD = 5.0 V, and DVDD = 3.3 V.


ANALOG INPUTS

VClippingMaximum differential voltage input range(AINP-AINN) ±62.5 mV

FSR Specified linear full-scale range(AINP-AINN) –50 50 mV

VCM Operating common-mode input range –0.032 AVDD – 2 V

CID Differential input capacitance 2 pF

IIB Input current Inputs shorted to AGND –97 –72 -57 μA

RID Differential input resistance 5 kΩ

IOS Input offset current ±5 nA

CMTI Common-mode transient immunity 15 kV/μs

CMRR Common-mode rejection ratio

fIN = 0 Hz,VCM min ≤ VIN ≤ VCM max

–104dB

fIN from 0.1 Hz to 50 kHz,VCM min ≤ VIN ≤ VCM max

–75

BW Input bandwidth 800 kHz

DC ACCURACY

DNL Differential nonlinearity Resolution: 16 bits –0.99 0.99 LSB

INL Integral nonlinearity (1) Resolution: 16 bits –4 ±1.5 4 LSB

EO Offset error Initial, at 25°C –50 ±2.5 50 µV

TCEO Offset error thermal drift (2) –1.3 1.3 μV/°C

EG Gain error Initial, at 25°C –0.3% –0.02% 0.3%

TCEG Gain error thermal drift (3) –40 ±20 40 ppm/°C

PSRR Power-supply rejection ratio VAVDD from 4.5 to 5.5V, at dc 105 dB

AC ACCURACY

SNR Signal-to-noise ratio fIN = 1 kHz 76 81 dB

SINAD Signal-to-noise + distortion fIN = 1 kHz 76 81 dB

THD Total harmonic distortion fIN = 1 kHz –90 –83 dB

SFDR Spurious-free dynamic range fIN = 1 kHz 83 92 dB

DIGITAL INPUTS/OUTPUTS

External Clock

fCLKIN Input clock frequency 5 20 20.1 MHz

DutyCLKIN Duty cycle 5 MHz ≤ fCLKIN ≤ 20.1 MHz 40% 50% 60%

CMOS Logic Family, CMOS with Schmitt-Trigger

IIN Input current DGND ≤ VIN ≤ DVDD –1 1 μA

CIN Input capacitance 5 pF

VIH High-level input voltage 0.7 × DVDD DVDD + 0.3 V

VIL Low-level input voltage –0.3 0.3 × DVDD V

CLOAD Output load capacitance fCLKIN = 20 MHz 30 pF

VOH High-level output voltageIOH = –20 µA DVDD – 0.1

VIOH = –4 mA DVDD – 0.4

VOL Low-level output voltageIOL = 20 µA 0.1

VIOL = 4 mA 0.4




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Electrical Characteristics: AMC1305M05 (continued)All minimum and maximum specifications at TA = –40°C to +125°C, AVDD = 4.5 V to 5.5 V, DVDD = 3.0 V to 5.5 V, AINP =–50 mV to 50 mV, AINN = 0 V, and sinc3 filter with OSR = 256, unless otherwise noted. Typical values are at TA = 25°C,CLKIN = 20 MHz, AVDD = 5.0 V, and DVDD = 3.3 V.


POWER SUPPLY

AVDD High-side supply voltage 4.5 5.0 5.5 V

IAVDD High-side supply current 6.5 8.2 mA

PAVDD High-side power dissipation 32.5 45.1 mW

DVDD Controller-side supply voltage 3.0 3.3 5.5 V

IDVDD Controller-side supply current3.0 V ≤ DVDD ≤ 3.6 V 2.7 4.0

mA4.5 V ≤ DVDD ≤ 5.5 V 3.2 5.5

PDVDD Controller-side power dissipation3.0 V ≤ DVDD ≤ 3.6 V 8.9 14.4

mW4.5 V ≤ DVDD ≤ 5.5 V 16.0 30.3




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(1) Integral nonlinearity is defined as the maximum deviation from a straight line passing through the end-points of the ideal ADC transferfunction expressed as the number of LSBs or as a percent of the specified linear full-scale range FSR.

(2) Offset error drift is calculated using the box method as described by the following equation:

(3) Gain error drift is calculated using the box method as described by the following equation:

7.10 Electrical Characteristics: AMC1305x25All minimum and maximum specifications at TA = –40°C to 125°C, AVDD = 4.5 V to 5.5 V, DVDD = 3.0 V to 5.5 V, AINP =–250 mV to 250 mV, AINN = 0 V, and sinc3 filter with OSR = 256, unless otherwise noted. Typical values are at TA = 25°C,CLKIN = 20 MHz, AVDD = 5.0 V, and DVDD = 3.3 V.


