AMD 2014 Mobility APU Lineup Announcement

AMD 2014 MOBILITY UPDATENOVEMBER 13, 2013

2| 2014 AMD MOBILITY APU LINEUP ANNOUNCEMENT | NOVEMBER 2013

IN THIS DECK

MARKET OVERVIEW

AMD’S POSITION & FOCUS

2014 MOBILITY APU ROADMAP ADDITIONS

NEW FEATURES & BENEFITS


THE AMD MISSION

To be the leading designer and integrator of innovative, tailored technology solutions that empower people to push the boundaries of what is possible.


THE EVOLVING CLIENT MARKET

Big screens X86 performance focus Work devices

Productivity Content creation Best gaming

DT towers Thick notebooks Slow boot, bad battery life

Small screens Good enough performance Communication devices

Beautiful displays App-based consumption Browsing/entertainment

Thin & light phones/tablets Able to go virtually everywhere Fast boot times, long battery life

ANDROID/IOS ECOSYSTEMOLD WINDOWS ECOSYSTEM

THE NEWCLIENT ECOSYSTEM


AMD’S MOBILITY FOCUS

ENHANCED MEDIA NATURAL USER INTERFACES GAMING CONTENT ANYWHERE

BRIDGING THE GAP BETWEEN TABLETS AND NOTEBOOKS

DELIVERING SURROUND COMPUTE EXPERIENCES ACROSS FORM FACTORS

PERFORMANCE TABLETS 2-in-1s CONVERTIBLES NOTEBOOKS

CONSUMPTION PRODUCTIVITY

Productivity, more immersive experiences

13–15” content creation and new compute experiences

Full featured notebook first,converts to touch tablet

Tablet & productivitynotebook


TABLETS & 2-in-1s SMALL SCREEN TOUCH NOTEBOOKS MAINSTREAM & PERFORMANCE NOTEBOOKS

AMD’S 2013 MOBILITY LINEUP IN ACTION

VIZIO 11.6”

Tablet PC

MSI W20 3M

Tablet

Toshiba Satellite®

Click

HP Pavilion13

x2

HP Pavilion11 TouchSmart

MSI S12T

Notebook

Acer Aspire

V5-122P

Acer Aspire V5-552

HP ENVY15

TouchSmart

Samsung ATIV Book

9 Lite


2013 2014

AMD 2013-2014 MOBILITY ROADMAP

Mainstream

Low-Power Essential

Ultra-Low Power

Performance

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

“Kabini” APU2-4 “Jaguar” CPU Cores

GCN Graphics Compute Units15W-25W

“Temash” APU2-4 “Jaguar” CPU Cores

GCN Graphics Compute Units 3W-4W SDP

“Beema ” APU 2-4 “Puma” CPU Cores

GCN Graphics Compute UnitsAMD Security Processor

10W-25W

“Kaveri” APU2-4 “Steamroller” CPU Cores

GCN Graphics Compute UnitsHSA Features

AMD TrueAudio15W-35W

“Mullins ” APU2-4 “Puma”” CPU Cores

GCN Graphics Compute UnitsAMD Security Processor

~2W SDP

“Richland” APU2-4 “Piledriver” CPU Cores

2nd Generation DX®11 GPU Cores17W-35W

32nm

28nm SoC

28nm SoC

28nm

28nm SoC

28nm SoC


More than 2X the performance per watt of the previous generation1

2014 AMD MOBILITY ROADMAP ADDITIONS

See backup for footnotes

More performance and the latest features for a better experience in mainstream & entry 2-in-1S AND NOTEBOOKS

“BEEMA”

3DMark11 - PerformanceNormalized

0%

50%

100%

150%

200%

250%

PCMark 8 - HomeNormalized

0%

50%

100%

150%

200%

250%"Kabini" 4C "Beema" 4C

AMD Radeon™ graphics: The world's best graphics technology that is found in all the latest game consoles AND in PCs that deliver richer more lifelike videos, movies, photos and the best gaming experience

AMD DockPort technology support Microsoft 8.1 optimizations and Microsoft InstantGo2 for faster wake times and to

ensure data, such as e-mail, actively refreshes in standby Platform security processor based on the ARM Cortex™-A5 processor featuring ARM

TrustZone® technology for enhanced data security

Outstanding performance in an SOC designed for fanless tablets, 2-in-1s, and notebooks

“MULLINS”

PCMark 8 - HomeNormalized

0%

50%

100%

150%

200%

250%

300% "Temash" 4C "Mullins" 4C

3DMark11 - PerformanceNormalized

0%

50%

100%

150%

200%

250%


AMD DOCKPORT TECHNOLOGY

Use AMD DockPort to connect: Up to four monitors*

Mouse/keyboard External HDD Optical drive Printers Virtually any other device or peripheral

that supports DP1.2 standard

ONE CONNECTION, VIRTUALLY LIMITLESS POSSIBILITIES

* Use of 4 1920x1200 external monitors does not support simultaneous USB 3.0 speed. BPU support required.

