Dr. Victor Veliadis

Deputy Executive Director and CTO, PowerAmerica

Professor ECE North Carolina State University, Raleigh, NC USA

jvveliad@ncsu.edu

Accelerating Adoption of Wide Bandgap Semiconductor Technologies

PowerAmerica is a U.S. Department of Energy WBG Semiconductor Manufacturing Institute

• The U.S Department of Energy launched the PowerAmericaInstitute under the initiative of “National Network of Manufacturing Institutes (NNMI)” to Accelerate Adoption Wide Band Gap (WBG) power devices

• PowerAmerica started operations in 2015 with $140M funds over 5 years, and is managed by North Carolina State University in Raleigh, NC USA

• PowerAmerica addresses gaps in technology to enable manufacturing that contributes to its mission of realizing manufacturing jobs creation and energy savings through accelerated large-scale adoption of WBG semiconductor devices in power electronic systems

Veliadis, PowerAmerica Proprietary

Strategic DOE/PowerAmerica BP3 Funding Allocation Addresses Gaps in Technology to Enable WBG Manufacturing

BP3: July 2017 – June 2018

Veliadis, PowerAmerica Proprietary

USCi Fabricates 1200 V Planar MOSFETs on

150-mm Wafers at X-FAB

Objective: Develop 40mOhm, 1200V planar MOSFET

• Breakdown values on target

• Vth lower than target

• On-state behavior looks good

• Basic TO247 Rel test data looks good –

see table

• Basic Switching and UIS tests look good

Test stress conditionduratio

n sample

size status

HTGBVGS=+20V, VDS=0,

Ta=150C 1000hrs 77 Pass

HTGBRVGS=-10V, VDS=0,

Ta=150C 1000hrs 77 Pass

HTRBVDS=960V, VGS=0,

Ta=150C 1000hrs 77 Pass

ABB Fabricates 3.3 kV SiC Schottky Diodes

and MOSFETs on 150-mm Wafers at X-FAB

Top view of a 3.3kV SiC JBS diode wafer in process

ABB Processes SiC diodes and MOSFETs on 150 mm SiC wafers for the first time:

Process routers developed in collaboration with XFAB

3.3 kV rated SiC Schottky and MOSFET wafers fully processed with encouraging yields (testing underway)

Pathways determined for cost reduction in future volume manufacturing

Next Steps: Test a statistically relevant number of dies to evaluate yield/performance

Schematic cross section of 3.3kV SiC JBS diode

Objective: Qualify 150-mm Si foundry for SiC processing

Wolfspeed Foundry Fabricates 3.3 kV/40 m SiC MOSFETs and 10 kV/15 A SiC JBS Diodes

8.10 mm

8.1

0 m

m

6.2 mm

6.2

mm

10kV/15A SiC JBS Diode 100% Passed 1000 hr HTRB at 175C & 8 kV (80% 10 kV)

0

2

4

6

8

10

0 200 400 600 800 1000

Leak

age

Cu

rre

nt

(µA

)

Hours

8.86 mm

4.82

mm

3.3 kV/40 mΩ SiC MOSFET Die 100% Passed 1000 hr HTRB at

175C & 2.64 kV (80% 3.3 kV)

Objective: Qualify 3.3 kV/40 m MOSFETs and 10 kV/20 A SiC JBS Diodes

Wolfspeed Foundry Fabrication and Qualification of 3.3 kV/45 m and 10 kV/350 m SiC MOSFETs is Underway

Tight RDS,ON Distribution Very Low Blocking Leakage Current

• All 3x 3.3 kV/45 m SiC MOSFET Qualification Fabrication Lots Completed with Good Yields• 3x25 3.3 kV/45 m SiC MOSFET JEDEC Qualification Activity Underway

4.9mm

7.7mm

3.3 kV/45 mSiC MOSFET

• All 3x 10 kV/350 m SiC MOSFET Qualification Fabrication Lots Completed with Good Yields• 3x25 10 kV/350 m SiC MOSFET JEDEC Qualification Activity Underway

10 kV/350 mSiC MOSFET

8.1mm

8.1

mm

Wolfspeed Develops 3.3-kV and 10-kV SiC Modules

with Customizable Device Configuration

3.3 kV Industry Standard Footprint Module with Low Inductance

Monolith Announces Fully Qualified 1200V SiC Schottky

Diodes Fabricated on 150-mm Wafers at X-FAB

Objective: Develop manufacturable, high yielding and low-cost 1200 V SiC Schottky diodes with best-in-class performance and reliability at X-FAB’s 150-mm SiC foundry.

Monolith is working with Littelfuse in bringing the fully qualified 1200V, 5A and 10A diodes to market

Monolith is currently working on expanding diode portfolio – current rating and packages

GeneSiC Fabricates 1200 V / 200 A Schottky

Diodes on 150-mm Wafers at X-FAB Texas

Multiple Devices

5 µA at 1200 V

Data from 5 Devices

1200 V / 200 A SiC packaged Schottky Diode engineering samples demonstrated with good yields at at X-FAB’s 150-mm SiC foundry

• PowerAmerica seeks public input on applied research topics addressing

gaps in knowledge and technology to enable manufacturing that will

contribute to its mission of realizing manufacturing jobs creation and

energy savings through accelerated large-scale adoption of wide bandgap

semiconductor devices in power electronic systems.

• PowerAmerica is NOT seeking to support development of:

Materials

WBG semiconductor technology areas which have not yet

demonstrated technical feasibility

Fabrication approaches for technologies that have already been

demonstrated to be suitable for high-volume manufacturing

PowerAmerica is Issuing a Request for Information (RFI)

to Develop its Funding Period 4 Request for Proposals

https://www.poweramericainstitute.org/news/poweramerica-request-for-information-rfi-now-open-for-public-input/