ANALOG INPUTS

VClippingMaximum differential voltage input range(AINP-AINN) ±312.5 mV

FSR Specified linear full-scale range(AINP-AINN) –250 250 mV

VCM Operating common-mode input range –0.16 AVDD – 2 V

CID Differential input capacitance 1 pF

IIB Input current Inputs shorted to AGND –82 –60 –48 μA

RID Differential input resistance 25 kΩ

IOS Input offset current ±5 nA

CMTI Common-mode transient immunity 15 kV/μs

CMRR Common-mode rejection ratio

fIN = 0 Hz,VCM min ≤ VIN ≤ VCM max

–95dB

fIN from 0.1 Hz to 50 kHz,VCM min ≤ VIN ≤ VCM max

–76

BW Input bandwidth 1000 kHz

DC ACCURACY

DNL Differential nonlinearity Resolution: 16 bits –0.99 0.99 LSB

INL Integral nonlinearity (1) Resolution: 16 bits –4 ±1.5 4 LSB

EO Offset error Initial, at 25°C –150 ±40 150 µV

TCEO Offset error thermal drift (2) –1.3 1.3 μV/°C

EG Gain error Initial, at 25°C –0.3 –0.02 0.3 %FS

TCEG Gain error thermal drift (3) –40 ±20 40 ppm/°C

PSRR Power-supply rejection ratio VAVDD from 4.5 V to 5.5 V, at dc 90 dB

AC ACCURACY

SNR Signal-to-noise ratio fIN = 1 kHz 82 85 dB

SINAD Signal-to-noise + distortion fIN = 1 kHz 80 84 dB

THD Total harmonic distortion fIN = 1 kHz –90 –83 dB

SFDR Spurious-free dynamic range fIN = 1 kHz 83 92 dB

DIGITAL INPUTS/OUTPUTS

External Clock

fCLKIN Input clock frequency 5 20 20.1 MHz

DutyCLKIN Duty cycle 5 MHz ≤ fCLKIN ≤ 20.1 MHz 40% 50% 60%

CMOS Logic Family (AMC1305M25), CMOS with Schmitt-Trigger

IIN Input current DGND ≤ VIN ≤ DVDD –1 1 μA

CIN Input capacitance 5 pF

VIH High-level input voltage 0.7 × DVDD DVDD + 0.3 V

VIL Low-level input voltage –0.3 0.3 × DVDD V

CLOAD Output load capacitance fCLKIN = 20 MHz 30 pF

VOH High-level output voltageIOH = –20 µA DVDD – 0.1

VIOH = –4 mA DVDD – 0.4

VOL Low-level output voltageIOL = 20 µA 0.1

VIOL = 4 mA 0.4




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Electrical Characteristics: AMC1305x25 (continued)All minimum and maximum specifications at TA = –40°C to 125°C, AVDD = 4.5 V to 5.5 V, DVDD = 3.0 V to 5.5 V, AINP =–250 mV to 250 mV, AINN = 0 V, and sinc3 filter with OSR = 256, unless otherwise noted. Typical values are at TA = 25°C,CLKIN = 20 MHz, AVDD = 5.0 V, and DVDD = 3.3 V.


LVDS Logic Family (AMC1305L25)

VOD Differential output voltage RLOAD = 100 Ω 250 350 450 mV

VOCM Output common-mode voltage 1.125 1.23 1.375 V

IS Output short-circuit current 24 mA

VICM Input common-mode voltage VID = 100 mV 0.05 1.25 3.25 V

VID Differential input voltage 100 350 600 mV

IIN Input current DGND ≤ VIN ≤ 3.3 V –24 0 20 µA

POWER SUPPLY

AVDD High-side supply voltage 4.5 5.0 5.5 V

IAVDD High-side supply current 6.5 8.2 mA

PAVDD High-side power dissipation 32.5 45.1 mW

DVDD Controller-side supply voltage 3.0 3.3 5.5 V

IDVDD Controller-side supply current

AMC1305L25, RLOAD = 100 Ω 6.1 8.0

mAAMC1305M25, 3.0 ≤ DVDD ≤ 3.6 V,CLOAD = 5 pF 2.7 4.0

AMC1305M25, 4.5 ≤ DVDD ≤ 5.5 V,CLOAD = 5 pF 3.2 5.5

PDVDD Controller-side power dissipation

AMC1305L25, RLOAD = 100 Ω 20.1 44.0

mWAMC1305M25, 3.0 ≤ DVDD ≤ 3.6 V,CLOAD = 5 pF 8.9 14.4

AMC1305M25, 4.5 ≤ DVDD ≤ 5.5 V,CLOAD = 5 pF 16.0 30.3




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tD

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7.11 Switching Characteristicsover operating free-air temperature range (unless otherwise noted)

PARAMETER MIN TYP MAX UNITtCLK CLKIN, CLKIN_N clock period 49.75 50 200 nstHIGH CLKIN, CLKIN_N clock high time 19.9 25 120 nstLOW CLKIN, CLKIN_N clock low time 19.9 25 120 nstD Falling edge of CLKIN, CLKIN_N to DOUT, DOUT_N valid delay,

CLOAD = 5 pF 0 15 ns

tISTARTInterface startup time(DVDD at 3.0 V min to DOUT, DOUT_N valid with AVDD ≥ 4.5 V) 32 32 CLKIN

cyclestASTART Analog startup time (AVDD step up to 4.5 V with DVDD ≥ 3.0 V) 1 ms

Figure 1. Digital Interface Timing

Figure 2. Digital Interface Startup Timing




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TA (°C)

I S (

mA

)

0 50 100 150 2000

100

200

300

400

500

D043

AVDD = DVDD = 3.6 VAVDD = DVDD = 5.5 V

TA (°C)

PS (

mW

)

0 50 100 150 2000

200

400

600

800

1000

1200

1400

1600

D044

13




7.12 Insulation Characteristics Curves

Figure 3. Thermal Derating Curve for Safety LimitingCurrent per VDE

Figure 4. Thermal Derating Curve for Safety Limiting Powerper VDE

TA up to 150°C, stress voltage frequency = 60 Hz

Figure 5. Reinforced Isolation Capacitor Lifetime Projection




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AVDD (V)

EO

(µ

V)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5-150

-125

-100

-75

-50

-25

0

25

50

75

100

125

150

D005AVDD (V)

EO

(µ

V)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5-50

-40

-30

-20

-10

0

10

20

30

40

50

D006

VIN (mV)

INL (

LS

B)

-0.25 -0.2 -0.15 -0.1 -0.05 0 0.05 0.1 0.15 0.2 0.25-4

-3

-2

-1

0

1

2

3

4

D003Temperature (°C)

INL (

|LS

B|)

-40 -25 -10 5 20 35 50 65 80 95 110 1250

0.5

1

1.5

2

2.5

3

3.5

4

D004

VCM (V)

I IB (P

A)

-0.5 0 0.5 1 1.5 2 2.5 3-80

-60

-40

-20

0

20

40

60

D001

1305x251305M05

fIN (kHz)

CM

RR

(dB

)

0.001 0.01 0.1 0.2 0.5 1 2 3 5 710 20 50 100-120

-100

-80

-60

-40

-20

0

D002

1305x251305M05

14




7.13 Typical CharacteristicsAt TA = 25°C, AVDD = 5.0 V, DVDD = 3.3 V, AINP = –250 mV to 250 mV, AINN = 0 V, fCLKIN = 20 MHz, and sinc3 filter withOSR = 256, unless otherwise noted.

