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mark-telford documents
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E-pHEMT complements HBT - may challenge below 3 V
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Networking slowdown driving faster components
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As profits heads south manufacturers turn to the east
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Gallium shortage easing
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Adaptation of silicon manufacturing technology to compounds
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Mid-tier IC makers outsource silicon; focus on compounds
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Self-organized quantum dots for optoelectronics
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Glut of “dark” fibre to drive DWDM component market
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SiC’s power cuts cost
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The one-stop shop
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China lights the blue touch paper
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GaAs RFICs: from undersupply to over-capacity
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Trends in mobile telecoms
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Progress in GaAs manufacturing technology
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Advances in InP and competing materials
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E-pHEMTs gaining favour for 3G wireless
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Shrinking transceivers drive InP integration
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GaAs boosted by WLAN & auto radar
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SiGe slips into main fabs
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QD lasers go to market
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Stretching silicon's lifespan
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