U.D. ZeitnerFraunhofer Institut für Angewandte Optik und Feinmechanik

Jena

Micro- and Nano-Technology...... for Optics

3.1 Layer Deposition

Micro- and Nano-Technology...... for Optics

3.1 Layer Deposition

Realization of Microscopic Structures

de-magnified imaging

camera

Ruby-Lith Mask Making

2. Resist exposure with

e-beam lithography

Typical Micro-Structuring Process

3. Resist development

4. Chromium etching

(RIE)

5. Deep etching into

substrate (ICP)

resist

Cr-layer

SiO2-Substrate

radiation1. Substrate coating

Thin Film Deposition Techniques

layer deposition

from vapor / gaseous phase from liquid phase

CVD PVD

thermal

activation

plasma

activation

sputtering thermal

evaporation

• dip coating

• spray coating

• spin coating

• galvanic layer

deposition

CVD – Thermal Activation

CVD – Plasma Enhanced (PECVD)

CVD – Plasma Enhanced (PECVD)

anode

cathode

HF-electrode

ground

reactor

chamber

gas inlet

gas outlet

substrate

plasma

PVD Techniques

Sputtering

anode

cathode

HF-electrode

ground

reactor

chamber

gas inlet

gas outlet

substrate

plasma

target

(layer material)

target atom

Thermal Evaporation

typical evaporation

sources

Electron Beam Evaporation

Particle movement in vacuum

pressure [Pa]

mean f

ree p

ath

length

[m

]atmospheric

pressure:

101 kPa ≈ 105 Pa

Liquid Phase Layer Deposition: Dip Coating

Liquid Phase Layer Deposition: Spin Coating