Figure 6. Input Current vs Input Common-Mode Voltage Figure 7. Common-Mode Rejection Ratio vsInput Signal Frequency

Figure 8. Integral Nonlinearity vs Input Signal Amplitude Figure 9. Integral Nonlinearity vs Temperature

AMC1305x25

Figure 10. Offset Error vs High-Side Supply Voltage

AMC1305M05

Figure 11. Offset Error vs High-Side Supply Voltage




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Temperature (qC)

EG

(%

FS

)

-40 -25 -10 5 20 35 50 65 80 95 110 125-0.3

-0.2

-0.1

0

0.1

0.2

0.3

D011fCLKIN (MHz)

EG

(%

FS

)

5 10 15 20-0.3

-0.2

-0.1

0

0.1

0.2

0.3

D012

fCLKIN (MHz)

EO

(µ

V)

5 10 15 20-150

-125

-100

-75

-50

-25

0

25

50

75

100

125

150

D009

1305x251305M05

AVDD (V)

EG

(%

FS

)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5-0.3

-0.2

-0.1

0

0.1

0.2

0.3

D010

Temperature (qC)

EO

(µ

V)

-40 -25 -10 5 20 35 50 65 80 95 110 125-150

-125

-100

-75

-50

-25

0

25

50

75

100

125

150

D007Temperature (qC)

EO

(µ

V)

-40 -25 -10 5 20 35 50 65 80 95 110 125-50

-40

-30

-20

-10

0

10

20

30

40

50

D008

15




Typical Characteristics (continued)At TA = 25°C, AVDD = 5.0 V, DVDD = 3.3 V, AINP = –250 mV to 250 mV, AINN = 0 V, fCLKIN = 20 MHz, and sinc3 filter withOSR = 256, unless otherwise noted.

AMC1305x25

Figure 12. Offset Error vs Temperature

AMC1305M05

Figure 13. Offset Error vs Temperature

Figure 14. Offset Error vs Clock Frequency Figure 15. Gain Error vs High-Side Supply Voltage

Figure 16. Gain Error vs Temperature Figure 17. Gain Error vs Clock Frequency




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fIN (kHz)

SN

R a

nd S

INA

D (

dB

)

0.1 1 10 10060

65

70

75

80

85

90

95

100

D017

SNR (x25)SINAD (x25)SNR (M05)SINAD (M05)

VIN (mVpp)

SN

R a

nd S

INA

D (

dB

)

0 50 100 150 200 250 300 350 400 450 50050

55

60

65

70

75

80

85

90

95

100

D018

SNRSINAD

Temperature (°C)

SN

R a

nd S

INA

D (

dB

)

-40 -25 -10 5 20 35 50 65 80 95 110 12560

65

70

75

80

85

90

95

100

D015


fCLKIN (MHz)

SN

R a

nd S

INA

D (

dB

)

5 10 15 2060

65

70

75

80

85

90

95

100

D016


Ripple Frequency (kHz)

PS

RR

(d

B)

0.001 0.01 0.1 1 10 100-120

-100

-80

-60

-40

-20

0

D013

1305x251305M05

AVDD (V)

SN

R a

nd S

INA

D (

dB

)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.560

65

70

75

80

85

90

95

100

D014


16





Figure 18. Power-Supply Rejection Ratio vsRipple Frequency

Figure 19. SNR and SINAD vs High-Side Supply Voltage

Figure 20. SNR and SINAD vs Temperature Figure 21. SNR and SINAD vs Clock Frequency

Figure 22. SNR and SINAD vs Input Signal Frequency

AMC1305x25

Figure 23. SNR and SINAD vs Input Signal Amplitude




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fIN (kHz)

TH

D (

dB

)

0.1 1 10 100-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

D023VIN (mVpp)

TH

D (

dB

)

0 50 100 150 200 250 300 350 400 450 500-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

D024

Temperature (°C)

TH

D (

dB

)

-40 -25 -10 5 20 35 50 65 80 95 110 125-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

D021fCLKIN (MHz)

TH

D (

dB

)

5 10 15 20-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

D022

VIN (mVpp)

SN

R a

nd S

INA

D (

dB

)

0 10 20 30 40 50 60 70 80 90 10050

55

60

65

70

75

80

85

90

95

100

D019

SNRSINAD

AVDD (V)

TH

D (

dB

)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

D020

17





AMC1305M05

Figure 24. SNR and SINAD vs Input Signal Amplitude Figure 25. Total Harmonic Distortion vsHigh-Side Supply Voltage

Figure 26. Total Harmonic Distortion vs Temperature Figure 27. Total Harmonic Distortion vs Clock Frequency

Figure 28. Total Harmonic Distortion vsInput Signal Frequency

AMC1305x25

Figure 29. Total Harmonic Distortion vsInput Signal Amplitude




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fIN (kHz)

SF

DR

(dB

)

0.1 1 10 10060

65

70

75

80

85

90

95

100

105

110

D029VIN (mVpp)

SF

DR

(dB

)

0 50 100 150 200 250 300 350 400 450 50060

65

70

75

80

85

90

95

100

105

110

D030

Temperature (°C)

SF

DR

(dB

)

-40 -25 -10 5 20 35 50 65 80 95 110 12560

65

70

75

80

85

90

95

100

105

110

D027fCLKIN (MHz)

SF

DR

(dB

)

5 10 15 2060

65

70

75

80

85

90

95

100

105

110

D028

VIN (mVpp)

TH

D (

dB

)

0 50 100 150-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

D025AVDD (V)

SF

DR

(dB

)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.560

65

70

75

80

85

90

95

100

105

110

D026

18





AMC1305M05

Figure 30. Total Harmonic Distortion vsInput Signal Amplitude

Figure 31. Spurious-Free Dynamic Range vsHigh-Side Supply Voltage

Figure 32. Spurious-Free Dynamic Range vs Temperature Figure 33. Spurious-Free Dynamic Range vsClock Frequency

