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AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail info@ats.net
www.ats.net
PCB materials for Automotive applications
iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015
2
Short Overview about AT&S
Material basics + qualification process
Product examples with advanced material requirements
High frequency materials for automotive radar
Agenda
AT&S Group
AT&S is currently the Technology Leader in HDI* and Any-Layer Boards
Highest automated HDI factory in China
No. 1 - ECP®** supplier with real commercial and industrial set up
Largest European PCB supplier
Largest PCB producer in India
Supplier of the Top Players in each targeted segment
* HDI = High Density Interconnect ** ECP = Embedded Component Packaging
3
4
AT&S Locations
Production facilities in Europe and Asia Headquarters in Leoben, Austria Procurement center in Hong Kong, China
Design center in Düren, Germany Sales network spanning three continents About ~8000 employees
BU IA Plant Leoben, Austria Headquarters Staff: ~ 900 Customer Orientation: 9% Automotive 91% Industrial
BU IA Plant Fehring, Austria Staff: ~350 Customer Orientation: 44% Automotive 56% Industrial
BU MS Plant Shanghai, China Staff: ~4.500 Customer Orientation: 84% Mobile Devices 14% Automotive 2% Industrial
BU IA Plant Ansan, Korea Staff: ~250 Customer Orientation: 13% Automotive 47% Industrial 40% Mobile Devices
BU IA Plant Nanjangud, India Staff: ~1.100 Customer Orientation: 60% Automotive 40% Industrial
BU MS Plant Chongqing, China under construction Staff: ~1000
AT&S AG Headquarters
Leoben, Austria
BU MS Headquarters
Hong Kong, China
AT&S AG Headquarters Sales Offices /Representations Business Unit Mobile Devices & Substrates (BU MS) Business Unit Industrial & Automotive (BU IA)
5
AT&S plants / installed capacity [m²]*
* Maximum capacity of plants Source: AT&S
AT&S plants
Technology: DS-PTH, Flex
Volume: low-mid
Market: IND / AUT
Technology: Standard ML
Volume: mid-high
Market: IND / AUT
Technology: HDI
Volume: high
Market: MD / IND / AUT
Technology: HDI / Standard ML,
Flex
Volume: Samples, Prototyps
low-mid
Market: IND / AUT
Technology: Flex / ridid-flex
Volume: mid-high
Market: MD / IND / AUT
380k
120k 300k
130k ~ 200k
Nanjangud Shanghai Seoul (Korea) Leoben Fehring Chongqing
710k
Under Construction
IC-substrates
6
Material: Prepreg, Core, copper foils
6
Carrier- und Isolation material with increasing requirements
Electrical Performance (Impedance, Signalspeed-/loss, higher frequencies…)
Thermal Performance
(TCT performance , Thermal stress, thermal conductivity…)
Physical Performance (Miniaturisation, Rigidity, Flexibility, Peel Strength, …)
• Prepreg: Glass cloth with resin; pre-cured; different types of glass clothes available,
• Core:
Prepreg with copper on top and bottom (CCL = copper clad laminate); fully cured
• RCC:
Resin Coated Copper; used only for HDI (laser drilling); no glass cloth, pre-cured
Base material introduction
7
Base material introduction
8
Base material introduction
1037
106
1080
2116
9
Base material introduction
10
Warp and weft (Grain direction )- glass fibers – different number of fibers in one bundle - different number of glass bundles per centimeter.
11
…currently used resin systems
• FR4 halogenated / halogen-reduced (e.g. R1755M, R1755V, R1566WN, 370HR …)
• FR4 high TG / halogen reduced / high speed (e.g. EM888, R1577, …)
• PPE Polyphenylether (low Dk Df) (e.g. Megtron7, Megtron 6, Megtron 4S, …)
• HF Hydrocarbon / Ceramics (low Dk Df) (e.g. RO4000 …)
• PI Polyimid (PI-glass , PI flex) (e.g. 35N, N7000, P96, DuPont, UBE, ..)
• LCP Liquid Crystal Polymer (flex, low water abs., low Dk Df) (e.g.FR-705T)
• PTFE Polytetrafloureten (Teflon) (e.g. RO3003, …)
• Substrate (Low CTExy, ..) (e.g. MCL E700, …)
12
Customer requirements
• IPC-class sheet defined
• RoHS conform (environmental feature)
• Halogen reduced (environmental feature)
• Lead free solder compatible (thermal reliability)
• CAF resistant
• TG (temperature related reliability)
• TCTxyz, CTExyz (temperature cycle reliability)
• Er (Dk) , Df (electrical signal performance)
• Degradiation Temperature (thermal reliability)
• T260 , T288 (time to delamination, thermal reliability)
• High thermal conductivity (heat transfer)
• Mechanical properties (Drop Test, stiffness, etc.)
