Aerospace & Defense Technologyassets.techbriefs.com/EML/2018/digital_editions/adt/ADT_0218.pdfThe COMSOL Multiphysics® software is used for simulating designs, devices, and processes

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Welcome to

your Digital Edition of

Aerospace & DefenseTechnology

February 2018

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Intro

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From the Publishers of

www.aerodefensetech.com February 2018

CompactPCI Serial Space

Plain Bearings for Aerospace Applications

Multi-Domain Command and Control (MDC2)

Loop Thermosyphons

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Multiple antennas are needed to create more complex communication systems on airplanes. But this arrangement of transmitters and receivers can cause aircraft operation issues due to crosstalk, or cosite interference. Simulation helps you analyze the crosstalk effect on an aircraft and in turn find the best antenna placement.

The COMSOL Multiphysics® software is used for simulating designs, devices, and processes in all fields of engineering, manufacturing, and scientific research. See how you can apply it to antenna simulation.

Visualization of the electric field norm and 3D far field due to a transmitting antenna. Antennas are intentionally large in this tutorial model.

Overcome antenna crosstalk issues with simulation.

comsol.blog/antenna-crosstalk

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From the Publishers of

www.aerodefensetech.com February 2018

CompactPCI Serial Space

Plain Bearings for Aerospace Applications

Multi-Domain Command and Control (MDC2)

Loop Thermosyphons

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2 Aerospace & Defense Technology, February 2018Free Info at http://info.hotims.com/69503-829

Aerospace & Defense Technology

ContentsFEATURES ________________________________________

4 Security & Communications4 Multi-Domain Command and Control (MDC2)

10 Thermal Management10 Loop Thermosyphons14 Avionics/Electronics14 CompactPCI Serial Space18 Aerospace Manufacturing18 Plain Bearings for Aerospace Applications

22 RF & Microwave Technology22 Additive Manufacturing Materials for RF Components26 NASA CubeSats: Pushing the Boundaries of Technology

TECH BRIEFS _____________________________________

34 Content Addressable Memory (CAM) Technologies for Big Dataand Intelligent Electronics Enabled By Magneto-ElectricTernary CAM

35 Natural DNA-Based Nonvolatile Resistive Switching Memory

36 A Mechanistic Analysis of Oxygen Vacancy Driven ConductiveFilament Formation in Resistive Random Access MemoryMetal/NiO/Metal Structures

38 pH-Dependent Spin State Population and 19F NMR ChemicalShift Via Remote Ligand Protonation in An Iron(II) Complex

DEPARTMENTS ___________________________________

28 Application Briefs40 New Products44 Advertisers Index

ON THE COVER ___________________________________

A new embedded computing specification calledCompactPCI Serial Space was ratified in 2017.Designed for use on defense and space-based proj-ects such as satellites, it takes the provenCompactPCI Serial standard to the next level byaddressing requirements like redundancy, radiationhardening, outgassing, and testing/screening. Tolearn more, read the feature article on page 14.

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4 www.aerodefensetech.com Aerospace & Defense Technology, February 2018

Multi-Domain Command and Control (MDC2)Changing the Face of Modern Warfare

We are at an inflection pointin the evolution of war-fare. While technology israpidly increasing pace, it

is also creating an expansion into multi-ple, parallel domains, and giving enemyforces more options for both disruptionand defense. Technology advances are akey factor to successes spanning thespectrum from humanitarian efforts tocomplex anti-access/area-denial envi-ronments. However, technology is onlyan enabler, and mindsets must changeto allow the technology to be a tool forsuccess, and not ignored due to anti-quated doctrine, policies, and guidance.

MDC2 represents a new way of think-ing about how to coordinate force em-ployment across multiple warfightingdomains, and bridging capabilities fromold and new technologies. MDC2 itselfis not a new technology, but rather amindset for operational planning, andcreating systems that can more easilytalk and coordinate with each other.Successful MDC2 will require tendrilsand communications links that allowseamless situational awareness, andcross-coordination of planning effortsacross existing horizontal and verticalboundaries.

Past human capability has restrictedwarfare to only a few environments, or“domains”. Land, followed by sea, thensubsurface, then air. New battlespacedomains are emerging rapidly. Space re-mained a peaceful environment fordecades, but now faces a constantlygrowing threat with the potential to im-pose or be subjected to damaging ef-fects. Cyber represents an even moreradical shift - hidden, unpredictable, itchanges faster than humans can moni-tor, and can be utilized for wide-reach-ing effects on top of and within allother domains.

Historically, communication limita-tions drove warfighters in each of the

domains to operate and communicateindependently at the tactical level, co-ordinating primarily at a strategic level.We can no longer successfully executeoperations as a set of independent cam-paigns. The shift to MDC2 enables inte-grated objectives, capabilities, timing,

and planning from the strategicthrough operational levels; it continueson down to tactical employment, andfosters cross-coordination during execu-tion. We need to rethink command re-lationships to promote agility across do-mains during planning and execution.

SATCOM quality. Red area on belt reachable by jammer; green is clear.

Cyber C2 Mission Manager

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Security & Communications

Any given domain may provide en-abling functions in support of anotherdomain, or deliver effects designed tochannel the enemy towards a domainwhere we can achieve desired effects.And the roles may reverse within min-utes or seconds.

Cyber brings new challenges in iden-tification and response to events. Be-fore responding to any attack we needto identify the source within seconds.We also must differentiate between stateand non-state actors, between attackson national assets and attacks on civil-ians/businesses. The cross-talk betweendomains must be fluid and constant.Intelligence sources cannot be binnedby domain, agency or time, but rathermust be constantly blended so that de-cision-makers in all domains share tem-porally relative situational awareness.Every level of decision-maker, fromcommanders to critical planners, con-stantly need current situational aware-ness of plans, operational execution,and observed opponent activity occur-ring simultaneously in all domains.Today’s operations demand actions andresponses far more quickly, and cannotwait for traditional interactions, such asphone calls and emails, to adjust.MDC2 capabilities must be an integralpart of the C2 (command and control)tools of the future. It is no longer sim-ply a method of coordination, but a ne-cessity to rapidly assemble the situa-tional awareness necessary to identifyand implement the best option toachieve a timely effect.

MDC2 for effects that are plannedwell in advance is currently performedon disparate systems, predominantlyair-gapped with little integration andunderstanding between domains. Ourmilitary expends excessive manpowerperforming manual coordination anddata exchange, completely dependenton liaison personnel at almost every or-ganization. This inefficient processmostly works for one-off strikes, whereevents are pre-planned and there arelimited competing operations drawingon resources. But in the advent of mul-tiple simultaneous operations or openconflict (even in its smallest form) withunpredictability and the need to rapidlyreact, this approach quickly falters.

The speed of operations differs signif-icantly by domain. On the upper end,maneuvers in space can be extremelyexpensive in both time and limited re-sources. At the other end, cyber effectscan happen at millisecond scales, atnearly zero marginal cost. Traditionalwarfighting domains lie in-between, butare under constant demand for in-creased speed. When various domainsolutions offer equal success, timing be-comes a deciding factor. The ability todictate tempo by implementing fasterthan an opponent can react remains aprimal key, and is even more critical inan era of diminishing operational re-sources.

The rise of social media and cyber ca-pabilities have greatly empoweredenemy forces. We can no longer de-pend on overwhelming force and finan-cial dominance to defeat hostiles.Many of our opponents are also unen-cumbered by the bureaucratic acquisi-tion or testing cycles currently drivingmany US programs. Our adversaries re-alize that the ability to locate a weak-ness, exploit the environment, commu-nicate on social media, and quicklyexecute, greatly enhances their chancesof success. They understand that therisk of operating outside of cumbersome

acquire/test/develop cycles is worth thespeed of execution. Our luxury ofwielding an overwhelming militaryforce has long hidden our inefficiencies.We take years to build requirements upto extremely detailed specifications,years choosing a contractor, years in de-velopment, then further years in inte-gration, test, and certification cycles –before we even begin deployment.

The defense industry is often blamedfor being slow and cumbersome. We arerightly criticized for hiring behemoth de-fense contractors who are great at the

Polaris Alpha provides integrated solutions across multiple C2 domains.

SAC2Core Solutions are flexible across allwarfighting domains.

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decades-long processes of building ships,tanks and aircraft, but who are poorlypostured to apply the agility, speed, andtalent necessary to produce modern soft-ware. The outcomes of today’s and to-morrow’s conflicts will leverage the abil-ities of our military hardware, but will

completely rely on the speed and capa-bility of the software and communica-tions required to C2 these assets. Thishas produced a current trend to look to-wards Silicon Valley for overnight solu-tions. At the same time, there is littlerecognition that government imposed

acquisition processes discourage innova-tion and slow the software process. In ad-dition to prolonged acquisition cycles,the government highly desires to ownthe resulting products and source code,and pay low fees – the exact opposite ofa typical Silicon Valley business model.Further, such stopgap measures can re-sult in unique solutions that only solvean immediate problem and may notscale to a larger conflict nor satisfy thebroader user community, impactingstandardization and creating additionalcosts in the form of interoperability andtraining challenges.

Technological solutions for manyMDC2 problems exist today, but con-tinue to be hampered by both organiza-tional and acquisition mindsets. Em-bracing best-of-breed solutions now,coupled with an open-architecture con-cept will allow us to grow and meet theMDC2 needs of the emerging battle-space instead of starting over with along acquisition process, and an acceler-ating list of requirements.

C2Core is an operational technologysuite that enables MDC2 across multiplewarfighting domains, within a commontechnology baseline. It provides enter-prise-level capabilities that allow eachdomain to remain in separate databasemodels, or be combined into a single, in-tegrated, temporal database. This allowsC2Core instances to be spread across dis-parate domains, with each node able tocommunicate with other nodes, or oper-ate where all parts of the MDC2 effort areco-located. C2Core provides both thickand thin client implementations, with2D, 3D, and 4D visualization capabili-ties. For both inter-node and externalsystems communications, it provides en-terprise web services supporting bothREST and SOAP connections, and pro-vides standard interfaces in XML,ATO/ACO/OPTASK LINK USMTF for-mats, CTO, AO COI, Joint METOC Bro-ker Language, and many others.

With a robust C2, domain-agnosticcore, C2Core is easily adaptable to in-clude many new emerging domains andoperations. C2Core is actively used fordaily operations in both kinetic andcyber mission planning domains, inboth theater-level and global opera-tions, and by US and allied militaries.



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Aerospace & Defense Technology, February 2018 9Free Info at http://info.hotims.com/69503-834


We need to begin encouraging flexible software designs thatcan be applied to multiple problems and domains. Over-spec-ification of requirements for a singular problem results in so-lutions that cannot be re-purposed in other domains. Com-pounding this is the fact that current testing procedures oftenflag additional capabilities as extraneous and count againstthe system instead of embracing the enhancement. The abil-ity to reuse and repurpose software and architecture should bea driving factor in investment decisions.

Rapid prototyping and experimentation is not new, althoughthe “idea” seems to occasionally reemerge under different la-bels. In the early 2000s, the USAF operated Battlelabs, charteredto work with end users to find near-term solutions to technicalproblems. They were later defunded, despite several dramaticsuccesses. “JEFX” experiments yielded large-scale successes dur-ing that timeframe and were utilized to try out new technolo-gies and processes. Capability providers made changes duringthe events to meet emerging requirements, and in effect exe-cute today’s agile DevOps concepts. Processes have since lockeddown rapid software modifications such that DevOps is nearlyimpossible. We need to return to an experimentation, ordemonstration focus, and support rapid development at largescale, bringing developers and operational users together.

Just as we need iterative development processes to becomethe norm, combat planning needs to evolve into a more itera-tive process, relying on and exploiting temporally accuratedata, rather than deliberate pre-planning that is frozen days orweeks in advance, and based on aging situational data. Emerg-ing machine intelligence capabilities have the promise ofgreatly facilitating human planners. This can let us think at ahigher level, easing the time consumption of mundane tasks.

We need to develop more advanced, resilient, and distrib-uted communications networks to allow MDC2 environmentsto share information smoothly. Our current tendency is tolock down every bit of communications, computers, and soft-ware, making it nearly impossible for fast, efficient, and trans-parent communications. Keeping up will require acceptingsome operational risk, or we will suffer from continued stove-piped actions between domains.

We need to break down cross-service and cross-domain polit-ical barriers. Each service has its own take on MDC2 in parallel,but diverting in purpose and impact. We must be willing to takeon more technical risk to keep up with required technologicalrevolution to merge domains. Our information assurance focusshould be at the infrastructure level — not every individual ap-plication. Automation should be imple mented to shorten thetime for accreditation — security must become agile as well.

