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DMM Presentation

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  1. 1. Engineering Presentation By Mike Ryland
  2. 2. ABOUT ME Graduated from CSUN in 2004 (B.S.M.E.) Core member of CSUN FSAE 2003/04 Race Team 10+ Years experience in New Product Development ProEngineer CREO and Solidworks expert power user Experienced with Aerospace Qualification / Documentation Advanced Interconnect design experience Design of custom Military connectors for use in Harsh Environments (Tactical Communications) Design for Space Applications (1,000,000 cycle RF switches) Pursuing M.S.M.E at CSUN (15 of 30 units completed)
  3. 3. Professional Experience EATON, Camarillo, Ca. 09/2013 to 01/2015 (1 Year, 5 Months) Senior Product Engineer HAAS Automation, Oxnard, Ca. 04/2013 to 08/2013 (4 months) Mechanical Engineer III (R&D) ISI, Camarillo, Ca. 06/2012 to 04/2013 (10 month contract) Project Engineer PTI Technologies, Oxnard, Ca. 07/2008 to 06/2012 (4 years) Mechanical Engineer Dow Key Microwave, Ventura, Ca. 09/2006 to 07/2008 (2 Years) Mechanical Design Engineer PTI Technologies, Oxnard, Ca. 06/2004 to 08/2006 (2 years, 2 months) Manufacturing Engineer
  4. 4. Certifications GD&T per ASME y14.5 1994 - Geometric Learning Solutions Solidworks Cosmos Professional - Go Engineer Solidworks PDM Jumpstart - Go Engineer Solidworks Routing Enovia PLM Administrator certifications - Enovia Solidworks Advanced Surface Design - Solidworks World Solidworks Mold Design / Plastics - Solidworks World Professional and Personal Development Eaton University Six Sigma Eaton University Project management Eaton University Project Management Certification Eaton University ProLaunch for Project Management Eaton University Feasibility studies Eaton University Influencing and Peer Communication Eaton University Managing Risk in Engineering Project
  5. 5. Recent Awards (Eaton)
  6. 6. My Engineering Degree
  7. 7. GD&T Certification
  8. 8. TECHNICAL PRESENTATION DENSE MEMORY MODULE
  9. 9. Custom Connector
  10. 10. Connector - Card Interface
  11. 11. Contact to Pad Alignment Challenge
  12. 12. Edge Card Connector Concept Design
  13. 13. DMM Connector Configuration
  14. 14. DMM Connector Configuration Top View
  15. 15. DMM Connector Configuration Bottom View (Pin Array)
  16. 16. Pin Socket Interconnect Array
  17. 17. Pin-Socket-BGA/LGA Array Interconnects
  18. 18. DMM Board Thermal Management
  19. 19. 1U Chasis and DMM Module Detail
  20. 20. Contact Design
  21. 21. Contact Design cont.
  22. 22. Contact Design cont.
  23. 23. Housing Design
  24. 24. Housing Design cont.
  25. 25. Housing Design cont.
  26. 26. Tolerance Analysis
  27. 27. Tolerance Analysis cont.
  28. 28. Connector Prototype
  29. 29. Contact Prototypes
  30. 30. Contact Prototypes
  31. 31. PERMANENT SET AFTER .015 DEFLECTION
  32. 32. MAX RESIDUAL STRESS, K000029902 NORMAL FORCE, BENDING STRESS AND PERMANENT SET
  33. 33. MAX STRESS (Uniform Distribution) TAPERED BEAM UNIFORMELY DISTRIBUTES STRESS ALONG THE LENGTH OF THE CONTACT/BEAM. MINIMIZE LOCAL STRESS CONCENTRATIONS, UTILIZING FULL LENGTH OF BEAM TO DISTRIBUTE STRESS. NORMAL FORCE 5.3 GRAMS PER CONTACT MAX STRESS/DEFLECTION OCCURS AT STEP 10 OF 26, 1.528 SECONDS INTO THE 4.2 SECOND SIMULATION USING A PARABOLIC LOADING/UNLOADING CURVE. STEPS ARE .042 SECONE INCREMENTS.
  34. 34. STRESS DISTRIBUTION (cont). ANIMATION DEMONSTRATING ONE COMPLETE CYCLE OF LOADING-UNLOADING TAPERED BEAM UNIFORMELY DISTRIBUTES STRESS ALONG THE LENGTH OF THE CONTACT/BEAM. MINIMIZE LOCAL STRESS CONCENTRATIONS, UTILIZING FULL LENGTH OF BEAM TO DISTRIBUTE STRESS. NORMAL FORCE 5.3 GRAMS PER CONTACT MAX STRESS/DEFLECTION OCCURS AT STEP 10 OF 26, 1.528 SECONDS INTO THE 4.2 SECOND SIMULATION USING A PARABOLIC LOADING/UNLOADING CURVE. STEPS ARE .042 SECONE INCREMENTS.
  35. 35. REACTION FORCE (X) MOMEMT = 5.3 GRAMS
  36. 36. MAX FIBRE/SURFACE STRESSES TENSION (+) AND COMPRRESSIVE (-) STRESSES
  37. 37. SETUP AND ASSUMPTIONS INPUT CURVE LOADING/UNLOADING CYCLE .015 PRESCRIBED DISPLACEMENT NO FIXED CONSTRAINTS WERE USED. ROLLER/SLIDER AND REFERENCE GEOMETRY/ SYMMETRY WAS USED TO MAKE SIMULATIONS AS REALISTIC AS POSSIBLE.
  38. 38. Solder Tab K000029903 STRESS ANALYSIS
  39. 39. DEFLECTION
  40. 40. DEFLECTION (Cont)
  41. 41. STRAIN
  42. 42. Final DMM Module
  43. 43. Questions