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ASM Solutions in SiP Application
10.2017
ASM SMT Solutions: An influential part of ASM Pacif ic Technologies
10/10/2017ASM Assembly Systems Page 2
The ASM PT Group is the world‘s largest supplier of assembly and packaging equipment
ASM Materials
� Leadframes� Other Materials� Molded Interconnect Substrate (MIS)
ASM Back End Equipment
� Die & Flip-Chip Bonder� Wire Bonder� Encapsulation Equipment� Tester & Sorter� Laser Dicing� LED Equipment
ASM SMT Solutions
� SMT Line Solution� DEK Printing Solutions� SIPLACE Placement Solutions� ASM Smart Factory Tools & Services
ASM Pacific Technologies (ASM PT) today: Three succ essful business segments
founded in
1975
ASM Pacific Technologies “in a nutshell”:
present in
> 30Countries
headquartered in
Singapore
>1,100patents
>1,700R&D engineers
revenues
1.84 Bn US$In calendar year 2016
6R&D centers
10manufacturing facilities
• Panels, strips or singulated
• Micro SMT
• Balls on component side
Bluetooth Module
Intarsia RF module.
Integrated passives
& wirebondeddie
System in Package
Key capability_ blue light camera for Cu pillar
10/10/2017ASM Assembly Systems Page 4
P
SIPLACE – Intelligent Height Learningfor Standard SMT Application
With Placement force control
� Machine will automatically learn component height and PCB warpage
� Continuous learning from every placement, every PCB
Component HeightLearning
PCB WarpageLearning
Dynamic 3D Terrain generated in machine
+ =
10/10/2017ASM Assembly Systems Page 5
Precondition for soft and reliable component placem entProgrammable z-axis (speed and force)
Page 6 ASM Assembly Systems 10/10/2017
START VIDEO
Safety distance
Targ
et le
vel
First PCB Second PCB
Safety distance
Self earning of placement levelPlacement on upwards wrapped PCB
Page 7 ASM Assembly Systems10/10/2017
START VIDEO
Targ
et le
vel
First PCB Second PCB
Safety distance
Targ
et le
vel
Self earning of placement levelPlacement on downwards wrapped PCB
Page 8 ASM Assembly Systems10/10/2017
START VIDEO
First PCB Second PCB
PCB Handling during ProductionPCB Oscillation self-healing
When ∆ > Allowed value, i.e. 0.2mm
� Machine will automati-cally slow down the movement of Z axis
� Or send out a warning message on the screen
� Or, if the process is critical, stop the machine
� Force feedback control� Z movement control� Speed control
∆= ?
Self-Healing Oscillation
� Optimal placement process control
� Avoid defects like, solder beads, short after reflow
10/10/2017ASM Assembly Systems Page 9
SIPLACE “0” Placement Force - ‘touchless’ placementfor Special Application*
“0” Placement force
� Application for very fragile component
� Accurate process control of placement into the flux/solder etc.
Vacuum tooling to make sure PCB is flat positioned and supported
1
2
3
Height measurement for PCB leveling prior to placement
Place component with accurate Z axis height control based on PCB leveling
∆ Controlled
10/10/2017ASM Assembly Systems Page 10
10/10/2017ASM Assembly Systems Page 11
TX Micron_ Key specification
SIPLACE TX Micron
Machine Configuration 2 gantries, 2 heads(TX2i micron / TX2 micron)
Placement heads SpeedStar (CP20M2) Multistar (CPP)
Benchmark 78000 cph@25µm, 71000 cph@20µm, 65000 cph@15µm
Up to 48000 CPH
Accuracy 25/20 or 25/15 µm @ 3 σ
Board size Dual conveyor: 45 x 45 mm to 375 x 260 mm
Component range 0201 metric – 27 x 27 mm
Component Supply Up to 80 x 8 mm tapes, JEDEC tray
Clean Room Class 10000 / ISO 7 (standard)
Power Consumption Typical: 1,9 kW including vacuum pump
Machine Dimensions 1,00m x 2,3 m x 1,45m
TX Micron_ Accuracy measures
10/10/2017ASM Assembly Systems Page 12
SIPLACE TX Micron Standard Package
• Standard accuracy 25/20 µm @ 3 σ
• High resolution glass scales for gantry system (10nm)
• Additional fiducial bar (x)
• Individual accuracy setting on component level
SIPLACE TX Micron 15 µm Package
• High accuracy 25/15 µm @ 3 σ
• High resolution glass scales for gantry system (10nm)
• Additional fiducial bar (x)
• Additional fiducial bars on vacuum tooling (y)
• Highly rigid conveyor system for substrate stabilization
• Special vacuum tooling with interchangeable vacuum plate
• Easy exchange via integration of positioning pins
