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2013 iNEMI Roadmap
2013 Webinar Series
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About iNEMI
International Electronics Manufacturing Initiative (iNEMI) is an industry-led
consortium of 110 global manufacturers, suppliers, industry associations,
government agencies and universities. A Non Profit Fully Funded by Member
Dues; In Operation Since 1994.
Visit us at www.inemi.org
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Document
• Proactive Forums
• Position Papers
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
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Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
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iNEMI Optoelectronics Roadmap
Tom Hausken
Dick Otte
Bill Bottom
Kim Kimerling
iNemi Roadmap, Optical Electronics Chapter
“Optical Electronic Data Transfer:
Technical Gaps, Needs and Non-Needs”
Richard Otte
TWG Chair Promex Industries Inc.
iNemi Webinar July 26, 2013
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Agenda
• iNemi OE Roadmap Overview
• Photons vs Electrons
• Application Needs
– Telecom
– Active Optical Cables
– Photonic Backplanes
– Microprocessor IO Bandwidth Density Need
– On-Chip Optical Interconnect
• Notions From the Roadmap Efforts
– Recent Potentially Important Innovations
– Potential Black Swans
iNemi OE Roadmap
Overview
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Roadmap Sources
• iNemi Optical Data Communications Chapter
– http://www.inemi.org/2011-inemi-roadmap
• Collaborators
– MIT Communications Technology Roadmap
– International Technology Roadmap for
Semiconductors, Assembly & Packaging TWG
– IPC
– OIDA
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Table 17. In-to and Out-of Package - Key Atttribute Needs
Intended to cover Optical IO for SiP (System in a Package) for distance on-card and longer
Optical source in a separate die, on the chip or in the chip.
Year 2011 2013 2015 2017 2023
Data rate/lane, fiber or
waveguide, Gb/s
10 14 25 40 40
Optical media; fiber
waveguide
Fiber/ Some
Waveguide
Fiber/Waveguid
e
Fiber/Waveguid
e
Fiber/Waveguide Waveguide/Some
fiber
Optical wavelength 850/1350/1550 850/1350/1550 850/1350/1550 850/1350/1550 850/1350/1550
#I/O per chip 96 128 512 1024 8192
max #
wavelengths/waveguide
1 1 4 8 32
Wavelength spacing, nm NA NA 20 40 10
Optical power,
mw/wavelength
0.1 to 1.0 0.1 to 1.0 0.1 to 1.0 0.1 to 1.0 0.1 to 1.0
Optical mode; multi/single multimode multimode multimode/sing
lemode
multimode/single
mode
multimode/single
mode
Light Source; VCSEL, other
laser, in-chip, etc.
VCSEL VCSEL VCSEL/in-chip VCSEL/in-chip VCSEL/in-chip
Physical Modulation Method
(direct or secondary)
direct direct direct direct direct
Construction; hybrid,
Integrated, etc.
SiP SiP SiP/hybrid/sour
ce integrated in
chip
SiP/hybrid/sourc
e integrated in
chip
SiP/hybrid/source
integrated in chip
Optical off-package density;
Gb/s/mm2
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Optical Connector density;
Gb/s/mm2
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Power/bit, pJ 20 10 <5 <3 <1
Transceiver cost, $/Gbs $ 2.24 $ 1.43 $ 0.92 $ 0.59 $ 0.19
Technology Status (ITRS format) Manufacturab
le solutions
exist, and are
being
optimized
Manufacturab
le Solutions
are Known
Manufacturab
le solutions
are NOT
known
Photons vs Electrons
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Photons vs Electrons for Data
Communications Photonic Electronic Comparison,
photonic/electro
nic
Waveguide/
conductor pitch
1 + 2 micron = 3
microns +/-
2 x 22 nm = 0.044
microns
1:68
Channels/mm 8 to 333
depending on
crosstalk &
cladding req’d
22,700 at 22 nm
node
1:2840 to 1:68
Bandwidth/chan
nel
128 x 40 Gbit/sec
= 5+Tbit/sec
10Gbit/sec 512:1 or more
Energy/bit Only Launch &
Receive losses,
2 to 25 pJ/bit is
SOA
As low as
0.1pJ/bit on-
chip. Greater
due to I2R + tan
delta with
distance.
Photons less if
distance greater
than a few cm
Cross coupling Easily eliminated Major Issue Photons win!
Application Needs
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Telecom Needs
• Drivers:
– Providing capacity with need growing +40%/yr.
– Minimizing Cost
– Increasing energy efficiency
– Providing more bandwidth to more users
• Solutions:
– Transmit more data through provisioned plant
• Lane data rates to 100 Gb/s, then 400, 1Tb/s, …. ??