Up to USB 3.0 speed*Charging power

DP 1.2USB 3.0Powers Notebook

DPHDMIVGA

DPHDMIVGA

DPHDMIVGA

Dock

KBD & Mouse

Smart Phone

DVD/Blu-ray

HDD


AMD AND MICROSOFT COLLABORATION – WINDOWS 8.1

Performance Optimizations in both Windows 8.1 as well as in the AMD driver4 to streamline performance

Accelerated ExperiencesInternet Explorer 11 includes support for WebGL™ to enable acceleration for better online experiences when using AMD APUs and GPUs

AMD Wireless DisplayEnabling great experiences for end users with AMD Wireless Display3 built on top of Windows 8.1 support for Miracast technology


INSTANTLY AVAILABLE ALWAYS CURRENT HIGHLY MOBILE

MICROSOFT INSTANTGO*

WITH INSTANTGO, YOUR WINDOWS DEVICE IS RESPONSIVE AND ALWAYS READY

Your device wakes up the moment you need it

Your apps and data are already up to date when your screen lights up

Your experience can last all day with extended battery life

Battery can last all-day while working or up to 14 days in standby mode

Designed for thin, light, and connected devices

Maintains network connectivity* and syncs automatically while your device sleeps

Allows Live Tiles, Windows Store apps, news, and data to refresh even when device is in standby

Go from standby mode to "on" in under 500 milliseconds

Get back to what you were doing in the blink of an eye

*Requires internet access acquired separately * Material provided by Microsoft. Microsoft testing not independently verified by AMD. For full details please contact Microsoft directly.


AMD-DESIGNED PLATFORM SECURITY PROCESSOR WITH ARM TRUSTZONE

Provides a Trusted Execution Environment (TEE)‒ Protects against software attack from open/rich OS side of

system‒ Provides scalable environment for secure applications like user

authentication, anti-malware, content management, online payments, etc.

Delivers two separate domains, normal and secure‒ Extends across entire system‒ Beyond simply the processor/SOC‒ Can deliver secure

‒ Processing data path‒ On/off-chip memory‒ I/O and display

PSP (ARM Cortex-A5)

Normal World Secure World

Secure Monitor

Secure Boot

Secure OS in TEE

Trus

ted

App

Trus

ted

App

Trus

ted

App

TrustZone API

Isol

ated

Ap

ps

Isol

ated

Ap

ps

Isol

ated

Ap

ps

AMD SOC


IN SUMMARY

New additions to the 2014 Mobility Roadmap focus on delivering exceptional performance and important features for this new era

And AMD is uniquely positioned to succeed

CONVERGENCE FORM-FACTORS GRAPHICS-INTENSIVE WORKLOADS SURROUND COMPUTING

THE CHANGING CLIENT MARKET CREATES A HUGE OPPORTUNITY, CENTERED AROUND

Thank You

Find us online:PINTERESTINSTAGRAM

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AMD.COM

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http://www.amd.com/


FOOTNOTES

1. Slide 8: Testing conducted by AMD Performance Labs on optimized AMD reference systems. PC manufacturers may vary configuration yielding different results. ‒ PCMark 8 - Home score divided by TDP(W) is used to simulate productivity performance per watt; the Mullins platform (4.5W) scored 1809 while the Temash platform(8W) scored 1343. MUN-3 AMD "Larne" reference platform

system used for both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz), Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Mullins” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1333MHz RAM, Windows 8.1, and unreleased reference driver.

‒ 3DMark 11 score divided by TDP(W) is used to simulate graphics performance per watt; the Mullins (4.5W) platform scored 570 while the Temash (8W) platform scored 468. MUN-4 AMD "Larne" reference platform system used for both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz), Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Mullins” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1333MHz RAM, Windows 8.1, and unreleased reference driver.

‒ PCMark 8 - Home score divided by TDP(W) is used to simulate productivity performance per watt; the Beema platform (15W) scored 2312 while the Kabini platform(25W) scored 1861. BMN-3 AMD "Larne" reference platform system used for both APUs. Kabini-based AMD A6-5200 quad-core APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Beema” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1600MHz RAM, Windows 8.1, and unreleased reference driver.

‒ 3DMark 11 score divided by TDP(W) is used to simulate graphics performance per watt; the Beema (15W) platform scored 823 while the Kabini (25W) platform scored 685. BMN-4 Home score divided by TDP(W) is used to simulate productivity performance per watt; the Beema platform (15W) scored 2312 while the Kabini platform(25W) scored 1861. BMN-3 AMD "Larne" reference platform system used for both APUs. Kabini-based AMD A6-5200 quad-core APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Beema” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1600MHz RAM, Windows 8.1, and unreleased reference driver.

2. Slide 8: Material provided by Microsoft. Microsoft testing not independently verified by AMD. For full details please contact Microsoft directly.

3. Slide 9: AMD Wireless Display technology provides the ability to wirelessly display local screen content onto a remote screen with low latency and automatic upscaling of video and graphics. AMD Wireless Display technology is enabled on select systems with AMD APUs and requires Windows 8 and Wi-Fi certified Miracast™ receiver equipment. Confirm capabilities with system manufacturer before purchase.

4. AMD Catalyst™ 13.11 Beta Driver for Windows® (http://support.amd.com/en-us/kb-articles/Pages/latest-catalyst-windows-beta.aspx).


DISCLAIMER & ATTRIBUTION

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.

The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.

ATTRIBUTION

© 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions.


CAUTIONARY STATEMENT

This Presentation contains forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things, AMD’s 2014 mobile Accelerated Processing Unit (APU) product roadmap, AMD’s future products including strategy, the timing , availability, features and functionality of such future products, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company’s third-party foundry suppliers will be unable to transition the Company’s products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company’s products on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company’s requirements for wafers will be less than the fixed number of wafers that we agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the Company’s products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company’s products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 28, 2013.

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AMD 2014 Mobility APU Lineup Announcement