Figure 34. Spurious-Free Dynamic Range vsInput Signal Frequency

AMC1305x25

Figure 35. Spurious-Free Dynamic Range vsInput Signal Amplitude




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Frequency (kHz)

Magnitude (

dB

)

0 5 10 15 20 25 30 35 40-140

-120

-100

-80

-60

-40

-20

0

D035AVDD (V)

I AV

DD (

mA

)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.53

4

5

6

7

8

9

10

D036

Frequency (kHz)

Ma

gnitu

de

(d

B)

0 5 10 15 20 25 30 35 40-140

-120

-100

-80

-60

-40

-20

0

D033Frequency (kHz)

Magnitude (

dB

)

0 5 10 15 20 25 30 35 40-140

-120

-100

-80

-60

-40

-20

0

D034

VIN (mVpp)

SF

DR

(dB

)

0 50 100 15060

65

70

75

80

85

90

95

100

105

110

D031Frequency (kHz)

Magnitude (

dB

)

0 5 10 15 20 25 30 35 40-140

-120

-100

-80

-60

-40

-20

0

D032

19





AMC1305M05

Figure 36. Spurious-Free Dynamic Range vsInput Signal Amplitude

AMC1305x25, 4096-point FFT, VIN = 500 mVPP

Figure 37. Frequency Spectrum with 1-kHz Input Signal

AMC1305x25, 4096-point FFT, VIN = 500 mVPP


AMC1305M05, 4096-point FFT, VIN = 500 mVPP


AMC1305M05, 4096-point FFT, VIN = 500 mVPP

Figure 40. Frequency Spectrum with 5-kHz Input Signal Figure 41. High-Side Supply Current vsHigh-Side Supply Voltage




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Temperature (°C)

I DV

DD (

mA

)

-40 -25 -10 5 20 35 50 65 80 95 110 1251

2

3

4

5

6

7

8

9

10

11

12

D041

LVDS 5 VLVDS 3.3 VCMOS 5 VCMOS 3.3 V

Clock Frequency (MHz)

I DV

DD (

mA

)

5 10 15 201

2

3

4

5

6

7

8

9

10

11

12

D042

LVDS 5VLVDS 3.3VCMOS 5 VCMOS 3.3 V

DVDD (V)

I DV

DD (

mA

)

3 3.1 3.2 3.3 3.4 3.5 3.61

2

3

4

5

6

7

8

9

10

11

12

D039

LVDSCMOS

DVDD (V)

I DV

DD (

mA

)

4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.51

2

3

4

5

6

7

8

9

10

11

12

D040

LVDSCMOS

Temperature (°C)

I AV

DD (

mA

)

-40 -25 -10 5 20 35 50 65 80 95 110 1253

4

5

6

7

8

9

10

D037fCLKIN (MHz)

I AV

DD (

mA

)

5 10 15 203

4

5

6

7

8

9

10

D038

20





Figure 42. High-Side Supply Current vs Temperature Figure 43. High-Side Supply Current vs Clock Frequency

Figure 44. Controller-Side Supply Current vsController-Side Supply Voltage (3.3 V, nom)

Figure 45. Controller-Side Supply Current vsController-Side Supply Voltage (5 V, nom)

Figure 46. Controller-Side Supply Current vs Temperature Figure 47. Controller-Side Supply Current vsClock Frequency




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+

-Is

ola

tio

n B

arr

ier

Re

ce

ive

r

û-Modulator

Re

ce

ive

r

1.25-V

Reference

Inte

rfa

ce

DOUT

CLKIN

DVDD

DGNDAGND

AINP

AINN

AVDD

BUF

BUF

BUFTX

TX

TX

TXAMC1305

DOUT_N (AMC1305L25 only)

CLKIN_N (AMC1305L25 only)

21




8 Detailed Description

8.1 OverviewThe differential analog input (AINP and AINN) of the AMC1305 is a fully-differential amplifier feeding theswitched-capacitor input of a second-order delta-sigma (ΔΣ) modulator stage that digitizes the input signal into a1-bit output stream. The isolated data output (DOUT) of the converter provides a stream of digital ones and zerossynchronous to the externally-provided clock source at the CLKIN pin with a frequency in the range of 5 MHz to20.1 MHz. The time average of this serial bit-stream output is proportional to the analog input voltage.

The Functional Block Diagram section shows a detailed block diagram of the AMC1305. The analog input rangeis tailored to directly accommodate a voltage drop across a shunt resistor used for current sensing. The SiO2-based capacitive isolation barrier supports a high level of magnetic field immunity as described in the applicationreport ISO72x Digital Isolator Magnetic-Field Immunity (SLLA181A), available for download at www.ti.com. Theexternal clock input simplifies the synchronization of multiple current-sense channels on the system level. Theextended frequency range of up to 20.1 MHz supports higher performance levels compared to other solutionsavailable on the market.

8.2 Functional Block Diagram




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http://www.ti.com/lit/pdf/SLLA181A

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VIN Integrator 1 Integrator 2

0 V

DAC

V1 V2 V4

V5

V3

CMP

fCLKIN

22




8.3 Feature Description

8.3.1 Analog InputThe AMC1305 incorporates front-end circuitry that contains a differential amplifier and sampling stage, followedby a ΔΣ modulator. The gain of the differential amplifier is set by internal precision resistors to a factor of 4 fordevices with a specified input voltage range of ±250 mV (for the AMC1305x25), or to a factor of 20 for deviceswith a ±50-mV input voltage range (for the AMC1305M05), resulting in a differential input impedance of 5 kΩ (forthe AMC1305M05) or 25 kΩ (for the AMC1305x25).

Consider the input impedance of the AMC1305 in designs with high-impedance signal sources that can causedegradation of gain and offset specifications. The importance of this effect, however, depends on the desiredsystem performance. Additionally, the input bias current caused by the internal common-mode voltage at theoutput of the differential amplifier causes an offset that depends on the actual amplitude of the input signal. Seethe Isolated Voltage Sensing section for more details on reducing these effects.