Our enemies do not take years and years to evaluate all po-tential risks of a particular implementation. They’ve adoptedthe common commercial mindset long ago that technology isthrow-away. Solutions shouldn’t be in use for decades. Weneed smaller, lighter, faster solutions that can come and go asoperational needs evolve.

This article was written by Marcus Featherston, Executive VicePresident, Mission Solutions, for Polaris Alpha (Colorado Springs,CO). For more information, visit http://info.hotims.com/69503-500.

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LOOP THERMOSYPHONSGravity-Driven Two-Phase Cooling for the 21st Century

Two-phase cooling has been uti-lized in the electronics coolingindustry for many decades,with possibly the most well-

known adaptation being the heat pipe.Heat pipes are capillary-driven, two-phase devices that rely on the boilingand condensation of a working fluid totransfer heat significant distances withminimal temperature gradient. The flowof the working fluid inside of a heat pipeis facilitated by a capillary wick structurethat relies on surface tension to returnthe condensed liquid to the heat gener-ating components. Heat pipes havefound their way into a large number ofindustries and applications because oftheir high performance, high reliability,and low cost. Unfortunately, as the elec-tronics industry’s insatiable quest forsmaller, higher-powered devices soldierson, the discrete cooling power of theheat pipe approaches obsolescence.

Cue the heat pipe’s lesser-knowncousin; the loop thermosyphon (orthermosiphon). Loop thermosyphons(LTS) are gravity-driven, two-phase de-vices that operate in a similar mannerto a heat pipe in so far as a workingfluid is evaporated and condensed in aclosed loop to transfer heat over agiven distance. Some readers may bemore familiar with a traditionalthermo sy phon, shown in Figure 1a,where the liquid and vapor occupy asingle tube. Loop thermosyphons, asshown in Figure 1b (and as the namesuggests), operate in more of a loopfashion where the liquid and vaportravel more independently.

Contrary to the capillary pumping ofthe working fluid in a heat pipe, an LTSrelies on gravity head to circulate thefluid around the loop. This, of course,means that loop thermsyphons canonly operate in a vertical orientation,

but if this condition can be met, an LTScan offer a wide range of benefits thatmost other cooling systems cannot.This article will provide an overview ofhow an LTS operates, how system inte-

grators could incorporate a technologylike this to advance their products, andthe benefits of using an LTS over mostexisting cooling technologies; passiveor active.

Figure 2. Example of a loop thermosyphon for power electronics cooling applications.

Figure 1. Schematic representation of a (a) traditional thermosyphon and (b) loop thermosyphon.

a b

VaporCondensationZone

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EvaporationZone

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Thermal Management

Loop Thermosyphon OperationA typical LTS consists of an evapora-

tor, a condenser, and plumbing betweenthe two for the liquid and vapor totravel. The liquid return line (or down-comer) is connected to the evaporatorcavity to facilitate the flow of the work-ing fluid. In a similar fashion, the vaporline (or riser) is connected to the con-denser completing the loop. The systemis hermetically sealed and filled with aparticular inventory of working fluid.Working fluids are typically dielectricrefrigerants with high liquid-to-vapordensity ratios and high latent heat. Thereason for selecting fluids with theseproperties is because flow in the loop isdriven by the density difference be-tween the downcomer and riser. Largerdifferences between liquid and vaporstates results in a larger driving forceand more fluid flow rate.

Heat is applied to the loop throughthe evaporator. The evaporator couldtake on any number of forms to coolthe system in question. The most com-mon configuration for the evaporator isa traditional-looking liquid cold plate inwhich heat generating components aremounted and the heat is conductedinto the system. An example of such aconfiguration is shown in Figure 2 for atraditional power electronics coolingapplication. The functionality of an LTSis mostly agnostic to the form of theevaporator, so many variations of anevaporator are possible. Some of theseconfigurations are discussed in more de-tail in the following section.

In the “off state” the loop sits idlewith an equal height of liquid fillingthe downcomer (h2) and evaporatorcavity (h1). As heat is applied to theevaporator region of the loop, vaporbubbles are generated in the flow asthe latent heat of the working fluidabsorbs the applied energy. Thesebubbles (or voids) serve to reduce theeffective density of the liquid columninside of the evaporator resulting in anet pressure head difference betweenthe downcomer and the evaporator.As more heat is applied to the system,more of the liquid in the evaporator isconverted into vapor further reducingthe effective density and driving morefluid flow. The maximum amount of

fluid flow, and corresponding powerinput, is determined by the availableheight difference between the evapo-rator and condenser (h2 – h1).

It is useful to define a term, voidratio, to refer to the ratio of void spacein the evaporator to the volume stilloccupied by liquid. As more heat isapplied to the LTS, the void ratio ap-proaches 1 (or 100%). At this pointthe maximum height gradient be-tween the condenser and evaporatoris achieved because there is no moreliquid head inside of the evaporator(i.e. h1 = 0). As shown in Figure 3, thispoint near maximum void fraction isnot necessarily a point of dryout (ormaximum vapor quality) like wouldbe seen in other two-phase systems.Since void fraction is a density-driventerm, fluids with low vapor densitiesand relatively high latent heat willreach a state near maximum voidingbefore all of the latent heat is con-sumed (i.e. quality = 1).

In practical terms what this meansis that an LTS will always operate inan excess liquid flow regime. Asshown in Figure 3, the flow ratearound the loop could approach itsmaximum level at a vapor quality ofaround 0.5. In contrast, heat pipes op-erate in a binary boiling and conden-sation process where the evaporatorsends 100% quality vapor to the con-denser and only saturated liquid (i.e.quality = 0) is returned to the evapora-tor. In this case the maximum powerthat a heat pipe can carry is directlyproportional to the latent heat of theworking fluid. Since excess liquid isvirtually guaranteed in an LTS, themaximum power handling capability

can far exceed that of a heat pipe pro-vided that sufficient vertical height isavailable.

LTS IntegrationLoop thermosyphons have actually

been in use for many decades in in-dustries like automotive engine cool-ing (circa 1935), chemical processingplants, and even nuclear reactors.Evaporator and condenser geometrycombinations are near infinite, butthe most typical configuration utilizesa liquid cold plate evaporator and atube-fin condenser like the one shownin Figure 4. Some other potential im-plementations could involve a two-circuit liquid heat exchanger for cool-ing a liquid loop or a liquid-to-airheat exchanger for cooling airstreams. Similarly, the condenser ofan LTS could be any type of heat ex-changer that allows heat to be re-moved from the system. This flexibil-ity in evaporator and condenserdesign is one of the major benefits ofutilizing LTS technology.

For more demanding applications,surface area enhancement features, likefins, are possible on the inside of theevaporator to increase the maximumheat flux capability. Traditional passivecooling techniques, like heat pipes, arelimited to heat fluxes of less than 50W/cm2. With an internal fin structurein an LTS evaporator and sufficientheight for fluid flow, heat fluxes greaterthan 100 W/cm2 have been demon-strated. That makes LTS technology oneof the highest heat flux capable passivecooling solutions currently available.

Another benefit of utilizing LTStechnology takes advantage of the

Figure 3. (left) Void fraction can be highly non-linear with increasing power while quality remains mostlylinear. (right) Flow rate in the system is mostly tied to void fraction and behaves similarly with respect toincreasing power.

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two-phase nature of the workingfluid inside of the loop. The phasechange process from liquid tovapor occurs along a line of con-stant temperature. Therefore, anLTS is capable of maintaining nu-merous heat sources mounted onthe same evaporator at around thesame temperature. This phenome-non is only possible in a two-phasesystem, whether it is active or pas-sive. A pumped single-phase liquidloop would require a substantialamount of fluid flow in order toachieve the same effect which re-sults in higher energy consump-tion, higher pump noise, and in-creased reliability concerns.

ConclusionLoop thermosyphons offer a wide

range of benefits to system designersincluding passive operation, highheat flux capability, isothermality,

and low cost. As long as a verticaloperating orientation can beachieved, an LTS is an optimal cool-ing solution for a wide range of ap-plications. Increasing componentpowers and shrinking system sizeswill continue to demand the highestof performance from cooling solu-tions, and system designers will notrelent in their pursuit of the lowestcost and most reliable solution thatmeets their system needs. Thermalmanagement no longer has to be aleash on our technological advance-ments. The opportunity to expandour system capabilities is out there,and loop thermosyphons provide aviable solution.

This article was written by Devin Pel-licone, Lead Engineer Custom Products,Advanced Cooling Technologies, Inc.(Lancaster, PA). For more information,visit http://info.hotims.com/69503-501.


Thermal Management

Figure 4. Example of a liquid cold plate evaporator and tube-fin condenser LTS.

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CompactPCI Serial SpaceA New Embedded System Specification

Takes on Extreme Environments

There are a few open specifications in the embedded industry that have been used in the ex-treme environments of space over the years. These include VME, CompactPCI, OpenVPX, andMicroTCA. But, prime contractors such as Airbus and others desired a high performance andversatile architecture that was relatively simple and cost-effective. The CompactPCI Serial

Space specification was ratified in 2017 to address these requirements, resulting in a compelling archi-tecture for defense and space-based projects.

A Brief HistoryVITA and PICMG have developed excellent specifications to address the needs of extreme environ-

ments. But, CompactPCI and VME are bus-based standards that do not provide the performance andinherent reliability of switched fabrics. OpenVPX and MicroTCA are both excellent, high bandwidth, andlow SWaP (Size, Weight Power) standards. But, CompactPCI Serial — the basis for CompactPCI SerialSpace (also referred as cPCI Serial Space) — is less complex and has a low-cost design approach. Com-pactPCI Serial, which was ratified in 2015, is similar to legacy CompactPCI in that it leverages the 3Uand 6U Eurocard form factor with 160mm deep cards. But it uses new, rugged high speed Airmax VSconnectors. The power is based on 12V (with an option of 5V standby), providing simplicity and cost-effectiveness. Having one main power rail is much simpler to specify the right power supplies and cansignificantly reduce the costs. The CompactPCI Serial power rails can be either a single plane, or everyboard could be supplied and controlled individually. Utilizing PCIe (current solutions are up to Gen3)or Gigabit Ethernet (current solutions are up to 10GbE with 40GbE-capable implementations), the ag-gregate data rates parallel other high-performance standards.

It is a significant benefit to potential users that CompactPCI Serial already has several design provi-sions for rugged environments. The specification started out in railway applications, having to surviveshock vibration, moisture & dust ingress, etc. The transition to CompactPCI Serial Space did not re-

quire signification adjustments. See Figure 1 for an example of a con-duction-cooled CompactPCI Serial switch card that meets -40° to +85°

temperature environments as well as MIL levels of shock/vibration.

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Aerospace & Defense Technology, February 2018 www.aerodefensetech.com 15

Avionics/Electronics

Ready for SpaceThere were important implementa-

tions for CompactPCI Serial to meetspace-level ruggedization. These include:

1) Redundancy: A key element forspace applications is redundancy.Downtime is extremely costly and hard-ware maintenance is impossible. Hav-ing a Dual Star architecture for both thedata traffic and Spacewire was impor-tant. Spacewire is a rugged variant ofFirewire for space applications. It canbe used to connect multiple enclosuresin the system, providing a serial point-to-point connection.

2) Control & Monitoring: This is acritical requirement for satellites, posi-tioning, and other space systems. So,each slot of CompactPCI Serial Space al-lows the use of several dedicated moni-toring and control signals.

3) RAD-Hard & Rugged: Naturally, thespecification required the rugged imple-mentation of CompactPCI Serial anddefines the levels for meeting compli-ance. Radiation is a problem for allstandard CMOS devices, so ensuring thesystem is RAD-hard is paramount. Sig-nificant testing was required.

4) Outgassing: Outgassing is a potentialissue for plastic components as they cancondense onto optical elements, thermalradiators, or solar cells and obscure them.NASA has a list of low-outgassing materi-als for use in spacecraft. The issue requirescareful selection and testing.

5) Testing & Screening: As men-tioned above, testing and screening ofcomponents was critical in the specifi-

cation development process. ThePICMG members working on the spec-ification needed to be certain that itcould meet shock, vibration, radia-tion, outgassing, extreme tempera-tures of -40°C to +85°C, dust and mois-ture ingress, EMI, etc.

The cPCI Serial Space specificationdefines a utility connector, which canbe controlled and configured via anopen management bus. It takes overthe hot-plug functionality from Com-pactPCI Serial. Of course, hot-swapfunctionality is not required in a satel-lite in space. But, it can actually be anattractive feature on ground-basedsystems and for

test/simulation systems. System moni-toring/man agement is supported viathe CAN (I2C bus is also optional forless critical applications).

