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TALK FLOW What is BiCMOS Why BiCMOS BiCMOS fabrication process CMOS inverter BiCMOS inverter Comparison between CMOS and BiCMOS Pros and Cons Applications Current status and future trends
WHAT IS BiCMOS Bipolar compatible CMOS(BiCMOS)
tehnology: Introduced in early 1980s Combines Bipolar and CMOS logic
BiCMOS
CMOS BIPOLARLow power dissipation High speed High packing density High output drive
BiCMOS
WHY BiCMOS For greater integration of mixed-signal analog systems To cover full delay-power space BiPOLAR
BiCMOS
CMOS
Adapted from Kiat-Seng Yeo et al.,”CMOS/BiCMOS ULSI:Low voltage,Low power”,Pearson Education,Inc., First edition,p.2,2002
Speed
Power
BiCMOS FABRICATION PROCESS
Adapted from A.R.Alvarage et al.,”An overview of BiCMOS Technology and Applications”,IEEE International Symposium on Circuits and Systems,1-3 May,1990
BiCMOS CROSS-SECTION
Adapted from J. M Rabaey, Digital Integrated Circuits: A Design Prespective, NewJersey: Prentice-Hall, Inc., 1996.
BiCMOS CROSS-SECTION
Adapted from J. P. Uremuya, Circuit Design for CMOS VLSI, Massachusetts: Kluwer Academic Publishers, 1992.
CMOS INVERTER
IP
VDD
GND
OP
Adapted from www2.eng.cam.ac.uk/~dmh/3b2/invert.htm
CIRCUIT DIAGRAM
BASIC BiCMOS INVERTER
Adapted from J. M Rabaey, Digital Integrated Circuits: A Design Prespective,New Jersey: Prentice-Hall, Inc., 1996.
CONVENTIONAL BiCMOS INVERTER
Adapted from J. M Rabaey, Digital Integrated Circuits: A Design Prespective,New Jersey: Prentice-Hall, Inc., 1996.
PULL UP EVENT
C load
Adapted from Sung-Mo Kang,Yusuf Leblebici,”CMOS Digital Integrated Circuits:Analysis and Design”,Tata McGraw-Hill,Third edition,2003,p.547.
PULL DOWN EVENT
C load
Adapted from Sung-Mo Kang,Yusuf Leblebici,”CMOS Digital Integrated Circuits:Analysis and Design”,Tata McGraw-Hill,Third edition,2003,p.550.
BiCMOS VS. CMOS
CMOS
BiCMOS
VTC DYNAMIC CHARACTERISTICS
Adapted from www2.eng.cam.ac.uk/~dmh/3b2/invert.htm
SPEED COMPARISON
Adapted from Larry Wissel and Elliot L. Gould,”Optimal Usage of CMOS within a BiCMOS Technology”,IEEE J. of solid-state circuits, Vol. 27, No. 3, March1992
DELAY COMPARISON
Adapted from Larry Wissel and Elliot L. Gould,”Optimal Usage of CMOS within a BiCMOS Technology”,IEEE J. of solid-state circuits, Vol. 27, No. 3, March 1992
AREA COMPARISON
A AREA
C COMPLEXITY
Adapted from H.Klose et al.,”Bicmos,a tehnology for High speed/High density ICs”,IEEE international conference on Computer Design:VLSI in computers and proessors,2-4 Oct.,1989
PROS OF BiCMOS
Improved speed over CMOS Improved current drive over CMOS Improved packing density over bipolar Lower power consumption than bipolar High input impedance Low output impedance
CONS OF BiCMOS Increased manufacturing process complexity Speed degradation due to scaling
Adapted from Paul G. Y. Tsui et al.,”Study of BiCMOS Logic Gate Configurations for Improved Low-Voltage Performance”, IEEE J. of solid-state circuits, Vol. 28, No 3. March 1993.