There are two restrictions on the analog input signals (AINP and AINN). First, if the input voltage exceeds therange of AGND – 6 V to AVDD + 0.5 V, the input current must be limited to 10 mA because the device inputelectrostatic discharge (ESD) protection diodes turn on. In addition, the linearity and noise performance of thedevice are ensured only when the differential analog input voltage remains within the specified linear full-scalerange (FSR), that is ±250 mV (for the AMC1305x25) or ±50 mV (for the AMC1305M05), and within the specifiedinput common-mode range.

8.3.2 ModulatorThe modulator implemented in the AMC1305 is a second-order, switched-capacitor, feed-forward ΔΣ modulator,such as the one conceptualized in Figure 48. The analog input voltage VIN and the output V5 of the 1-bit digital-to-analog converter (DAC) are differentiated, providing an analog voltage V1 at the input of the first integratorstage. The output of the first integrator feeds the input of the second integrator stage, resulting in output voltageV3 that is differentiated with the input signal VIN and the output of the first integrator V2. Depending on the polarityof the resulting voltage V4, the output of the comparator is changed. In this case, the 1-bit DAC responds on thenext clock pulse by changing its analog output voltage V5, causing the integrators to progress in the oppositedirection while forcing the value of the integrator output to track the average value of the input.

Figure 48. Block Diagram of a Second-Order Modulator

The modulator shifts the quantization noise to high frequencies; see Figure 49. Therefore, use a low-pass digitalfilter at the output of the device to increase overall performance. This filter is also used to convert from the 1-bitdata stream at a high sampling rate into a higher-bit data word at a lower rate (decimation). TI's microcontrollerfamily TMS320F2837x offers a suitable programmable, hardwired filter structure termed a sigma-delta filtermodule (SDFM) optimized for usage with the AMC1305 family. Also, SD24_B converters on the MSP430F677xmicrocontrollers offer a path to directly access the integrated sinc-filters, thus offering a system-level solution formultichannel isolated current sensing. An additional option is to use a suitable application-specific device (suchas the AMC1210, a four-channel digital sinc-filter). Alternatively, a field-programmable gate array (FPGA) can beused to implement the digital filter.




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http://www.ti.com/product/MSP430F6779

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Modulator Output

Analog Input

+FS (Analog Input)

-FS (Analog Input)

Clipping

ClippingIN

V

VV

*2

0

20

40

60

80

100

120

140

-

-

-

-

-

-

-

10 10M

Frequency (Hz)

Magnitude (

dB

)

100 1k 10k 100k 1M

23




Feature Description (continued)

Figure 49. Quantization Noise Shaping

8.3.3 Digital OutputA differential input signal of 0 V ideally produces a stream of ones and zeros that are high 50% of the time. Adifferential input of 250 mV (for the AMC1305x25) or 50 mV (for the AMC1305M05) produces a stream of onesand zeros that are high 90% of the time. A differential input of –250 mV (–50 mV for the AMC1305M05)produces a stream of ones and zeros that are high 10% of the time. These input voltages are also the specifiedlinear ranges of the different AMC1305 versions with performance as specified in this document. If the inputvoltage value exceeds these ranges, the output of the modulator shows non-linear behavior while thequantization noise increases. The output of the modulator would clip with a stream of only zeros with an inputless than or equal to –312.5 mV (–62.5 mV for the AMC1305M05) or with a stream of only ones with an inputgreater than or equal to 312.5 mV (62.5 mV for the AMC1305M05). In this case, however, the AMC1305generates a single 1 (if the input is at negative full-scale) or 0 every 128 clock cycles to indicate proper devicefunction (see the Fail-Safe Output section for more details). The input voltage versus the output modulator signalis shown in Figure 50.

The density of ones in the output bit-stream for any input voltage value (with the exception of a full-scale inputsignal as described in Output Behavior in Case of Full-Scale Input ) can be calculated using Equation 1:

(1)

The AMC1305 system clock is typically 20 MHz and is provided externally at the CLKIN pin. Data aresynchronously provided at 20 MHz at the DOUT pin. Data change at the CLKIN falling edge. For more details,see the Switching Characteristics table.

Figure 50. Analog Input versus AMC1305 Modulator Output




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CLKIN

DOUT VIN 312.5 mV (AMC1305M05: 61.5 mV)

DOUT VIN 312.5 mV (AMC1305M05: 61.5 mV)

... ...

...

...

...

...

127 CLKIN cycles 127 CLKIN cycles

DOUT

AVDD

CLKIN

AVDD GOOD AVDD FAIL

DOUT

Case 1: DOUT = Z1[ÁZvs(]o

Case 2: DOUT = Z0[ÁZvs(]o

24




8.4 Device Functional Modes

8.4.1 Fail-Safe OutputIn the case of a missing high-side supply voltage (AVDD), the output of a ΔΣ modulator is not defined and couldcause a system malfunction. In systems with high safety requirements, this behavior is not acceptable.Therefore, the AMC1305 implements a fail-safe output function that ensures the device maintains its output levelin case of a missing AVDD, as shown in Figure 51.

Figure 51. Fail-Safe Output of the AMC1305

8.4.2 Output Behavior in Case of Full-Scale InputIf a full-scale input signal is applied to the AMC1305 (that is, VIN ≥ VClipping), the device generates a single one orzero every 128 bits at DOUT, depending on the actual polarity of the signal being sensed, as shown in Figure 52.In this way, differentiating between a missing AVDD and a full-scale input signal is possible on the system level.

Figure 52. Overrange Output of the AMC1305




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OSR

EN

OB

(bits)

1 10 100 10000

2

4

6

8

10

12

14

16

D053

sinc1sinc2sinc3

ENOBdBdBSNR *02.676.1

3

11

1)( ¸

¹

·¨©

§

z

zzH

OSR

25




9 Application and Implementation

NOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI’s customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Digital Filter UsageThe modulator generates a bit stream that is processed by a digital filter to obtain a digital word similar to aconversion result of a conventional analog-to-digital converter (ADC). A very simple filter, built with minimal effortand hardware, is a sinc3-type filter, as shown in Equation 2:

(2)

This filter provides the best output performance at the lowest hardware size (count of digital gates) for a second-order modulator. All the characterization in this document is also done with a sinc3 filter with an over-samplingratio (OSR) of 256 and an output word width of 16 bits.

