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U.D. ZeitnerFraunhofer Institut für Angewandte Optik und Feinmechanik
Jena
Micro- and Nano-Technology...... for Optics
3.1 Layer Deposition
Micro- and Nano-Technology...... for Optics
3.1 Layer Deposition
Realization of Microscopic Structures
de-magnified imaging
camera
Ruby-Lith Mask Making
2. Resist exposure with
e-beam lithography
Typical Micro-Structuring Process
3. Resist development
4. Chromium etching
(RIE)
5. Deep etching into
substrate (ICP)
resist
Cr-layer
SiO2-Substrate
radiation1. Substrate coating
Thin Film Deposition Techniques
layer deposition
from vapor / gaseous phase from liquid phase
CVD PVD
thermal
activation
plasma
activation
sputtering thermal
evaporation
• dip coating
• spray coating
• spin coating
• galvanic layer
deposition
CVD – Thermal Activation
CVD – Plasma Enhanced (PECVD)
CVD – Plasma Enhanced (PECVD)
anode
cathode
HF-electrode
ground
reactor
chamber
gas inlet
gas outlet
substrate
plasma
PVD Techniques
Sputtering
anode
cathode
HF-electrode
ground
reactor
chamber
gas inlet
gas outlet
substrate
plasma
target
(layer material)
target atom
Thermal Evaporation
typical evaporation
sources
Electron Beam Evaporation
Particle movement in vacuum
pressure [Pa]
mean f
ree p
ath
length
[m
]atmospheric
pressure:
101 kPa ≈ 105 Pa
Liquid Phase Layer Deposition: Dip Coating
Liquid Phase Layer Deposition: Spin Coating
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