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- 1. Engineering Presentation By Mike Ryland
- 2. ABOUT ME Graduated from CSUN in 2004 (B.S.M.E.) Core member
of CSUN FSAE 2003/04 Race Team 10+ Years experience in New Product
Development ProEngineer CREO and Solidworks expert power user
Experienced with Aerospace Qualification / Documentation Advanced
Interconnect design experience Design of custom Military connectors
for use in Harsh Environments (Tactical Communications) Design for
Space Applications (1,000,000 cycle RF switches) Pursuing M.S.M.E
at CSUN (15 of 30 units completed)
- 3. Professional Experience EATON, Camarillo, Ca. 09/2013 to
01/2015 (1 Year, 5 Months) Senior Product Engineer HAAS Automation,
Oxnard, Ca. 04/2013 to 08/2013 (4 months) Mechanical Engineer III
(R&D) ISI, Camarillo, Ca. 06/2012 to 04/2013 (10 month
contract) Project Engineer PTI Technologies, Oxnard, Ca. 07/2008 to
06/2012 (4 years) Mechanical Engineer Dow Key Microwave, Ventura,
Ca. 09/2006 to 07/2008 (2 Years) Mechanical Design Engineer PTI
Technologies, Oxnard, Ca. 06/2004 to 08/2006 (2 years, 2 months)
Manufacturing Engineer
- 4. Certifications GD&T per ASME y14.5 1994 - Geometric
Learning Solutions Solidworks Cosmos Professional - Go Engineer
Solidworks PDM Jumpstart - Go Engineer Solidworks Routing Enovia
PLM Administrator certifications - Enovia Solidworks Advanced
Surface Design - Solidworks World Solidworks Mold Design / Plastics
- Solidworks World Professional and Personal Development Eaton
University Six Sigma Eaton University Project management Eaton
University Project Management Certification Eaton University
ProLaunch for Project Management Eaton University Feasibility
studies Eaton University Influencing and Peer Communication Eaton
University Managing Risk in Engineering Project
- 5. Recent Awards (Eaton)
- 6. My Engineering Degree
- 7. GD&T Certification
- 8. TECHNICAL PRESENTATION DENSE MEMORY MODULE
- 9. Custom Connector
- 10. Connector - Card Interface
- 11. Contact to Pad Alignment Challenge
- 12. Edge Card Connector Concept Design
- 13. DMM Connector Configuration
- 14. DMM Connector Configuration Top View
- 15. DMM Connector Configuration Bottom View (Pin Array)
- 16. Pin Socket Interconnect Array
- 17. Pin-Socket-BGA/LGA Array Interconnects
- 18. DMM Board Thermal Management
- 19. 1U Chasis and DMM Module Detail
- 20. Contact Design
- 21. Contact Design cont.
- 22. Contact Design cont.
- 23. Housing Design
- 24. Housing Design cont.
- 25. Housing Design cont.
- 26. Tolerance Analysis
- 27. Tolerance Analysis cont.
- 28. Connector Prototype
- 29. Contact Prototypes
- 30. Contact Prototypes
- 31. PERMANENT SET AFTER .015 DEFLECTION
- 32. MAX RESIDUAL STRESS, K000029902 NORMAL FORCE, BENDING
STRESS AND PERMANENT SET
- 33. MAX STRESS (Uniform Distribution) TAPERED BEAM UNIFORMELY
DISTRIBUTES STRESS ALONG THE LENGTH OF THE CONTACT/BEAM. MINIMIZE
LOCAL STRESS CONCENTRATIONS, UTILIZING FULL LENGTH OF BEAM TO
DISTRIBUTE STRESS. NORMAL FORCE 5.3 GRAMS PER CONTACT MAX
STRESS/DEFLECTION OCCURS AT STEP 10 OF 26, 1.528 SECONDS INTO THE
4.2 SECOND SIMULATION USING A PARABOLIC LOADING/UNLOADING CURVE.
STEPS ARE .042 SECONE INCREMENTS.
- 34. STRESS DISTRIBUTION (cont). ANIMATION DEMONSTRATING ONE
COMPLETE CYCLE OF LOADING-UNLOADING TAPERED BEAM UNIFORMELY
DISTRIBUTES STRESS ALONG THE LENGTH OF THE CONTACT/BEAM. MINIMIZE
LOCAL STRESS CONCENTRATIONS, UTILIZING FULL LENGTH OF BEAM TO
DISTRIBUTE STRESS. NORMAL FORCE 5.3 GRAMS PER CONTACT MAX
STRESS/DEFLECTION OCCURS AT STEP 10 OF 26, 1.528 SECONDS INTO THE
4.2 SECOND SIMULATION USING A PARABOLIC LOADING/UNLOADING CURVE.
STEPS ARE .042 SECONE INCREMENTS.
- 35. REACTION FORCE (X) MOMEMT = 5.3 GRAMS
- 36. MAX FIBRE/SURFACE STRESSES TENSION (+) AND COMPRRESSIVE (-)
STRESSES
- 37. SETUP AND ASSUMPTIONS INPUT CURVE LOADING/UNLOADING CYCLE
.015 PRESCRIBED DISPLACEMENT NO FIXED CONSTRAINTS WERE USED.
ROLLER/SLIDER AND REFERENCE GEOMETRY/ SYMMETRY WAS USED TO MAKE
SIMULATIONS AS REALISTIC AS POSSIBLE.
- 38. Solder Tab K000029903 STRESS ANALYSIS
- 39. DEFLECTION
- 40. DEFLECTION (Cont)
- 41. STRAIN
- 42. Final DMM Module
- 43. Questions