• Individual accuracy setting on component level
SIPLACE TX Micron fiducial bar (x)
Vaccum tooling with fiducial bar (y)
Page 13ASM Assembly Systems 10/10/2017
Independent Operation with i-mode
� Improvement on OEE
� Dynamic editing on one head, the rest of the line are still running; works for NPI, mass production as well
Independent operation
• Teaching of - fiducial- barcode - component shape- pickup/placement position- component tray, feeder pocket- etc
SIPLACE BulkFeeder XOverview
Page 14 ASM Assembly Systems 10/10/2017
CartridgePick up window
EDIF
Camera
Control panel� 7 segment display� Forward Button� Backward Button� Cartridge removal
SIPLACE BulkFeeder XCartridge overview
Page 15 ASM Assembly Systems 10/10/2017
Pick up window with shutter
Refill
RFID
Container
0402 0201 01005
Container Capacity Up to 110.000 Up to 500.000 Up to 1.500.000
SIPLACE BulkFeeder XComponent analysis
Page 16 ASM Assembly Systems 10/10/2017
Legend
Pickable components are marked green
Tiled components are marked orange
Component clusters are marked blue
Components laying too close are marked red
Always enough components for 20 pick up’s
#1 supply form for high volume applications
� Reduce Manual work
� No reels – No splicing – No waste
� Up to 90% less material logistics
� Higher pickup reliability
� Better placement quality, especially for narrow gap placement
SIPLACE BulkFeeder X
10/10/2017ASM Assembly Systems Page 17
Bad Mark Recognition with SIPLACE Machine
PCB bad mark detection in the productionBad marks (or Inkspots) on PCBs are required to avoid placing expensive components on a defect board
Inkspot detection with SIPLACE machine
� Inkspot is programmed in SIPLACE Pro and assigned to each sub-panel of a board
� Inkspots are read by the PCB camera prior to placement in each machine
� Only the good panels (with good inkspot recognition) will be populated
� Time needed for inkspots reading is added to cycle time
SIPLACE Virtual Inkspot Handling – System Overview
System workflow (from Station SW 707)� External system provides Virtual Inkspot file that describes the circuits to be produced per board
identified by a barcode
� 1st SIPLACE machine scans barcode of board (scanner or camera)
� Barcode is send via OIB Interface of SIPLACE Board Gate Keeper (BGK) to external system
� External system returns inkspot data with the circuits to be produced (name of subpanels defined in SIPLACE Pro)
� Inkspot data are transferred to the next SIPLACE machine by the Whisper Down The Line option
Board ID + Inkspot Data
Board ID + Inkspot Data
SIPLACE Line Controller
BGK
ExternalSystem(MES)
InkspotData
Board ID
Product overview
Page 20ASM Assembly Systems 10/10/2017
Model Name: XXXX-601402-XXXXSide: TopSize: 260x100mmPlacements: 9450Panels: 105
Dipping Component Qty : 10
SiP Assembly Line Overview
Page 21ASM Assembly Systems 10/10/2017
Proposed Line Configuration:
2*NeoHorizon03iX and 3*X4iS-M
Current Line Configuration
Alternating modeResults - Dipping Process vs Flux Printing Process
Increased ~ 20% productivity
Page 22ASM Assembly Systems 10/10/2017
Performance
Feeder demand
Nozzle demand
SIPLACE CA
10/10/2017ASM Assembly Systems Page 23
Accuracy
� Chip shooter with integrated wafer system � Supports SMT, flip chip (DCA) & die attach (COB)
on a single platform
SIPLACE Wafer System (SWS)Standard
10/10/2017ASM Assembly Systems Page 24
� Handling of wafers from 4” up to 12”
� Hoop ring handling capability
� 8”/12” Wafer Expansion Unit / Stretcher
� Automatic wafer exchange
� Multi Die Capability
� Wafer magazine for up to 25 wafers
� Supports Linear Dipping Unit
� ALPS electronic wafer map
� Setup verification for SWS
New products or changed packaging (e.g. wafer, T&R) can easily be adopted.
Introduction
10/10/2017ASM Assembly Systems Page 25
SIPLACE CA
� For Advanced Packaging market
� Flip Chip & Die Attach from wafers combined with SMD
� Suitable for
� High Placement Accuracy, High Volume Production.
eWLB� FC� FC+ SMD
Chip 2 Wafer� FC� DA with DAF� Cap wafer
with DAF
Embedded PCB� FC� FC + SMD� DA with DAF
SiP / Hybrid� DA with SP + SMD� FC + SMD� Multi DA with SP + SMD� Multi FC + SMD
LED� large Panel� FC (LED) + SMD
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