• Greater spectral efficiency; 10 bits/Hz ?
– Stay in the Optical domain, especially to serve more end users
• Switch optically; avoid optical-to-electronic-to-optical conversions
– Develop a new network architecture to capitalize on optical capabilities
• Software defined network
• 1000 x 1000 switching
• No fixed wavelength grid
• Etc.
• Utilize Photonic Integrated Circuits (InP) ??
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Optical Data Communication & Telecom
• The Telecom View of optical technologies is evolving:
– OE was viewed as a long haul technology
– Increasingly, OE is viewed more broadly:
• An enabler of FTTX
• An energy and space saver
• An enabler of alternate architectures
– Implies much higher volumes and lower cost
implementations
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Active Optical Cables
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Figure 3: A 2010 Data Center requires about 25 megawatts of power so energy saving technology is
important.
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AOC:
An Optical Electronic Success
• Saves 75% of power and space
• Growing rapidly
• The Low Adoption RISK Accelerated Acceptance !!
– Could go back to copper if he did not work.
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Active Optical Cable Needs
• Drivers
– Reducing interconnect power
– Reducing interconnect size and space
• Solutions; Continuing Evolution
– More connector/electrical replacements
– Less power (@ ~10pJ/bit @ 10Gb/s, going to 25Gb/s)
– Smaller Size
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Photonic Backplane
Optical backplane
Daughter-board
Optical connector
Opto－electrical
connector
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Photonic Backplane Needs
• Driver
– Require less power and space at data rates > 10Gb/s than is required in an electronic backplane
– Electronics limited to ~20Gb/s at 1 meter
• Solutions
– A Physical Architecture that combines optical and electrical
– A robust optical & electrical card to backplane connector.
• Able to tolerate dust resulting from air cooling
– An architecture that eliminates the backplane
• PERC supercomputer “drawer” concept
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A. Shibata,
Japanese Electronics
Packaging
and Circuits Association
(JEITA)
Optical backplane
Daughter-board
Optical connector
Electric connector
Flexible optical circuit/
optical cables with connector
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Microprocessor Bandwidth
Density Need • Drivers
– The ITRS Roadmap forecasts IO doubling every 2
years; 2.5Tb/s in 2012 to 80Tb/s (32X) in 2022.
– ITRS Roadmap 2022 Projection
• 40 Gb/s modulation/wavelength
• 40 watts for IO or 0.5pJ/bit.
• Density of 89Gb/s/mm2 IF a 30 mm x 30 mm package
• Cost of <$0.14/Gb/s
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Table AP 23 Optical IO for SiP (System in a Package) for distance on-card and longer.Year 2012 2014 2016 2018 2020 2022
Max Package I/O Data Rate, Gb/s 2,500 5,000 10,000 20,000 40,000 80,000
Max IO Power dissipation, watts 40 40 40 40 40 40
Optical media; fiber, waveguide, optical viaRibbon Fiber Fiber/Waveguide Fiber/Waveguide Fiber/Waveguide
Waveguide/Some
fiber
Waveguide/Some
fiber
Optical wavelength 850 850/1350/1550 850/1350/1551 850/1350/1553 850/1350/1551 1350/1551
Max Data rate/Optical Lane, Gb/s 10 25 25 25 40 40
max # wavelengths/waveguide 1 1 4 8 8 16
Max Data rate/Optical IO, Gb/s 10 25 100 200 320 640
Optical #I/O per package 250 200 100 100 125 125
Wavelength spacing, nm NA NA NA NA 20 5
Optical power, mw/wavelength 0.1 to 1.0 0.1 to 1.0 0.1 to 1.1 0.1 to 1.3 0.1 to 1.0 0.1 to 1.0
Optical mode; multi/singlemultimode
multimode/single
mode
multimode/single
mode
multimode/single
mode
multimode/singlem
ode
multimode/single
mode
Light Source; VCSEL, laser, in-chip, etc. VCSEL/hybrid VCSEL/hybrid VCSEL/in-chip VCSEL/in-chip VCSEL/in-chip VCSEL/in-chip
Physical Modulation Method (direct or
secondary modulators)direct direct direct direct direct modulators direct modulators
Construction; hybrid, Integrated, etc. SiP SiP
SiP/hybrid/sourc
e integrated in
package
SiP/hybrid/sourc
e integrated in
package
SiP/hybrid/source
integrated in chip
SiP/hybrid/sourc
e integrated in
chip
Optical off-package density; Gb/s/mm2 of
board space. 30 mm x 30 mm footprint2.8 5.6 11.1 22.2 44.4 88.9
Optical Connector density; Gb/s/mm of SiP
edge 4 x 30 mm21 42 83 167 333 667
Max Power/bit, pJ 16.0 8.0 4.0 2.0 1.0 0.5
Optical IO Cost, $/Gbs $ 1.34 $ 0.86 $ 0.55 $ 0.35 $ 0.23 $ 0.14
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Microprocessor Bandwidth
Density Need • Solutions of Interest
– Replace electrical differential pair IO with Optical Sources and Detectors; 1 data lane per optical IO.
