2018 Project Focus of IPSR

Dr. Robert C. PfahlDirector of RoadmappingMarch 12, 2018OFC

Sponsors & Participants

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Sponsor

Lead Participants

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Goals and Objectives of IPSR

Goals• Create A Self-Sustaining Roadmapping Consortium

• Impact the Nation by Establishing the path to Volume Integrated Photonics Manufacturing

Objectives• Build an “Integrated Silicon Photonics Manufacturing” Community

• Phase 1 (2014-2015): Produced a Prioritized Manufacturing Systems Roadmap for Photonic. This Phase of the roadmap was funded by NIST AMTech – Stage 1: Initial Roadmap Development of technology needs

– Stage 2: “Emulator” Development to Quantify volume-cost objectives

– Stage 3: Creation of the R&D “Technical Plan”

• Phase 2 (2016-2020): Provide R&D Project recommendations to AIM Photonics and other specialized R&D consortia

Roadmap Participation as of November 2017

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• 17 Countries

• 926 Individuals

• 308 Organizations

2016 & 2017 Roadmaps available at www.photonicsmanufacturing.org

2018 Goals

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– Post updated IPSR 2017 containing two new chapters

– Publish comprehensive IPSR 2018– Complete Phase 1 Board Level Optical Interconnect

Project with AIM-based prototypes– Document and Implement a technical planning

process to develop additional AIG projects that address strategic gaps that AIM members see as critical

– Launch application interest groups (AIGs) to execute these critical projects

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1. Scope and Analyze the Situation1. Market (Applications)2. Technology

2. Identify the Needs and Grand Challenges1. Design Tools2. Training of Designers3. Manufacturing Technologies4. Materials5. Component Technology6. Standards Development7. Intellectual Property Protection8. Security and Information Management

3. Identify Paradigm Shifts and Strategic Concerns4. Develop Strategic Recommendations for all Stakeholders

1. Design Tools2. Manufacturing Technology3. Materials Development4. Supply Chain Development through “Industry Standards”

5. Provide these recommendations to AIM Photonics and other organizations to aid in focusing and prioritizing their Technical Plans for Research and Development

Steps in IPSR Roadmapping Process

The Technology Needs Differ by Market Segment

Data Center Product• Data center servers require

heterogeneous integration of memory, logic, power controllers and photonics in 3D-SiP package architecture to meet applications requirements in a controlled environment.

• The solution selected must provide for packaging of replacements for existing “top of rack” components.

• These solutions must include SiP based traffic analysis supporting data path switching decisions, selecting between photonic and electronic data paths and between packet switching and circuit switching.

Photonics for the Internet of Things• The internet of things (IoT) will

require a package for heterogeneous integration of sensors, RF components, memory and photonics in 3D-SiP architectures.

• The package must enable a general purpose SiP IoT hub packaging for environments that may not be well controlled.

• This capability will include energy scavenging to power the IoT hub in many cases and redundancy to ensure long term service free reliability.

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Product “Emulators” are Used To Drive Technology Requirements

Benefits of Roadmapping

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• Anticipate technology trends and paradigm shifts

• Collaborate with key players, industry experts, suppliers and customers, globally –in all major markets

• Obtain access to learning and knowledge experts

• Develop consensus for next steps

2018 IPSR Roadmap-TWGs and PEGs

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Product Emulator GroupsTWGs

Dat

a C

ente

r

Inte

rnet

ofT

hing

s

1. Monolithic Integration

2. Packaging of Integrated Silicon Photonics

3. Connectors4. Substrates5. Assembly6. Test7. Electronic-

Photonic Design Automation

8. Photonic Sensors

Cost

Sens

ors

RF

Phot

onic

s

Aut

omot

ive

IPSR Leadership

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David ArmstrongChair, Test TWGAdvantest

Additional IPSR Leadership

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• Ajey Jacob, Co-Chair Monolithic Integration TWG, Global Foundries

• Brett Attaway, Electronic-Photonic Design Automation TWG, Bridg

• Terry Smith, Interconnect TWG, 3M

• Tom Marrapode, On Board Photonics Project Chair, Molex

Strategic Recommendations from the IPSR Roadmap

Strategic Recommendations2015-2020

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• Focus Projects on Addressing the Grand Challenges– Reduction in Power per function– Reduction in Cost– Decrease Latency– Increased physical bandwidth density

• Address challenges that the supply chain will not achieve in time to address the quantified industrial needs in the IPSR Roadmap– Design Tools– Manufacturing Technology– Materials Development– Supply Chain Consolidation through “Industry Standards”

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Technical Plan for Board-Level Optical Interconnect

• The following 3 Phase Technical Plan was the result of looking for “low-hanging fruit” at the 2016 IPSR Spring Meeting.• The discussions started with the Interconnection TWG

lead by John MacWilliams• A small group met weekly to develop a Statement of

Work (SOW) for an industry led project.• As discussions have progressed, more short terms

needs have been identified that must be addressed if single mode expanded beam connectors are to be implemented in high volume.

• High volume is necessary to achieve cost objectives.

For additional information:

Bob Pfahlbob.pfahl@inemi.org

www.photonicsmanufacturing.org