Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published by Yole Developpement

©2017 by System Plus Consulting | Continental ARS4-A Radar 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Continental ARS4-ALong and Short Range 77GHz RadarSystem report by David Le GacMarch 2017


Table of Contents

Overview / Introduction 4

o Executive Summary

o Main Chipset

o Reverse Costing Methodology

Company Profile 7

o Continental

Teardown Analysis 9

o Global View of the Radar

o Views and Dimensions of the Radar

o Radar Opening

o MCU Electronic Board

Top Side – Global view

Top Side – High definition photo

Top Side – PCB markings

Top Side – Main components markings

Top Side – Main components identification

Top Side – Other components markings

Top Side – Other components identification

Bottom Side – High definition photo

Bottom Side – Components identification

o RF Electronic Board

o Receiver Package and Die

o Transmitter Package and Die

o VCO Package and Die

o RF Chipset

o Comparison with Autoliv MMRV1 and Bosch MRR1Plus

Cost Analysis 45

o Accessing the BOM

o PCB Cost

o Estimation of the Cost of the NXP Semiconductor MCU

o BOM Cost – MCU Electronic Board

o BOM Cost – RF Electronic Board

o Housing Part – Estimation

o BOM Cost - Housing

o Material Cost Breakdown by Sub-Assembly

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Electronic Boards Manufacturing Flow

o Details of the Electronic Boards AV Cost

o Details of the System Assembly AV Cost

o Added-Value Cost Breakdown

o Manufacturing Cost Breakdown

Estimated Price Analysis 77

o Estimation of the Manufacturing Price

Company services 80


Overview / Introductiono Executive Summaryo Main Chipseto Block Diagramo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Cost Analysis

Selling Price Analysis

About System Plus

The reverse costing analysis is conducted in several phases:

Reverse Costing Methodology

• The initialization of the analysis

Pictures of the elements to be studied.

Identification of the components.

• Description of the material in the “SYScost+” software

Creation of an “estimation project” of the studied board with SYScost+ software.

Construction of the Bill of Material (BOM).

• Assessing the material

Searching for the price of each reference among distributors and manufacturers.

Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)

The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phases

Assembly and test lines are modeled with the SYScost+ software.

The assembly and tests costs are estimated.

• Production cost & selling price

Estimation of the production cost & selling price.

• Report

A report is edited.

SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.


Overview / Introduction


Physical Analysis o Views & Dimensionso System Openingo Electronic Board

Cost Analysis


About System Plus

Global View of the Radar

Global view of the ARS4-A Radar.

Total Weight: 287g





Cost Analysis


About System Plus

Part Collection





Cost Analysis


About System Plus

MCU Board – Top Side – Global View





Cost Analysis


About System Plus

MCU Board – Top Side – Main Components Identification





Cost Analysis


About System Plus

RF Board – Top Side – Global View





Cost Analysis


About System Plus

Transmitter Package and Die





Cost Analysis


About System Plus

Comparison with Autoliv MMRV1 and Bosch MMR1Plus


RF Board Cross Section and EDX analysis




Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacuring Cost


About System Plus

BOM Cost – MCU Board

There is a total of xxx components on the MCU Board. xxx components are on the top side and xxx components are on the bottom side.

The material cost of the MCU Board is estimated to $xx.xx for 500K units in 2017.




Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacuring Cost


About System Plus

Manufacturing Cost Breakdown




Physical Analysis

Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

Estimation of the Manufacturing Price




Physical Analysis

Manufacturing Process Flow

Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Contact

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 30% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

o Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole DéveloppementEmail: [email protected]

– Japan: Takashi Onozawa, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement, Email: [email protected]

o Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole DéveloppementEmail: [email protected]

– Japan: Miho Ohtake, Japan Sales Manager, Yole K.K., Email: [email protected]

– Greater China: Mavis Wang, Business Development Manager, Yole China - [email protected]

– Rest of Asia: Takashi Onozawa, President & General Manager, Yole K.K., Email: [email protected]

o Financial services

– Jean-Christophe Eloy, CEO & President, Email: [email protected]

o General: Email: [email protected]




Physical Analysis

Manufacturing Process Flow

Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings

COMPLETE TEARDOWN WITH:

• Detailed photos

• Material analysis

• MMIC die views and RF chipset analysis

• Comparison with AutolivMMRV1 and Bosch MRR

• PCB cross-sections

• MCU physical analysis and cost estimate

• Complete and priced bill-of-materials

• Manufacturing process flow

• Manufacturing cost analysis

• Estimated cost and sales price

Continental ARS4-A 77GHz Radar

Title: Continental ARS4-A 77GHZ Radar

Pages: 85

Date: March 2017

Format: PDF & Excel file

Price: Full report: EUR 2 990

Bundle Offer with NXP MR2001 Radar Chipset: EUR 4 490

The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection

between two objects. It is thus able to detect stationary objects withoutany camera support.