ApplicationsWith wide use in railway and other

rugged applications, ruggedized Com-pactPCI Serial is common. The wedgelock clamshells for conduction-coolingprovide further stability, and the mod-ules meet MIL specs such as MIL-STD810 and 901D for shock and vibrationlevels. CompactPCI Serial has alreadybeen used in defense applications, in-cluding a fully DO-168G qualifiedrugged natural convection ARINC600ATR for an airborne network server.

With cPCI Serial Space’s additionalcontrolling and monitoring capabili-ties, there is an even stronger solutionfor failure detection, isolation, and re-covery (FDIR). Another application forCompactPCI Serial in defense applica-tions is a conduction-cooled ATR with a3U backplane and a supplementary in-ternal fan for additional cooling for adata recorder in a military vehicle. Thearchitecture was also recently chosenon a major naval program as an up-grade from a previous CompactPCI de-sign. There are certainly benefits fromleveraging CompactPCI boards for thenewer serial solutions. The types ofMil/Aero applications for CompactPCISerial and cPCI Serial Space include(but are not limited to):

Figure 1. CompactPCI Serial has long been ruggedi-zed for extreme environments. This SBC example(courtesy of MEN Micro) shows an example of a 3Uversion in a conduction-cooled clamshell.

Figure 2. There are a variety of advanced processors being developed in CompactPCI Serial/cPCI

Serial Space, including this SPARC-based Leon4 quad core board (courtesy of Airbus)(right) and P4080 board (courtesy of Fraunhofer FOKUS)(left).

SPARC/Leon is a preferred platform computer used by the European Space Agency.

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• Simulators (for satellite environment,military systems)

• Test equipment (for satellites, militarysystems)

• Satellite platform control (altitudeand orbit control)

• Satellite payload/instrument control

• Mass memory (satellite, military datarecorders)

• Networking/communications (satel-lite & ground station, military)

• RADAR & SONAR systems• Electronic warfare & signal intelli-

gence systems

• C4ISR & situational awareness sys-temsThe space industry faces some great

challenges as there is a clear trend formega constellations, such as OneWeb(900 satellites providing internet serviceworldwide). Industrialization hasreached the space craft manufacturersand therefore, the opportunity is hugefor future programs. As these highlyrugged systems are developed, theecosystem will undoubtedly continueto expand. So, Mil/Aero engineers willhave a wealth of high-performance cPCISerial modules to choose from in an ar-chitecture that is comparatively lowcost and easy-to-use. Figure 2 showscPCI Serial Space CPU modules (with-out clamshells). On the right is a Leon4quad-core processor and on the left is aNXP P4080 QorIQ chipset version thatprovides the processing power for on-board payload data processing. Bothboards have undergone the radiation,thermal, shock/vibration, EMC, andfunctional tests for space applications.

What is Next? Most Military embedded computing

applications require a proven, reliable,scalable architecture with low SWaP,high-performance options, a simpleand easy design that is ruggedizable.With the wealth of ruggedized Com-pactPCI Serial products, there appearsto be increasing interest for the archi-tecture in Mil/Aero projects. For spacerequirements, additional testing is re-quired for radiation, outgassing,shock/vibration, etc. The cPCI SerialSpace architecture has performed thesetests, providing a space hardened im-plementation. There are a significantnumber of processors, switches, I/Ocards, carriers, storage, and graphicsmodules in the CompactPCI Serial ar-chitecture. As more FPGA and digitizercards are created over time, the indus-try may see an even larger push in de-fense applications.

This article was written by Justin Moll,Vice President of Marketing PICMG(Wakefield, MA) and Hans Juergen Herpel,Expert on Advanced Avionics Software,Airbus Defence and Space GmbH(Toulouse, France). For more information,visit http://info.hotims.com/69503-502.


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Plain Bearings for AerospaceApplications

Plain bearings are used across awide range of aerospace appli-cations to help achieve betterfuel efficiency, extend main-

tenance intervals, and lower carbonemissions. These applications includeinstallation in aircraft wing systems(flaps, spoilers, and slats), flight con-trols, cockpit controls, auxiliary powerunits, landing gear, door systems, andaircraft interiors (seats, bins, latches,and hinge points). “Our plain bearingseven have a footprint on Mars,” saidBrett Ricci, GGB Aerospace Strategic Ac-count Manager for North America. “Op-erating in temperatures between -200°Cto +280°C, our plain bearings haveserved as the primary suspension com-ponents in the robotic drilling arm ofNASA’s Curiosity Mars Rover since2012.”

Just as impressively, all of these appli-cations are served by just two types ofplain bearings: metal-polymer and fiberreinforced composite (FRC).

Metal-Polymer Plain BearingsMetal-polymer bearings consist of an

outer metal backing with a porousbronze inner structure that is coatedwith a polymer-resin lining. Each partof this structure contributes to the over-all characteristics of these bearings: thepolymer liner provides lubricating prop-erties with low friction and wear; thebronze inner structure provides themechanism to contain the polymerliner while also transferring load andheat; and the metal backing providesmechanical strength. Metal-polymerbearings are made in two varieties: self-lubricating and pre-lubricated.

Self-lubricating bearings have asmooth, PTFE-based liner that is trans-ferred to the mating surface during op-eration, forming a lubricant film. Thisresults in very good wear and low fric-tion performance over a wide range ofloads, speeds, and temperatures in dryrunning conditions. Pre-lubricated bear-ings utilize different materials for this

liner and include circular indents thatare filled with grease before operation.

“Self-lubricating metal polymer bear-ings are GGB’s most popular productswith the aerospace industry—particu-larly the DU-B,” says Kim Evans, one ofGGBs aerospace application engineers.“I’d say it’s the industry standard for air-craft landing gear struts.”

Fiber-Reinforced Composite (FRC)Bearings

FRC bearings consist of a self-lubricat-ing liner backed by continuously

wound high-strength fiberglass. To en-sure they fit a variety of applications,FRC bearings use two different forms ofliners: fiber and tape. A fiber liner offershigh abrasion resistance and improvedability to handle shocks and misalign-ment. Due to a greater PTFE content, atape liner additionally offers higherspeed capability and improved machin-ability. Regardless of the liner, all FRC

GGB's DU-B bearing

Metal-polymer bearing material structure

Fiber reinforced composite bearing materialsstructure

GGB's HPMB® fiber reinforced composite bearing

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Aerospace Manufacturing

bearings are self-lubricating through theuse of dry lubricants. This method of lu-brication results in a low coefficient offriction, low wear rates, and extendedmaintenance intervals, as re-lubricationis unnecessary. In addition, FRC bear-ings are able to operate in a wide rangeof temperatures and are also resistant toacids, bases, salt solutions, oils, fuels, al-cohols, solvents, and gases.

FRC bearings can have the self-lubricat-ing liner on the inner or outer diameterand can contain flanges or grooves withor without a liner as well. FRC washers,plates, and other custom forms are alsoavailable to serve different applications.“The versatility and specifications ofthese FRC products make them an excel-lent choice for most heavy load, lowspeed, oscillating applications,” says YuriKlepach, GGB’s FRC Product Manager.

Plain Bearing Manufacturing Metal-polymer bearings are produced

using a series of technologies that com-bine the steel or bronze metal backing,bronze powder, and polymer liner. Tostart, a coil of backing metal is fedthrough a machine that applies bronzepowder to one side through the use ofheat—a process known as “sintering.”The sintered strip is then cooled andready for impregnation. Impregnationis the application of a polymer lineronto the sintered strip and can be donewith the polymer in either mush or tapeform. According to Evans, “For GGB’sself-lubricated bearings, a mechanicalarm drops the polymer onto the sin-tered strip, which is then rolled outthrough downstream machines to cre-ate a smooth self-lubricating liner. GGBpre-lubricated bearing liners are madewith a polymer tape that is applied di-rectly onto the sintered strip.”

The impregnation process for bothforms of polymer includes a series ofmill-rolling, heating, and cooling op-erations in order to create a smooth-surfaced metal-polymer strip. After im-pregnation, the strip is finished andcoiled for later shaping into bearingproducts. As Evans explains, “Thisshaping process utilizes roll-formingor pressing, depending on the bearingsize, to create a smooth, cylindrical-shaped product.”

FRC bearings are manufacturedthrough a winding process that utilizesautomated winding machines. For bear-ings with the liner on the inside diame-ter, the liner material must first be ap-plied to the length of a mandrel. Forwound liner products, this is done by awinding machine that is continuouslyfed strings of high-strength fibers en-capsulated in an internally lubricatedepoxy resin. For tape liner products, aPTFE tape is applied on a mandrel. Afterthis base liner is applied, the fiberglassbacking is wound around the mandrelthrough the use of automated windingmachines. Once this backing reachesthe required thickness, the mandrel isremoved and later cured in an oven.This process hardens the windingaround the mandrel into a solid tube. Atthis point, the inside diameter issmooth and finished while the outsidediameter is rough and oversized. Inorder to finish the outside diameter, it isground down to its desired final size.The tube is then cut to produce multi-ple finished bearings whose edges aredeburred as needed. “The length and di-ameter of the mandrels used in thisprocess can vary,” Klepach says, “toachieve different dimensions based oncustomer need.”

The Trend Toward Self-LubricatingBearings

As mentioned previously, manyplain bearing models are used in aero-space applications—most of them self-lubricating. Self-lubricating bearingsutilize a pre-applied dry lubricant, usu-ally PTFE, in place of traditional liquidlubricants. Dry lubricants do not re-quire reapplication and thus entail lessmaintenance than traditional bearings.This makes them extremely effective inapplications where re-lubricationmaintenance would prove difficult.Dry lubricants are also able to operatein conditions where fluid lubricantsare ineffective, such as environmentssusceptible to corrosive gases, dirt, anddust; high temperatures; cryogenictemperatures; radiation; extreme pres-sures; or vacuums—all of which arehazards found in the aerospace indus-try. Due to these benefits, it is no sur-prise self-lubricating bearings are beingused over traditional metal bearingsboth here on Earth and beyond in thefollowing applications:

In aircraft landing gear struts, orshock absorbers, where they eliminateladder cracking and heat damage on thestrut rod surface. GGB’s DU-B bronze-backed metal-polymer bearings werechosen by one of the world’s leadingcommercial aircraft manufacturers to beused in all current production of theirlanding struts due to their high load ca-pabilities, resistance to corrosion, andincreased component life.

In aircraft ground support, whichrequires reliable equipment to ensureflights leave safely and on time. Ac-cording to Klepach, “GGB’s HSG[High-Strength GAR-MAX®] FRC bear-ings are found in scissor-lift-type ap-plications, which handle significantloads during intermittent operations,often while being exposed to harshenvironmental conditions.” This typeof bearing offers ultimate compressivestrength up to 620 MPa (90,000 PSI)and more consistent friction thangreased bronze bearings—with theadded benefit of being both abrasionand corrosion resistant. This helps ex-tend maintenance intervals and im-prove the efficiency of aircraft groundsupport services.

The filament winding process for fiber reinforcedbearing manufacture.

GGB metal-polymer bearings on the production line

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In NASA’s Curiosity Rover, the largest and most successfulMars Rover to date. As Ricci says, “Curiosity’s arm-drill re-quired bearings that could withstand the harsh Martian tem-peratures—ranging between -153°C and 20°C—and atmos-phere. DU® bearings were chosen due to their high wearresistance, ability to operate comfortably in the temperaturesof Mars, and resilience towards dust and debris.” The opera-tion of this arm-drill was critical to the discovery that Marsonce had conditions suitable for microbial life.

GGB has also worked with Airbus, Airbus Helicopters, Boe-ing, Lockheed Martin, private spaceflight companies, the mil-itary, and other private aircraft manufacturers to create cus-tom solutions for their plain bearing needs.

Plain bearing solutions provide the aerospace industrywith weight and space reduction, enhanced energy effi-ciency, improved strength and safety, and increased operat-ing temperatures for its ground, air, and outer-space appli-cations.

This article was written by GGB Bearing Technology (Thorofare,NJ). For more information, visit http://info.hotims.com/69503-503.

Aerospace & Defense Technology, February 2018 21

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Metal polymer bearings on the manufacturing line, after visual inspection.

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RF & Microwave Technology

Additive Manufacturing Materials forRF Components

The Army Aviation and MissileResearch, Development, andEngineering Center (AM-RDEC) Weapons Development

and Integration (WDI) Directorate has aprogram known as PRIntable Materialswith Embedded Electronics (PRIME2).PRIME2 will integrate RF and electron-ics into additive manufacturing pro -cesses to reduce size, weight, and overallcost of these components and subsys-tems. This program will advance thestate of the art in printable electronics,and deliver a materials database, processdevelopment, modeling, and simula-tion of 3D-printed objects with embed-ded conductive elements, passive proto-types, and RF prototypes. PRIME2 willcreate a new fabrication capability (ap-plied to electronics and RF technologyareas), weight reduction, higher reliabil-ity, and on-demand (local and immedi-ate) spare components in the field.