• Add optical IO parts to CMOS substrate
• Source driver and TIA built into CMOS chip
• Build waveguides in PCB
– Separate Electronics and Photonics: Electronic Package on Photonic Interposer with optical multiplexing
• Source driver and TIA built into CMOS chip
• Integrate Optical sources, detectors, waveguides, multiplexers, demultiplexers into an interposer
• Build waveguides in PCB
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Fabrication Alternatives To Implement Microprocessor
Optical IO
I. Assemble Discrete parts II. Integrate on a Platform
Mounts on optically Enabled Daughter card With Waveguides and 45
o mirrors combined
With conventional copper traces. Optical connectors might be added at card edge.
0.6 mm solder ball on 1 mm pitch Quad photodetector chip, 0.25 x 0.5 mm Quad VCSEL chip, 0.25 x 0.5 mm Optical focus element to collimate light
$689/package 12.Tb/s 3.2 pJ/bit @ 40W $151/package 48Tb/s 0.8pJ/bit @ 40W
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Photonic Interposer
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Things Learned Re: Optical IO Implementation
• Assemblying hundreds of individual parts is expensive. • Electronic substrates are used to Increase pitch; they are spacial impedance matchers between chips
(~0.170 mm pitch) and circuit boards (1.0 mm). • VCSELs, PINs, waveguides and multiplexers are small compared to electrical IOs. • Microprocessor package size may be limited by the number of IO needed for power and ground. • De-multiplexers are relatively large (Is this always true ?) • When optical devices are made with integration, the cost depends only slightly on the # of devices per
unit area. • Cost and density views do not depend on SM or MM; space for either is available. • The Optical IO data rate is no longer space or size limited but multiplex/ demultiplex density limited.
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On Chip
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On-Chip Optical Issues
Optical, Potential Electrical, Now
Point to Point on Chip
Power 1 ? pJ/bit To 10 pJ/bit ~ 0.1pJ/bit up to 1 mm
Lane Density, pitch ~ 3 micron pitch ~ 0.044 micron pitch
Data Rate/”connection” 10 ? Tb/s per
waveguide
100 Gb/s per conductor
pair
On-to & Off-of Chip
IO Data density,
Gb/s/mm2
>10Tb/s/0.16 mm2 25Gb/s/mm2
Power 1 ? pJ/bit To 10 pJ/bit 0.8 pJ/bit (1V, 50 Ohm)
Data rate/IO 1Tb/s 20Gb/s
“Reach” Meters ~25 cm
Notions From The Roadmap
Efforts
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• The Optical Interposer concept • Continual Improvement in Ring Oscillator Technology • The demonstration of lasing in several new material systems • Multi core fiber • “Clear curve” fiber; 2mm radius
Recent Potentially Important Innovations
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Potential Black Swans Implication
An All Optical Digital Signal
Regenerator
Unlimited regeneration in the optical
domain without conversion to the
electronic domain. Eliminate
amplifiers and their noise input.
A method of terminating and
connectorizing glass fiber as easily as
plastic optical fiber.
Major cost savings and increase in
applications.
An 95+% efficient converter of
electrical energy to narrow bandwidth
light that is easily modulated.
Power saving; implementation of
many proposed concepts.
An Architecture that utilizes free-space
for optical interconnect
New hardware architecture that,
ideally, is “better” than current
architecture.
Meta Materials Development What Unique Capabilities might
Emerge ?
Questions and Answers
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20 Technology Roadmaps
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Organic PCB Board
Assembly Customer
Optoelectronics Large Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging
&
Component
Substrates
Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Systems
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Aqua=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
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2013 iNEMI Roadmap Webinar Series
For access to the link to the recording
for this webinar go to:
http://www.inemi.org/node/2036#rm
2013 Roadmap Pricing
• Full roadmap $3000*
(USB drive)
• Single chapter $ 500
(PDF download)
• Special pricing for research
institutes, universities, gov’t
agencies & non-profits
• Full roadmap $ 500*
• Chapter $ 100
* + $100 shipping outside North America
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www.inemi.org Email contacts:
Chuck Richardson
Bob Pfahl