The system integrates two electronic boards including an NXPSemiconductor microcontroller and Broadcom Ethernet transceiver. Theradio-frequency (RF) board is manufactured with an asymmetric structureusing a hybrid PTFE/FR4 substrate and is equipped with planar antennas.

The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset,composed of four receivers, two transmitters and an associated voltagecontrolled oscillator (VCO), is used as high-frequency transmitter andreceiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured byFreescale.

Based on a complete teardown analysis of the Continental radar, thereport provides the bill-of-material (BOM) and the manufacturing cost ofthe radar sensor.

A complete physical analysis and manufacturing cost estimation of theNXP semiconductor monolithic microwave integrated circuits (MMICs) isavailable in a separate report.

The Continental ARS4-A Radar isdesigned for forward collisionwarning, emergency brake assist,collision mitigation system orAdaptive Cruise Control (ACC). Aspecial feature of the device is thesimultaneous measurement of longdistances, up to 250m with +/-0.2maccuracy, and short range, up to70m, relative velocity and angle

Véronique is in charge ofstructure analysis of semi-conductors. She has a deepknowledge in chemical &physical technical analyses. Shepreviously worked for 20 yearsin Atmel Nantes Laboratory.

Author (Lab):VéroniqueLe Troadec

He is in charge of reverse costingwith a focus on boards and systems.He previously worked for LacroixElectronics where he was incharge of its components database.He holds a master’s degree in micro-electronics from the University ofRennes.

David Le Gac

David joined SystemPlus Consulting as acost engineer in 2013.

AUTHORS:

TABLE OF CONTENTS

Overview / Introduction• Executive Summary

• Company Profile

• Reverse Costing Methodology

Physical Analysis• Overview of the Radar

• Views and Dimensions of the Radar

• Radar Opening

• Electronic Boards

• MCU Board

• Overview

• High Definition Photo

• Component Markings and Identification

• RF Board

• Overview

• High Definition Photo

• Component Markings and Identification

• RF Chipset Analysis

• Comparison with AutolivMMRV1 and Bosch MMR1

Cost Analysis• PCB Cost

• RF Board Cross Section and EDX Analysis

• Estimation of the Cost of the NXP Semiconductor MCU

• BOM Cost – MCU Board

• BOM Cost - RF Board

• BOM Cost - Housing

• Material Cost Breakdown

• Accessing the Added Value (AV) Cost

• MCU Board Manufacturing Flow

• RF Board Manufacturing Flow

• Details of the Housing Assembly and Functional Test Costs

• Added Value Cost Breakdown

• Manufacturing Cost Breakdown

Estimated Price Analysis• Estimation of the

Manufacturing Price

laboratory. He previously workedfor 25 years at Atmel NantesTechnological Analysis Laboratoryas fab support in physical analysis,and for three years at HirexEngineering in Toulouse, in adestructive physical analysis lab.

Yvon Le Goff (Lab)

Yvon joined SystemPlus Consulting in2011 to set up its

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ANALYSIS PERFORMED WITH OUR COSTING TOOL SYSCOST+

System Plus Consulting offerspowerful costing tools to evaluatethe production cost and selling pricefrom single chip to complexstructures.

SYSCost+

Defining the cost of an electronicsystem requires an estimation of allcomponent costs, including PCB,housing and connectors, and asimulation of the cost of theassembly and test process at theboard and system level.

The costing modules included inSYScost+ answer all theserequirements and help costingengineers get accurate calculations.

SYScost+ is flexible in order to beused in multiple applications.

SYSCost+

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Autoliv 77GHz Multi Mode

Radar

Delphi Rear andSide Detection System

NXP MR2001 Multi-Channel 77 GHz Radar Rx/Tx/VCO

Fan-Out RCP Chipset

A compact, cost-effective andhigh-performance drivingassistance system combiningmedium- and long-rangedetection.

The RSDS offers an array of activesafety features including blind-spotdetection, lane-change mergeassist, rear cross-traffic alert andrear pre-crash sensing.

The new 77 GHz radar chipset forADAS from NXP/Freescale SiGe:CxHBT technology & Fan-Out RCPWafer-Level Packaging.

Pages: 80Date: January 2017Full report: EUR 2,990*

Pages: 83Date: September 2016Full report: EUR 2,990*

Pages: 129Date: March 2016Full report: EUR 3,290*

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