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UW - Center for Intelligent Materials and Systems 1
1-D Heat Flow Measurement1-D Heat Flow : Calibrate Seebeck Coefficient for TFTC(Thin Film Thermocouples)
x
y
Heater (70°C)
Water (19°C)
UW - Center for Intelligent Materials and Systems 2
1-D Heat Flow Measurement
138014001420144014601480150015201540
1560
1580
1600
24
68
102
4
6
8
TEP(
Ther
mal
Ele
ctric
Pow
er) (µV
)
X Data
Y Data
1-D Heat Flow
1380 1400 1420 1440 1460 1480 1500 1520 1540 1560 1580 1600
y
Contour Graph 2
X Data
2 4 6 8 10
Y D
ata
2
4
6
8
10
1420 1440 1460 1480 1500 1520 1540 1560 1580
Distance vs. TEP
Distance (mm)
0 2 4 6 8 10 12 14 16
TEP
(µV)
1000
1100
1200
1300
1400
1500
1600
1700
1800
Line 1Line 2Line 3Line 4Line 5Line 6Line 7Line 8Line 9Line 10TC
slope = 19.15 µV/ °C
slope = 42.93 µV/ °C
Factor = 42.93/19.15=2.242
Temperature vs. Factor
Temperature (oC)
20 25 30 35 40 45
Fact
or
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Temperature vs. Factor
2.258
UW - Center for Intelligent Materials and Systems 3
2-D Heat Flow Measurement
x
y
Heater Location
x
y
Several thick paper : Reducing the radiationeffects
Heater Dimension :12.75mm × 12.75mm
ANSYS Simulation Used DataWater Temp.2 Measured Temp.(Channel 14, 15)
Heater size
Assumptionno radiationneglect convection (air)neglect conduction due to lead wiresTop surface of heater is really parallel to the silicon surface.
UW - Center for Intelligent Materials and Systems 4
2-D Measurement
25
30
35
40
45
50
24
68
102
4
6
8
Tem
pera
ture
(o C)
X Data
Y Data
ANSYS Simulation
25 30 35 40 45 50
25
30
35
40
45
50
24
68
102
4
6
8
Tem
pera
ture
(o C)
X Data
Y Data
Measured Data (with Factor)
25 30 35 40 45 50
25
30
35
40
45
50
24
68
102
4
6
8
Tem
pera
ture
(o C)
X Data
Y Data
Both
25 30 35 40 45 50
Minimum 0.8
Maximum 2.2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
24
68
102
4
6
8
Dev
iatio
n (o C
)
X Data
Y Data
Deviation
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Analysis
Measurement Errors
Both
