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ConfidentialConfidential
MEMS Deployment in a Ubiquitous Intelligence Era – Foundry View
Dr. Keh-Ching Huang Corporate Marketing
UMCApr. 2014
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34 Years Experience20 Years Pure-Play Foundry
16,000 Employees1,100 R&D Engineers
500,000 wpm Capacity12” Fab x28” Fab x76” Fab x1
$4B Revenue24% from <=40nm
28nm Ramp Up 2Q1414nm Pilot 2014/E
12ATainan
8ABHsinchu
Fab 12iSingapore
8C & DHsinchu
8EHsinchu
8NSuzhou
8FHsinchu
8SHsinchu
6AHsinchu
UMC Facts in One Slide
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Outline
• All Good Things…• Next Semiconductor Driving Force
• IoT• Wearable
• MEMS Enablement Proposal• Summary
3
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Title of final episode of Star Trek, The Next GenerationGeoffrey Chaucer, father of English literature
All good things, must come to an end…
P. 4
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Just like everthing else…
5
Advanced Technology Driver Out of Steam
-40%
-20%
0%
20%
40%
60%
80%
100%
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Volu
me
Gro
wth
Rat
e
Source: IDC, Gartner, CM
Feature Phone: (-21%)
PC: (-8%)
LCD TV: (-5%)
Smartphone: 6%
Tablet: 9%
ConfidentialConfidential
Leonardo Da Vinci
Learn to see and realize that everything connects to everything else.
P. 6
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Data Alchemy Drives The Need
P. 7
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IoT, Big Data and Cloud Computing
P. 8
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Ubiquitous Intelligence Future
smart glass
smart mobiles
Wearable – watch, bio-info
locationlocation
safety
Infotainment
Power Management
Games
Entertainment
Appliances
Information
Finance
Security
ID
Datacloud
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WW IoT Market Prospect
• IoT market by 2020• 50bn units • US$ Trillions
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WW IoT Advocators
• Top 5 IoT Countries• USA, EU, South Korea, Japan, China
• Major government projects• China
• Important tasks and major projects of “12th Five-Year Development Plan”
• IoT Centers, Shanghai, Wuxi, and Guangdong
• Europe• IERC, IOT European Research Cluster, is a cooperation
platform and develop a research vision for IOT activities in Europe
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‘Internet Of Things’, Where The Money Goes
12
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Inflection at 2017, enough time for preparation
P. 13
IoT Engine Revving Up
• 5 quintillion byte data per day generated• 50B devices by 2020, inflection point 2017
• >30% CAGR from 2013 to 2020• >200KWPM (12in) in 2020
• Market fragmented, commodity process won’t cut it!• System knowhow, tailor-made processes, partnership
• Most devices in mature nodes, but new requirements, especially power the major concern.
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Main IOT Applications & Key Technologies
IOT
: MCU : AP : RF/Connectivity : Sensors
Wearable Device
Smart Grid
Remote Healthcare
Smart Home/Building
Smart Logistic/Retail
Smart Transport
LP MCU
HP AP
BT/BLEZigbee2G/3G/4G
MEMS
LP MCU
RFID/NFCGPS
MEMS
LP MCU
RFID/NFCGPS
MEMS
LP MCU
HP AP
ZigbeePLCWi-FiBT/BLE
MEMS
LP MCU
HP AP
ZigbeePLCWi-FiBT/BLE
LP MCU
BT/BLE
MEMS
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IOT Solution at Low Power Platform
ProcessingMCU/eNVMProcessingMCU/eNVM
SensingSensor/MEMS
SensingSensor/MEMS
CommunicationConnectivity/
RF
CommunicationConnectivity/
RF
Low Power/
Energy Harvest
Technology
15
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A Wearable Deluge
P. 16
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IoT Application Heats Up -- Wearables
P. 17
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IoT Application Heats Up -- Wearables
P. 18
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IoT Application Heats Up -- Wearables
P. 19
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IoT Application Heats Up -- Wearables
P. 20
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IoT Application Heats Up -- Wearables
P. 21
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IoT Application Heats Up -- Wearables
P. 22
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IoT Application Heats Up -- Wearables
P. 23
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IoT Can Be A Blessing or Curse…
P. 24
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How Will MEMS Participate in IoT Party?
25
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Diversified Usage Scenarios for MEMS Sensors
RF MEMS
e-Compass
Gyroscope
Micro Fuel Cell
MEMS Mic.
Pico Projector
Auto Focus
P-sensor
Accelerometer
MEMS Oscillator
6-/9-axis IMUs
RH/T Sensor
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ThickPoly
ThickPoly
P. 27
Existing Working Model: Modular Process
MEMSPlatform
Thick Oxide
WaferThinning
PIQ Release
SpecialMetal
OxideVHF
Release
Wafer Bonding
SiDry
Release
OxideWet
Release
CMOSPlatform
ThickPoly
StressControllable
SiN
DoubleSide
Alignment
OxideDRIE
Si DRIE
StressControllable
Poly
Lift Off
ThickPoly
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MEMS Modules Production Examples
ApplicationDouble Side
Aligner
Si DRIE
OxDRIE
PIQ release
Ox Vapor HF
Wet OxHF
release
Pt dry etch
Micro‐ phone A V V V
Micro‐ phone B V V V V
Micro‐phone C (CMOS+ MEMS) V V V
Accelerometer V
Gas sensor V V V V
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DRIE Process for Si Etching
• Scallop control vs process through-put
P. 29
Scallop control of DRIE Bosch Si etching
Through-pitch profile control of DRIE Bosch Si etching
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P. 30
Oxide DRIE & Isotropic Si Etching
• MEMS structure fine tuning by Oxide+Si DRIE
Cross section of accelerometer with silicon released underneath
Top view of MEMS structure with silicon released underneath
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P. 31
Oxide Release Process
• Vapor HF (dry) oxide release process uniformity control vs. through-put
• Pattern loading effect considerations
SEM view of MEMS structure after VHF oxide release
Process scheme of VHF oxide release
Tungsten
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• Film stress control• Chemistry, temparature, RF Power, …
• Chamber release uniformity• Etching recipe, drying procedures, …
Difficulties Persist With Modulized Processes…
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Things need to be done differently!
More than a year proces tuning typicallyLose-lose case for customer and foundry
33
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An Open MEMS Design Environment Proposed
Fine grain process modules
Accurate model database
Package-aware service flow
34
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Summary• IoT will drive MEMS shipment
• MEMS market diversified, process development
cycle too long
• Slow time to market, high entry barrier, deter innovation
• Cowork with supply chain to facilitate delivery
• Fine grain process modules
• Accurate model database
• Package-aware service flow
35
ConfidentialConfidential
Thank You