Additive ManufacturingAdditive manufacturing is a rapidly

maturing process by which digital 3Ddesign data are used to build up compo-nents in layers by depositing materials,or through the melting and sintering of(powdered) materials to create solidstructures. These materials can be con-ductive (metal) or nonconductive (poly-mer), and have complex material prop-erties that are dependent on printparameters.

Recently, additive manufacturing hasquickly gained adoption and accept-ance as a valuable manufacturing tech-nology. There are many different typesof printers, including fused filamentdeposition (FFD), stereolithography(SLA), and laser sintering. The NationalAeronautics and Space Administration(NASA) has a FFD machine on the Inter-national Space Station (ISS).

Additive manufacturing, known as3D printing, is rapidly developing tomeet the needs of a wide range ofcommercial and military applications.3D printing is typically used in proto-

type development to reduce costs anddevelopment time compared to tradi-tional manufacturing. For example,3D printing enables concept-to-proto-type in less than a day at $5 to $8 percubic inch of material, and it has beenused to fabricate prototypes, tooling,fixtures, and forms to test design fit.3D printing allows free complexityand integration of parts that are toocostly or even impossible for tradi-tional manufacturing. In some cases,printing requires no tool adjustmentsto fabricate hollow and buried struc-tures; therefore, interconnects andconnectors are simply printed wherethey are needed within the volume.This design freedom is particularly rel-evant to RF antennas where directivityand efficiency are currently limited bymanufacturing constraints and lossesin conductive feeds.

Additive manufacturing brings a newcapability that can be explored acrossall technology areas for benefits anduse. The benefits can be many and var-ied, resulting in components that arenot achievable utilizing traditional sub-tractive machining methods, lower-weight components, low cost, local andimmediate prototyping, and compo-nent creation.

Traditionally, electronic componentsand RF components are assembledpiecemeal and are not part of the addi-tive manufacturing process. PRIME2 isdeveloping enabling technologies to

print an entire printed wiring boardwith embedded passive componentsand integrated RF structures in one step.

Materials A variety of materials are available for

additive manufacturing. These includeboth conductors and dielectrics; how-ever, many of these materials compro-mise mechanical or electrical perform-ance to enable ease of manufacture. Inaddition, many of these materials oftenrequire incompatible post-processing,such as thermal cures that can disruptunderlying structural elements. Thecharacterizations of FFD (also known asFused Deposition Modeling (FDM)),SLA, inkjet deposition, and microdis-pensable dielectric materials are pre-sented here, along with the characteri-zations of FDM, inkjet deposition, andmicrodispensable conductive materials.

More than 35 dielectric materials suit-able for FDM, SLA, and inkjet were eval-uated in an effort to demonstrate a ma-terial set that had sufficient processcompatibility to be co-fabricated thatyielded electronic structures embeddedwithin structural elements, yet also pos-sessed sufficient performance to enablehigh-frequency RF use.

For dielectrics, relative permittivityand loss tangent are critical for imple-menting RF systems. In general, mostadditively manufacturable materials arepolymeric, with a dielectric constantthat falls within the range of 2 to 6;however, some unique materials areavailable. In particular, composite mate-rials incorporating metals and ceramicsprovide enhanced dielectric constantsthat may be useful in RF design. Somepolymer matrix composites can yieldlow levels of conductivity. These levelsare not sufficient for quality RF compo-nents, but could be useful for direct cur-rent (DC) signals.

The selected conductive materials fo-cused on inkjet and microdispense tech-nologies. These materials demonstrateda wide range of conductivities. Organic

Figure 1. Structures printed using PLA.

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conductors were at the low end of therange, and were not suitable for RF ap-plications. Conductive epoxies have de-sirable features of room-temperaturecuring. This makes them more readilycompatible with other additive manu-factured substrates, but their conductiv-ities were an order of magnitude belowthe nanoparticle inks that are used inaerosol and inkjet techniques. Thenanoparticle inks exhibit no better than50% of the conductivity of solid metalconductors such as electroplated cop-per. In addition, they require elevatedtemperatures to sinter the nanoparticlesinto a conductive sheet. These elevatedtemperatures can cause incompatibilitywith certain additively manufactureddielectric materials.

Based on the collected data, a subsetof materials was further investigated forco-fabrication and realization of RFstructures. Considerations during theselection process included material per-

formance, material compatibility, avail-ability and capability of additive manu-facturing tools, and the desired RF com-ponent and designs.

Fused Filament DepositionTechnology

Fused filament deposition (FFD) uses acontinuous filament of a thermoplastic

material fed from a spool through a mov-ing, heated, printer extruder head.Molten material is forced out of the print-head’s nozzle, and is deposited on thegrowing workpiece to form a 3D object.

PLA is a biodegradable thermoplasticpolyester. It is a commonly manufac-tured from renewable resources such ascornstarch, tapioca roots, and sugar-cane. PLA is harder than ABS plastic, hasa lower melting temperature (180-220°C), and a glass transition temperaturebetween 60 and 65 °C. It is dimension-ally stable, and can be printed with orwithout a heated build plate. It adhereseasily to borosilicate glass, Lexan, poly-carbonate sheets, blue painters’ tape,polyimide (Kapton) tape, and so forth.PLA may be treated with a wide range ofpost-processing techniques (Figure 1).PLA prints may have slight dimensionalvariations compared to other materials.Color and brand have some small ef-fects on printing.



Figure 2. ABS polymer filaments.

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ABS is a common thermoplastic. It isless brittle (tougher) than PLA. With aglass transition temperature approxi-mately 105 °C, it requires a higher ex-truder temperature than PLA — 230 °C±15 degrees. ABS creates mild fumeswhen being extruded, and printersshould be operated in a well-ventilatedarea. ABS requires a heated build platethat is heated to approximately 110 °Cdue to its tendency to warp when print-ing larger prints. Figure 2 shows exam-ple polymer filaments.

The flexibility of the thermoplasticelastomer (TPE) filament makes it quiteresilient and sturdy for producing ob-jects with a Shore A hardness of approx-imately 75-85 A. This filament is easilyprinted in most printers capable ofprinting PLA or ABS plastics, although ithas a slightly higher melting tempera-ture (240 °C), and is ideal for multi-ma-terial applications requiring portions ofthe design to flex, such as shock absorp-

tion devices and hinges. Printing TPEbenefits from a build plate that isheated to approximately 60 °C and di-rect drive extruders.

Stronger than PLA and more durablethan ABS, nylon offers the benefit of amaterial robust enough for functional

parts. Nylon’s high melting temperatureand low friction coefficient present aversatile printing option that allowsflexibility.

ULTEM offers high thermal resis -tance, high strength and stiffness, andbroad chemical resistance. ULTEM isavailable in transparent and opaquecustom colors as well as glass-filledgrades. Plus, ULTEM copolymers areavailable for even higher heat, chemi-cal, and elasticity needs. ULTEM 1000(standard, unfilled PEI) has a high di-electric strength, inherent flame resis -tance, and extremely low smoke gener-ation. These high mechanical properties perform in continuous use to 340°F (170 °C), which makes it desirablefor many engineering applications.

With its unique mechanical, chemi-cal, and thermal properties, PEEK hasmany advantages over other poly-mers, and is able to replace industrialmaterials such as aluminum and steel.


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Figure 3. PEEK filament.

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It allows its users to reduce total weight and processing cy-cles, and increase durability. Compared to metals, the PEEKpolymer allows a greater freedom of design and improvedperformance. PEEK is used to fabricate items used in de-manding applications, including bearings, piston parts,pumps, high-performance liquid chromatography (HPLC)columns, compressor plate valves, and electrical cable insu-lation. It is one of the few plastics compatible with ultra-high vacuum applications. Figure 3 shows an example of aPEEK filament.

Stereolithography TechnologyWhile FFD technology provides a means to rapidly proto-

type objects, stereolithography (SLA) is often better suitedfor detail and high-speed production. Parts are constructedin a layer-by-layer fashion using photo-polymerization, aprocess by which ultraviolet (UV) light causes chains ofmolecules to link and form polymers that then make up a3D solid object. The production of these objects relies onmaterials that are currently available in many forms, in-cluding standard and engineering resins.• Standard Resins. The material selection for SLA is more lim-

ited than FFD, but general-purpose or standard resins havegrown to include a variety of colors in varying opacities.Standard resins provide high resolution for applications likevisual demonstrations and models.

• Engineering Resins. Matching the detail provided withstandard resins, engineering resins possess additionalstrength and functionality. The flexible resin variety sim-ulates an 80A durometer rubber, which is often chosen forimpact resistance and compression. The tough resin issimilar to a finished product formed from ABS plastic. Ap-plications that will undergo high stress and strain are fre-quently engineered with tough engineering resin, ensur-ing successful assembly, machining, snap-fits, and livinghinge supports. The ceramic resin is UV-curable, with ob-jects often glazed with commercially available coatingsafter firing.

ConclusionBased on initial work in the PRIME2 program, a subset

of materials was investigated for co-fabrication and real-ization of RF structures. Standard PLA, standard ABS,PEEK, and ULTEM were selected for further dielectric in-vestigation.

The existence of a suitable solvent for the dielectric ma-terial can be helpful in preparing printed substrate sur-faces for further additive manufacturing steps. In addition,the melt temperature of the material is important for post-processing steps that may be required when depositingcertain conductive materials.

This article was written by Janice C. Booth, Army ARDECWeapons Development and Integration Directorate, Redstone Arse-nal, AL; and Michael Whitley, Carl Rudd, and Michael Kranz ofEngeniusMicro, Huntsville, AL. For more information, visitwww.ardec.army.mil.

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NASA’s Small Spacecraft TechnologyProgram is on the countdown clock

to advance communications and prox-imity maneuvering capabilities forCubeSats with the Integrated SolarArray and Reflectarray Antenna (ISARA)mission.

The spacecraft is a 3U CubeSat carry-ing a Ka-band payload that includes alow-power transmitter, High Gain An-tenna (HGA), standard gain referenceantenna, and RF antenna select switch.A Ka-band ground station will verifyhigh data rate by signal-to-noise (SNR)measurement, and measure the antennaperformance. The HGA gain will bemeasured by switching between theHGA and an onboard standard gain an-tenna (SGA), while the spacecraft willbe slewed on orbit to measure the an-tenna patterns. The on-orbit data willbe compared to measurements thatwere taken prior to launch.

The technology benefit of theISARA mission is to enhance CubeSatswith a blend of antenna and solarcells, to allow for higher data-down-link communications. ISARA will useradio frequency Ka-band – the firsttime Ka-band uses a reflectarray an-tenna – that will surpass the existingbaseline CubeSat transmission rate of9.6 kilobits per second to more than100 megabits per second.

“We have a lot of mission firsts withISARA,” said Richard Hodges, principalinvestigator of the CubeSat mission atNASA’s Jet Propulsion Laboratory (JPL)in Pasadena, CA. As a devoted “antennaguy” with decades of experience, he seesa bright future for the integrated solararray and reflectarray antenna that wasperfected by JPL technologists.

“This is a flat antenna style, effectivelyreplacing an antenna such as the curvedsurface parabolic style. Thanks to a pho-tolithographic etching process, the re-flectarray is relatively inexpensive to

produce and they are lightweight. Fur-thermore, this type of antenna makesvery efficient use of CubeSat volume.And that means lots of added room forpayloads, such as science instruments orimaging systems,” Hodges observed.

To the best of his knowledge, ISARAwill be the first in-space demonstrationof a reflectarray antenna as well as thatof an integrated antenna and solararray. “As far as we know, no reflectar-ray has ever flown in space. It has beendiscussed over the years, but now we’regoing to demonstrate it does work inthe space environment,” said Hodges.

TechnologyA reflectarray is a relatively new type

of antenna fabricated from standardprinted circuit boards with an array ofsquare copper patches etched on them.The reflectarray antenna consists ofthree panels, electrically tied togetherthrough hinges, which have the circuitboard patches on them. The size of thepatches is adjusted so that the phase ofthe reflected feed illumination colli-mates the radiation in much the sameway a parabolic dish reflector would.Unlike a parabolic dish, however, the re-flectarray panels are flat, which enablesthem to be folded down against theCubeSat. On the opposite side of theprinted reflectarray antenna, solar cells

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NASA CubeSats: Pushing the Boundaries of Technology

ISARA’s three antenna panels feature a printed cir-cuit board pattern that narrowly focuses theCubeSat’s radio transmission beam in much thesame way as a parabolic dish reflector. (Nanoracks)

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have been added. This makes the over-all antenna/solar array panel assemblyslightly thicker, but the cells are stowedin the “dead space” between the launchrails that would have otherwise beenleft empty. This combination of an-tenna and solar cells makes for a very ef-ficient use of CubeSat volume, creatingmore room for payloads.

