MEMS Deployment in Ubiquitous Intelligence Era MEF 2014-rev · 2014-05-08 · • Top 5 IoT...

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MEMS Deployment in a Ubiquitous Intelligence Era – Foundry View

Dr. Keh-Ching Huang Corporate Marketing

UMCApr. 2014

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34 Years Experience20 Years Pure-Play Foundry

16,000 Employees1,100 R&D Engineers

500,000 wpm Capacity12” Fab x28” Fab x76” Fab x1

$4B Revenue24% from <=40nm

28nm Ramp Up 2Q1414nm Pilot 2014/E

12ATainan

8ABHsinchu

Fab 12iSingapore

8C & DHsinchu

8EHsinchu

8NSuzhou

8FHsinchu

8SHsinchu

6AHsinchu

UMC Facts in One Slide

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Outline

• All Good Things…• Next Semiconductor Driving Force

• IoT• Wearable

• MEMS Enablement Proposal• Summary

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Title of final episode of Star Trek, The Next GenerationGeoffrey Chaucer, father of English literature

All good things, must come to an end…

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Just like everthing else…

5

Advanced Technology Driver Out of Steam

-40%

-20%

0%

20%

40%

60%

80%

100%

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015

Volu

me

Gro

wth

Rat

e

Source: IDC, Gartner, CM

Feature Phone: (-21%)

PC: (-8%)

LCD TV: (-5%)

Smartphone: 6%

Tablet: 9%

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Leonardo Da Vinci

Learn to see and realize that everything connects to everything else.

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Data Alchemy Drives The Need

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IoT, Big Data and Cloud Computing

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Ubiquitous Intelligence Future

smart glass

smart mobiles

Wearable – watch, bio-info

locationlocation

safety

Infotainment

Power Management

Games

Entertainment

Appliances

Information

Finance

Security

ID

Datacloud

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WW IoT Market Prospect

• IoT market by 2020• 50bn units • US$ Trillions

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WW IoT Advocators

• Top 5 IoT Countries• USA, EU, South Korea, Japan, China

• Major government projects• China

• Important tasks and major projects of “12th Five-Year Development Plan”

• IoT Centers, Shanghai, Wuxi, and Guangdong

• Europe• IERC, IOT European Research Cluster, is a cooperation

platform and develop a research vision for IOT activities in Europe

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‘Internet Of Things’, Where The Money Goes

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Inflection at 2017, enough time for preparation

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IoT Engine Revving Up

• 5 quintillion byte data per day generated• 50B devices by 2020, inflection point 2017

• >30% CAGR from 2013 to 2020• >200KWPM (12in) in 2020

• Market fragmented, commodity process won’t cut it!• System knowhow, tailor-made processes, partnership

• Most devices in mature nodes, but new requirements, especially power the major concern.

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Main IOT Applications & Key Technologies

IOT

: MCU : AP : RF/Connectivity : Sensors

Wearable Device

Smart Grid

Remote Healthcare

Smart Home/Building

Smart Logistic/Retail

Smart Transport

LP MCU

HP AP

BT/BLEZigbee2G/3G/4G

MEMS

LP MCU

RFID/NFCGPS

MEMS

LP MCU

RFID/NFCGPS

MEMS

LP MCU

HP AP

ZigbeePLCWi-FiBT/BLE

MEMS

LP MCU

HP AP

ZigbeePLCWi-FiBT/BLE

LP MCU

BT/BLE

MEMS

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IOT Solution at Low Power Platform

ProcessingMCU/eNVMProcessingMCU/eNVM

SensingSensor/MEMS

SensingSensor/MEMS

CommunicationConnectivity/

RF

CommunicationConnectivity/

RF

Low Power/

Energy Harvest

Technology

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A Wearable Deluge

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IoT Application Heats Up -- Wearables

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IoT Application Heats Up -- Wearables

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IoT Application Heats Up -- Wearables

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IoT Application Heats Up -- Wearables

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IoT Application Heats Up -- Wearables

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IoT Application Heats Up -- Wearables

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IoT Application Heats Up -- Wearables

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IoT Can Be A Blessing or Curse…

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How Will MEMS Participate in IoT Party?

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Diversified Usage Scenarios for MEMS Sensors

RF MEMS

e-Compass

Gyroscope

Micro Fuel Cell

MEMS Mic.

Pico Projector

Auto Focus

P-sensor

Accelerometer

MEMS Oscillator

6-/9-axis IMUs

RH/T Sensor

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ThickPoly

ThickPoly

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Existing Working Model: Modular Process

MEMSPlatform

Thick Oxide

WaferThinning

PIQ Release

SpecialMetal

OxideVHF

Release

Wafer Bonding

SiDry 

Release

OxideWet

Release

CMOSPlatform

ThickPoly

StressControllable 

SiN

DoubleSide

Alignment

OxideDRIE

Si DRIE

StressControllable 

Poly

Lift Off

ThickPoly

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MEMS Modules Production Examples

ApplicationDouble Side 

Aligner

Si DRIE

OxDRIE

PIQ release

Ox Vapor HF

Wet OxHF

release

Pt dry etch

Micro‐ phone A V V V

Micro‐ phone B V V V V

Micro‐phone C  (CMOS+ MEMS) V V V

Accelerometer V

Gas sensor V V V V

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DRIE Process for Si Etching

• Scallop control vs process through-put

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Scallop control of DRIE Bosch Si etching

Through-pitch profile control of DRIE Bosch Si etching

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Oxide DRIE & Isotropic Si Etching

• MEMS structure fine tuning by Oxide+Si DRIE

Cross section of accelerometer with silicon released underneath

Top view of MEMS structure with silicon released underneath

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Oxide Release Process

• Vapor HF (dry) oxide release process uniformity control vs. through-put

• Pattern loading effect considerations

SEM view of MEMS structure after VHF oxide release

Process scheme of VHF oxide release

Tungsten

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• Film stress control• Chemistry, temparature, RF Power, …

• Chamber release uniformity• Etching recipe, drying procedures, …

Difficulties Persist With Modulized Processes…

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Things need to be done differently!

More than a year proces tuning typicallyLose-lose case for customer and foundry

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An Open MEMS Design Environment Proposed

Fine grain process modules

Accurate model database

Package-aware service flow

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Summary• IoT will drive MEMS shipment

• MEMS market diversified, process development

cycle too long

• Slow time to market, high entry barrier, deter innovation

• Cowork with supply chain to facilitate delivery

• Fine grain process modules

• Accurate model database

• Package-aware service flow

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Thank You