(3)

Figure 53. Measured Effective Number of Bits versus Oversampling Ratio

An example code for an implementation of a sinc3 filter in an FPGA, see the application note CombiningADS1202 with FPGA Digital Filter for Current Measurement in Motor Control Applications (SBAA094), availablefor download at www.ti.com.




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http://www.ti.com/lit/pdf/SBAA094


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SD-C1

SD-D1

TMS320F2837x

DC link

RSHUNT

Gate Driver

Gate Driver

Gate Driver

Gate Driver

RSHUNT

Gate Driver

Gate Driver

RSHUNT

SD-C3

SD-D2

SD-C4

SD-D4

SD-C5

SD-D5

DOUT

CLKIN

DVDD

DGNDAGND

AINN

AINP

AVDD

AMC1305

5.0 V 3.3 V

DOUT

CLKIN

DVDD

DGNDAGND

AINN

AINP

AVDD

AMC1305

5.0 V 3.3 V

DOUT

CLKIN

DVDD

DGNDAGND

AINN

AINP

AVDD

AMC1305

5.0 V 3.3 V

DOUT

CLKIN

DVDD

DGNDAGND

AINN

AINP

AVDD

AMC1305

5.0 V 3.3 V

PWMx

26




9.2 Typical Applications

9.2.1 Frequency Inverter ApplicationBecause to their high ac and dc performance, isolated ΔΣ modulators are being widely used in new generationfrequency inverter designs. Frequency inverters are critical parts of industrial motor drives, photovoltaic inverters(string and central inverters), uninterruptible power supplies (UPS), electrical and hybrid electrical vehicles, andother industrial applications. The input structure of the AMC1305 is optimized for use with low-impedance shuntresistors and is therefore tailored for isolated current sensing using shunts.

Figure 54. The AMC1305 in a Frequency Inverter Application

9.2.1.1 Design RequirementsA typical operation of the device in a frequency inverter application is shown in Figure 54. When the inverterstage is part of a motor drive system, measurement of the motor phase current is done via the shunt resistors(RSHUNT). Depending on the system design, either all three or only two phase currents are sensed.

In this example, an additional fourth AMC1305 is used to support isolated voltage sensing of the dc link. Thishigh voltage is reduced using a high-impedance resistive divider before being sensed by the device across asmaller resistor. The value of this resistor can degrade the performance of the measurement, as described in theIsolated Voltage Sensing section.

9.2.1.2 Detailed Design ProcedureThe usually recommended RC filter in front of a ΔΣ modulator to improve signal-to-noise performance of thesignal path, is not required for the AMC1305. By design, the input bandwidth of the analog front-end of thedevice is limited to 1 MHz.

For modulator output bit-stream filtering, a device from TI's TMS320F2837x family of dual-core MCUs isrecommended. This family supports up to eight channels of dedicated hardwired filter structures that significantlysimplify system level design by offering two filtering paths per channel: one providing high accuracy results forthe control loop and one fast response path for overcurrent detection.




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settling time (µs)

EN

OB

(bits)

0 2 4 6 8 10 12 14 16 18 200

2

4

6

8

10

12

14

16

D054

sinc1sinc2sinc3

27




Typical Applications (continued)9.2.1.3 Application CurveIn motor control applications, a very fast response time for overcurrent detection is required. The time for fullysettling the filter in case of a step-signal at the input of the modulator depends on its order; that is, a sinc3 filterrequires three data updates for full settling (with fDATA = fCLK / OSR). Therefore, for overcurrent protection, filtertypes other than sinc3 can be a better choice; an alternative is the sinc2 filter. Figure 55 compares the settlingtimes of different filter orders.

Figure 55. Measured Effective Number of Bits versus Settling Time

The delay time of the sinc filter with a continuous signal is half of its settling time.




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IN

GGtot

R

REE

3

+

-û-Modulator

VCM = 2 V

AMC1305

5 V

GND

High voltage

potential

R1

R2

R3

R4 R5

R4' R5'

IIB

RID

AVDD

AINP

AINN

AGND

R3'

28




Typical Applications (continued)9.2.2 Isolated Voltage SensingThe AMC1305 is optimized for usage in current-sensing applications using low-impedance shunts. However, thedevice can also be used in isolated voltage-sensing applications if the impact of the (usually higher) impedanceof the resistor used in this case is considered.

Figure 56. Using AMC1305 for Isolated Voltage Sensing

9.2.2.1 Design RequirementsFigure 56 shows a simplified circuit typically used in high-voltage sensing applications. The high impedanceresistors (R1 and R2) are used as voltage dividers and dominate the current value definition. The resistance ofthe sensing resistor R3 is chosen to meet the input voltage range of the AMC1305. This resistor and thedifferential input impedance of the device (the AMC1305x25 is 25 kΩ, the AMC1305M05 is 5 kΩ) also create avoltage divider that results in an additional gain error. With the assumption of R1, R2, and RIN having aconsiderably higher value than R3, the resulting total gain error can be estimated using Equation 4, with EGbeing the gain error of the AMC1305.

(4)

This gain error can be easily minimized during the initial system level gain calibration procedure.

9.2.2.2 Detailed Design ProcedureAs indicated in Figure 56, the output of the integrated differential amplifier is internally biased to a common-modevoltage of 2 V. This voltage results in a bias current IIB through the resistive network R4 and R5 (or R4' and R5')used for setting the gain of the amplifier. The value range of this current is specified in the ElectricalCharacteristics table. This bias current generates additional offset error that depends on the value of the resistorR3. Because the value of this bias current depends on the actual common-mode amplitude of the input signal (asshown in Figure 57), the initial system offset calibration does not minimize its effect. Therefore, in systems withhigh accuracy requirements TI recommends using a series resistor at the negative input (AINN) of the AMC1305with a value equal to the shunt resistor R3 (that is R3' = R3 in Figure 56) to eliminate the effect of the biascurrent.