Once the three antenna panels are de-ployed, they narrowly focus the Cube-Sat’s radio transmission beam to a“sweet spot” in much the same way aparabolic dish reflector would, Hodgesexplained. “ISARA’s solar array and re-flectarray antenna is a very attractivepackage that enables high-speed datarates of more than 100 megabits per sec-ond. That’s our primary goal for thismission.”

Signals from the reflectarray antennaare to be transmitted to a ground stationlocated at NASA’s JPL. Experts there willreconstruct the antenna signal pattern,contrasting that pattern against pre-launch ground tests to appraise overallquality of ISARA’s downlink transmis-sion over months of mission duration.

OperationsAfter deployment, ISARA will deploy

its solar array/reflectarray antenna anduse the Attitude Determination andControl System (ADACS) to stabilize.The UHF system will be used to establishinitial communications with the satel-lite and perform on-orbit checkout pro-cedures. Once spacecraft health hasbeen established, on-orbit testing of theKa-band system can begin.

The Ka-band experiments will includethe determination of three elements: datarate capability, antenna gain, and an-tenna pattern. In order to verify the datarate capability, the received signal will be

measured and compared against the esti-mated receiver noise. Antenna gain willbe measured by transmitting a signal andswitching between the HGA and thestandard gain antenna. Characterizingthe antenna pattern involves a multi-passoperations procedure. Throughout theduration of a pass, the spacecraft will beheld to a commanded attitude. As theground observation angle changes duringthe pass, a cut of the antenna pattern isobtained. For subsequent passes, thespacecraft is commanded to new point-ing angles, resulting in a sweep of cutswhich allows for pattern reconstruction.The figure shows a notional depiction ofhow attitude would vary throughout anumber of passes, with the line-of-sightvector to the ground station in the down-ward direction.

The ISARA technology will be validatedin space during a five-month mission tomeasure key reflectarray antenna charac-teristics that include how much power

can actually be obtained over its field ofview. ISARA contains a transmitter andan avionics subsystem that features aGlobal Positioning System (GPS) receiverand a high-precision attitude control sys-tem designed to orient the CubeSat to en-able accurate antenna beam pointing.

At the end of the validation mission,the reflectarray antenna technology willbe available for use on other missionsthat need high-bandwidth telecommu-nications. The ISARA technology willenable CubeSats and other small satel-lites to serve as viable platforms for per-forming missions that were previouslyonly possible on larger and more costlysatellites. For a modest increase in mass,volume, and cost, the high data ratethis technology enables will pave theway for high-value science missions andformation flying missions that use dis-tributed CubeSats and small satellites.

Visit the ISARA mission page at www.jpl.nasa.gov/cubesat/missions/isara.php



ISARA spacecraft configuration with 3U CubeSat andsolar array with integrated reflectarray antenna.

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Application Briefs

Turret Aiming and StabilizationSystemCurtiss-Wright Defense Solutions DivisionAshburn, VA+1-703-779-7800www.curtisswrightds.com

Curtiss-Wright’s Defense Solutions division recently com-pleted significant enhancements to the production facili-

ties of its Defense Solutions’ Drive Technology business unit,located in Neuhausen am Rheinfall, Switzerland, to supportincreased demand for its Turret Drive Servo System (TDSS)technology. The innovative, upgradeable TDSS turret aimingand stabilization drive system uniquely delivers scalable func-

tionality and power adaptability to ground vehicle designersand turret manufacturers. Significant investments were madein the Drive Technology business unit’s production line, engi-neering, and development test tools. These include new test-ing equipment at the facility, such as state-of-the-art auto-mated test benches and upgrades to the plant’s coating line.

The Drive Technology business, which primarily supportsthe military ground vehicle market with system level solu-tions for Turret and Weapon System Motion Control, TDSS,Ammunition Handling Systems, Missile Launcher MotionControl, and Remote Weapon Station Components, is cur-rently producing and delivering TDSS solutions for four majorand several smaller programs around the globe.

TDSS Aiming and Stabilization Drive System componentsinclude Rotary Gear Drives, Linear Gear Drives, Motor Con-

Unmanned Aircraft TrainingMaterialsBohemia Interactive Simulations (BISim)Orlando, FL+1 407-608-7000https://bisimulations.com

The U.S. Air Force Academy has selected VBS3 and VBSFires FST products from Bohemia Interactive Simula-

tions and SimCentric Technologies for use in the Acad-emy’s Military Strategic Studies course.

VBS3, developed by Bohemia Interactive Simulations, is afull-featured virtual environment appli-cation, complete with scenario editors,after-action review, a massive contentlibrary, developer tools, an easy-to-useinteroperability gateway, and a voicecommunications system. It is arguablythe standard in game-based desktopsimulation for tactical training andmission rehearsal, and is by far themost widely used game-based simula-tion software among militaries today.

Prior to using VBS3, the U.S. Air ForceAcademy primarily relied on live train-ing to introduce cadets to remotely pi-loted aircraft operations, using the RQ-11 Raven, a lightweight, hand-launchedunmanned aerial system commonlyused for low-altitude surveillance andreconnaissance intelligence.

Michael “Ski” Golembesky, the instructor for the USAFARPA Program who incorporated VBS3 into the curriculum,designed a series of scaffolded training scenarios usingVBS3 that require cadets to conduct basic tasks such astracking an individual using the virtual UAV to more chal-lenging missions, designed to test a team’s ability to take acommander’s intent to support a complex special opera-

tions nighttime mission. Golembesky noted that the VBS3mission editors allow him the flexibility as training admin-istrator to inject new elements into the scenario or controlthe pace of how events unfold in an exercise, depending onhow quickly the students progress. Cadets use mIRC chatand voice-over IP to simulate interactions over satellitecommunications with instructors playing different roles.VBS3 also connects to the Academy’s RPA simulator.

VBS3 includes more than 40 unmanned systems and pro-vides a generic UAV interface for operation system payloadsensors and weapons. UAV models also feature a variety ofcamera modes including Electro-Optical and Infraredviews. VBS Fires FST, from SimCentric Technologies, simu-

lates Call for Fire and Close Air Support activities withinVBS3, providing exterior and terminal ballistics to high lev-els of detail and supports a wide array of munitions, fusetypes and firing platforms.

Roughly 250 cadets a year will gain exposure to RPA andair power operations training through the course.

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Application Briefs

trollers, Gyroscopes, Hand Controllersand System Software. TDSS is availablein three pre-defined configurations, or ifpreferred, as a uniquely configured cus-tom solution:• Configuration 1: Mechanical - The

basic configuration is a hand drivethat can mechanically move the turretin elevation and azimuth.

• Configuration 2: Electrical - A servodrive provides basic electromechanicalaiming of the turret and the gun, and ahand drive interface can be providedfor backup. This system configurationincludes rotary and/or linear drives,motor controllers and optional handcontrollers.

• Configuration 3: Stabilized - This con-figuration adds gyroscopes for stabi-lized turret control to the capabilitiesincluded in Configuration 2.

• Customized: Drive Technology can develop an individu-ally tailor-made solution based on the customer’s uniquerequirements.

Each TDSS configuration supports the option to incre-mentally add functionality via upgrades as the mission re-quirements change. For example, if Configuration 2 is in-stalled, an upgrade to Configuration 3, a stabilized system,

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Application Briefs

Light Reconnaissance VehicleSupacatHoniton, Devon, UK01 404 891 777www.supacat.com

Supacat, a UK designer and manufacturer of specialforces vehicles, recently unveiled the latest variation of

its Light Reconnaissance Vehicle 400 (LRV 400). The Light Reconnaissance Vehicle (LRV) 400 is a high

speed and high mobility off-road vehicle developed tocarry out border patrol, reconnaissance, rapid interventionand light strike missions. It is a militarized variant of theWildcat off-road motorsport vehicle. Supacat and UK-basedmotorsport company QT Services jointly developed theLRV 400. Supacat originally introduced the LRV 400 at theDefence Security and Equipment International (DSEi) exhi-bition 2013 in London.

Designed to operate in harsh environments, includingdeserts and rough terrains, the LRV 400 is a low cost andhigh mobility platform, filling the gap between the heavierJackal surveillance, reconnaissance and patrol vehicle andthe smaller All-Terrain Mobility Platform (ATMP). The4.3m long and 1.8m wide vehicle is designed with a tubu-lar space frame chassis. The space-frame design of the vehi-cle enables easy re-configuration to help address differentoperational roles. The vehicle is air transportable by theCH-47 Chinook helicopter.

The LRV 400 is manned by three crew members (comman-der, driver and gunner). Its gross and kerb weights are 3,500kgand 2,100kg respectively. The fuel capacity is 160 liters.

UK-based survivability solutions provider ArmourWorksdesigned and manufactured a lightweight, convenient seat,which is primarily a standing platform that can be option-

can be cost effectively achieved by adding gyroscope sen-sors, without needing to replace any of the existing hard-ware. When mission demands fall outside of the pre-definedconfigurations, a completely customized system that meetsthat mission’s unique requirements can be developed.

Typical TDSS High Performance specifications include:• Slow speed tracking < 0.3 mrad/s• Max. speed 1 rad/s• Acceleration 2 rad/s2

• Stabilization quality 1 value 0.3 mrad• All typical electrical interfaces are available (e.g. RS-422,

RS-485, CANBUS)The TDSS approach is generally more cost-effective and

flexible than traditional bespoke aiming and stabilizationsystem alternatives. TDSS is also designed to make it easyfor system integrators to configure only the system thatthey require now, while adding increasing levels of stabi-lization as their mission evolves.


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Application Briefs

ally used as a comfortable and safe seat,for the Supacat. Hutchinson providedbead-lock run flats for the vehicle.

The LRV 400 boasts a self-recoverywinch, a beam-type axle with 300mmtravel race-derived hydraulic shock ab-sorbers, infrared (IR) lights, a differentialfront and rear air locking system, 24V DCelectrical system, forward- and rear-facingIR cameras, lengthened wheelbase, LEDhi-mount T16 driving lights and rearwork lights.

The vehicle can be fitted with optionalequipment and systems, such as smokegrenade launchers, a remote weapons sta-tion, weapon mounts, left-hand drive orright-hand drive configuration, Pinnaclecompass, Nato tow hook, onboard waterboiler, canvas roof and side screens, detachable polycarbon-ate windscreen and dry-break quick change main radiatorsystem. Various communication and weapon systems canbe integrated with the vehicle based on customer specifica-tions and configuration.

The LRV 400 provides a highly versatile tactical capability forspecial forces; it can be transported centrally inside a CH-47 Chi-nook fully equipped and loaded, making it immediately andrapidly deployable. Also, it has the unique feature of being con-vertible from 4×4 to 6×6 to provide a flexible alternative config-

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Application Briefs

Unmanned Aerial VehiclesAeroVironment, Inc.Monrovia, CA626-357-9983www.avinc.com

AeroVironment, Inc. a manufacturer of unmanned air-craft systems (UAS) for both military and commercial

applications, received a contract award from the UnitedStates Navy for continuation and expansion of its Black-

uration that increases payload, capacity and range to meet dif-ferent operational requirements. The fast-moving LRV 400 ispowered by a 3.2L Ford diesel or V8 petrol engines. The Forddiesel engine generates 236hp and 550Nm torque. The V8 petrolengine produces 430hp to 640hp of power. The LRV 400 can ac-complish a maximum speed of 170km/h and maximum loadrange of 1,000 km. It has the ability to carry a 1,400 kg payload.


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Application Briefs

wing™ small Unmanned Aerial Vehicles (UAV) program.The contract includes orders for multiple Blackwing vehi-cles, sensor payloads and refurbishment kits for a totalvalue of $2,578,822.

Blackwing is a small, tube-launched unmanned aircraftthat employs an advanced, miniature electro-optical andinfrared (EO/IR) payload, integrated inertial/ GPS autopilotsystem, and secure Digital Data Link (DDL), all packagedinto a vehicle that launches from under the surface of thesea, from manned submarines and unmanned underwatervehicles (UUVs).