13
„Standard“ FR4
Material definition at AT&S
Halogenated (ROHS) or Halogen reduced materials
TG 150 , 170 , …
Reliability: Leadfree soldering , Low CTE z for temperature cycle tests
High Speed , Low Loss
HF/PPE (Hydrocarbon Ceramics, Polyphenylenether, …)
PTFE , LCP , …
Low CTE x y , Special Modulus Materials
BT / CE / ..Blend (Bismaleinimid-Triazin resin , Cyanatester)
CTE x y Reliability solutions
13
14
AT&S material Analysis To protect special technology requirements (material and final application):
• Reflow [thermal stability, delamination]
• Scanning Measuring Machine [accurate overall Dimensional Panel behaviour]
• SEM: Scanning Electron Microscope [check Filler, roughness, etc.]
• EDX: Energy Dispersive X-ray spectrometer [element analysis]
• FTIR: Fourier Transforming Infra-Red Spectroscope [footprint resin system]
• DSC: Differential Scanning Calorimeter [TG]
• MFK: Model Free Kinetic (DSC) [required energy to cure B-stage resin]
• TGA: Thermo Gravimetry [Degradiation]
• TMA: Thermo Mechanical Analysis [TG mechanical, CTE, TTD time to delamination]
• DMA: Dynamic Mechanic Analysis [TG , thermomechanic behaviour]
• Rheometer / Viscosimeter [viscosity and curing behaviour of resin system]
• Peel Strength Tester [Cu peel strength, all sorts of peel strength]
• TCT – Tester [temperature cycle test e.g. -40/+125° 1000 Cycles]
• HAST (CAF/SIR) [High Accelerated Stress Test , Conductive Anodic Filament, Surface Insulation Resistance]
• Laboratory Press [resin flow, prepreg cure]
• Climatic Chamber [humidity, temperature simulations]
• Drop Test
• Bending Test [Flex, Semiflex application]
Prototyping asap, define risk managment with the customer
Process parameter qualification app. 3 months
UL Qualification Flammability, Full Recognition app. 6 months
15
Material Qualification + UL Listing
- Technology requirements , qualification time and cost will define the material selection - Check existing material portfolio New Technologies and new materials on the market require ongoing material qualifications
16
Standard qualification
Qualification process
Resin assignment
Process parameter definition
Reliability Tests
Reliability Qualification
Special , increased Reliability Requirements
Temperatur Cycle Test x y z direction (smaller packages)
HAST
CAF requirements / Design
… let us know your requirements ?
New applications will require adjusted reliability tests
Laboratory equipment and AT&S Know How allow sophisticated customer solutions
Quelle: foto: lowe ggk
Quelle: foto: lowe ggk
Radar
Short range radar 24 GHz (79GHz) and long range radar 77 GHz AT&S produces standard multilayer controller boards as well as hybrid multilayer boards implementing high-frequency materials addressing the requirements for modern automotive radar systems.
Cameras are increasingly supported by radar technology for blind spot detection, rear pre-crash, rear cross traffic alert, vehicle assistant and lane change assistant systems.
Frequency Allocation Dilemma
18
Source: ANALOG DEVICES
RF Roadmap RF Stack up Material (Dk / Df) 2014 2015 2016 2017 2018 2019
30 GHz Homogeneous Stack up FR4 < 3,6 / 0,01
45 GHz Asymmetric Hybrid FR4 < 3,4 / 0,004
80 GHz Asymmetric Hybrid + PTFE (…) FR4 / PTFE < 3 / 0,002
> 80 GHz Homogeneous Stack up with PTFE (…) PTFE < 3 / 0,002
R&D Implementation Ramp / Volume
Homogeneous Stack up Asymmetric Hybrid Stack up
19
Dk (Dielectric Constant) Df (Dissipation Factor)
Material
20
< 5 GHz
< 20 GHz
< 30 GHz
35-90 GHz
Frequency Speed
~ 1,5 GB/s
~ 7 GB/s
~ 10 GB/s
~12-30 GB/s Very Low DK
PTFE (Teflon), LCP
Dk 2.0-3.0 Df 4 Df > 0.015
Losses due to the influence of copper foil treatment: Skin Effect 1
Design & PCB Optimization
21
Treatment Rz= 5 – 7 µm @ 17µm Treatment Rz= 4 µm @ 17µm
Impact of treatment with increasing frequency!
21
Concept 1 Concept 2 Concept 3 Line Shape
Trace Geometric
Design & PCB Optimization
22
Losses based on the PCB structuring : Skin Effect 2
Smooth Line Shape & Trace Geometry reduce losses! 22
Skin Depth
Contact Information
In case of any questions…
23
Michael Gössler Engineering Manager Fabriksgasse 13 8700 Leoben Tel: +43/3842/200/5687 Mobile: +43/676/89555687 E-Mail: m.goessler@ats.net
PCB materials for Automotive applications � �iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015Slide Number 2AT&S GroupAT&S LocationsSlide Number 5Slide Number 6Base material introductionSlide Number 8Slide Number 9Base material introductionSlide Number 11Slide Number 12Slide Number 13Slide Number 14Slide Number 15Slide Number 16RadarFrequency Allocation DilemmaSlide Number 19Slide Number 20Slide Number 21Slide Number 22Contact Information
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