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VCM (V)

I IB (P

A)

-0.5 0 0.5 1 1.5 2 2.5 3-80

-60

-40

-20

0

20

40

60

D001

1305x251305M05

%100*'3'4

41(%) ¸

¹

·¨©

§

RR

RE

G

29




Typical Applications (continued)This additional series resistor (R3') influences the gain error of the circuit. The effect can be calculated usingEquation 5 with R5 = R5' = 50 kΩ and R4 = R4' = 2.5 kΩ (for the AMC1305M05) or 12.5 kΩ (for theAMC1305x25).

(5)

9.2.2.3 Application CurveFigure 57 shows the dependency of the input bias current on the common-mode voltage at the input of theAMC1305.

Figure 57. Input Current vs Input Common-Mode Voltage




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DOUT

CLKIN

DVDD

DGNDAGND

AINP

AINN

AVDD

AMC1305

HV+

HV-

to load

Floating

Power Supply

20 V

SD-Cx

SD-Dx

TMS320F2837x

3.3 V, or 5.0 V

RSHUNT

Gate Driver

Gate Driver

5.1 V

R1

800

Z1

1N751A

C1

10 F C2

0.1 F

C4

0.1 F C5

2.2 F

PWMx

30




10 Power Supply RecommendationsIn a typical frequency inverter application, the high-side power supply (AVDD) for the device is derived from thefloating power supply of the upper gate driver. For lowest cost, a Zener diode can be used to limit the voltage to5 V ±10%. Alternatively a low-cost low-drop regulator (LDO), for example the LM317-N, can be used to minimizenoise on the power supply. A low-ESR decoupling capacitor of 0.1 µF is recommended for filtering this power-supply path. Place this capacitor (C2 in Figure 58) as close as possible to the AVDD pin of the AMC1305 for bestperformance. If better filtering is required, an additional 10-µF capacitor can be used. The floating groundreference (AGND) is derived from the end of the shunt resistor, which is connected to the negative input (AINN)of the device. If a four-pin shunt is used, the device inputs are connected to the inner leads, while AGND isconnected to one of the outer leads of the shunt.

For decoupling of the digital power supply on controller side, TI recommends using a 0.1-µF capacitor assembledas close to the DVDD pin of the AMC1305 as possible, followed by an additional capacitor in the range of 1 µF to10 µF.

Figure 58. Zener-Diode-Based High-Side Power Supply




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http://www.ti.com/product/LM317-N

to/fromMCU

(filter)

Clearance areato be kept free of any conductive materials

AMC1305Mxx

AINP

AINN

AGND

DVDD

CLKIN

DOUT

DGND

AGND

0.1 µF

SMD0603

1 16

Top View

From shunt resistor

LEGEND

TOP layer: copper pour & traces

high-side area

controller-side area

via to ground plane

via to supply plane

NC

NC

NC

NC

NC

AVDD

DGND

0.1 µF

SMD0603

NC

31




11 Layout

11.1 Layout GuidelinesA layout recommendation showing the critical placement of the decoupling capacitors (as close as possible to theAMC1305) and placement of the other components required by the device is shown in Figure 59.

For the AMC1305L25 version, place the 100-Ω termination resistor as close as possible to the CLKIN, CLKIN_Ninputs of the device to achieve highest signal integrity. If not integrated, an additional termination resistor isrequired as close as possible to the LVDS data inputs of the MCU or filter device; see Figure 60.

11.2 Layout Examples

Figure 59. Recommended Layout of the AMC1305Mx




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Clearance areato be kept free of any conductive materials

AMC1305L25

AINP

AINN

AGND

DVDD

CLKIN

DOUT

DGND

AGND

0.1 µF

SMD0603

1 16

Top View

From shunt resistor

LEGEND

TOP layer: copper pour & traces

high-side area

controller-side area

via to ground plane

via to supply plane

NC

NC

DOUT_N

CLKIN_N

NC

AVDD

DGND

0.1 µF

SMD0603

NC

100 :

SMD0603

100 :

SMD0603

to/fromMCU(filter)

32




Layout Examples (continued)

Figure 60. Recommended Layout of the AMC1305L25




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33




12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related DocumentationFor related documentation see the following:• Texas Instruments, Isolation Glossary application report• Texas Instruments, ISO72x Digital Isolator Magnetic-Field Immunity application report• Texas Instruments, Combining ADS1202 with FPGA Digital Filter for Current Measurement in Motor Control

Applications application report• Texas Instruments, LM117, LM317-N Wide Temperature Three-Pin Adjustable Regulator data sheet• Texas Instruments, TMS320F2837xD Dual-Core Delfino™ Microcontrollers data sheet• Texas Instruments, MSP430F677x Polyphase Metering SoCs data sheet• Texas Instruments, AMC1210 Quad Digital Filter for 2nd-Order Delta-Sigma Modulator data sheet

12.2 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to order now.

Table 1. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICALDOCUMENTS

TOOLS &SOFTWARE

SUPPORT &COMMUNITY

AMC1305L25 Click here Click here Click here Click here Click hereAMC1305M05 Click here Click here Click here Click here Click hereAMC1305M25 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on ti.com. In the upperright corner, click on Alert me to register and receive a weekly digest of any product information that haschanged. For change details, review the revision history included in any revised document.

12.4 Support ResourcesTI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straightfrom the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and donot necessarily reflect TI's views; see TI's Terms of Use.