Blackwing builds on AeroVironment’s extensive operationalexperience with small UAS and its Switchblade® LethalMiniature Aerial Missile System (LMAMS) to provide the Navywith a low-cost, submarine-launched UAS optimized for de-nied environments. AeroVironment developed the Blackwingsystem as part of a 2013 Navy and United States Pacific Com-mand (PACOM) sponsored Joint Capabilities TechnologyDemonstration (JCTD) called Advanced Weapons Enhancedby Submarine UAS against Mobile targets (AWESUM). ThisJCTD was completed in September 2015 with a strong recom-mendation to transition the capability into the fleet.

AeroVironment’s Blackwing can also be integrated withand deployed from a wide variety of surface vessels andmobile ground vehicles to provide the kind of rapid re-sponse reconnaissance capabilities needed to helpwarfighters proceed with certainty, even in the most chal-lenging settings. The miniature flying ISR package can beoperated manually or autonomously. Blackwing’s built-in,jointly interoperable datalink enables cross-domain com-mand and control (C2) relay operations between land, sur-face and undersea manned and unmanned vessels. Black-wing provides the operator with real-time video forinformation gathering and feature/object recognition, andthe vehicle’s small size and quiet motor make it difficult todetect, recognize and track even at close ranges. Its modu-lar payload bay is designed to enable a variety of specificmission capabilities.

The Naval Undersea Warfare Center, Division Newport(NUWCDIVNPT) awarded this contract to AeroVironment,the only manufacturer of the Blackwing UAS, on a solesource basis in accordance with Federal Acquisition Regula-tions (FAR) guidelines.


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Tech Briefs

Content Addressable Memory (CAM) Technologies for BigData and Intelligent Electronics Enabled By Magneto-Electric Ternary CAMNew associative memory approach based on the propagation of spikes provides ultra-low energysearch operations.

Air Force Research Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio

Content addressable memory (CAM)is one of the most promising hard-

ware solutions for high-speed datasearching and has many practical appli-cations such as anti-virus scanners, in-ternet protocol (IP) filters, and networkswitches. Since CAM stores the data inits internal memory elements and com-pares them with the search data in par-allel, it can achieve much faster speedcompared to the software lookup.

There are two types of CAM: binaryCAM and ternary CAM (TCAM). Espe-cially, TCAM has not only two binarystates (‘0’ and ‘1’) but also an additional“don’t care” state in which it performsthe wild match. The most importantqualification for a TCAM cell is fast op-eration speed for data searching. Due tothis reason, static random access mem-ory (SRAM) has been widely used inmemory elements of the conventionalTCAM cell, even though it has high bit-cell cost, typically requiring 12-16 tran-sistors per cell as shown in Figure 1.

However, recent trends in electronicapplications, such as internet of things,big data, wireless sensors, and mobiledevices, have begun to focus on the im-portance of energy consumption. The

large SRAM-based TCAM cell inevitablyincreases capacitive loading of matchlines (MLs) and search lines (SLs), whichin turn raises dynamic power of searchoperation. Also, as complementarymetal-oxide-semiconductor (CMOS)shrinks to nanometer-scale, the othermajor issue has emerged: a highstandby power due to leakage current. Ascaled-down channel length increasesthe leakage current, and hence the useof SRAM in TCAM applications is not asustainable pathway.

The first approach to achieve a low-power and high-density TCAM with acomparable searching speed is utiliz-ing emerging memory technologies.Although emerging nonvolatile memo-ries, such as resistive RAM (ReRAM),phase-change RAM (PCRAM), and spin-transfer RAM (STT-RAM) have been pro-posed for TCAM applications, usingMeRAM as a memory element of TCAMis being proposed because MeRAM out-performs other memory technologies interms of speed, energy, and density. Typ-ically, a MeRAM cell consists of one tran-sistor and one voltage-controlled mag-netic tunnel junction (1T-1MTJ) asshown in Figure 2 where the bottom

layer of the voltage-controlled magnetictunnel junction (VC-MTJ) is connectedto the drain of the access transistor, andthe top layer is connected to the bit line(BL). The size of the access transistor inMeRAM can be reduced further in thatthe voltage-driven switching ideallydoes not require the flow of current.Thus the bit cell array of MeRAM canachieve higher density compared toother families of magneto-resistive RAM(MRAM). Also, the thickness of the tun-nel barrier is relatively thick, practicallyreducing ohmic dissipation during thewrite operation.

This work was done by Kang L. Wang,University of California, Los Angeles, for theAir Force Research Laboratory. For more in-formation, download the TechnicalSupport Package (free white paper) atwww.aerodefensetech.com under the Elec-tronics & Computers category. AFRL-0257

Figure 2. 1T-1MTJ Cell Architecture in MeRAM.Switching can be achieved by applying an electricpulse to the MTJ, which induces a magnetic pre-cessional motion in the free layer. Since this typeof switching mechanism is non-deterministic, aunipolar pulse can switch either from AP to P orfrom P to AP.

Figure 1. Conventional SRAM based TCAM Cell Architecture Consisting of Two Volatile Storage Elementsand Comparison Logic.

ComparisonLogic

Volatile Storage Volatile Storage

VDD

BL1 SL (S) SL (S) BL2

ML

WL

GND

b1 b2

BLIw

HextVMTJ

OVVC-MTJAP to P

orP to AP

SL

WL

Access Transistor

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http://www.aerodefensetech.com


Natural DNA-Based Nonvolatile Resistive SwitchingMemoryReliable memory devices can be realized within a single macromolecule based on natural DNA.

Air Force Research Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio

Motivated by the demand for aneven larger storage capacity in the

information era, research efforts havebeen devoted to the development ofmore efficient and cost-effective mem-ory elements.

Many digital data storage infrastruc-tures are constructed based on thebuilding block with a resistive switching(RS) behavior, where resistances can bereversibly changed by applying differ-ent voltages. So far, the RS effect hasbeen demonstrated in many metaloxide and organic materials, such asSiO2, HfO2, P3HT, PVK, etc. The use ofbiomaterials in electronic devices hasalso drawn considerable attention re-cently, driven by the rapid developmentof technology coupled with the growinginterests toward green electronics.

Biomaterials are abundant, eco-friendly, and suitable for large-area im-plementation, which make them ofgreat interest for applications such asflexible displays and wearable technolo-gies. As green electronics continue toadvance, the development of a facile ap-proach to fabricate a biomaterial-basedmemory device becomes critical to pavethe way for implementation of low-costand green electronic devices.

Previous studies have been done onthe use of biomaterials for resistivememory devices. Some involve DNA se-quence control, while others may re-quire external doping of guest compo-nents. The addition of nanoparticles, forexample, provides an easy route to tunethe electrical properties of the compos-ites. However, uniform dispersion andcompatibility of the hybrid compositesmay be difficult to control. Furthermore,some reported devices need to be oper-ated under controlled environmentalconditions. These features increase com-plexity when it comes to practical im-plementation and device integration.

This study reports on the fabricationof resistive switching devices based on


Tech Briefs

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Tech Briefs

natural DNA biomaterial. The raw DNA material is isolatedfrom salmon milt, which is randomly sequenced with a widerange of distribution of base pairs. Such DNA can be readilyextracted from biological species and is abundant in nature.

In the present device, the structure consists of a spin-coatedDNA layer sandwiched by two electrodes without DNA se-quence control or external doping of nanoparticles. The fabri-cated devices show a reliable resistive switching behavior withlow switching voltages, data retention longer than 104 s, andmore than 180 times in memory endurance under ambientconditions. The device also shows multi-level memory charac-teristics, in which the current levels can be controlled by resetvoltages.

To study the underlying switching mechanisms, the electricalproperties are examined under different fabrication parametersand measurement conditions. This demonstration shows thatreliable memory devices operated under ambient conditionscan be realized within a single macro-molecule based on natu-ral DNA biomaterial. The ease of material handling and devicefabrication may lead to future development for biomaterial-based multifunctional devices or green electronic devices.

This work was done by Huei-Yau Jeng, Tzu-Chien Yang, LiYang, Hsin-Lung Chen, and Yu-Chueh Hung of National TsingHua University and James G. Grote for the Air Force Research Lab-oratory. For more information, download the Technical Sup-port Package (free white paper) at www.aerodefensetech.comunder the Electronics & Computers category. AFRL-0259

A Mechanistic Analysis ofOxygen Vacancy DrivenConductive FilamentFormation in ResistiveRandom Access MemoryMetal/NiO/Metal StructuresStudy could lead to more efficient electricallyswitchable resistive random access memorydevices.

Air Force Research Laboratory, Wright-Patterson AirForce Base, Dayton, Ohio

Resistive Random Access Memory (RRAM) devices havedrawn much interest in the last decade, particularly the

concept of a memristor. In this case, the so-called memris-tance, which provides the relationship between the change incharge (time integral of the current) and flux (time integral ofthe voltage), is not a constant as in linear elements, but afunction of the charge, resulting in a nonlinear circuit ele-ment. Applications of such two-terminal electrical devicesthat provide high densities and low-power operation include,

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Tech Briefs

for instance, neuromorphic-type com-puting elements.

This area of research led to a study onthe effects of ionizing radiation on suchdevices. Significant focus on filamen-tary-type resistive switching (RS) mecha-nisms emerged, where formation/rup-ture of a conductive filament (CF)ensures successive switching in the non-volatile metal-insulator-metal (MIM)memristors, dependent on the switchingmaterial. In such a RRAM device, binaryoxide MIM structures are constructedusing an insulating layer stacked be-tween two electrodes, which can be builteither symmetrically or asymmetricallyusing the same or different top or bot-tom electrodes, respectively.

In the filamentary RS mechanism, fol-lowing the CF forming stage, where acompliance current is used for control-ling its size, operation depends on themigration of ions across the metal oxidein the SET (RESET) stages upon applica-tion of positive (negative) voltage in abipolar RRAM, or of the same polarityvoltage in a unipolar system. The ruptureof the CF causes a High Resistance State(HRS), and its re-formation results in aLow Resistance State (LRS). Proposed con-ductance mechanisms by metal cationsor positively charged oxygen vacancies,namely electrochemical metallizationmemory or conductive-bridge memory,and valence change memory mecha-nisms, respectively, are most common.

A thermochemical mechanism was alsoproposed. However, despite much prom-

ise and progress in this field, many issuesremain, requiring further understandingof the memristive mechanism for specificMIMs. Indeed, a consensus on materialsselection has still not been reached be-cause properties such as reliability, switch-ing speed, or the range of resistance states,depend on the materials used.

Among a multitude of metal oxideselections for RRAM devices, the behav-ior of p-type NiO, one of the earlieststudied, still raises questions on themechanism of operation. Followingearly work, RS characteristics of NiOwere determined in a number of exam-ples demonstrating high stability andreliable memory characteristics, highspeed, low voltage, fast programming,and compatibility with the CMOSprocess. Moreover, inclusion of an oxy-gen exchange layer (Ta) in a Pt/NiO/Cudevice enabled reaching a very high re-sistance ON/OFF ratio of 106.

Characterization of NiO filaments bymagnetoresistance demonstrated theirstructural evolution, and also thatmulti-filaments are involved in the LRS,rupturing separately during RESET.Unipolar memristive behavior for NiO-based MIMs was demonstrated, indicat-ing that reliable RS depends on the oxy-gen partial pressure during growth, sothat the initial oxygen vacancy defectconfiguration affected the reliability ofRS. Experiments for NiO/Pt films usingtime-of-flight secondary ion mass spec-troscopy and conductive atomic forcemicroscopy (C-AFM) measurements

Optimized MIM structural models for Ag/NiO/Ag with a) O on-top b) Ni on-top; Pt/NiO/Pt with a tensile-strained lattice with c) O on-top and d) Ni on-top; Pt/NiO/Pt with the Pt lattice constant with e) O on-topand f) Ni on-top. The balls represented by gray, red, yellow, and blue correspond to nickel, oxygen, silver,and platinum atoms, respectively. The optimized (final) configurations of the interfaces for the O on-topinitial configuration are shown in a), c), and e), while those in b), d), and f) correspond to the final config-urations of the interfaces with the Ni on-top initial configuration.

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• Welded & Mechanical Assemblies

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• Close Tolerance Grinding

• Tooling, Fixtures and Gages

• Laser Cutting and Welding

• Rapid Prototyping

• Wire EDM

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www.aerodefensetech.com Aerospace & Defense Technology, February 2018Free Info at http://info.hotims.com/69503-854

Tech Briefs

showed that oxygen atoms move to theanode, changing the surface composi-tion, and therefore the resistance.

Oxygen vacancy migration, such as in avalence change memory mechanism-typesystem, has also been postulated. Al-though Ni vacancies in p-type NiO can bepresent in films, when the growth condi-tions are modified, appreciable concentra-tion of oxygen vacancies is achieved. In-deed, investigation of diffusion of oxygenvacancies in epitaxial NiO by local multi-modal scanning probe microscopy was re-

ported, consistent with earlier work. Nev-ertheless, the NiO-based MIM system forRRAM application, which demonstratesencouraging characteristics, still posesquestions on the role of oxygen vacanciesin RS for this MIM system.

