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Building Science Renovation and Rehabilitation Peter Baker, P.Eng, presented by www.buildingscience.com

2019-08-08 - 01 Physics - Compatibility Mode · 8/8/2019  · 2019-08-08 - 01 Physics - Compatibility Mode Keywords Created Date: 20190814153042Z

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Page 1: 2019-08-08 - 01 Physics - Compatibility Mode · 8/8/2019  · 2019-08-08 - 01 Physics - Compatibility Mode Keywords Created Date: 20190814153042Z

Building Science Renovation and Rehabilitation

Peter Baker, P.Eng,

presented by www.buildingscience.com

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Presentation Overview- Building Physics- Foundations- Mass Masonry- Walls- Roofs

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Building Physics

August 8, 2019

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What is a Building?

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A Building is an Environmental Separator

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• Control heat flow• Control airflow• Control water vapor flow• Control rain• Control ground water• Control light and solar radiation• Control noise and vibrations• Control contaminants, environmental hazards and odors• Control insects, rodents and vermin• Control fire• Provide strength and rigidity• Be durable• Be aesthetically pleasing• Be economical

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Damage FunctionsWaterHeatUltra-violet Radiation

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Water Control LayerAir Control LayerVapor Control LayerThermal Control Layer

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Window

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Configurations of the Perfect Wall

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Conduction

Convection

Radiation

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Conduction- Heat Flow by direct contact- Vibrating molecules- Most important for solids

t1 t2

t1 > t2

HEAT FLOW

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MOVING FLUID

tfluid

HEAT FLOW

tfluid < tsurface

Forced Convection- Heat Flow by bulk movement of molecules- Most important for liquids and gases- Movement driven by fans or wind

tsurface

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Natural Convection- Heat Flow by bulk movement of molecules- Most important for liquids and gases- Natural buoyancy drives movement

t1 t2

t1 > t2

HEAT FLOW

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Radiation- Heat flow by electromagnetic waves- Heat radiates from all materials, e.g. campfire- Passes through gases and vacuum (NOT Solid)

tsurface1 tsurface2

tsurface1 > tsurface2

NET HEAT FLOW

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Function of:- Material Type- Density and pore structure- Moisture content- Temperature difference

Combination of:- Conduction through material and air (or other gas)- Convection in pores- Radiation through pores

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MX.1QMEQSJ=O)9S4E!1NG):=QE!S=O

J$#*58'($#Y'+/$56+)F&'"/(&-Z

J$#%"8'($#Y,"'2""#)<(,"/0Z

!&*(&'($#Y</$F)$#")<(,"/'$)&#$'+"/Z

J$#*58'($#Y'+/$56+)&(/Z

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MX.1QMEQSJ=O).1!1NG):=QE!S=O

J$#*58'($#Y'+/$56+)F&'"/(&-Z

J$#%"8'($#Y2('+(#)H$/"0Z

!&*(&'($#Y</$F)$#")H$/")2&--'$)'+")$'+"/)H$/")2&--Z

J$#*58'($#Y'+/$56+)H$/")6&0Z

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Thermal Conductivity (k)- Material property- Time rate of heat flow through a unit thickness and

unit area of material under a unit temperature difference

Units: Btu•in/(ft2•hr•°F) or W/(m•K)

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Thermal Conductance (C)- Layer property- Time rate of heat flow through a unit area of a

material layer (or the conductivity of a material for a given thickness)

Formula: C = k/LUnits: Btu/(ft2•hr•°F) or W/(m2•K)

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Thermal Resistance- Layer property- Reciprocal of conductance- A measure of how well a material resists heat flow

Formula: Resistance = 1/CUnits: ft2•hr•°F/ Btu or m2•K/W

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R-Value or RSI- Gives heat flow as “equivalent conductance”- Includes all three modes of heat transfer- Rarely includes thermal bridging or three

dimensional heat flow- Never intended to include airtightness or mass

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Total thermal resistance RT is a sum of the thermal resistance of all the materials in the enclosure assembly.

Materials such as gypsum, plywood, OSB, wood studs, metal studs all contribute to the overall thermal resistance.

R1 R2 R3

RT = R1 + R2 + R3

Conductance through the enclosure assemblies

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Materials of lower thermal resistance create pathways of increased conductance losses, or “thermal bridges” through layers of greater thermal resistance

Thermal bridging can reduce the effective R-value of a wall assembly.

Cold Hot

A 2x6 wood stud wall 16” OC with R-19 Fiberglass Batt = effective R-13 wall assembly.

Conductance through the enclosure assemblies

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Steel is 400 times more conductive than wood

Steel studs are about 40 times thinner

R=4+

R<0.3

Cold Hot

A 2x6 steel stud wall 16” OC with R-19 Fiberglass Batt = effective R-9 wall assembly.

Conductance through the enclosure assemblies

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Conductance through the enclosure assemblies

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Conductance through the enclosure assemblies

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Conductance through the enclosure assemblies

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Commonly referred to as “Air Leakage”

Driven by air pressure differences

- wind- mechanical- stack effect

Large energy impacts (can account for 30% of the heating and cooling energy)

Convection through the enclosure assemblies

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Commonly referred to as “Convective Loops”

Driven by natural buoyancy -warm air will rise

Short circuits insulation

R-value does not take into account the potential of movement of air within an assembly.

Cold Hot

Convection within the enclosure assemblies

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Convection within the enclosure assemblies

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Paths for flow

Spaces for flow from:- Compressing batts- Inset stapling- Difficulty in filling steel

studs

Convection within the enclosure assemblies

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Convection within the enclosure assemblies

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Net radiant flow across a clear cavity

Emissivity is expressed as a fraction of energy emitted when compared to the radiation from a black body

Common in attics

Radiation from surfaces within the enclosure assemblies

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Radiation from surfaces within the enclosure assemblies

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Must have an airspace for radiant products to work

While low emitting, radiant products are often highly conductive

Energy will be conducted to other materials in contact with radiant product (framing, dirt)

Cold Hot

Radiation from surfaces within the enclosure assemblies

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J$-* M$'756%&A$;#&$1&$./68$0#&9)/&/$-.$1%&8/)-50%6&%)&*)/:

^A.(#&()*&#4.%%.13>&/$-.$1%&8/)-50%6&$/#&)9%#1&A.3A(,&0)1-50%.;#

]1#/3,&*.((&+#&0)1-50%#-&%)&)%A#/&4$%#/.$(6&.1&0)1%$0%&*.%A&/$-.$1%&8/)-50%&B9/$4.13>&-./%H

Radiation from surfaces within the enclosure assemblies

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Heat Flow Is From Warm To ColdMoisture Flow Is From Warm To ColdMoisture Flow Is From More To LessAir Flow Is From A Higher Pressure to a

Lower PressureGravity Acts Down

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Moisture Flow Is From Warm To ColdMoisture Flow Is From More To Less

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Moisture Flow Is From Warm To ColdMoisture Flow Is From More To Less

Thermal Gradient – Thermal DiffusionConcentration Gradient – Molecular Diffusion

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Moisture Flow Is From Warm To ColdMoisture Flow Is From More To Less

Thermal Gradient – Thermal DiffusionConcentration Gradient – Molecular Diffusion

Vapor Diffusion

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Thermodynamic Potential

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Building Science CorporationJoseph Lstiburek 73

Sorption Isotherms

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Building Science CorporationJoseph Lstiburek 74

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Building Science Corporationd$0"H+)O0'(,5/"[))ef

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Building Science CorporationJoseph Lstiburek 76

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Building Science Corporationd$0"H+)O0'(,5/"[))ee