CONS OF BiCMOS(CONTD.) Hot carrier degradation
Adapted from J. David Burnett and Chenming hu,”Hot-Carrier Degradation in Bipolar transistors at 300 and 110 K-Effect on BiCMOS Inverter Performance”,IEEE Trasactions On Electron Devices,Vol 17. No 3. April 1990.
APPLICATIONS
Full custom ICs SRAM,DRAM Microproessor,controller
Semi custom ICs Register,Flipflop
Standard cells Adders,mixers,ADC,DAC
Gate arrays
CURRENT STATUS AND FUTURE TRENDS SiGe BiCMOS HP SiGe BiCMOS WL SiGe HBT
BiCMOS PRODUCTS
SiGe BiCMOS GPS CIRCUIT GSM 900 POWER AMPLIFIER
Adapted from D.Harame et al.,”The Emerging Role of SiGe BiCMOS Technologyin Wired and Wireless Communications”, Fourth IEEE International Caracas Conference on Devices, Circuits and Systems, Aruba, April 17-19, 2002.
BiCMOS PRODUCTS(CONTD.)
W-CDMA DCR
OC-48c SONET/SDH Mapper
Adapted from D.Harame et al.,”The Emerging Role of SiGe BiCMOS Technologyin Wired and Wireless Communications”, Fourth IEEE International Caracas Conference on Devices, Circuits and Systems, Aruba, April 17-19, 2002.
CONCLUSION The extra process complexity requires
chip manufacturers to command a premium for BiCMOS products. In the analog market the ability to integrate large mixed systems provides the compelling cost advantage of BiCMOS; this market is still emerging.
BiCMOS is a complement to pure CMOS and Bipolar technologies in important system application areas.
REFERENCES[1]Kiat-Seng Yeo et al.,”CMOS/BiCMOS ULSI:Low voltage,Low power”,Pearson
Education,Inc., First edition,2002.[2]Sung-Mo Kang,Yusuf Leblebici,”CMOS Digital Integrated Circuits:Analysis and
Design”,Tata McGraw-Hill,Third edition,2003.[3]E.A.Gonzalez,”BiCMOS processes,trends and applications”,DLSU ECE,Technical
report,Nov.29,2004.[4]A.R.Alvarez et al.,”An overview of BiCMOS technology and applications”,IEEE
International Symposium on Circuits and Systems,1-3 May,1990.[5] T. Sakurai, “A review on low-voltage BiCMOS circuits and a BiCMOS vs. CMOS speed
comparison,” Proceedings of the 35th Midwest Symposium on Circuits and Systems, vol. 1, Aug. 9-12 1992.
[6] J. M Rabaey, Digital Integrated Circuits: A Design Prespective, NewJersey: Prentice-Hall, Inc., 1996.
[7] J. P. Uremuya, Circuit Design for CMOS VLSI, Massachusetts: Kluwer Academic Publishers, 1992.
[8] Adapted from H.Klose et al.,”Bicmos,a tehnology for High speed/High density ICs”,IEEE international conference on Computer Design:VLSI in computers and proessors,2-4 Oct.,1989
[9] Larry Wissel and Elliot L. Gould,”Optimal Usage of CMOS within a BiCMOS Technology”,IEEE J. of solid-state circuits, Vol. 27, No. 3, March 1992[10] Paul G. Y. Tsui et al.,”Study of BiCMOS Logic Gate Configurations for Improved Low-
Voltage Performance”, IEEE J. of solid-state circuits, Vol. 28, No 3. March 1993.[11] D.L.Harame,”Current Status and Future Trends of SiGe BiCMOS Technology” IEEE
transactions on electron devices, vol. 48, no. 11, november 2001[12]Adapted from D.Harame et al.,”The Emerging Role of SiGe BiCMOS Technology in Wired and Wireless Communications”, Fourth IEEE International Caracas
Conference on Devices, Circuits and Systems, Aruba, April 17-19, 2002.
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