This work was done by Handan Yildirimand Ruth Pachter for the Air Force ResearchLaboratory. For more information, down-load the Technical Support Package (freewhite paper) at www.aerodefensetech.com under the Electronics & Computerscategory. AFRL-0260

pH-Dependent Spin State Populationand 19F NMR Chemical Shift ViaRemote Ligand Protonation in AnIron(II) ComplexAn FeII complex that features a pH-dependent spin state populationdemonstrates potential as a 19F chemical shift-based pH sensor.

Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio

The development of transition metal-based molecules and materials that

can be switched between low-spin andhigh-spin electronic states has consti-tuted a highly active area of researchover the past several decades. Indeed,the magnetic bistability of such spin-crossover compounds make them po-tential candidates for molecularswitches and chemical sensors, as thespin transition can be controlled by anumber of external stimuli, such astemperature, pressure, and light.

Recently, researchers have begun toexplore the potential for spin-switch-able molecules as bioresponsive probesfor temperature, anions, and enzymeactivity. In addition, given the relation-ship between tissue acidosis and dis-eases, including cancer and ischemia, acompound that undergoes a spin statetransition as a function of pH couldserve as a valuable tool for pH sensing.Nevertheless, pH-induced spin stateswitching is rare, and compounds thatexhibit such behavior are unsuitable formost biological sensing applicationsdue to pKa values far from biological pHor poor stability in water.

One approach toward biological pHsensing is to employ pH-induced changesin the chemical shift of 19F resonances,typically caused by an interconversionbetween species of different protonationstates. Here, the use of 19F magnetic reso-nance spectroscopy (MRS) offers key ad-vantages over the more commonly em-ployed 1H MRS, most notably theabsence of endogenous fluorine in livingsystems. Furthermore, the chemical shiftof the 19F nucleus is highly sensitive to itslocal environment, such that smallchemical changes can lead to drasticchanges in chemical shift. Indeed, dia-magnetic 19F MRS pH probes with pKavalues near 7 have been developed for invivo applications, where a variation in19F chemical shift of 12 ppm was ob-served between the protonated and de-protonated forms. In addition, the sen-sitivity of 19F MRS probes can be furtherimproved by incorporating paramagneticmetal ions, as the difference in chemicalshift between the protonated and de-protonated forms is amplified by thepresence of contact (through-bond) anddipolar (through-space) contributions tothe chemical shift.

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It has been previously demonstratedthat spin-crossover FeII complexes can fa-cilitate chemical shift-based MR ther-mometry. Here, since both the contactand dipolar contributions to the para-magnetic chemical shift scale with S(S +1), where S is the electronic spin state,thermally-induced spin-crossover froman S =0 ground state to an S = 2 excitedstate afforded a dramatic increase inchemical shift with temperature. Build-ing on these results, an attempt was madeto develop a spin-crossover FeII complexthat undergoes a deprotonation-inducedspin state change near biological pH for19F chemical shift-based pH sensing.Herein are reported the synthesis andcharacterization of an FeII complex thatfeatures a new asymmetric 1,4,7-triazacy-clononane (TACN) ligand appended withtwo 4-hydroxylpyridine donors, and itwas demonstrated that pH-induced spinstate switching can engender highly sen-sitive 19F MRS pH probes.

In order to develop an 19F MR probethat undergoes a pH-induced spin statetransition, the decision was made to de-sign a ligand that (1) forms a water-solu-ble complex with FeII, (2) features an 19Freporter group, and (3) affords a ligandfield that changes dramatically with pH.Toward this end, 4-hydroxy- 3,5-di-methyl-2-pyridyl groups were selected asthe pH sensing moieties, because theability of 4-hydroxylpyridines to engen-der significant changes in the electronicstructure of transition metal compoundsupon protonation or deprotonation hasbeen demonstrated in V-, Fe-, Co-, Ni-,Ru-, Pt-, Re-, and Ir-based compounds. It

has thus been hypothesized that incor-porating hydroxylpyridine groups into aspin-crossover complex could create acompound with a pH-sensitive spinstate population (see Figure).

This work was done by Alexandra I.Gaudette, Agnes E. Thorarinsdottir, and T.

David Harris of Northwestern Universityfor the Air Force Research Laboratory. Formore information, download the Tech-nical Support Package (free whitepaper) at www.aerodefensetech.comunder the Electronics & Computers cat-egory. AFRL-0258


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Scheme depicting the mechanism for pH sensing with 1. With increasing pH, the pendent hydroxylpyridine groups are deprotonated, and the resulting weaker lig-and field leads to a higher population of the S = 2 high-spin state.

decreasing ligand field and thus increasing population of high-spin

2+ 0

— 2H+

+ 2H+F

N N

NN

N N

N N

N

N N

N

F

Fe Fe

HOOH

OO

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www.aerodefensetech.com Aerospace & Defense Technology, February 2018

SEE THE LIGHT! Learn about the latest Infrared technology.

Taught by the

Discount and Early Bird Discount available.

June 18-22, 2018 UCSB Extension

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New Products

PCI Express Mini CardsACCES I/O Products, Inc. (San Diego,

CA) has released a new family of miniPCI Express (mPCIe) digital I/O cards.Key features of the mPCIe-DIO familyinclude: PCI Express Mini Card form-factor (mPCIe) type F1, with latchingI/O connectors; up to 24-channels ofDigital I/O forcompact controland mon itoringapp l i c a t i on s ;event detectionto monitor spe-cific changes onselected input lines or all input lines;digital filtering to eliminate glitches oninput data; both pulse (high- / low-going) and frequency measurement si-multaneously; and extended operatingtemperature (-40°C to +85°C).

All the cards share features such asmemory mapped registers for low-latencyoperation. Output channels supportpulse/train / PWM / frequency / and quad-rature generation. Input channels supportquadrature encoders, flexible measure-ment of pulse duration, frequency, andevent counting, with optional debounc-ing, IRQ generation, and more.

For Free Info Visithttp://info.hotims.com/69503-514

Rugged Servers with Skylake Architecture

Themis Computer® (Fremont, CA) announced the launch of its next generationXR6 Rugged Enterprise Servers (RES) featuring the newest Intel® Xeon® Scalable(Skylake) Processors.

The first available RES-XR6 server – a 1U with eight front access drives – is com-prised of two Intel® Xeon® Gold Skylake processors with up to twenty-four coresper socket, up to 1.5 TB ECC DDR4 2666 MHz Memory, 3PCIe x16 slots, eight SAS3capable 2.5" front access drive slots for either SSD or HDD storage, and two onboard1 Gbit Ethernet (optional 10 Gbit Ethernet) ports. Additionally, all XR6 RES serverscome with IPMI v2.0, TPM 2.0 and are compatible with popular hypervisors and op-erating systems.

Optimized for size, weight, and power (SWaP), the system weighs only 22 lbs, is20" deep, and is capable of meeting a wide variety of MIL-STD environmental spec-ifications. A robust array of high speed I/O, storage options, enhanced reliability fea-tures, and expansion choices allow users maximum flexibility for current and futuresystem requirements.


Miniature Circular ConnectorITT Cannon’s (Irvine, CA) new MKJ

Clip Lock (MKJ CL) miniature circularconnector features an innovative cliplock latching system that was repurposedfrom a design originally used for the au-tomotive industry. By eliminating higher

cost components, it's beentransformedinto a mil-style con-nector with

a proven snapon positive lock dimension.

Features include: easy use and installa-tion with quick connect clip lock feature;positive latch or breakaway options;multiple keying options that preventmismating with 6 clocking positions;high density size 23 machine contacts;available in 4, 6, 7 and 10 positions; fullymachined aluminum shells; field re-pairable.


Night Vision Weapon Sight Harris Corporation (Rochester, NY)

has introduced the new F7030 clip-onnight vision weapon sight for militaryuse. Developed with longtime partnerKnight’s Armament Company (KAC),the F7030 buildson technologyused in thewidely-fieldedKAC AN/PVS-30night vision sightand includes the latest advancement innight vision image intensification. Itcan be mounted on standard assaultand long-range rifles with day scopes.

The KAC-patented technology andextended focus ensures the accuracy ofthe day scope boresight. The refractivelens provides high-performance lightcollection in a lightweight design, andis optimized for use with green or whitephosphor image intensifiers. The sightalso features the patented Single Inter-changeable Battery (SIB)® that exceeds24 hours of continuous operation. Thehighly-efficient power circuit can evenrun on used batteries providing severaladditional hours of operation.


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Aerospace & Defense Technology, February 2018

CONFERENCE: MARCH 26–29, 2018 EXHIBITS: MARCH 27–28, 2018LONG BEACH [CA] CONVENTION CENTER

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New Products

Micro Purge SystemAeroprobe Corporation (Christians-

burg, VA), a company that provides airdata measurement systems to aero -space, automotive, turbo-machinery,wind turbine, and wind tun nel testingindustries around the world, is adding aMicro Purge System (μPS) to its line ofmeasurement solutions products. TheμPS will allow users to purge the pneu-matic system of the μADS of debris andmoisture that can develop during nor-mal operation. These elements can in-fluence data acquisition and createfunctional issues.

The μPS is controlled by a Micro AirData Computer (μADC), another com-ponent of the μADS. As a pump-basedpurge system, the μPS can be operatedwith out the need for an ex ternal com -pressed airsource. Aero-probe’s μPSis the light-est solutionfor purge available and can be pairedwith any of the company’s μADCs.


Full HD, Uncooled 1080p ThermalImager

Sierra-OlympicTechnologies (HoodRiver, OR) recently introduced the VayuHD, an uncooled thermal camera withtrue high definition (1920 ¥ 1200 pixels)capable of 1080p output. The new ther-mal imager replaces the recently intro-duced Viento HD and Viento HD IP67cameras and features the same longwaveinfrared (LWIR) spectral response from 8to 14 μm.

The rugged Vayu HD provides unprece-dented image resolution utilizing a vana-dium oxide microbolometer (VOx) sensorwith a capacity of over 2.3 million pixelson a 12-micron pixel pitch, in a commer-cially-designed, IP67-environmentallyrated, stand-alone camera. Other featuresinclude an athermalized 24 mm F1.1 cus-tom-designed optic, 30 Hz frame rate, andthree video formats: HD-SDI, h.264 IP-Video, or 16-bit Camera Link output.


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42 Aerospace & Defense Technology, February 2018

Presenters:Dave AbbottChair, SAE’s AMS-AM Committee on Additive Manufacturing

Daniel ReevesSecretary, SAE’s AMS-AMCommitteeon Additive Manufacturing

Webinars

This 60-minute Webinar includes:• Live Q&A session • Application Demo • Access to archived event on demand

Please visit www.techbriefs.com/webinar429

New SAE Standards on Additive Manufacturing: World’s First for Aerospace IndustryThis SAE Standards Webinar outlines the specification structure andstrategy for specifications encompassing additive manufacturing processesand materials. Topics include the interconnected relationship among theprecursor materials, process, and resulting fabricated materialsspecifications for additive manufacturing.

Available On Demand!

New Products

Complete Data Storage SystemThe Model 9740 Complete Data Storage Solution

from the Memory Division of Kaman Precision Prod-ucts, Inc. (Middletown, CT) includes an electronicsmodule, a ground station adapter with encryptionkey enabled, and encryption key programmer. TheModel 9740 features the new Kaman SATA card, witha unique ruggedized design, small form factor, high

memory density, and on-card encryption providing data-at-rest functionality. TheKaman SATA card is hermetically sealed to enable it to withstand even the most se-vere military environments.

Four 10/100/ 1000 Mb Ethernet channels provide high speed data transfers;NAS functions such as NFS, FTP, TFTP, and DHCP Server protocols; and TCP/IPand UDP transport layer protocols. The system’s throughput rate is 50 megabytesper second. Heat ladders within the Model 9740 ensure that the device can with-stand temperatures from -40˚C to +71˚C. It has a vibration endurance rating of3.89 GRMS and a crash safety shock rating of 30G peak. The Model 9740 is com-pliant with MIL-STD-810 for altitude, humidity, sand and dust, salt spray, and ex-plosive atmosphere and with MIL-STD-461f for EMI/EMC.

The system requires low power, with a 22-watt maximum at an input of 28volts. It supports sanitize algorithms including support for NAVSO 5239-26, NSA9-12, AFSIS 5020, and DOD 5220.22-M. The unit is available with up to 2 TB oftotal storage capacity.