12.5 TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.




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http://www.ti.com/lit/pdf/SNVS774

http://www.ti.com/lit/pdf/SPRS880

http://www.ti.com/lit/pdf/SLAS768

http://www.ti.com/lit/pdf/SBAS372

http://www.ti.com/product/AMC1305L25?dcmp=dsproject&hqs=pf

http://www.ti.com/product/AMC1305L25?dcmp=dsproject&hqs=sandbuy&#samplebuy

http://www.ti.com/product/AMC1305L25?dcmp=dsproject&hqs=td&#doctype2

http://www.ti.com/product/AMC1305L25?dcmp=dsproject&hqs=sw&#desKit

http://www.ti.com/product/AMC1305L25?dcmp=dsproject&hqs=support&#community

http://www.ti.com/product/AMC1305M05?dcmp=dsproject&hqs=pf

http://www.ti.com/product/AMC1305M05?dcmp=dsproject&hqs=sandbuy&#samplebuy

http://www.ti.com/product/AMC1305M05?dcmp=dsproject&hqs=td&#doctype2

http://www.ti.com/product/AMC1305M05?dcmp=dsproject&hqs=sw&#desKit

http://www.ti.com/product/AMC1305M05?dcmp=dsproject&hqs=support&#community

http://www.ti.com/product/AMC1305M25?dcmp=dsproject&hqs=pf

http://www.ti.com/product/AMC1305M25?dcmp=dsproject&hqs=sandbuy&#samplebuy

http://www.ti.com/product/AMC1305M25?dcmp=dsproject&hqs=td&#doctype2

http://www.ti.com/product/AMC1305M25?dcmp=dsproject&hqs=sw&#desKit

http://www.ti.com/product/AMC1305M25?dcmp=dsproject&hqs=support&#community

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http://www.ti.com/corp/docs/legal/termsofuse.shtml

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34




13 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.




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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead finish/Ball material

(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

AMC1305L25DW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC1305L25

AMC1305L25DWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC1305L25

AMC1305M05DW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC1305M05

AMC1305M05DWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC1305M05

AMC1305M25DW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC1305M25

AMC1305M25DWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC1305M25

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to twolines if the finish value exceeds the maximum column width.

http://www.ti.com/product/AMC1305L25?CMP=conv-poasamples#samplebuy

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PACKAGE OPTION ADDENDUM

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Addendum-Page 2

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF AMC1305L25, AMC1305M05, AMC1305M25 :

• Automotive: AMC1305L25-Q1, AMC1305M05-Q1, AMC1305M25-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

AMC1305L25DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1

AMC1305M05DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1

AMC1305M25DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1

AMC1305M25DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2021

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

AMC1305L25DWR SOIC DW 16 2000 350.0 350.0 43.0

AMC1305M05DWR SOIC DW 16 2000 350.0 350.0 43.0

AMC1305M25DWR SOIC DW 16 2000 350.0 350.0 43.0

AMC1305M25DWR SOIC DW 16 2000 853.0 449.0 35.0

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 2

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GENERIC PACKAGE VIEW

This image is a representation of the package family, actual package may vary.Refer to the product data sheet for package details.

SOIC - 2.65 mm max heightDW 16SMALL OUTLINE INTEGRATED CIRCUIT7.5 x 10.3, 1.27 mm pitch

4224780/A

www.ti.com

PACKAGE OUTLINE

C

TYP10.639.97

2.65 MAX

14X 1.27

16X 0.510.31

2X8.89

TYP0.330.10

0 - 80.30.1

(1.4)

0.25GAGE PLANE

1.270.40

A

NOTE 3

10.510.1

BNOTE 4

7.67.4

4220721/A 07/2016

SOIC - 2.65 mm max heightDW0016ASOIC

NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.5. Reference JEDEC registration MS-013.

1 16

0.25 C A B

98

PIN 1 IDAREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL ATYPICAL

SCALE 1.500

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EXAMPLE BOARD LAYOUT

0.07 MAXALL AROUND

0.07 MINALL AROUND

(9.3)

14X (1.27)

R0.05 TYP

16X (2)

16X (0.6)

4220721/A 07/2016


NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASKOPENING

NON SOLDER MASKDEFINED

SOLDER MASK DETAILS

OPENINGSOLDER MASK METAL

SOLDER MASKDEFINED

LAND PATTERN EXAMPLESCALE:7X

SYMM

1

8 9

16

SEEDETAILS

SYMM

www.ti.com

EXAMPLE STENCIL DESIGN

R0.05 TYP

16X (2)

16X (0.6)

14X (1.27)

(9.3)

4220721/A 07/2016


NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL

SCALE:7X

SYMM

SYMM

1

8 9

16

www.ti.com

PACKAGE OUTLINE

C

TYP10.639.97

2.65 MAX

14X 1.27

16X 0.510.31

2X8.89

TYP0.330.10

0 - 80.30.1

(1.4)

0.25GAGE PLANE

1.270.40

A

NOTE 3

10.510.1

BNOTE 4

7.67.4

4221009/B 07/2016

SOIC - 2.65 mm max heightDW0016BSOIC

NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.5. Reference JEDEC registration MS-013.

1 16

0.25 C A B

98

PIN 1 IDAREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL ATYPICAL

SCALE 1.500

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EXAMPLE BOARD LAYOUT

(9.75)R0.05 TYP

0.07 MAXALL AROUND

0.07 MINALL AROUND

(9.3)

14X (1.27)

R0.05 TYP

16X (1.65)

16X (0.6)

14X (1.27)

16X (2)

16X (0.6)

4221009/B 07/2016


SYMM

SYMM

SEEDETAILS

1

8 9

16

SYMM

HV / ISOLATION OPTION8.1 mm CLEARANCE/CREEPAGE

NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASKOPENING

NON SOLDER MASKDEFINED

SOLDER MASK DETAILS

OPENINGSOLDER MASK METAL

SOLDER MASKDEFINED

LAND PATTERN EXAMPLESCALE:4X

SYMM

1

8 9

16

IPC-7351 NOMINAL7.3 mm CLEARANCE/CREEPAGE

SEEDETAILS

www.ti.com

EXAMPLE STENCIL DESIGN

R0.05 TYPR0.05 TYP

16X (1.65)

16X (0.6)

14X (1.27)

(9.75)

16X (2)

16X (0.6)

14X (1.27)

(9.3)

4221009/B 07/2016


NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design.

SYMM

SYMM

1

8 9

16

HV / ISOLATION OPTION8.1 mm CLEARANCE/CREEPAGE

SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL

SCALE:4X

SYMM

SYMM

1

8 9

16

IPC-7351 NOMINAL7.3 mm CLEARANCE/CREEPAGE

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