OscilloscopesRIGOL Technologies (Beaverton, OR)

has introduced its new DS2000E SeriesOscilloscope, a 200 MHz, 2 channelscope that isavailable at ei-ther 100 MHzor 200 MHzbandwidths.All models provide 2 analog channelswith 50 input impedance standard.With real-time sample rate of 1GS/Sec(on both channels), memory depth ofup to 28Mpts standard, and waveformcapture rate up to 50,000 wfms/sec, theDS2000E provides the performance re-quired to meet today’s more advanceddebug challenges.

The 200 MHz DS2000E provides full5X oversampling at 200 MHz on bothchannels and is supported with RIGOL’sUltraVision architecture. Other featuresinclude: large 8 inch WVGA intensitygraded display, complete network con-nectivity, hardware waveform record/playback, serial trigger and decode.


Temperature Control InstrumentThe TC15 LAB (15A, 20V) from Wave-

length Electronics (Bozeman, MT) is anultra-stable digital controller for ther-moelectrics andresistive heaterswhere tight tem-perature stabilityis required. Stabil-ity better than 0.0009°C can beachieved at 15 Amps up to 20 Volts to athermoelectric or resistive heater. Intu-itive touchscreen front panel shows set-point, actual temperature, stability sta-tus all on one screen. Safety featuresshut down your laser / QCL / active loadif it goes outside user set temperaturelimits, while an auxiliary sensor canmonitor heat sink temperature. An ex-panded Remote Command set allowsusers to control and log data from a re-mote computer via USB (Test & Meas-urement Class) or Ethernet. Intelli-Tune® optimizes PID control values tominimize time to temperature or rejectexternal disturbances.


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http://www.techbriefs.com/webinar429


New Products

Rugged FanlessEmbedded System

American Portwell Tech-nology, Inc. (Fremont, CA)recently announced the re-lease of the WEBS-21D0, a fanless embedded system featuring theIntel® Atom® processor E3900 series (formerly Apollo Lake). Thenew rugged WEBS-21D0 is equipped with the Portwell NANO-6062, a Nano-ITX form factor embedded board based on theIntel® Atom® processor E3900 series, which integrates the lowpower Intel® Gen9 graphics engine with up to 18 executionunits that improves 3D graphics performance and supports faster4K encode and decode operations.

The compact WEBS-21D0 embedded system also featuresDDR3L SO-DIMM up to 8GB supporting 1866/1600 MT/s; dualUSB 3.0 ports (optional, up to 4x USB 3.0); one DisplayPort (DP)on rear I/O with resolution up to 4096 x 2160; one legacy VGAinterface support; one smart COM port for RS-232/422/485 se-lected by BIOS; and multiple storage with 2.5" HDD/SSD, mSATAas well as microSD card. In addition, the compact 150mm x150mm x 60mm chassis platform integrates the latest M.2 type Einterface, which provides wireless connectivity such as Wi-Fi,Bluetooth and NFC (near-field communication) functionalities.


High Voltage DC Power SuppliesGlassman Europe (Hampshire, UK) has introduced a new

range of programmable, DC regulated power supplies called theGX Series. The GX Series is a highly-specified family of 25kW to200kW fast response, air in-sulated power supplies,boasting tight regulationcombined with low rippleand noise. This comprehen-sive range has nineteen mod-els in all, from 0 to 1kVthrough to 0 to 100kV, andindividual units can be set upin a master/slave configura-tion to produce a maximum output capability of 200kW.

Input for the rack-mountable GX Series is 480 VAC 3-phase as standard, with 380VAC and 415VAC input availableas an option. The units feature a microcontroller based frontpanel control and communication interface and there arealso integral RS232/USB serial ports as standard, plus an op-tional Ethernet interface, which enables high-resolutionvoltage and current programming either on-site via the frontpanel digital encoders or via the analogue remote interface.



Free Info at http://info.hotims.com/69503-863Free Info at http://info.hotims.com/69503-862Free Info at http://info.hotims.com/69503-861

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LEMOS ULTRA-WIDEBANDPOWER AMPLIFIERThe Lemos PAT-HPA21G is ahigh performance, low noise,ultra-wideband amplifier. Basedon GaN technology. Our ampli-fier achieves high reliability

and high efficiency in a very small form-factor. It’salso lightweight which makes it suitable for a widerange of applications. We also offer CUSTOMoptions and RF Design Services. Please contact [email protected] or http://www.lemosint.com

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FIBER OPTICTRANSMISSIONSYSTEMSLiteway, Inc. offers a full

line of fiber optic transmission systems covering moststandard analog and digital protocols including: RS-232/422/485, TTL, GPS, PPS, NMEA, IRIG, Audio,Contact Closures and DC Levels. All units can be usedStand-alone, DIN rail or Rack Mounted, are avail-able with all standard optical connectors and are readyto use immediately. All systems are manufactured inthe USA and custom units are available. Visitwww.Liteway.com or call Liteway, Inc. at 1-516-931-2800.

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Master Bond EP13LTE offers excellent adhesion todissimilar substrates and has a stellar physicalstrength profile. This NASA low outgassing approvedsystem is easy to use, doesn’t require mixing, and hasan unlimited working life at room temperature. Italso features high temperature resistance, dimen-sional stability and is able to withstand 1,000 hours at85°C/85% RH. www.masterbond.com/tds/ep13lte

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COMSOL Multiphysics® is an integrated software envi-ronment for creating physics-based models and simula-tion apps. Add-on products allow the simulation of elec-trical, mechanical, acoustic, fluid flow, thermal, andchemical applications. Interfacing tools enable its inte-gration with all major technical computing and CADtools. Simulation experts rely on COMSOL Serverproduct to deploy apps to their colleagues and cus-tomers worldwide. https://www.comsol.com/products

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Aerospace & Defense Technology, February 2018 www.aerodefensetech.com 43

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Ad IndexAdvertiser Page Web Link

Accurate Screw Machine ..........................................2..........................................................www.accuratescrew.com

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Del-Tron Precision, Inc. ............................................43......................................................................www.deltron.com

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Hunter Products, Inc. ................................................32 ....................................................www.hunterproducts.com

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Integrated Engineering Software ..........................25..................................................................integratedsoft.com

International Manufacturing Services, Inc. ......27 ..........................................................www.ims-resistors.com

Intlvac Thin Film Corporation ................................38 ......................................................................www.intlvac.com

Lemos International Co., Inc. ................................43 ......................................................http://www.lemosint.com

Liteway Inc. ..................................................................43 ....................................................................www.Liteway.com

Lyons Tool & Die Co. ..................................................37 ........................................................................www.Lyons.com

Master Bond Inc. ........................................................32, 43 ....................................................www.masterbond.com

Michigan Economic Development Corporation........................................5 ..............................michiganbusiness.org/pure-aerospace

Mini-Systems, Inc. ......................................................23 ..............................................................mini-systemsinc.com

Morehouse Instrument Company..........................33....................................................................www.mhforce.com

New England Wire Technologies ............................17 ..............................................................newenglandwire.com

Pepin Manufacturing Inc. ........................................29 ................................................................www.pepinmfg.com

S.I. Tech ..........................................................................43 ........................................http://www.sitech-bitdriver.com

Specialty Coating Systems, Inc. ............................35 ......................................................scscoatings.com/military

State Of The Art, Inc. ................................................8 ......................................................................www.resistor.com

TECA, Inc. ......................................................................11 ........................................................www.thermoelectric.com

Themis Computer........................................................16 ..............................................................THEMIS.COM/RES-XR6

ThermOmegaTech, Inc. ............................................3 ......................................ThermOmegaTech.com/aerospace

UCSB Extension............................................................40 ......................................................extension.ucsb.edu/aero

VPT, Inc. ........................................................................7 ....................................................................www.vptpower.com

W.L. Gore & Associates ..............................................COV II..........................................www.gore.com/GORE-FLIGHT

Publisher . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Joseph T. Pramberger

Editorial Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Linda L. Bell

Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bruce A. Bennett

Digital Editorial Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Billy Hurley

Associate Editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Edward Brown

Managing Editor, Tech Briefs TV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kendra Smith

Production Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Adam Santiago

Assistant Production Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kevin Coltrinari

Creative Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Lois Erlacher

Senior Designer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ayinde Frederick

Marketing Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Debora Rothwell

Marketing Communications Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Natasha Neysmith

Digital Marketing Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Kaitlyn Sommer

Audience Development Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Stacey Nelson

Subscription Changes/Cancellations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [email protected]

TECH BRIEFS MEDIA GROUP, AN SAE INTERNATIONAL COMPANY261 Fifth Avenue, Suite 1901, New York, NY 10016(212) 490-3999 FAX (646) 829-0800

Chief Executive Officer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Domenic A. Mucchetti

Executive Vice-President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Luke Schnirring

Technology Director . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Oliver Rockwell

Systems Administrator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Vlad Gladoun

Digital Media Assistant Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Anel Guerrero

Digital Media Assistants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peter Weiland, Howard Ng, Md Jaliluzzaman

Digital Media Audience Coordinator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Jamil Barrett

Credit/Collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Felecia Lahey

Accounting/Human Resources Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Sylvia Bonilla

Accounts Receivable Assistant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Nicholas Rivera

Office Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Alfredo Vasquez

ADVERTISING ACCOUNT EXECUTIVES

MA, NH, ME, VT, RI, Eastern Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ed Marecki

(401) 351-0274

CT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Stan Greenfield

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(203) 938-2418

NJ, PA, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .John Murray

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (973) 409-4685

Southeast, TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ray Tompkins

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(281) 313-1004

NY, OH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ryan Beckman

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(973) 409-4687

MI, IN, WI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chris Kennedy

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(847) 498-4520 ext. 3008

MN, ND, SD, IL, KY, MO, KS, IA, NE, Central Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Bob Casey

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(847) 223-5225

Northwest, N. Calif., Western Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Craig Pitcher

(408) 778-0300

S. Calif., AZ, NM, Rocky Mountain States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tim Powers

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(424) 247-9207

Europe — Central & Eastern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Sven Anacker

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49-202-27169-11

Joseph Heeg

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49-621-841-5702

Europe — Western . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Chris Shaw

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44-1270-522130

Integrated Media Consultants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Patrick Harvey

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (973) 409-4686

Angelo Danza

(973) 874-0271

Scott Williams

(973) 545-2464

Rick Rosenberg

(973) 545-2565

Todd Holtz

(973) 545-2566

Christian DeLalla(973) 841-6035

Casey Hanson

(973) 841-6040

Reprints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Jill Kaletha

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(219) 878-6068

Aerospace & Defense Technology, ISSN 2472-2081, USPS 018-120. Periodicals postage paid atNew York, NY and at additional mailing offices. Copyright © 2017 in U.S. is published inFebruary, April, May, June, August, September, October, and December (8 issues) by TechBriefs Media Group, an SAE International Company, 261 Fifth Avenue, Suite 1901, NewYork, NY 10016. The copyright information does not include the (U.S. rights to) individualtech briefs that are supplied by NASA. Editorial, sales, production, and circulation offices at261 Fifth Avenue, Suite 1901, New York, NY 10016. Subscription is free to qualified sub-scribers and subscriptions for non-qualified subscribers in the U.S. and Puerto Rico, $75.00for 1 year. Digital Edition: $24.00 for 1 year. Single copies: $6.25. Foreign subscriptions, one-year U.S. Funds: $195.00. Remit by check, draft, postal, express orders or VISA, MasterCard,and American Express. Other remittances at sender’s risk. Address all communications forsubscriptions or circulation to NASA Tech Briefs, 261 Fifth Avenue, Suite 1901, New York,NY 10016. Periodicals postage paid at New York, NY and at additional mailing offices.

POSTMASTER: Send address changes and cancellations to NASA Tech Briefs, P.O. Box47857, Plymouth, MN 55447.

February 2018, Volume 3, Number 1

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Multiple antennas are needed to create more complex communication systems on airplanes. But this arrangement of transmitters and receivers can cause aircraft operation issues due to crosstalk, or cosite interference. Simulation helps you analyze the crosstalk effect on an aircraft and in turn find the best antenna placement.

The COMSOL Multiphysics® software is used for simulating designs, devices, and processes in all fields of engineering, manufacturing, and scientific research. See how you can apply it to antenna simulation.

Visualization of the electric field norm and 3D far field due to a transmitting antenna. Antennas are intentionally large in this tutorial model.

Overcome antenna crosstalk issues with simulation.

comsol.blog/antenna-crosstalk


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Documents

Aerospace & Defense Technologyassets.techbriefs.com/EML/2018/digital_editions/adt/ADT_0218.pdfThe COMSOL Multiphysics® software is used for simulating designs, devices, and processes